UPC8002 [NEC]
SECOND MIXER IF AMPLIFIER FOR DIGITAL CORDLESS TELEPHONES; 第二混频器的IF放大器，数字无绳电话
| 型号： | UPC8002 |
| 厂家： | 
NEC |
| 描述： | SECOND MIXER IF AMPLIFIER FOR DIGITAL CORDLESS TELEPHONES |
| 文件： | 总32页 (文件大小：209K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
µPC8002
SECOND MIXER + IF AMPLIFIER
FOR DIGITAL CORDLESS TELEPHONES
The µPC8002 is a monolithic IC developed for use in digital cordless telephones. Its internal equivalent circuits
comprise a double balanced mixer (DBM), IF amplifier circuit, and RSSI (Received Signal Strength Indicator) circuit.
The µPC8002 can operate on a wide range of power supply voltages from 2.7 V to 5.5 V, and incorporates a power-
off function, making it ideal for achieving low set power consumption.
The package is a 20-pin plastic shrink SOP (225 mil) suitable for high-density surface mounting.
FEATURES
•
•
•
•
•
•
•
Low-voltage, low-consumption-current operation possible (VCC = 2.7 to 5.5 V, ICC = 3.4 mA at VCC = 3 V)
Wide mixer input frequency range (fMIX = 250 MHz (TYP.) to 500 MHz (MAX.))
Wide IF amplifier input frequency range (fIF = 8 MHz (MIN.) to 12 MHz (MAX.), 10.7 MHz (TYP.))
High limiting sensitivity (SL = –100 dBm (TYP.))
Wide RSSI dynamic range (DR = 85 dB (TYP.))
On-chip power-off function
Use of 20-pin plastic shrink SOP (225 mil) allows high-density surface mounting
BLOCK DIAGRAM
GND
V
CC
BYPASS1 IF1 IN BYPASS2 IF1 OUT BYPASS4 IF2 IN BYPASS3 (IF OUT) (IF OUT) IF2 OUT
20
19
18
17
16
15
14
13
12
11
IF Amp 1
IF Amp 2
Output Stage
Power ON/OFF
RSSI
RSSI
2nd MIXER
1
2
3
4
5
6
7
8
9
10
PD
MIX OUT
V
CC (IF)
V
CC (MIX) LO IN GND(IF) GND(MIX) MIX IN1 MIX IN2 RSSI OUT
ORDERING INFORMATION
Part Number
Package
µPC8002GR
20-pin plastic shrink SOP (225 mil)
µPC8002GR-E1
20-pin plastic shrink SOP (225 mil)
Embossed carrier taping (pin 1 is tape unwinding direction)
µPC8002GR-E2
20-pin plastic shrink SOP (225 mil)
Embossed carrier taping (pin 1 is tape winding direction)
The information in this document is subject to change without notice.
Document No. S10717EJ2V0DS00 (2nd edition)
Date Published March 1997 N
Printed in Japan
1997
©
µPC8002
Application Circuit Example 1 (Using 2 BPFs)
V
CC
1
2
3
4
5
6
7
8
9
PD
BYPASS1 20
IF1 IN 19
1000 pF
1000 pF
0.01 µF
0.01 µF
MIX OUT
V
V
CC
V
CC (IF)
BYPASS2 18
IF1 OUT 17
1 µF
1000 pF
CC
VCC (MIX)
1 µF
1000 pF
470 pF
LO IN
BYPASS4 16
IF2 IN 15
GND (IF)
GND (MIX)
MIX IN1
MIX IN2
BYPASS3 14
GND (IF OUT) 13
470 pF
470 pF
V
CC
V
CC (IF OUT) 12
1 µF
1000 pF
IF2 OUT 11
10 RSSI OUT
Caution Ensure that the pin voltage does not exceed the power supply voltage.
Remark The VCC pass capacitors (1 µF, 1000 pF) should be located close to the respective VCC pins.
Chip laminated ceramic capacitors (MURATA GRM36 or equivalent) should be used.
2
µPC8002
Application Circuit Example 2 (Using 1 BPF)
V
CC
1
2
3
4
5
6
7
8
9
PD
BYPASS1 20
IF1 IN 19
1000 pF
1000 pF
0.01 µF
MIX OUT
V
CC
V
CC (IF)
BYPASS2 18
IF1 OUT 17
1µ F
1000 pF
V
CC
VCC (MIX)
1
F
µ
1000 pF
470 pF
LO IN
BYPASS4 16
IF2 IN 15
GND (IF)
GND (MIX)
MIX IN1
MIX IN2
BYPASS3 14
GND (IF OUT) 13
0.01
F
µ
470 pF
470 pF
V
CC
V
CC (IF OUT) 12
1µ F
1000 pF
IF2 OUT 11
10 RSSI OUT
Cautions 1. Ensure that the pin voltage does not exceed the power supply voltage.
