SVHB21C105M [NEC]
SURFACE MOUNT RESIN MOLDED TANTALUM CHIP CAPACITORS HIGH RELIABILITY; 表面贴装树脂成型片式钽电容器高可靠性
| 型号： | SVHB21C105M |
| 厂家： | 
NEC |
| 描述： | SURFACE MOUNT RESIN MOLDED TANTALUM CHIP CAPACITORS HIGH RELIABILITY |
| 文件： | 总20页 (文件大小：104K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATA SHEET
TANTALUM CAPACITOR
SV/H SERIES
SURFACE MOUNT RESIN MOLDED TANTALUM CHIP CAPACITORS
HIGH RELIABILITY
NEC’s SV/H series solid tantalum capacitor has developed for automotive application.
Comparing to the former type (R Series), the higher reliability and the higher performance have been built in the
same chip size with the NEC’s original technologies.
FEATURES
The SV/H series has the highest level of reliability and performance in the tantalum chip capacitors as shown below.
•
•
•
•
Damp heat (steady state)
: 85°C, 85% RH 1000 hours
Rapid change of temperature: –55°C to +125°C, 1000 cycles
Resistance to soldering
Failure rate
: 260°C, 10 sec (Fully immersed to solder)
: 0.5%/1000 hours (at 85°C, rated voltage applied)
APPLICATIONS
•
•
Automotive electronics
Other electronic equipment which requires high reliability and performance.
DIMENSIONS
L
W
1
L
W1
Y
L
W
1
Z
Z
Z
Z
Z
Z
[A Case]
[B2 Case]
[C, D2 Case]
(Unit: mm)
Case Code
L
W1
W2
H
Z
Y
–
A
B2
C
3.2 ± 0.2
3.5 ± 0.2
6.0 ± 0.3
5.8 ± 0.3
1.6 ± 0.2
2.8 ± 0.2
3.2 ± 0.3
4.6 ± 0.3
1.2 ± 0.1
2.3 ± 0.1
1.8 ± 0.1
2.4 ± 0.1
1.6 ± 0.2
1.9 ± 0.2
2.5 ± 0.3
3.2 ± 0.3
0.8 ± 0.3
0.8 ± 0.3
1.3 ± 0.3
1.3 ± 0.3
–
0.4C
–
D2
The information in this document is subject to change without notice.
Document No. EC0064EJ2V1DS00 (2nd edition)
Date Published July 2000 P CP(K)
Printed in Japan
1990 (1996)
©
SV/H SERIES
MARKING
- Upper face -
[A Case]
polarity (anode)
[B2 Case]
capacitance (µF)
1
35N
rated voltage
C105
production date code
rated voltage (V)
polarity (anode)
capacitance code (pF)
rated voltage code
[A:10 V, C:16 V, D:20 V, E:25 V, V:35 V]
[C Case]
[D2 Case]
polarity (anode)
capacitance (µF)
6.8
capacitance (µF)
10
16N
35N
production date code
rated voltage (V)
polarity (anode)
production date code
rated voltage (V)
- Bottom face -
(for A case sizes)
N
production date code
[Marking of production date code]
M
Jan.
Feb.
Mar.
Apr.
May
Jun.
Jul.
Aug.
Sept.
Oct.
Nov.
Dec.
Y
1995
1996
1997
1998
a
n
b
p
c
q
d
r
e
s
f
t
g
u
h
v
j
k
x
l
m
z
w
J
y
L
Y
A
N
B
P
C
Q
D
R
E
S
F
T
G
U
H
V
K
X
M
Z
W
Data code will resume beginning in 1999.
2
SV/H SERIES
PRODUCT LINE UP AND CASE CODE
UR (Vdc)
10 V
16 V
20 V
25 V
35 V
Capacitance (µF)
0.1
A
A
0.15
0.22
0.33
0.47
0.68
1
A
A
A
B2
B2
B2
C
A
A
A
1.5
B2
2.2
A
B2
C
3.3
B2
C
4.7
B2
C
D2
D2
6.8
C
10
C
D2
15
22
33
C
D2
D2
D2
U
R
: Rated voltage
PART NUMBER SYSTEM
- Bulk –
SVH B2 1V 105 M
Capacitance Tolerance M : ±20 %
K : ±10 %
Capacitance Code in pF: First two digits represent significant figures. Third digit
specifies number of zeros to follow. (105: 1 µF)
Rated Voltage
(1A: 10 V, 1C: 16 V, 1D: 20 V, 1E: 25 V, 1V: 35 V)
Case Code
Series Name
- Tape and Reel -
TE SVH B2 1V 105M 8 R
R : negative terminal on sprocket hole side
L : positive terminal on sprocket hole side
Packing orientation
Tape width 8 mm for A, B2 case
12 mm for C, D2 case
Same as bulk part
Tape and reel
3
SV/H SERIES
PERFORMANCE
No.
