UPC1663 [NEC]
DC to VHF WIDEBAND DIFFERENTIAL INPUT AND OUTPUT AMPLIFIER IC; DC到VHF宽带差分输入和输出放大器IC
| 型号： | UPC1663 |
| 厂家： | 
NEC |
| 描述： | DC to VHF WIDEBAND DIFFERENTIAL INPUT AND OUTPUT AMPLIFIER IC |
| 文件： | 总16页 (文件大小：94K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
µPC1663
DC to VHF WIDEBAND DIFFERENTIAL INPUT AND OUTPUT AMPLIFIER IC
DESCRIPTION
The µPC1663 is a differential input, differential output wideband amplifier IC that uses an high frequency silicon
bipolar process. This process improves bandwidth phase characteristics, input noise voltage characteristics, and low
power consumption when compared to conventional HF-band differential amplifier ICs.
These features make this device suitable as a wideband amplifier in high-definition TVs, high-resolution monitors,
broadcasting satellite receivers, and video cameras, as a sense amplifier in high-density CCD and optical pick-up
products, or as a pulse amplifier for optical data links.
These ICs are manufactured using NEC’s 6 GHz fT NESATTM I silicon bipolar process. This process uses silicon
nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and
prevent corrosion/migration. Thus, these ICs have excellent performance, uniformity and reliability.
FEATURES
•
Bandwidth and typical gain: 120 MHz @ AVOL = 300
700 MHz @ AVOL = 10
•
•
•
•
•
Phase delay
: –85 deg. @ AVOL = 100, 100 MHz
Input Noise Voltage
Supply Current
: 3 µVr.m.s. (RS = 50 Ω, 10 k to 10 MHz)
±
: 13mA TYP. @ VCC = ±6 V
Gain adjustable from 10 to 300 with external resistor
No frequency compensation required (Small phase delay at 10 MHz or less)
ORDERING INFORMATION
Part Number
Package
Marking
1663
Supplying Form
Embossed tape 12 mm wide.
µPC1663G-E1
8-pin plastic SOP (225 mil)
Pin 1 is in tape pull-out direction.
Qty 2.5 kp/reel.
µPC1663GV-E1
8-pin plastic SSOP (175 mil)
Embossed tape 8 mm wide.
Pin 1 is in tape pull-out direction.
Qty 1 kp/reel.
Remark To order evaluation samples, please contact your local NEC sales office. (Part number for sample order:
µPC1663G, µPC1663GV)
Caution µPC1663C (8-pin plastic DIP) is discontinued.
Caution Electro-static sensitive devices
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. G11024EJ6V0DS00 (6th edition)
Date Published September 1999 N CP(K)
Printed in Japan
The mark
shows major revised points.
©
1987, 1999
µPC1663
CONNECTION DIAGRAM
(Top View)
Pin No.
Pin Name
IN2
1
2
3
4
8
7
6
5
1
2
3
4
5
6
7
8
G1B
−
VCC
OUT2
OUT1
VCC+
G1A
IN1
PIN EXPLANATIONS
In Dual
Bias
In Single
Bias
Pin
No.
Pin
Functions and Applications
Input pin
Internal Equivalent Circuit
Name
(V)
(V)
8
1
IN1
IN2
Pin
Apply
voltage
VCC/2
voltage
0
6
5
4
OUT1
OUT2
Pin
Apply
voltage
VCC/2
Output pin
voltage
0
6
VCC+
±2 to ±6.5
–0.3 to +14 Plus voltage supply pin.
This pin should be
8
1
2
5
4
7
Note
Note
connected with bypass
capacitor to minimize AC
impedance.
(G2A
)
(G2B)
3
VCC–
GND
Minus voltage supply pin.
This pin should be
3
connected with bypass
capacitor to minimize AC
impedance.
7
2
G1A
G1B
—
—
Gain adjustment pin.
External resistor from 0 to
10 kΩ can be inserted
between pin 2 and 7 to
determine gain value.
Internal circuit constants should be referred to
application note.