2. With this application circuit, confirm that there is not problem with interfering wave
characteristics.
Remark The VCC pass capacitors (1 µF, 1000 pF) should be located close to the respective VCC pins.
Chip laminated ceramic capacitors (MURATA GRM36 or equivalent) should be used.
3
µPC8002
Application Circuit Example 3 (Using 1 BPF)
V
CC
1
2
3
4
5
6
7
8
9
PD
BYPASS1 20
IF1 IN 19
1000 pF
MIX OUT
V
CC
V
CC (IF)
BYPASS2 18
IF1 OUT 17
1000 pF
1µ F
1000 pF
V
CC
VCC (MIX)
390 Ω
1
F
µ
1000 pF
470 pF
LO IN
BYPASS4 16
IF2 IN 15
0.01 µF
GND (IF)
GND (MIX)
MIX IN1
MIX IN2
1000 pF
BYPASS3 14
GND (IF OUT) 13
0.01 µF
470 pF
470 pF
V
CC
V
CC (IF OUT) 12
1 µF
1000 pF
IF2 OUT 11
10 RSSI OUT
Cautions 1. With this application circuit, good interfering wave characteristics are obtained with a single
BPF. However, there is a drop in sensitivity.
2. Ensure that the pin voltage does not exceed the power supply voltage.
Remark The VCC pass capacitors (1 µF, 1000 pF) should be located close to the respective VCC pins.
Chip laminated ceramic capacitors (MURATA GRM36 or equivalent) should be used.
4
µPC8002
Application Circuit Example 4 (Using 1 BPF)
V
CC
1
2
3
4
5
6
7
8
9
PD
BYPASS1 20
IF1 IN 19
1000 pF
MIX OUT
V
CC
V
CC (IF)
BYPASS2 18
IF1 OUT 17
1000 pF
390 Ω
1
F
µ
1000 pF
V
CC
VCC (MIX)
1
F
µ
1000 pF
470 pF
LO IN
BYPASS4 16
IF2 IN 15
0.01 µF
1000 pF
0.01 µF
GND (IF)
GND (MIX)
MIX IN1
MIX IN2
1.5 µH
150 pF
BYPASS3 14
GND (IF OUT) 13
470 pF
470 pF
V
CC
V
CC (IF OUT) 12
1 µF
1000 pF
IF2 OUT 11
10 RSSI OUT
Cautions 1. With this application circuit, good interfering wave characteristics are obtained with a single
BPF (and sensitivity is better than in Application Circuit Example 3).
2. Ensure that the pin voltage does not exceed the power supply voltage.
Remark The VCC pass capacitors (1 µF, 1000 pF) should be located close to the respective VCC pins.
Chip laminated ceramic capacitors (MURATA GRM36 or equivalent) and a chip coil (MURATA LQHIN
or equivalent) should be used.
5
µPC8002
CONTENTS
1. PIN CONFIGURATION AND PIN FUNCTIONS ....................................................................................7
2. INPUT/OUTPUT EQUIVALENT CIRCUIT DIAGRAMS ........................................................................9
3. ELECTRICAL SPECIFICATIONS .......................................................................................................10
4. CHARACTERISTIC DIAGRAMS ........................................................................................................13
5. LEVEL DIAGRAMS.............................................................................................................................17
6. TEST METHODS ................................................................................................................................18
7. TEST CIRCUIT EXAMPLES ...............................................................................................................19
8. EVALUATION BOARD MOUNTING EXAMPLE .................................................................................25
9. WIRING PATTERN CAPACITANCE DIAGRAM (REFERENCE) ........................................................28
10. PACKAGE DRAWINGS.......................................................................................................................29
11. RECOMMENDED SOLDERING CONDITIONS..................................................................................30
6
µPC8002
1. PIN CONFIGURATION AND PIN FUNCTIONS
(1) Pin Configuration (Top View)
•
20-pin plastic shrink SOP (225 mil)
PD
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
BYPASS1
IF1 IN
MIX OUT
V
CC (IF)
BYPASS2
IF1 OUT
V
CC (MIX)
LO IN
BYPASS4
IF2 IN
GND (IF)
GND (MIX)
MIX IN1
BYPASS3
GND (IF OUT)
MIX IN2
VCC (IF OUT)
RSSI OUT
IF2 OUT
Pin Names
BYPASS1-BYPASS4 : Bypass
GND (IF)
: Ground (Intermediate Frequency Amp.)
