UPC1687G [NEC]
GENERAL PURPOSE 5 V FREQUENCY DOWN-CONVERTER IC; 一般用途的5 V频率下转换器IC
| 型号： | UPC1687G |
| 厂家： | 
NEC |
| 描述： | GENERAL PURPOSE 5 V FREQUENCY DOWN-CONVERTER IC |
| 文件： | 总16页 (文件大小：82K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
µPC1687G/GV
GENERAL PURPOSE 5 V FREQUENCY DOWN-CONVERTER IC
DESCRIPTION
The µPC1687 is Silicon monolithic IC designed for UHF band receiver applications. This IC consists of double
balanced mixer, local oscillator, IF amplifier, and voltage regulator.
The package is 8-pin SOP or SSOP suitable for high-density surface mount.
FEATURES
•
•
•
•
•
UHF band operation
Single-end push-pull IF amplifier suppresses fluctuation in output impedance.
Good capability of UHF-varactor diode due to balanced amplifier oscillator
Supply voltage: 5 V
Packaged in 8-pin SOP or SSOP suitable for high-density mounting
APPLICATIONS
•
•
Tuners for TV and VCR
Receivers for UHF band
ORDERING INFORMATION
Part Number
Package
8-pin plastic SOP (225 mil)
Package Style
Embossed tape 12 mm wide.
µPC1687G-E1
µPC1687G-E2
µPC1687GV-E1
Pin 1 indicates pull-out direction of tape.
Qty 2.5 kp/reel.
Embossed tape 12 mm wide.
Pin 1 indicates roll-in direction of tape.
Qty 2.5 kp/reel.
8-pin plastic SSOP (175 mil)
Embossed tape 8 mm wide.
Pin 1 indicates pull-out direction of tape.
Qty 1 kp/reel.
Remark To order evaluation samples, please contact your local NEC office. (Part number for sample order:
µPC1687G, µPC1687GV)
Caution Electro-static sensitive devices
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. P11101EJ4V0DS00 (4th edition)
Date Published October 1999 N CP(K)
Printed in Japan
The mark
shows major revised points.
©
1996, 1999
µPC1687G/GV
INTERNAL BLOCK DIAGRAM
PIN CONFIGURATION (Top View)
8
7
6
5
IF Main
Amp.
1. OSC base (bypass)
2. OSC base (feedback)
3. OSC collector (coupling)
4. VCC
1
2
3
4
8
7
6
5
IF Pre
Amp.
OSC
Buffer
OSC
5. IF output
MIX
6. GND
7. RF input1 (bypass)
8. RF input2
REG.
4
1
2
3
2
Data Sheet P11101EJ4V0DS00
µPC1687G/GV
PIN EXPLANATION
Pin
Symbol
Function and Explanation
Equivalent Circuit
No.
1
OSC base
(bypass)
Internal oscillator consists in balance amplifier.
2 pin and 3 pin should be externally equiped
with tank resonater circuit in order to oscillate
with feedback loop.
3
1
2
V
CC
2
OSC base
(feedback)
1 pin should be grounded through coupling
capacitor to 5 pF.
to OSC
buffer
amp.
3 pin is defined as open collector. This pin
should be coupled through resistor or chock coil
in order to adjust Q and be supplied voltage. In
case of abnormal oscillation, adjust its Q lower
to stabilize the operation.
V
REF
3
OSC
collector
(coupling)
4
5
VCC
Supply voltage pin for the IC.
IF output
IF output pin. IF amplifier is designed as single-
end push-pull amplifier.
VCC
from IF
pre amp.
This pin is assigned for the emitter follower
output with 50 Ω constant resistive impedance
in wide band.
IF
output
5
6
7
GND
GND pin for the IC.
RF input 1
(bypass)
7 pin and 8 pin are inputs for mixer designed as
double balanced type.
VCC
to IF
Either pin can be assigned for input and another
for ground.
amp.
from
OSC
buffer
8
RF input 2
RF
input
3
Data Sheet P11101EJ4V0DS00
µPC1687G/GV
ABSOLUTE MAXIMUM RATINGS
Parameter Symbol
Conditions
Rating
6.0
Unit
V
Supply Voltage
VCC
PD
TA = +25 °C
A = +85 °C
Power Dissipation
T
Note
250
mW
°C
Operating Ambient Temperature
Storage Temperature
TA
−40 to +85
−65 to +150
Tstg
°C
Note Mounted on 50 × 50 × 1.6-mm epoxy glass PWB, with copper patterning on both sides.