1
Items
Specifications
Test Conditions
Operating Temp. Range –55 to +125°C
Applied voltage shall be
derated over +85°C
2
3
4
5
6
7
Rated Voltage
10
13
16
20
10
20
26
13
25
33
16
35
46
22
Vdc
Vdc
Vdc
Surge Voltage
at 85°C
Derated Voltage
Capacitance Range
6.3
at 125°C
0.1 to 33 µF
Capacitance Tolerance ±20%, ±10%
at 120 Hz
Leakage Current
Tangent of loss angle
Surge Voltage
0.01CV (µA) or 0.5 (µA) whichever is greater
Rated Voltage applied
after 5 minutes.
8
9
0.1 to 4.7 µF: 0.04 MAX.
6.8 to 33 µF : 0.06 MAX.
at 120 Hz
∆C/C
: ±5%
at 85°C, Rs = 1 kΩ
Tangent of loss angle: initial requirement
1000 cycles
Leakage Current
: initial requirement
10
Charac-
teristics
at high
Temp.
–55°C
+85°C
+125°C
∆C/C
0
+12
+15
0
%
%
%
–12
0
and low
Tangent of 0.1 to 4.7 µF: 0.08 MAX.
initial
0.1 to 4.7 µF: 0.06 MAX.
temperature
loss angle
6.8 to 33 µF : 0.10 MAX.
requirement 6.8 to 33 µF : 0.08 MAX.
Leakge
Current
—
0.1 CV or 5 µA
0.125 CV or 6.25 µA
MAX.
MAX.
11
Rapid change of
temperature
∆C/C
: ±10%
IEC68-2-14 Test N and
IEC68-22-33 Guidance
–55°C to +125°C,
1000 cycles
Tangent of loss angle: initial requirement
Leakage Current
: initial requirement
12
13
Resistance to
Soldering
∆C/C
: ±5%
IEC68-2-58 Test Td
Fully immersion to Solder
260°C, 10 sec
Tangent of loss angle: initial requirement
Leakage Current
: initial requirement
Damp Heat
∆C/C
: ±10%
IEC68-2-3 Test Ca
at 85°C, 85% RH,
1000 h
(steady state)
Tangent of loss angle: 150% of initial requirement
Leakage Current : initial requirement
14
15
Terminal Strength
Endurance (1)
There shall be no loosening or permanent damage
pull of 5N in an axial
direction
∆C/C
: ±10%
at 85°C, Rated Voltage
Tangent of loss angle: initial requirement
applied 2000 h
Leakage Current
: 125% of initial requirement
: ±10%
16
17
Endurance (2)
Failure Rate
∆C/C
at 125°C, Derated
Tangent of loss angle: initial requirement
Voltage applied 2000 h
Leakage Current
: 125% of initial requirement
0.5%/1000 h
each condition of No. 15
and No. 16 above
4
SV/H SERIES
STANDARD RATINGS
Rated
Leakage
Current
(µA)
Capacitance
Tangent of
loss angle
Case
Code
Voltage
(Vdc)
Part Number
(µF)
2.2
4.7
15
0.04
0.04
0.06
0.06
0.04
0.04
0.04
0.06
0.06
0.04
0.04
0.06
0.06
0.04
0.04
0.04
0.06
0.04
0.04
0.04
0.04
0.04
0.04
0.04
0.04
0.04
0.04
0.04
0.06
0.5
0.5
1.5
3.3
0.5
0.5
0.5
1.6
3.5
0.5
0.5
1.4
3.0
0.5
0.5
1.1
2.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.7
1.2
1.6
2.3
A
B2
C
SVHA1A225M
SVHB21A475M
SVHC1A156M
SVHD21A336M
SVHA1C105M
SVHA1C155M
SVHB21C335M
SVHC1C106M
SVHD21C226M
SVHA1D684M
SVHB21D225M
SVHC1D685M
SVHD21D156M