GND (IF OUT)
GND (MIX)
IF1 IN, IF2 IN
: Ground (Intermediate Frequency Amp. Output)
: Ground (Mixer)
: Intermediate Frequency Amp. Input
IF1 OUT, IF2 OUT : Intermediate Frequency Amp. Output
LO IN
: Local Input
MIX IN1, MIX IN2
MIX OUT
PD
: Mixer Input
: Mixer Output
: Power Down
RSSI OUT
VCC (IF)
: Received Signal Strength Indicator Output
: Power Supply (Intermediate Frequency Amp.)
: Power Supply (Intermediate Frequency Amp. Output)
: Power Supply (Mixer)
VCC (IF OUT)
VCC (MIX)
7
µPC8002
(2) Pin Functions
No.
1
Pin Name
I/O
I
Function
PD
Power on/off control signal input
Mixer output
2
MIX OUT
VCC (IF)
O
–
–
I
3
IF amplifier and RSSI power supply pin
Mixer power supply pin
4
VCC (MIX)
LO IN
5
Local input
6
GND (IF)
GND (MIX)
MIX IN1
–
–
I
IF amplifier and RSSI ground pin
Mixer ground pin
7
8
Mixer input
9
MIX IN2
I
Filter capacitor connection
RSSI output
10
11
12
13
14
15
16
17
18
19
20
RSSI OUT
IF2 OUT
VCC (IF OUT)
GND (IF OUT)
BYPASS3
IF2 IN
O
O
–
–
–
I
IF amplifier 2 output
IF amplifier output stage power supply pin
IF amplifier output stage ground pin
Filter capacitor connection (IF2 side)
IF amplifier 2 input
BYPASS4
IF1 OUT
BYPASS2
IF1 IN
–
O
–
I
Filter capacitor connection (IF2 side)
IF amplifier 1 output
Filter capacitor connection (IF1 side)
IF amplifier 1 input
BYPASS1
–
Filter capacitor connection (IF1 side)
8
µPC8002
2. INPUT/OUTPUT EQUIVALENT CIRCUIT DIAGRAMS
Mixer Input
1 kΩ
Mixer Output
276 Ω
2
1 kΩ
700 µA
8
9
Local Input
IF Amplifier 1 Output
IF Amplifier 2 Output
RSSI Output
1 kΩ
207 Ω
17
1 kΩ
250 µA
5
IF Amplifier 1 Input
19
20
330 Ω
330 Ω
11
18
290 µA
14.9 kΩ
14.9 kΩ
IF Amplifier 2 Input
15
VCC
32 kΩ
16
10
330 Ω
330 Ω
14
11.8 kΩ
11.8 kΩ
2 kΩ
Power On/Off Input
50 kΩ
1
150 kΩ
9
µPC8002
3. ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings (TA = 25 °C)
Parameter
Power supply voltage
Total power dissipation
Storage temperature
Pin voltage
Symbol
VCC
Test Condition
Rating
7
Unit
V
PT
TA = 85 °C
120
mW
°C
V
Tstg
–40 to +125
VCC+0.2
VPIN
Caution Product quality may suffer if the absolute rating is exceeded for any parameter, even momentarily.
In other words, an absolute maximum rating is a value at which the possibility of physical damage
to the product cannot be ruled out. Care must therefore be taken to ensure that the these ratings
are not exceeded during use of the product.
Recommended Operating Ratings (TA = 25 °C)
0 dBm = 223.6 mVrms (at 50 Ω)
Parameter
Power supply voltage
Operating ambient temperature
Mixer input level
Symbol
VCC
Test Condition
MIN.
2.7
TYP. MAX.
Unit
V
3.0
5.5
+85
–18
–27
+5
TA
–30
–98
–107
–5
+25
°C
VMIX
50 Ω resistance termination
dBm
LC matching (reference value)
50 Ω resistance termination
LC matching (reference value)
Local input level
VLOC
dBm
–20
–99
–10
–14
500
12
IF amplifier input level
VIF
fMIX
fOM
fIF
dBm
MHz
MHz
MHz
pF
Mixer input frequency
250
10.7
Mixer output frequency
8
8
IF amplifier input frequency
RSSI output load capacitance
IF2 output load capacitance
10.7
12
COI
COR
10Note
10Note
pF
Note Includes all capacitances (board, pattern, etc.) applied to the pin.
