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SVSP0J106M [NEC]

Surface mount resin molded, Ultra miniaturized chip; 表面贴装树脂成型,超小型化的芯片
SVSP0J106M
型号: SVSP0J106M
厂家: NEC    NEC
描述:

Surface mount resin molded, Ultra miniaturized chip
表面贴装树脂成型,超小型化的芯片

文件: 总16页 (文件大小:125K)
中文:  中文翻译
下载:  下载PDF数据表文档文件

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ETC