SVHA1E474M
SVHB21E155M
SVHC1E475M
SVHD21E106M
SVHA1V104M
SVHA1V154M
SVHA1V224M
SVHA1V334M
SVHB21V474M
SVHB21V684M
SVHB21V105M
SVHC1V155M
SVHC1V225M
SVHC1V335M
SVHD21V475M
SVHD21V685M
10
16
33
D2
A
1
1.5
3.3
10
A
B2
C
22
D2
A
0.68
2.2
6.8
15
B2
C
20
25
D2
A
0.47
1.5
4.7
10
B2
C
D2
A
0.1
0.15
0.22
0.33
0.47
0.68
1
A
A
A
B2
B2
B2
C
35
1.5
2.2
3.3
4.7
6.8
C
C
D2
D2
5
SV/H SERIES
TAPE AND REEL SPECIFICATION
Carrier Tape Dimensions and Packaging Quantity
embossed cavity
sprocket hole
D
A
0
t
P
P2
P0
K
direction of feed
(Unit: mm)
P2 ± 0.05
2.0
Case Code
A0 ± 0.2
1.9
B0 ± 0.2
W ± 0.3
F ± 0.05
3.5
E ± 0.1
1.75
P ± 0.1
4.0
A
B2
C
3.5
3.8
6.4
6.2
8.0
8.0
3.3
3.5
1.75
4.0
2.0
3.7
12.0
12.0
5.5
1.75
8.0
2.0
D2
5.1
5.5
1.75
8.0
2.0
D +0.1
0
Case Code
P0 ± 0.1
K ± 0.2
t
Q’ty/Reel
`
A
B2
C
4.0
4.0
4.0
4.0
φ1.5
φ1.5
φ1.5
φ1.5
1.9
2.1
3.0
3.6
0.2
0.2
0.3
0.4
2 000
2 000
500
D2
500
Reel Dimensions
W1
E
D
R
W2
Tape Width
(Unit: mm)
Tape Width
A
N
C
D
E
W1
W2
R
1
1
8
φ178 ± 2.0
φ178 ± 2.0
φ50 Min.
φ50 Min.
φ13 ± 0.5
φ13 ± 0.5
φ21 ± 0.5
φ21 ± 0.5
2.0 ± 0.5
2.0 ± 0.5
10.0 ± 1.0 14.5 max.
14.5 ± 1.0 18.5 max.
12
6
SV/H SERIES
CHARACTERISTICS DATA
Rapid change of temperature (–55°C to +125°C, n = 50)
6
4
6
4
2
2
0
0
–2
–4
–6
–2
–4
–6
0.08
0.06
0.04
0.02
0
0.08
0.06
0.04
0.02
0
µ
µ
0.1
0.01
0.1
0.01
0.001
0.001
initial
500 cycles
10 V/2.2
1000 cycles
initial
500 cycles
35 V/0.33 µF
1000 cycles
µ
F
7
SV/H SERIES
Rapid change of temperature (–55°C to +125°C, n = 50)
6
4
6
4
2
2
0
0
–2
–4
–6
–2
–4
–6
0.08
0.06
0.04
0.02
0
0.08
0.06
0.04
0.02
0
µ
µ
0.1
0.01
0.1
0.01
0.001
0.001
initial
500 cycles
1000 cycles
initial
500 cycles
1000 cycles
10 V/33 µF
35 V/6.8 µF
8
SV/H SERIES
Damp heat (steady state) (85°C, 85% RH, n = 50)
6
4
6
4
2
2
0
0
–2
–4
–6
–2
–4
–6
0.08
0.06
0.04
0.02
0
0.08
0.06
0.04
0.02
0
µ
0.1
0.01
µ
0.1
0.01
0.001
0.001
initial
500 h
1000 h
initial
500 h
35 V/0.33 µF
1000 h
10 V/2.2 µF
9
SV/H SERIES
Damp heat (steady state) (85°C, 85% RH, n = 50)
6
4
6
4
2
2
0
0
–2
–4
–6
–2
–4
–6
0.08
0.06
0.04
0.02
0
0.08
0.06
0.04
0.02
0
µ
0.1
0.01
µ
0.1
0.01
0.001
0.001
initial
500 h
1000 h
initial
500 h
1000 h
10 V/33 µF
35 V/6.8 µF
10
SV/H SERIES
Endurance (85°C, UR × 1.3 applied, n = 50)
(reference data)
6
4
6
4
2
2
0
0
–2
–4
–6
–2
–4
–6
0.08
0.06
0.04
0.02
0
0.08
0.06
0.04
0.02
0
0.1
0.01
0.1
µ
µ
0.01
0.001
0.001
initial
500 h
1000 h
initial
500 h
35 V/0.33 µF
1000 h
10 V/2.2 µF
11
SV/H SERIES
Endurance (85°C, UR × 1.3 applied, n = 50)
(reference data)
6
4
6
4
2
2
0
0
–2
–4
–6
–2
–4
–6
0.08
0.06
0.04
0.02
0
0.08
0.06
0.04
0.02
0
0.1
0.01
0.1
µ
µ