10
µPC8002
Electrical Specifications (TA = 25 °C, VCC = 3 V)
(1) Mixer Section (fMIX = 250 MHz, fLOC = 239.3 MHz, VLOC = –5 dBm)
0 dBm = 223.6 mVrms (at 50 Ω)
(Where not specified in the Test Condition, input has 50 Ω termination)
Parameter
Power supply current
Conversion gain
Symbol
ICCM
Test Condition
MIN.
4
TYP. MAX.
Unit
mA
dB
No signal
1.7
2.2
GC
50 Ω resistance termination
8
17.0
–10
–3
11.0
LC matching (reference value)
–1 dB compression output level
Third order intercept point
Noise factor
VOM
IP3
–14
–7
dBm
dBm
dB
dB
dB
Ω
Stipulated by output
Note 1
Note 2
NF
16
LC matching (reference value)
Mixer non-input
7
Local separation
ISL
40
54
Mixer input impedance
Local input impedance
Output resistance
ZINM
ZINL
ROM
tONM
tOFM
ILM
31-j156
31-j169
330
8
Ω
230
430
15
3
Ω
Power-on rise time
VPO = 3 VNote 3
VPO = 0 VNote 4
VPO = 0 V
µs
Power-off fall time
1
µs
Power-off power supply current
0
5
µA
Notes 1. f1 = 250.3 MHz, f2 = 250.6 MHz
2. Leakage from local input to mixer output
3. Time until the difference between the local input pin power-on and power-off voltages reaches 90 %
Power-on input voltage (VPO) rise time: 10 ns
4. Time until the power supply current reaches 10 % of the power-on value
Power-on input voltage (VPO) fall time: 10 ns
11
µPC8002
(2) IF Amplifier Section (fIF = 10.7 MHz)
0 dBm = 223.6 mVrms (at 50 Ω)
Parameter
Power supply current
Symbol
ICCI
SL
Test Condition
MIN.
TYP. MAX.
Unit
mA
dBm
deg
Vp-p
ns
No signal
1.7
–100
10
2.3
Limiting sensitivity
–3 dB point
–97
IF amplifier phase fluctuation
IF amplifier output amplitude
IF amplifier output amplitude rise time
IF amplifier output amplitude fall time
IF amplifier input resistance
IF amplifier input capacitance
IF amplifier output resistance
RSSI linearity
SP
VIF = –70 to –14 dBm
IF2 OUT, VIF = –14 dBm
IF2 OUT, VIF = –14 dBm
IF2 OUT, VIF = –14 dBm
IF1 IN, IF2 IN
Note 1
VO
tR
0.2
0.3
8
0.4
20
tF
15
25
ns
Rin
Cin
RO
LR
230
230
18
330
3.5
330
430
6.0
430
±2
Ω
IF1 IN, IF2 IN
pF
IF1 OUT
Ω
VIF = –94 to –14 dBm
dB
RSSI slope
SR
20
22
mV/dB
RSSI intercept
IR
–164.7 –148 –134.4 dBm
RSSI output voltage 1
RSSI output voltage 2
RSSI output voltage 3
RSSI output voltage 4
RSSI output temperature stability
RSSI output dynamic range
RSSI rise time
VR1
VR2
VR3
VR4
ST
VIF = –14 dBm
VIF = –54 dBm
VIF = –94 dBm
No signal
2.58
1.76
0.88
2.68
1.88
1.08
0.96
±2
2.78
2.0
V
V
1.28
1.23
V
V
VIF = –94 to –14 dBm
Note 3
Note 2
dB
dB
µs
µs
mVp-p
kΩ
µs
µs
µA
DR
trf1
80
90
VIF = –14 dBm
VIF = –14 dBm
VIF = –14 dBm
Note 4
Note 4
1.0
4
4
RSSI fall time
trf2
1.6
RSSI output ripple
RR
ROR
tONI
tOFI
ILI
20
38.4
10
3
RSSI output resistance
Power-on rise time
25.6
32
5
VPO = 3 V, no signalNote 5
VPO = 0 VNote 6
Power-off fall time
1
Power-off power supply current
VPO = 0 V
6
10
Notes 1. Network analyzer RBW = 3 Hz
2. TA = –30 °C to +85 °C
3. Input level range for which drift from the regression expression with VIF = –94 to –14 dBm is ≤ 2 dB
4. Time until the RSSI output reaches the final value ±10 %
5. Time until the RSSI output is within ±10 % of the power-on value
Power-on input voltage (VPO) rise time: 10 ns
6. Time until the power supply current reaches 10 % of the power-on value
Power-on input voltage (VPO) fall time: 10 ns
(3) Power-On/Off Section
Parameter
Power-on input voltage
Power-off input voltage
Power-on input current
Symbol
VON
Test Condition
Power-on at VON or above, VCC or below
Power-off at VOF or below, GND or above
VPO = 3 V
MIN.