Note µPC1664 which had G2A, G2B of the other gain adjustment pins is discontinued.
2
Data Sheet G11024EJ6V0DS00
µPC1663
ABSOLUTE MAXIMUM RATINGS (TA = +25 °C)
Parameter
Supply Voltage
Symbol
µPC1663G
±7
µPC1663GV
Unit
V
±
VCC
±7
Power Dissipation
Differential Input Voltage
Input Voltage
PD
VID
280 (T
A = +75°C)Note
280 (TA = +75 °C)Note
mW
V
±5
±5
±6
VICM
±6
V
(within VCC− to VCC+ range)
(within VCC− to VCC+ range)
Output Current
IO
TA
35
35
mA
°C
Operating Ambient Temperature
Storage Temperature
−45 to +75
−55 to +150
−45 to +75
−55 to +150
Tstg
°C
Note Mounted on double sided copper clad 50 × 50 × 1.6 mm epoxy glass PWB
RECOMMENDED OPERATING CONDITIONS
Parameter
Supply Voltage
Symbol
MIN.
±2
TYP.
±6
MAX.
±6.5
20
Unit
V
±
VCC
Output Source Current
Output Sink Current
IO source
IO sink
fopt
—
—
mA
mA
MHz
—
—
2.5
Operating Frequency Range
DC
—
200
3
Data Sheet G11024EJ6V0DS00
µPC1663
±
ELECTRICAL CHARACTERISTICS (TA = +25 °C, VCC = ±6 V)
Parameter
Symbol
Avd
Conditions
f = 10 MHzNote 1
MIN.
200
8
TYP.
320
10
MAX.
500
12
—
Unit
—
Differential Voltage Gain
Gain 1
Gain 2
Gain 1
Gain 2
Gain 1
Gain 2
Gain 1
Gain 2
Gain 1
Gain 2
f = 10 MHzNote 2
Bandwidth
BW
tr
RS = 50 Ω (3 dB down point)
—
120
700
2.9
2.7
2
MHz
ns
—
—
Rise Time
RS = 50 Ω, Vout = 1 VP-P
RS = 50 Ω, Vout = 1 VP-P
—
—
—
—
Propagation Delay
Input Resistance
tpd
—
—
ns
—
1.2
4.0
180
2
—
Rin
—
—
kΩ
50
—
—
Input Capacitance
Input Offset Current
Input Bias Current
Input Noise Voltage
Input Voltage Range
Cin
IIO
—
pF
µA
—
0.4
20
5.0
40
—
IB
—
µA
Vn
RS = 50 Ω, 10 k to 10 MHz
Vcm = ±1 V, f ≤ 100 kHz
—
3
µVr.m.s.
V
VI
±1.0
53
—
—
Common Mode
Rejection Ratio
Gain 2
CMR
94
—
dB
Supply Voltage Rejection Ratio
Output Offset Voltage Gain 1
Gain 2
SVR
∆V = ±0.5 V
50
—
70
0.3
0.1
2.9
4.0
3.6
13
—
1.5
1.0
3.4
—
dB
V
VO(off)
VO(off) = |OUT1 – OUT2|
—
Output Common Mode Voltage
Output Voltage Swing
Output Sink Current
VO(CM)
VOP-P
Isink
2.4
3.0
2.5
—
V
Single-ended
VP-P
mA
mA
—
Power Supply Current
ICC
20
Notes 1. Gain select pins G1A and G1B are connected.
2. All gain select pins are opened.
4
Data Sheet G11024EJ6V0DS00
µPC1663
TEST CIRCUIT
50 Ω
IN
Z
S
= 50 Ω
50 Ω
1
2
3
4
8
7
6
5
µ
0.1
F
1 000 pF
1 000 pF
–
+
V
CC
V
CC
µ
0.1 F
Measurement value at
OUT connector should
be converced into DUT’s
output value at pin 5.
Remark
1 kΩ
OUT
950 Ω
µ
0.1
F
Z
50 Ω
L
=
Remark
Definition and test circuit of each characteristic should be referred to application note ‘Usage of
µPC1663 (Document No. G12290E)’.