0.01
0.001
0.001
initial
500 h
1000 h
initial
500 h
1000 h
10 V/33 µF
35 V/6.8 µF
12
SV/H SERIES
FREQUENCY CHARACTERISTIC (reference data)
100
35 V/0.33 µF
10
16 V/22µ F
35 V/1µF
1
10 V/33µ F
0.1
1 k
10 k
100 k
1 M
10 M
40 M
Frequency (Hz)
13
SV/H SERIES
GUIDE TO APPLICATIONS FOR TANTALUM CHIP CAPACITORS
The failure of the solid tantalum capacitor is mostly classified into a short-circuiting mode and a large leakage
current mode. Refer to the following for reliable circuit design.
1. Field failure rate
SV/H Series tantalum chip capacitors are typically applied to decoupling, blocking, by-passing and filtering.
The SV/H Series has a very low failure rate in the field. For example, the maximum field failure rate of an SV/H
Series capacitor with a DC working voltage of 16 V is 0.0002 %/1000 hour (2 Fit) at an applied voltage of 5 V, operating
temperature of 25°C and series resistance of 3 Ω.
The maximum failure rate in the field is estimated by following expression:
T−T
0
3
V
10
λ
=
λ
0
× 2
V0
λ
: Maximum field failure rate
λ0 : 0.5%/1000 hour (The failure rate of the SV/H Series at the full rated DC working voltage at operating
temperature of 85°C and series resistance of 3 Ω.)
V
: Applied voltage in actual use
V0 : Rated DC working voltage
: Operating temperature in actual use
T
T0 : 85°C
120
The nomograph is provided for quick estima-
tion of maximum field failure rates.
102
7
4
2
110
100
90
80
70
60
50
40
30
20
Connect operating temperature T and ap-
plied voltage ratio V/V0 of interest with a
straight line. The failure rate multiplier F is
given at the intersection of this line with the
model scale. The failure rate is obtained as
λ = λ0·F.
101
7
4
2
1.0
0.9
0.8
100
7
4
0.7
0.6
2
10–1
7
Examples:
0.5
0.4
Given V/V0 = 0.4 and T = 45°C, read
4
F = 4 × 10–3
.
2
Hence, λ = 0.002%/1000 hour (20 Fit).
Given V/V0 = 0.3 and T = 25°C, read
10–2
7
0.3
0.2
4
F = 4 × 10–4
.
2
Hence, λ = 0.0002%/1000 hour (2 Fit).
10–3
7
4
2
10–4
7
4
2
0.1
10–5
14
SV/H SERIES
2. Series resistance
As shown in Figure 1, reliability is increased by inserting a series resistance of at least 3 Ω/V into circuits where
current flow is momentary (switching circuits, charge/discharge circuits, etc.).
If the capacitor is in a low-impedance circuit, the voltage applied to the capacitor should be less than 1/2 to 1/3
of the rated DC working voltage.
10
1
0.1
0.1
1
10
100
Series Resistance (Ω/V)
Figure 1. Effects of Series Resistance
3. Ripple voltage
The sum of DC voltage and peak ripple voltage should not exceed the rated DC working voltage of the capacitor.