0.6
TYP. MAX.
Unit
V
1.5
1.2
40
2.4
VOF
V
ION
60
µA
12
µPC8002
4. CHARACTERISTIC DIAGRAMS
(1) Power supply current vs power supply voltage (IF amplifier section)
4
3
2
1
0
0
1
2
3
4
5
6
7
[V]
Power supply voltage
(2) Power supply current vs power supply voltage (Mixer section)
5
4
3
2
1
0
0
1
2
3
4
5
6
7
[V]
Power supply voltage
13
µPC8002
(3) IF amplifier output level vs IF amplifier input level
0
_
3dB
_
10
_
20
Limiting sensitivity
_
30
120
_
_
_
_
_
_
20
100
80
60
[dBm]
IF amplifier input level
40
0
(4) IF amplifier output phase vs IF amplifier input level
140
130
120
Phase fluctuation
110
Test input level range
100
_
_
_
_
_
_
_
10
70
60
50
40
[dBm]
IF amplifier input level
30
20
_
14
14
µPC8002
(5) RSSI characteristics (a)
Regression line
3
2.5
2
1.5
1
0.5
0
_
_
_
_
_
_
20
120
100
80
60
40
0
Regression line
[dBm]
IF amplifier input level
(6) RSSI characteristics (b)
5
4
3
2
1
0
_
1
_
2
_
3
_
4
_
_
5
120
_
_
_
_
_
20
100
80
60
40
0
[dBm]
IF amplifier input level
15
µPC8002
(7) Mixer output level vs mixer input level
50 Ω resistance termination
0
_
10
_
20
_
30
_
40
_
50
_
60
_
70
_
80
_
_
_
_
_
_
_
10
70
60
50
40
30
20
0
[dBm]
Mixer input level
16
µPC8002
5. LEVEL DIAGRAMS
(1) For Application Circuit 1
µPC8002GR
IF OUT
0.3 Vp-p
MIXER
BPF
IF Amp1
+ 42 dB
BPF
IF Amp2
+ 66 dB
+ 8 dBNote 1
4 dB
_
_
4 dB
+ 17 dBNote 2
_
_
10 dBm
6.5 dBm
_
_
12 dBm
52 dBm
_
14 dBm
80 dB
Note 1
Note 2
_
_
_
18 dBm
27 dBm
16 dBm
_
56 dBm
80 dB
Note 1
Note 2
_
_
98 dBm
90 dBm
_
107 dBm
_
94 dBm
(2) For Application Circuit 2
µPC8002GR
IF OUT
0.3 Vp-p
MIXER
IF Amp1
+ 42 dB
BPF
IF Amp2
+ 66 dB
330 pF
+ 8 dBNote 1
4 dB
_
+ 17 dBNote 2
_
_
10 dBm
6.5 dBm
_
_
12 dBm
48 dBm
Note 1
Note 2
_
_
_
18 dBm
27 dBm
16 dBm
52 dBm
80 dB
80 dB
_
Note 1
Note 2
_
_
98 dBm
90 dBm
_
107 dBm
Notes 1. 50 Ω resistance termination
2. LC matching (reference value)
17
µPC8002
6. TEST METHODS
(1) Mixer input section
(a) With 50 Ω resistance termination
(b) With 50 Ω LC matching
470 pF
470 pF
8
8
MIX IN1
MIX IN1
CNote
LNote
V
MIX
V
MIX
50 Ω
Note Since the values of L and C are affected by the board’s parasitic capacitance and inductance, L and
C should be adjusted so that the impedance looking at the MIX IN pin side from the signal source is
50 Ω.
