PS9851-1 [NEC]

HIGH NOISE REDUCTION, 15 Mbps CMOS OUTPUT TYPE 8-PIN SSOP PHOTOCOUPLER; 高降噪, 15 Mbps的CMOS输出型8引脚SSOP PHOTOCOUPLER
PS9851-1
型号: PS9851-1
厂家: NEC    NEC
描述:

HIGH NOISE REDUCTION, 15 Mbps CMOS OUTPUT TYPE 8-PIN SSOP PHOTOCOUPLER
高降噪, 15 Mbps的CMOS输出型8引脚SSOP PHOTOCOUPLER

输出元件
文件: 总10页 (文件大小:91K)
中文:  中文翻译
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PRELIMINARY DATA SHEET  
PHOTOCOUPLER  
PS9851-1,-2  
HIGH NOISE REDUCTION, 15 Mbps CMOS OUTPUT TYPE  
8-PIN SSOP PHOTOCOUPLER  
NEPOC Series−  
DESCRIPTION  
The PS9851-1, -2 are optically coupled isolators containing GaAlAs LED on the input side and a CMOS output IC  
on the output side.  
They are high common mode transient immunity (CMR), high-speed CMOS output type photocouplers designed for  
high-speed logic interface circuits.  
FEATURES  
High-speed response (15 Mbps)  
PIN CONNECTION  
• Operable at high temperature (40 to +100°C)  
(Top View)  
High common mode transient immunity (CMH, CML = 15 kV/µs TYP.)  
High isolation voltage (BV = 2 500 Vr.m.s.)  
Pulse width distortion (tPHLtPLH= 5 ns TYP.)  
Ordering number of tape product : PS9851-1-F3, F4: 1 500 pcs/reel  
: PS9851-2-F3, F4: 1 500 pcs/reel  
PS9851-1  
8
7
6
5
1. NC  
2. Anode  
3. Cathode  
4. NC  
5. GND  
Safety standards  
6. V  
O
7. NC  
8. VDD  
UL awaiting approved  
1
8
2
7
3
4
DIN EN60747-5-2 (VDE0884 Part2) awaiting approved  
PS9851-2  
6
5
1. Anode1  
2. Cathode1  
3. Cathode2  
4. Anode2  
5. GND  
APPLICATIONS  
FA Network  
6. V  
7. V  
O
2
1
Measurement equipment  
PDP  
O
8. VDD  
1
2
3
4
The information in this document is subject to change without notice. Before using this document, please confirm that  
this is the latest version.  
Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices  
representative for availability and additional information.  
Document No. PN10493EJ01V0DS (1st edition)  
Date Published May 2004 CP(K)  
Printed in Japan  
NEC Compound Semiconductor Devices 2004  
PS9851-1,-2  
PACKAGE DIMENSIONS (UNIT: mm)  
5.21 0.25 (include burr)  
5.08 0.15  
6.0 0.2  
3.95 0.1  
0.5 0.3  
1.27  
+0.10  
0.10 S  
0.25 M  
0.4  
–0.05  
MARKING EXAMPLE  
PS9851-1  
PS9851-2  
9851-1  
N451  
9851-2  
N451  
Type Number  
Type Number  
Assembly Lot *1  
Assembly Lot *1  
N
N
N 4 51  
N 4 51  
Week Assembled  
Year Assembled  
(Last 1 Digit)  
No. 1 pin Mark  
Initial of NEC  
(Engraved mark)  
Week Assembled  
Year Assembled  
(Last 1 Digit)  
No. 1 pin Mark  
Initial of NEC  
(Engraved mark)  
Rank Code  
Rank Code  
*1 For the external plating Sn-Bi product,  
*1 For the external plating Sn-Bi product,  
L is indicated at the second digit of the rank.  
L is indicated at the second digit of the rank.  