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired
oscillation).
(3) The bypass capacitor should be attached to VCC line.
(4) When gain between Gain 1 and Gain 2 is necessary, insert adjustment resistor (0 to 10 kΩ) between
G1A and G1B to determine gain value.
(5) Due to high-frequency characteristics, the physical circuit layout is very critical. Supply voltage line
bypass, double-sided printed-circuit board, and wide-area ground line layout are necessary for stable
operation. Two signal resistors connected to both inputs and two load resistors connected to both
outputs should be balanced for stable operation.
+
V
CC
50 Ω
(150 Ω to ∞)
(150 Ω to ∞)
50 Ω
–
V
CC
5
Data Sheet G11024EJ6V0DS00
µPC1663
TYPICAL CHARACTERISTICS (Unless otherwise specified TA = +25 °C)
RELATIVE VOLTAGE GAIN vs. OPERATING
AMBIENT TEMPERATURE
SINGLE-ENDED VOLTAGE GAIN vs. FREQUENCY
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.1
V
CC± = ± 6 V
60
50
40
30
20
10
0
Gain 2
Gain 1
Gain 2
Gain 1
100 K
1 M
10 M
100 M
Frequency f (Hz)
Remark Differential voltage gain is double of
single-ended voltage gain.
±2
±3
±4
±5
±6
±7
±8
Supply Voltage VCC± (V)
OUTPUT SINK CURRENT vs. OPERATING
AMBIENT TEMPERATURE
RELATIVE GAIN vs. OPERATING AMBIENT
TEMPERATURE
1.05
1.00
0.95
0.90
4.0
3.5
3.0
2.5
V
CC±= ±6 V
Gain 2
Gain 1
V
CC± = ±6 V
–20
0
+20
+50
+80
(°C)
–20
0
+20
+50
+80
Operating Ambient Temperature T
A
Operating Ambient Temperature T (°C)
A
Remark Relative voltage gains are described based on gains 1.00 at T
A
= +25°C, VCC± = ±6 V
6
Data Sheet G11024EJ6V0DS00
µPC1663
SINGLE-ENDED OUTPUT VOLTAGE SWING vs.
OPERATING AMBIENT TEMPERATURE
DIFFERENTIAL VOLTAGE GAIN vs. GAIN ADJUST
RESISTANCE
5.0
1000
V
CC± = ±6 V
4.5
4.0
3.5
3.0
2.5
100
10
10
100
1 k
10 k
Gain Adjust Resistance RADJ (Ω)
V
CC± = ±6 V
–20
0
+20
+50
+80
Operating Ambient Temperature T
A
(°C)
INPUT BIAS CURRENT vs.
SUPPLY CURRENT vs.
OPERATING AMBIENT TEMPERATURE
OPERATING AMBIENT TEMPERATURE
CC± = ±6 V
50
40
30
20
10
0
16
15
14
13
12
11
10
V
V
CC± = ±6 V
µ
–20
0
+20
+50
+80
Operating Ambient Temperature T
A
(°C)
–20
0
+20
+50
+80
Operating Ambient Temperature
TA (°C)
SUPPLY CURRENT vs. SUPPLY VOLTAGE
30
15
10
5
±2
±4
±6
±8
±10
0
Supply Voltage VCC± (V)
7
Data Sheet G11024EJ6V0DS00
µPC1663
APPLICATION CIRCUIT EXAMPLES
EXAMPLE 1
Video Line Driver Circuit Example
+6 V
COAXIAL
0.1 F
µ
Output
75 Ω
200 Ω
75 Ω
µ
PC1663
Input
75 Ω
75 Ω
200 Ω
–6 V
MAXIMUM OUTPUT VOLTAGE vs. FREQUENCY (VIDEO LINE, SINGLE-ENDED)
VCC± = ±6 V
2.0
1.0
Remark
Differential output voltage is double of single-ended output voltage.
