PS8601L-V [NEC]
HIGH SPEED ANALOG OUTPUT TYPE 8 PIN PHOTOCOUPLER; 高速模拟输出型8引脚PHOTOCOUPLER
| 型号： | PS8601L-V |
| 厂家： | 
NEC |
| 描述： | HIGH SPEED ANALOG OUTPUT TYPE 8 PIN PHOTOCOUPLER |
| 文件： | 总10页 (文件大小：82K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATA SHEET
PHOTOCOUPLERS
PS8601, PS8601L
HIGH SPEED ANALOG OUTPUT TYPE
8 PIN PHOTOCOUPLER
DESCRIPTION
PS8601 and PS8601L is a 8-pin high speed photocoupler containing a GaAIAs LED on input side and a P-N
photodiode and a high speed amplifier transistor on output side on one chip. PS8601 is in a plastic DIP (Dual In-line
Package). PS8601L is lead bending type (Gull wing) for surface mount.
FEATURES
CC
•
•
•
•
•
•
•
High supply voltage
High speed response
High isolation voltage
(V = 35 V MAX.)
PHL PLH
(t , t : 0.8 s MAX.)
r.m.s.
(BV: 5 000 V
MIN.)
TTL, CMOS compatible with a resistor
Taping product number (PS8601L-E3)
UL recognized [File No. E72422(s)]
VDE0884 recognized: option
APPLICATIONS
•
•
•
Interface circuit for various instrumentations, control equipments.
Computer and peripheral manufactures.
Electrical isolation of TV video terminals.
ORDERING INFORMATION
PART NUMBER
PACKAGE
SAFETY STANDARD APPROVAL
Normal specification products
PS8601
8 pin DIP
• UL Approved
PS8601L
8 pin DIP, lead bending type
8 pin DIP, lead bending type
(for long distance)
PS8601L1
PS8601L2
PS8601-V
PS8601L-V
PS8601L1-V
PS8601L2-V
VDE0884 specification products (option)
• VDE Approved
8 pin DIP
8 pin DIP, lead bending type
8 pin DIP, lead bending type
(for long distance)
[Handling Precaution]
This product is weak for static electricity by designed with high speed integrated circuit. So, protect against static
electricity when handling.
Document No. P11650EJ2V0DS00 (2nd edition)
(Previous No. LC-2362)
Date Published June 1996 P
Printed in Japan
©
1995
PS8601, PS8601L
PACKAGE DIMENSIONS (Unit: mm)
DIP (Dual In-line Package)
PS8601
Lead Bending type (Gull-wing)
PS8601L
PIN CONNECTIONS (Top View)
PIN CONNECTIONS (Top View)
Output
Output
8
7
6
5
8
7
6
5
10.16 MAX.
10.16 MAX.
1
2
3
4
1
2
3
4
Input
Input
8
1
5
8
1
5
4
1. NC
2. Anode
5. Emitter
6. VO
7. Base
8. VCC
1. NC
2. Anode
5. Emitter
6. VO
7. Base
8. VCC
3. Cathode
4. NC
3. Cathode
4. NC
4
7.62
7.62
1.27
MAX.
0.9
± 0.25
1.27
MAX.
9.60 ± 0.4
2.54
1.34 ± 0.10
1.34
0 to 15o
M
0.25
2.54
0.50 ± 0.10
M
0.25
Lead Bending type (for long distance)
PS8601L1
PS8601L2
10.16 MAX.
10.16 MAX.
8
5
8
5
11.8 ± 0.4
10.16
1
4
1
4
10.16
7.62
7.62
0.9 ± 0.25
1.27 MAX.
2.54
0 to 15o
1.27 MAX.
2.54
M
0.25
1.34 ± 0.10
1.34
M
0.25
0.50 ± 0.10
2
PS8601, PS8601L
ABSOLUTE MAXIMUM RATINGS (TC = 25 C)
Diode
F
Forward Current
Reverse Voltage
Power Dissipation
Detector
I
25
5
mA
V
R
D
V
P
45
mW
CC
O
Supply Voltage
V
I
35
35
V
V
Output Voltage
V
O
Output Current
8
mA
mW
r.m.s.
C
Power Dissipation
Isolation Voltage*1
Operating Temperature
Storage Temperature
P
100
BV
5 000
55 to +100
55 to +150
V
A
T
C
C
stg
T
*1 AC voltage for 1 minute at TA = 25 C, RH = 60 % between input and output.
ELECTRICAL CHARACTERISTICS (TA = 25 C)
PARAMETER
SYMBOL MIN. TYP
.
MAX.