100
10
1
100
10
1
Case: A, B
2
Case: C, D
2
35 V
25 V
20 V
16 V
10 V
35 V
25 V
20 V
16 V
@ 25°C
@ 25°C
10 V
0.1
0.1
0.1
1
10
100
0.1
1
10
100
Frequency (kHz)
Frequency (kHz)
Figure 2. Permissible Ripple Voltage vs. Frequency
Figure 2 is based on an ambient temperature of 25°C. For higher temperature, permissible ripple voltage shall
be derated as follows.
Permissible voltage @ 50°C = 0.7 × permissible voltage @25°C
Permissible voltage @ 85°C = 0.5 × permissible voltage @25°C
Permissible voltage @ 125°C = 0.3 × permissible voltage @25°C
15
SV/H SERIES
4. Reverse voltage
Because the capacitors are polarized, reverse voltage should not be applied.
If reverse voltage cannot be avoided because of circuit design, the voltage application should be for a very short
time and should not exceed the following.
10% MAX. of rated DC working voltage @25°C
5% MAX. of rated DC working voltage @85°C
1% MAX. of rated DC working voltage @125°C
5. Mounting
(1) Direct soldering
Keep in mind the following points when soldering the capacitor by means of jet soldering or dip soldering:
(a) Temporarily fixing resin
Because the SV/H series solid tantalum capacitors are larger in size and subject to more force than the
chip multilayer ceramic capacitors or chip resistors, more resin is required to temporarily secure the solid
tantalum capacitors. However, if too much resin is used, the resin adhering to the patterns on a printed
circuit board may adversely affect the solderability.
(b) Pattern design
b
a
c
a
Case
A
a
b
c
2.9
3.0
4.1
5.4
1.7
2.8
2.3
2.9
1.2
1.6
2.4
2.4
B2
C
D2
The above dimensions are for reference only. If the capacitor is to be mounted by this method, and if the
pattern is too small, the solderability may be degraded.
(c) Temperature and time
Keep the peak temperature and time to within the following values:
Solder temperature ............ 260°C max.
Time ................................. 10 seconds max.
Whenever possible, perform preheating (at 150°C max.) for smooth temperature profile. To maintain the
reliability, mount the capacitor at a low temperature and in a short time whenever possible.
(d) Component layout
If many types of chip components are mounted on a printed circuit board which is to be soldered by means
of jet soldering, solderability may not be uniform over the entire board depending on the layout and density
of the components on the board (also take into consideration generation of flux gas).
16
SV/H SERIES
(e) Flux
Use resin-based flux. Do not use flux with strong acidity.
(2) Reflow soldering
Keep in mind the following points when soldering the capacitor in a soldering oven or with a hot plate:
(a) Pattern design
b
a
c
a
Case
A
a
b
c
1.6
1.6
2.4
2.4
1.7
2.8
2.3
2.9
1.2
1.6
2.4
2.4
B2
C
D2
The above dimensions are for reference only. Note that if the pattern is too big, the component may not
be mounted in place.
(b) Temperature and time
Keep the peak temperature and time to within the following values:
Solder temperature .............. 260°C max.
Time: 10 seconds max.
Whenever possible, perform preheating (at 150°C max.) for smooth temperature profile. To maintain the
reliability, mount the capacitor at a low temperature and in a short time whenever possible. The peak
temperature and time shown above are applicable when the capacitor is to be soldered in a soldering over
or with a hot plate. When the capacitor is soldered by means of infrared reflow soldering, the internal
temperature of the capacitor may rise beyond the surface temperature.
(3) Using soldering iron
When soldering the capacitor with a soldering iron, controlling the temperature at the tip of the soldering iron
is very difficult. However, it is recommended that the following temperature and time be observed to maintain
the reliability of the capacitor:
Iron temperature ......... 300°C max.
Time ........................... 3 seconds max.
Iron power .................. 30 W max.