2
Preliminary Data Sheet PN10493EJ01V0DS  
PS9851-1,-2  
ORDERING INFORMATION  
Part Number  
Package  
Packing Style  
Safety Standards  
Approval  
Solder plating  
specification  
Application  
Part Number*1  
PS9851-1  
8-pin SSOP  
(SO-8)  
20 pcs (Tape 20 pcs cut)  
Standard products  
(UL awaiting  
approved)  
Sn-Pb  
PS9851-1  
PS9851-2  
PS9851-1  
PS9851-2  
PS9851-1  
PS9851-2  
PS9851-1  
PS9851-2  
PS9851-1-F3  
PS9851-1-F4  
PS9851-2  
Embossed Tape 1 500 pcs/reel  
20 pcs (Tape 20 pcs cut)  
PS9851-2-F3  
PS9851-2-F4  
PS9851-1-V  
Embossed Tape 1 500 pcs/reel  
20 pcs (Tape 20 pcs cut)  
DIN EN60747-5-2  
(VDE0884 Part2)  
awaiting approved  
(Option)  
PS9851-1-V-F3  
PS9851-1-V-F4  
PS9851-2-V  
Embossed Tape 1 500 pcs/reel  
20 pcs (Tape 20 pcs cut)  
PS9851-2-V-F3  
PS9851-2-V-F4  
PS9851-1-A  
Embossed Tape 1 500 pcs/reel  
20 pcs (Tape 20 pcs cut)  
Standard products  
(UL awaiting  
approved)  
Sn-Bi  
PS9851-1-F3-A  
PS9851-1-F4-A  
PS9851-2-A  
Embossed Tape 1 500 pcs/reel  
20 pcs (Tape 20 pcs cut)  
PS9851-2-F3-A  
PS9851-2-F4-A  
PS9851-1-V-A  
PS9851-1-V-F3-A  
PS9851-1-V-F4-A  
PS9851-2-V-A  
PS9851-2-V-F3-A  
PS9851-2-V-F4-A  
Embossed Tape 1 500 pcs/reel  
20 pcs (Tape 20 pcs cut)  
DIN EN60747-5-2  
(VDE0884 Part2)  
awaiting approved  
(Option)  
Embossed Tape 1 500 pcs/reel  
20 pcs (Tape 20 pcs cut)  
Embossed Tape 1 500 pcs/reel  
*1 For the application of the Safety Standard, following part number should be used.  
3
Preliminary Data Sheet PN10493EJ01V0DS  
PS9851-1,-2  
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)  
Parameter  
Symbol  
IF  
Ratings  
Unit  
mA  
V
Diode  
Forward Current  
Reverse Voltage  
20  
5
VR  
Detector Supply Voltage  
Output Voltage  
VDD  
VO  
0 to 5.5  
0.5 to VDD+0.5  
2
V
V
Output Current  
IO  
mA  
Vr.m.s.  
°C  
Isolation Voltage*1  
BV  
TA  
2 500  
Operating Ambient Temperature  
Storage Temperature  
40 to +100  
55 to +125  
Tstg  
°C  
*1 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output.  
RECOMMENDED OPERATING CONDITIONS (TA = 25°C)  
Parameter  
Symbol  
IF  
MIN.  
10  
TYP.  
5.0  
MAX.  
16  
Unit  
mA  
V
Forward Current  
Supply Voltage  
VDD  
4.5  
5.5  
4
Preliminary Data Sheet PN10493EJ01V0DS  
PS9851-1,-2  
ELECTRICAL CHARACTERISTICS (TA = 40 to +100°C, VDD = 4.5 to 5.5 V, unless otherwise  
specified)  
Parameter  
Symbol  
VF  
Conditions  
IF = 10 mA, TA = 25°C  
VR = 3 V, TA = 25°C  
V = 0 V, f = 1 MHz, TA = 25°C  
IF = 0 mA (1ch)  
MIN.  
TYP.*1  
1.6  
MAX.  