UNIT
TEST CONDITIONS
Diode
Forward Voltage
Reverse Current
VF
IR
1.7
2.2
10
V
A
IF = 16 mA
VR = 5 V
Forward Voltage Temperature
Coefficient
VF
1.6
mV/ C IF = 16 mA
T
Junction Capacitance
Ct
60
3
pF
nA
A
V = 0, f = 1 MHz
Detector
High Level Output Current
High Level Output Current
Low Level Output Voltage
IOH 1
IOH 2
VOL
500
100
0.4
IF = 0 mA, VCC = VO = 5.5 V
IF = 0 mA, VCC - VO = 35 V
0.1
V
IF = 16 mA, VCC = 4.5 V,
IO = 1.2 mA
Low Level Supply Current
High Level Supply Current
Current Transfer Ratio
ICCL
ICCH
50
A
A
IF = 16 mA, VO = Open, VCC = 35 V
IF = 0 mA, VO = Open, VCC = 35 V
0.01
1
Coupler
CTR
15
%
IF = 16 mA, VCC = 4.5 V,
VO = 0.4 V
Isolation Resistance
Isolation Capacitance
Propagation Delay Time
R1-2
C1-2
tPHL
1011
Vin-out = 1 kVDC
0.7
0.5
pF
s
V = 0, f - 1 MHz
0.8
0.8
IF = 16 mA, VCC = 5 V
RL = 1.9 k
(H
Propagation Delay Time
(L H)
L)
*2
*2
tPLH
0.3
s
IF = 16 mA, VCC = 5 V
RL = 1.9 k
3
PS8601, PS8601L
*2 Test Circuit for Propagation Delay Time.
I
F
Pulse Input
I
F
V
V
CC = 5 V
50 %
1
2
3
4
8
7
6
5
PW = 100 µs
Duty Cycle = 1/10
0
RL
5 V
V
O
V
O
IF Monitor
1.5 V
1.5 V
V
O
Monitor
OL
51 Ω
t
PHL
t
PLH
4
PS8601, PS8601L
TYPICAL CHARACTERISTICS (TA = 25 C)
MAX. FORWARD CURRENT vs.
AMBIENT TEMPERATURE
TRANSISTOR POWER DISSIPATION
vs. AMBIENT TEMPERATURE
30
20
10
120
100
80
60
40
20
0
0
25
50
75
100
125
25
50
75
100
125
TA - Ambient Temperature - ˚C
TA - Ambient Temperature - ˚C
FORWARD CURRENT vs.
FORWARD VOLTAGE
OUTPUT CURRENT vs.
OUTPUT VOLTAGE
10
8
100
10
IF = 25 mA
6
IF = 20 mA
IF = 15 mA
IF = 10 mA
TA =100 ˚C
50 ˚C
1.0
25 ˚C
0 ˚C
–25 ˚C
4
2
0
0.1
IF = 5 mA
0.01
1.0
1.2
1.4
1.6
1.8
2.0
2.2 2.4
0
2
4
6
8
10 12 14 16 18 20
VF - Forward Voltage - V
VO - Output Voltage - V
CURRENT TRANSFER RATIO
vs. FORWARD CURRENT
NORMALIZED OUTPUT CURRENT
vs. AMBIENT TEMPERATURE
2.0
1.8
50
Normalized to
at TA = 25 ˚C
VCC = 4.5 V
VO = 0.4 V
VCC = 4.5 V
VO = 0.4 V
TA = 25 ˚C
1.6
1.4
40
30
20
10
IF = 16 mA
1.2
1.0
0.8
0.6
0.4
0.2
0.0
∆
0
.1
–75 –50 –20
0
25
50 75 100 125
.5
1
5
10
50 100
IF - Forward Current - mA
TA - Ambient Temperature - ˚C
5
PS8601, PS8601L
OUTPUT VOLTAGE vs.