17
SV/H SERIES
6. Cleaning
Generally, several organic solvents are used for flux cleaning of an electronic component after soldering. Many
cleaning methods, such as immersion cleaning, rinse cleaning, brush cleaning, shower cleaning, vapor cleaning, and
ultrasonic cleaning, are available, and one of these cleaning methods may be used alone or two or more may be used
in combination. The temperature of the organic solvent may vary from room temperature to several 10°C, depending
on the desired effect. If cleaning is carried out with emphasis placed only on cleaning effect, however, the marking
on the electronic component cleaned may be erased, the appearance of the component may be damaged, and in the
worst case, the component may be functionally damaged. It is therefore recommended that the R series solid tantalum
capacitor be cleaned under the following conditions:
[Recommended conditions of flux cleaning]
(1) Cleaning solvent ......... Chlorosen, isopropyl alcohol
(2) Cleaning method ......... Shower cleaning, rinse cleaning, vapor cleaning
(3) Cleaning time .............. 5 minutes max.
*Ultrasonic cleaning
This cleaning method is extremely effective for eliminating dust that has been generated as a result of mechanical
processes, but may pose a problem depending on the condition. As a result of an experiment conducted by NEC,
it was confirmed that the external terminals of the capacitor were cut when it was cleaned with some ultrasonic cleaning
machines. The cause of this phenomenon is considered metal fatigue of the capacitor terminals that occurred due
to ultrasonic cleaning. To prevent the terminal from being cut, decreasing the output power of the ultrasonic cleaning
machine or shortening the cleaning time may be a possible solution. However, it is difficult to specify the safe cleaning
conditions because there are many factors involved such as the conversion efficiency of the ultrasonic oscillator,
transfer efficiency of the cleaning bath, difference in cleaning effect depending on the location in the cleaning bath,
the size and quantity of the printed circuit boards to be cleaned, and the securing states of the components on the
boards. It is therefore recommended that ultrasonic cleaning be avoided as much as possible.
If ultrasonic cleaning is essential, make sure through experiments that no abnormality occur as a result of the
cleaning. For further information, consult NEC.
18
SV/H SERIES
7. Others
(1) Do not apply excessive vibration and shock to the capacitor.
(2) The solderability of the capacitor may be degraded by humidity. Store the capacitor at (–5 to +40°C) room
temperature and (40 to 60% RH) humidity.
(3) Exercise care that no external force is applied to the tape packaged products (if the packaging material is
deformed, the capacitor may not be automatically mounted by a chip mounted).
19
SV/H SERIES
No part of this document may be copied or reproduced in any form or by any means without the
prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any
errors which may appear in this document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other
intellectual property rights of third parties by or arising from use of a device described herein or
any other liability arising from use of such device. No license, either express, implied or
otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC
Corporation or others.
While NEC Corporation has been making continuous effort to enhance the reliability of its
electronic components, the possibility of defects cannot be eliminated entirely. To minimize risks
of damage or injury to persons or property arising from a defect in an NEC electronic component,
customers must incorporate sufficient safety measures in its design, such as redundancy, fire-
containment, and anti-failure features. NEC devices are classified into the following three quality
grades:
"Standard," "Special," and "Specific". The Specific quality grade applies only to devices
developed based o n a c u s t o m e r d e s i g n a t e d " q u a l i t y a s s u r a n c e p r o g r a m " f o r a s p e c i f i c
application. The recommended applications of a device depend on its quality grade, as indicated
below. Customers must check the quality grade of each device before using it in a particular
application.
Standard: Computers, office equipment, communications equipment, test and measurement
equipment, audio and visual equipment, home electronic appliances, machine tools,
personal electronic equipment and industrial robots
Special:
Transportation equipment (automobiles, trains, ships, etc.), traffic control systems,
anti- d i s a s t e r s y s t e m s , a n t i - c r i m e s y s t e m s , s a f e t y e q u i p m e n t a n d m e d i c a l
equipment (not specifically designed for life support)
Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control
systems, life support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets
or Data Books. If customers intend to use NEC devices for applications other than those
specified for Standard quality grade, they should contact an NEC sales representative in
a d v a n c e.
(Note)
(1) "NEC" as used in this statement means NEC Corporation and also includes its majority-
owned subsidiaries.
(2) "NEC electronic component products" means any electronic component product developed
or manufactured by or for NEC (as defined above).
DE0202
相关型号：
SVHB21E155K
Tantalum Capacitor, Polarized, Tantalum (dry/solid), 25V, 10% +Tol, 10% -Tol, 1.5uF, Surface Mount, 1411, CHIP
RENESAS
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