1.9  
Unit  
V
Diode  
Forward Voltage  
Reverse Current  
IR  
10  
µA  
pF  
mA  
Terminal Capacitance  
Ct  
30  
3
Detector High Level Supply Current  
Low Level Supply Current  
IDDH  
IDDL  
VOH  
VOL  
IFHL  
RI-O  
5
5
IF = 10 mA (1ch)  
3
High Level Output Voltage  
Low Level Output Voltage  
IO = 20µA, IF = 0 mA  
IO = 20µA, IF = 10 mA  
4.0  
5.0  
0.01  
V
0.1  
6
Threshold Input Current  
Isolation Resistance  
Coupled  
VO < 1 V  
mA  
1011  
VI-O = 1 kVDC, RH = 40 to 60%,  
TA = 25°C  
V = 0 V, f = 1 MHz, TA = 25°C  
Isolation Capacitance  
Propagation Delay Time  
(H L)*2  
CI-O  
0.9  
35  
pF  
ns  
IF = 10 mA, VDD = 5 V,  
tPHL  
60  
60  
CL = 15 pF, CMOS Levels  
Propagation Delay Time  
(L H)*2  
tPLH  
30  
5
Pulse Width  
PW  
100  
Pulse Width Distortion  
(PWD)  
tPHLtPLH  
30  
40  
Propagation Delay Skew  
Rise Time  
tPSK  
tr  
3
3
Fall Time  
tf  
VDD = 5 V, IF = 0 mA,  
Common Mode  
Transient Immunity at  
High Level Output*3  
Common Mode  
Transient Immunity at  
Low Level Output*3  
CMH  
10  
10  
15  
kV/µs  
VCM = 1 kV, VO > 4 V, TA = 25°C  
VDD = 5 V, IF = 10 mA,  
CML  
15  
VCM = 1 kV, VO < 1 V, TA = 25°C  
*1 Typical values at TA = 25°C  
5
Preliminary Data Sheet PN10493EJ01V0DS  
PS9851-1,-2  
*2 Test circuit for propagation delay time  
PS9851-1  
VDD = 5 V  
Pulse input (I  
F
)
(PW = 100 ns,  
Duty cycle = 50%)  
Input  
µ
F
0.1  
V
O
(Monitor)  
I = 10 mA  
F
Input  
CL  
= 15 pF  
(Monitor)  
50%  
47 Ω  
Output  
2.5 V  
PS9851-2  
Pulse input (I )  
F
VOL  
VDD = 5 V  
tPHL  
tPLH  
Input  
(Monitor)  
µ
0.1  
F
VO  
(Monitor)  
47 Ω  
CL  
= 15 pF  
Remark CL includes probe and stray wiring capacitance.  
*3 Test circuit for common mode transient immunity  
PS9851-1  
V
DD = 5 V  
I
F
0.1  
µF  
SW  
V
O
(Monitor)  
C
L
= 15 pF  
1 kV  
90%  
10%  
V
V
CM  
0 V  
V
CM  
t
r
t
f
O
V
OH  
PS9851-2  
(I  
F
= 0 mA)  
4 V  
1 V  
I
F
V
DD = 5 V  
V
O
SW  
V
OL  
VO (Monitor)  
(IF = 10 mA)  
0.1 µF  
CL = 15 pF  
V
CM  
Remark CL includes probe and stray wiring capacitance.  
USAGE CAUTIONS  
1. This product is weak for static electricity by designed with high-speed integrated circuit so protect against static  
electricity when handling.  
2. By-pass capacitor of more than 0.1 µF is used between VDD and GND near device. Also, ensure that the  
distance between the leads of the photocoupler and capacitor is no more than 10 mm.  
3. Avoid storage at a high temperature and high humidity.  
6
Preliminary Data Sheet PN10493EJ01V0DS  
PS9851-1,-2  
TAPING SPECIFICATIONS (UNIT: mm)  
Outline and Dimensions (Tape)  
2.0 0.05  
4.0 0.1  
+0.1  
–0  
4.05 MAX.  
1.5  
1.7 0.1  
3.6 0.1  
6.4 0.1  
0.3 0.05  
8.0 0.1  
Taping Direction  
PS9851-1-F4  
PS9851-2-F4  
PS9851-1-F3  
PS9851-2-F3  
Outline and Dimensions (Reel)  
2.0 0.5  
2.0 0.5  
13.0 0.2  
φ
R 1.0  
φ
φ
φ
φ
21.0 0.8  
13.5 1.0  
17.5 1.0  
11.9 to 15.4  
Outer edge of  
flange  
Packing: 1 500 pcs/reel  
7
Preliminary Data Sheet PN10493EJ01V0DS  
PS9851-1,-2  
NOTES ON HANDLING  
1. Recommended soldering conditions  
(1) Infrared reflow soldering  
• Peak reflow temperature  
260°C or below (package surface temperature)  
10 seconds or less  
• Time of peak reflow temperature  
• Time of temperature higher than 220°C  
60 seconds or less  
• Time to preheat temperature from 120 to 180°C 120 30 s  
• Number of reflows  
• Flux  
Three  
Rosin flux containing small amount of chlorine (The flux with a  
maximum chlorine content of 0.2 Wt% is recommended.)  