RECOMMENDED OPERATING RANGE
Parameter
Symbol
VCC
MIN.
4.5
TYP.
5.0
MAX.
5.5
Unit
V
Supply Voltage
Operating Ambient Temperature
TA
−40
+25
+85
°C
ELECTRICAL CHARACTERISTICS (VCC = 5 V, TA = +25 °C)
Parameter
Circuit Current 1
Symbol
ICC1
Test Conditions
MIN.
25
TYP.
38
MAX.
48
Unit
mA
dB
No input signal
fRF = 500 MHz, fIF = 50 MHz,
Note
Conversion Gain 1
Conversion Gain 2
Noise Figure 1
CG1
22
26
29
−
OSC
−
= 5 dBm Note
PRF = 40 dBm, P
CG2
NF1
fRF = 900 MHz, fIF = 50 MHz,
20
−
24
9
27
12
13
−
dB
dB
PRF = −40 dBm, POSC = −5 dBm
Note
Note
Note
fRF = 500 MHz, fIF = 50 MHz,
POSC = −5 dBm
Noise Figure 2
NF2
fRF = 900 MHz, fIF = 50 MHz,
−
10
dB
POSC = −5 dBm
Maximum Output Power 1
Maximum Output Power 2
PO(sat)1
fRF = 500 MHz, fIF = 50 MHz,
−
+10
+10
dBm
dBm
PRF = 0 dBm, POSC = −5 dBm Note
PO(sat)2
fRF = 900 MHz, fIF = 50 MHz,
−
−
PRF = 0 dBm, POSC = −5 dBm Note
Note By test circuit 1
4
Data Sheet P11101EJ4V0DS00
µPC1687G/GV
STANDARD CHARACTERISTICS (FOR REFERENCE) (VCC = 5 V, TA = +25 °C unless otherwise specified)
Parameter
Symbol
fstb
Test Conditions
Reference Values
Unit
kHz
kHz
V
Oscillation Frequency Stability
Oscillation Frequency Drift
Oscillation Start Voltage
V
CC = ±10 %, fOSC = 550 to 950 MHz Note 1
±200
150
3.0
88
fdrift
f
f
f
f
OSC = 550 to 950 MHz, 30 min.
Note 1
Note 1
VOSC
CM1
CM2
OSC = 550 to 950 MHz
RF = 500 MHz
1 % Cross-modulation Distortion 1
1 % Cross-modulation Distortion 2
Note 2, 3
Note 2, 3
dBµ
dBµ
RF = 900 MHz
89
Notes 1. By test circuit 2
2. By test circuit 1
3. fundes = fRF ±12 MHz, PRF = −31 dBm, fIF = 50 MHz, POSC = −5 dBm
AM: 100 kHz, 30 % Mod., S/I Ratio = 46 dBc, output 75 Ω open
5
Data Sheet P11101EJ4V0DS00
µPC1687G/GV
TYPICAL CHARACTERISTICS (TA = +25 °C)
CIRCUIT CURRENT VS. SUPPLY VOLTAGE
No Input
Signal
50
40
30
20
10
0
1
2
3
4
5
6
Supply Voltage VCC (V)
NOISE FIGURE AND CONVERSION GAIN VS. INPUT FREQUENCY
CG
16
14
12
10
8
25
20
15
10
5
NF
6
V
CC = 5 V, fIF = 50 MHz,
RF Input Terminal: No Tuned, PRF = –40 dBm, POSC = –5 dBm
0
500
Input Frequency fRF (MHz)
1 000
1 200
6
Data Sheet P11101EJ4V0DS00
µPC1687G/GV
CONVERSION GAIN VS. INPUT FREQUENCY
30
25
20
15
10
5
VCC = 5 V, PRF = –40 dBm, fIF = 50 MHz, POSC = –5 dBm
RF Input Terminal: Tuned
55
200
500
900
Input Frequency fRF (MHz)
1 % CROSS-MODULATION DISTORTION VS. INPUT FREQUENCY
µ
100
90
80
70
60
V
CC = 5 V
f
undes = fRF ±12 MHz
PRF = –31 dBm
IF = 50 MHz
f
POSC = –5 dBm
AM: 100 kHz, 30 % Mod.