FORWARD CURRENT
HIGH LEVEL OUTPUT CURRENT
vs. AMBIENT TEMPERATURE
1000
100
10
7
V
CC = 5 V
IF = 0
I
F
V
CC
6
5
RL
4
3
V
CC = V
O
= 35 V
= 5.5 V
RL = 1.9 kΩ
5.6 kΩ
VCC = V
O
2
1
1
10 kΩ
0
.1
–25
0
2
4
6
8
10 12 14 16 18 20
0
25
50
75
100
I
F
- Forward Current - mA
TA - Ambient Temperature - ˚C
PROPAGATION DELAY TIME
vs. LOAD RESISTANCE
PROPAGATION DELAY TIME
vs. AMBIENT TEMPERATURE
3.0
2.5
10
5
V
CC = 5 V
= 16 mA
R = 1.9 kΩ
µ
µ
V
CC = 5 V
= 16 mA
IF
IF
L
t
PLH
2.0
1
1.5
1.0
0.5
.5
t
PLH
t
PHL
t
PHL
.1
0.0
–75 –50 –25
0
25
50 75 100 125
1
5
10
50
100
RL - Load Resistance - kΩ
T
A
- Ambient Temperature - ˚C
6
PS8601, PS8601L
TAPING
1. TAPING DIRECTION
PS8601L-E3
N
1 0 1
× × P S 8 6
N E C J A P A N
1 0 1
× ×
A P A N
2. OUTLINE AND DIMENSIONS (TAPE)
Unit: mm
SYMBOL
RATINGS
10.7 0.1
10.3 0.1
1.55 0.1
1.55 0.1
1.75 0.1
7.5 0.1
4.0 0.1
12.0 0.1
2.0 0.1
4.3 0.2
0.3
T0
P0
D0
P2
A
B
D0
D1
E
D1
P1
T1
F
P0
P1
P2
T0
T1
W
A
16 0.3
3. OUTLINE AND DIMENSIONS (REEL)
Unit: mm
SYMBOL
RATINGS
330
A
N
2 ± 0.5
80 5.0
+2.0
W
φ18.0 ± 0.5
W
16.4
0
φ21 ± 0.8
R1.0
4. PACKING; 1000 pieces/reel
7
PS8601, PS8601L
SOLDERING PRECAUTION
(1) Infrared reflow soldering
•
•
Peak temperature : 235 C or lower (plastic surface)
Time
: 30 s or less
(Time during plastic surface temperature overs 210 C)
•
•
No. of reflow times : Three
Flux
: Rosin-base flux
INFRARED RAY REFLOW TEMPERATURE PROFILE
(ACTUAL HEAT)
to 10 s
235 ˚C MAX
210 ˚C
to 30 s
120 to 160 ˚C
60 to 90 s
(PRE-HEAT)
TIME (s)
<NOTES>
(1) Please avoid be removed the residual flux by water after the first reflow processes.
Peak Temperature 235 ˚C or lower
(2) Dip soldering
•
•
•
Peak temperature : 260 C or lower
Time
Flux
: 10 s or less
: Rosin-base flux
8
PS8601, PS8601L
SPECIFICATION OF VDE MARKS LICENSE DOCUMENT (VDE0884)
PARAMETER
Application classification (DIN VDE0109)
SYMBOL
SPECK
UNIT
for rated line voltages 300 Veff
for rated line voltages 600 Veff
IV
III
Climatic test class (DIN IEC 68 Teil 1/09.80)
55/100/21
Dielectric strength maximum operating isolation voltage.
Test voltage (partial discharge test procedure a for type test and random test)
Upr = 1.2 UIORM, Pd < 5 pC
UIORM
Upr
890
Vpeak
Vpeak
1 068
Test voltage (partial discharge test procedure b for random test)
Upr = 1.6 UIORM, Pd < 5 pC
Upr
1 424
Vpeak
Highest permissible overvoltage
Degree of pollution (DIN VDE 0109)
Clearance distance
UTR
8 000
2
Vpeak
> 7.0
mm
mm
Creepage distance
> 7.0
Comparative tracking index (DIN IEC 112/VDE 0303 part 1)
Material group (DIN VDE0109)
Storage temperature range
CTI
175
IIIa
Tstg
55 to +150
55 to +100
Cel
Cel
Operating temperature range
Tamb
Isolation resistance, minimum value
UIO = 500 V dc at 25 Cel
Ris min
Ris min
1012
1011
ohm
ohm
UIO = 500 V dc at Tamp maximum at least 100 Cel
Safety maximum ratings (maximum permissible in case of fault, see thermal
derating curve)
Package temperature
Tsi
Isi
175
400
700
Cel
mA
mW
Current (input current IF, Psi = 0)
Power (output or total power dissipation)
Isolation resistance
Psi
UIO = 500 V dc at 175 Cel (Tsi)
Ris min
109
ohm
9
PS8601, PS8601L
CAUTION
The Great Care must be taken in dealing with the devices in this guide.
The reason is that the material of the devices is GaAs (Gallium Arsenide), which is
designated as harmful substance according to the law concerned.
Keep the law concerned and so on, especially in case of removal.
No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this
document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from use of a device described herein or any other liability arising
from use of such device. No license, either express, implied or otherwise, is granted under any patents,
copyrights or other intellectual property rights of NEC Corporation or others.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on
a customer designated "quality assurance program" for a specific application. The recommended applications
of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each
device before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
Anti-radioactive design is not implemented in this product.
M4 96. 5
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