Recommended Temperature Profile of Infrared Reflow  
(heating)  
to 10 s  
260˚C MAX.  
220˚C  
to 60 s  
180˚C  
120˚C  
120 30 s  
(preheating)  
Time (s)  
(2) Wave soldering  
• Temperature  
• Time  
260°C or below (molten solder temperature)  
10 seconds or less  
• Preheating conditions  
• Number of times  
• Flux  
120°C or below (package surface temperature)  
One (Allowed to be dipped in solder including plastic mold portion.)  
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine  
content of 0.2 Wt% is recommended.)  
(3) Cautions  
• Fluxes  
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.  
2. Cautions regarding noise  
Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between  
collector-emitters at startup, the output side may enter the on state, even if the voltage is within the absolute  
maximum ratings.  
8
Preliminary Data Sheet PN10493EJ01V0DS  
PS9851-1,-2  
The information in this document is current as of May, 2004. The information is subject to change  
without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data  
books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products  
and/or types are available in every country. Please check with an NEC sales representative for  
availability and additional information.  
No part of this document may be copied or reproduced in any form or by any means without prior  
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.  
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of  
third parties by or arising from the use of NEC semiconductor products listed in this document or any other  
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any  
patents, copyrights or other intellectual property rights of NEC or others.  
Descriptions of circuits, software and other related information in this document are provided for illustrative  
purposes in semiconductor product operation and application examples. The incorporation of these  
circuits, software and information in the design of customer's equipment shall be done under the full  
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third  
parties arising from the use of these circuits, software and information.  
While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers  
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize  
risks of damage to property or injury (including death) to persons arising from defects in NEC  
semiconductor products, customers must incorporate sufficient safety measures in their design, such as  
redundancy, fire-containment, and anti-failure features.  
NEC semiconductor products are classified into the following three quality grades:  
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products  
developed based on a customer-designated "quality assurance program" for a specific application. The  
recommended applications of a semiconductor product depend on its quality grade, as indicated below.  
Customers must check the quality grade of each semiconductor product before using it in a particular  
application.  
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio  
and visual equipment, home electronic appliances, machine tools, personal electronic equipment  
and industrial robots  
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster  
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed  
for life support)  
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life  
support systems and medical equipment for life support, etc.  
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's  
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not  
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness  
to support a given application.  
(Note)  
(1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd.  
and also includes its majority-owned subsidiaries.  
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for  
NEC (as defined above).  
M8E 00. 4-0110  
9
Preliminary Data Sheet PN10493EJ01V0DS  
PS9851-1,-2  
This product uses gallium arsenide (GaAs).  
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe  
the following points.  
Caution GaAs Products  
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws  
and/or ordinances, dispose of the product as recommended below.  
1. Commission a disposal company able to (with a license to) collect, transport and dispose of  
materials that contain arsenic and other such industrial waste materials.  
2. Exclude the product from general industrial waste and household garbage, and ensure that the  
product is controlled (as industrial waste subject to special control) up until final disposal.  
• Do not burn, destroy, cut, crush, or chemically dissolve the product.  
• Do not lick the product or in any way allow it to enter the mouth.  
For further information, please contact  
NEC Compound Semiconductor Devices, Ltd.  
http://www.ncsd.necel.com/  
E-mail: salesinfo@ml.ncsd.necel.com (sales and general)  
techinfo@ml.ncsd.necel.com (technical)  
5th Sales Group, Sales Division TEL: +81-44-435-1588 FAX: +81-44-435-1579  
NEC Compound Semiconductor Devices Hong Kong Limited  
E-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general)  
TEL: +852-3107-7303  
TEL: +886-2-8712-0478 FAX: +886-2-2545-3859  
TEL: +82-2-558-2120  
FAX: +82-2-558-5209  
FAX: +852-3107-7309  
Hong Kong Head Office  
Taipei Branch Office  
Korea Branch Office  
NEC Electronics (Europe) GmbH  
http://www.ee.nec.de/  
TEL: +49-211-6503-0 FAX: +49-211-6503-1327  
California Eastern Laboratories, Inc.  
TEL: +1-408-988-3500 FAX: +1-408-988-0279  
http://www.cel.com/  
0401  

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