S/I Ratio = 46 dBc
Ω Open
Output Port: 75
0
500
1 000
1 200
Input Frequency fRF (MHz)
7
Data Sheet P11101EJ4V0DS00
µPC1687G/GV
OUTPUT POWER VS. INPUT POWER
+30
P
out
0
IM
3
V
CC = 5 V
f
IF = 50 MHz
f
RF = 900 MHz
POSC = –5 dBm
–40
0
+20
Input Power Pin (dBm)
OSC-FREQUENCY STABILITY VS. OSC-FREQUENCY
+300
VCC ±10 %
V
CC –10 %
0
V
CC +10 %
–300
0
500
1 000
1 200
Oscillation Frequency fOSC (MHz)
8
Data Sheet P11101EJ4V0DS00
µPC1687G/GV
TEST CIRCUIT 1
OSC Input
1 000 pF
47 Ω 150 nH
V
CC
5 pF
1 000 pF
4
3
6
2
7
1
8
5
1 000 pF
IF Output
RF Input
1 000 pF
1 000 pF
4 pF
TEST CIRCUIT 2
ZO
= 200 Ω
47 kΩ
= 20 mm
BT
4 pF 4 pF
HVU202
10 pF
5 pF
0.5 pF
47 Ω 150 nH
VCC
1 000 pF
4
3
6
2
7
1
8
5
1 000 pF
IF Output
RF Input
1 000 pF
1 000 pF
4 pF
9
Data Sheet P11101EJ4V0DS00
µPC1687G/GV
APPLICATION CIRCUIT EXAMPLE
ZO
= 200 Ω
47 kΩ
= 20 mm
BT
4 pF 4 pF
HVU202
10 pF
5 pF
0.5 pF
47 Ω 150 nH
V
CC
1 000 pF
4
3
6
2
7
1
8
5
1 000 pF
IF Output
RF Input
1 000 pF
4 pF
10
Data Sheet P11101EJ4V0DS00
µPC1687G/GV
PACKAGE DIMENSIONS
8 PIN PLASTIC SOP (225 mil) (UNIT: mm)
8
5
detail of lead end
+7˚
–3˚
3˚
1
4
5.2 ± 0.2
6.5 ± 0.3
1.57 ± 0.2
4.4 ± 0.15
1.1 ± 0.2
1.49
0.85 MAX.
0.6 ± 0.2
0.10
+0.08
–0.07
1.27
0.17
+0.08
–0.07
0.42
M
0.12
0.1 ± 0.1
Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition.
NOTE
11
Data Sheet P11101EJ4V0DS00
µPC1687G/GV
8 PIN PLASTIC SSOP (175 mil) (UNIT: mm)
8
5
detail of lead end
+7˚
–3˚
3˚
1
4
3.00 MAX
4.94 ± 0.2
3.2 ± 0.1
1.8 MAX
0.87 ± 0.2
1.5 ± 0.1
0.575 MAX.
0.5 ± 0.2
0.15
+0.10
–0.05
0.65
0.15
+0.10
–0.05
0.3
M
0.10
0.1 ± 0.1
Each lead centerline is located within 0.10 mm of its true position (T.P.) at maximum material condition.
NOTE
12
Data Sheet P11101EJ4V0DS00
µPC1687G/GV
NOTE ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).
(3) Keep the track length of the ground pins as short as possible.
(4) Connect a bypass capacitor (example: 1 000 pF) to the VCC pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions. For soldering methods and
conditions other than those recommended below, contact your NEC sales representative.
Soldering Method
Infrared Reflow
Soldering Conditions
Recommended Condition Symbol
IR35-00-3
Package peak temperature: 235 °C or below
Time: 30 seconds or less (at 210 °C)
Count: 3, Exposure limit: NoneNote
VPS
Package peak temperature: 215 °C or below
Time: 40 seconds or less (at 200 °C)
Count: 3, Exposure limit: NoneNote
VP15-00-3
WS60-00-1
–
Wave Soldering
Partial Heating
Soldering bath temperature: 260 °C or below
Time: 10 seconds or less
Count: 1, Exposure limit: NoneNote
Pin temperature: 300 °C
Time: 3 seconds or less (per side of device)
Exposure limit: NoneNote
Note After opening the dry pack, keep it in a place below 25 °C and 65 % RH for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
13
Data Sheet P11101EJ4V0DS00
µPC1687G/GV
[MEMO]
14
Data Sheet P11101EJ4V0DS00
µPC1687G/GV
[MEMO]
15
Data Sheet P11101EJ4V0DS00
µ
PC1687G/GV
NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation.
• The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
• No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
• NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.
• Descriptions of circuits, software, and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these circuits,
software, and information in the design of the customer's equipment shall be done under the full responsibility
of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third
parties arising from the use of these circuits, software, and information.
• While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
• NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
M7 98. 8
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