0
100 k
1 M
10 M
100 M
1 G
Frequency f (Hz)
PHASE CHARACTERISTICS vs. FREQUENCY
CC± = ±6 V
V
0
–45
–90
Gain 2
Gain 1
–135
–180
100 k
1 M
10 M
100 M
Frequency f (Hz)
8
Data Sheet G11024EJ6V0DS00
µPC1663
EXAMPLE 2
VCC single supply application example (Outline)
VCC
R1
R1
C
µ PC1663
RL
R
2
1
R2
RL
R
= R
2
EXAMPLE 3
Photo signal detector circuit example (Outline)
V+
L
+
CC
V
C
PIN Photo Diode
NDL2102
NDL2104
NDL2208
NDL5200
OUT
OUT
1
2
RS
µPC1663
RL
RL
R
S
(Refer to data sheet
of each part number)
–
V
CC
Caution When signal source impedance for µPC1663 is critical, FET source follower buffer should be
inserted between PIN Photo diode and µPC1663 input.
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
Precautions for design in and detail application circuit examples should be referred to application note ‘Usage of
µPC1663 (Document No. G12290E)’.
9
Data Sheet G11024EJ6V0DS00
µPC1663
PACKAGE DIMENSIONS
8 PIN PLASTIC SOP (225 mil) (Unit: mm)
− µPC1663G −
8
5
detail of lead end
P
1
4
A
H
I
F
J
G
E
S
B
L
N
S
C
K
M
D
M
NOTE
ITEM MILLIMETERS
Each lead centerline is located within 0.12 mm of
its true position (T.P.) at maximum material condition.
A
5.2±0.2
B
C
0.85 MAX.
1.27 (T.P.)
+0.08
0.42
D
−0.07
E
F
G
H
I
0.1±0.1
1.57±0.2
1.49
6.5±0.3
4.4±0.15
1.1±0.2
J
+0.08
0.17
K
−0.07
L
M
N
0.6±0.2
0.12
0.10
+7°
3°
P
−3°
10
Data Sheet G11024EJ6V0DS00
µPC1663
8 PIN PLASTIC SSOP (175 mil) (Unit: mm)
− µPC1663GV −
8
5
detail of lead end
1
4
4.94 ± 0.2
3.2 ± 0.1
3.0 MAX.
0.87 ± 0.2
0.5 ± 0.2
0.15
0.65
0.575 MAX.
+0.10
–0.05
M
0.10
0.30
11
Data Sheet G11024EJ6V0DS00
µPC1663
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions. For soldering methods and
conditions other than those recommended below, contact your NEC sales representative.
Soldering Method
Infrared Reflow
Soldering Conditions
Recommended Condition Symbol
IR35-00-3
Package peak temperature: 235 °C or below
Time: 30 seconds or less (at 210 °C)
Count: 3, Exposure limit: NoneNote
VPS
Package peak temperature: 215 °C or below
Time: 40 seconds or less (at 200 °C)
Count: 3, Exposure limit: NoneNote
VP15-00-3
WS60-00-1
—
Wave Soldering
Partial Heating
Soldering bath temperature: 260 °C or below
Time: 10 seconds or less
Count: 1, Exposure limit: NoneNote
Pin temperature: 300 °C
Time: 3 seconds or less (per side of device)
Exposure limit: NoneNote
Note After opening the dry pack, keep it in a place below 25 °C and 65 % RH for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E)
12
Data Sheet G11024EJ6V0DS00
µPC1663
[MEMO]
13
Data Sheet G11024EJ6V0DS00
µPC1663
[MEMO]
14
Data Sheet G11024EJ6V0DS00
µPC1663
[MEMO]
15
Data Sheet G11024EJ6V0DS00
µPC1663
ATTENTION
OBSERVE PRECAUTIONS
FOR HANDLING
ELECTROSTATIC
SENSITIVE
DEVICES
NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation.
• The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
• No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
• NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.
• Descriptions of circuits, software, and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these circuits,
software, and information in the design of the customer's equipment shall be done under the full responsibility
of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third
parties arising from the use of these circuits, software, and information.
• While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
• NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
M7 98. 8
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