(2) Third order intercept
MIX IN1
MIX OUT
2
LO IN
5
8
470 p
470 p
50 Ω
82 pF
50 Ω
16.7 Ω
V
MIX
f
OSC = 239.3 MHz
16.7 Ω
16.7 Ω
f1 = 250.3 MHz
f2 = 250.6 MHz
18
µPC8002
7. TEST CIRCUIT EXAMPLES
In test circuit example 2 onward, only the portion that differs from test circuit example 1 is shown.
Test Circuit Example 1.
VCC
1
2
3
4
5
6
7
8
9
PD
BYPASS1 20
IF1 IN 19
1000 pF
MIX OUT
VCC (IF)
VCC (MIX)
LO IN
330 pF
50 Ω
82 pF
VCC
VCC
BYPASS2 18
IF1 OUT 17
1000 pF
1 µF
1 µF
1000 pF
1000 pF
BYPASS4 16
IF2 IN 15
0.01 µF
470 pF
50 Ω
GND (IF)
GND (MIX)
MIX IN1
MIX IN2
BYPASS3 14
GND (IF OUT) 13
VCC (IF OUT) 12
IF2 OUT 11
0.01 µF
470 pF
50 Ω
VCC
470 pF
1 µF
1000 pF
10 RSSI OUT
1000 pF
10 pF
10 pF
10 kΩ
Caution The 10 pF capacitor value for IF2 OUT and RSSI OUT includes all the capacitances (board,
pattern, etc.) applied to the pin. Ensure that the recommended load condition (10 pF) is not
exceeded for IF2 OUT and RSSI OUT.
Remark Chip laminated ceramic capacitors (MURATA GRM36 or equivalent) should be used.
19
µPC8002
Test Circuit Example 2. (Power supply current, power-off power supply current)
V
CC (IF)
3
V
CC (IF OUT)
12
V
CC (MIX)
4
A
A
1 µF
1000 pF
1µ F
1000 pF
1000 pF
VCC
VCC
Test Circuit Example 3. (Limiting sensitivity, IF amplifier output amplitude, IF amplifier output amplitude rise
time, IF amplifier output amplitude fall time, RSSI linearity, RSSI slope, RSSI
intercept, RSSI output voltage, RSSI temperature stability, RSSI output ripple)
IF1 IN
19
RSSI OUT
10
IF2 OUT
11
330 pF
1000 pF
10 pF
10 kΩ
50 Ω
10 pF
Digital voltmeter
Spectrum
analyzer
Oscilloscope
SG (Signal generator)
10.7 MHz
Oscilloscope
Caution The 10 pF capacitor value for IF2 OUT and RSSI OUT includes all the capacitances (board,
pattern, etc.) applied to the pin. Ensure that the recommended load condition (10 pF) is not
exceeded for IF2 OUT and RSSI OUT.
20
µPC8002
Test Circuit Example 4. (IF amplifier phase fluctuation)
IF1 IN
19
IF2 OUT
11
1000 pF
330 pF
Attenuator
50 Ω
10 kΩ
10 pF
Network
analyzer
Caution The 10 pF capacitor value for IF2 OUT includes all the capacitance (board, pattern, etc.) applied
to the pin. Ensure that the recommended load condition (10 pF) is not exceeded.
Test Circuit Example 5. (RSSI rise time, RSSI fall time)
... Time until RSSI output is within ±10 % of the final value)
IF1 IN
19
IF1 OUT
17
IF2 IN
15
RSSI OUT
10
330 pF
330 pF
For IF1 input
10 pF
50 Ω
50 Ω
For IF2 input
SG
SG
_
_
10.7 MHz, 14 dBm
10.7 MHz, 14 dBm
Storage
oscilloscope 2
Storage
oscilloscope 1
Input signal from SG
1 SEC
50 µSEC
Caution The 10 pF capacitor value for RSSI OUT includes all the capacitances (board, pattern, etc) applied
to the pin.
21
µPC8002
Test Circuit Example 6. (Power-on rise time)
Mixer section : Time until the difference between the local input pin power-on and
power-off voltage reaches 90 %
IF section
: Time until RSSI output is within ±10 % of the power-on value.
PD
1
LO IN
5
RSSI OUT
10
10 pF
SG
Storage
oscilloscope 1
Storage
oscilloscope 2
Input signal from SG
3 V
0 V
50 µSEC
1 SEC
Remark Power-on input voltage (VPO) rise time: 10 ns
Caution The 10 pF capacitor value for RSSI OUT includes all the capacitances (board, pattern, etc.)
applied to the pin. Ensure that the recommended load condition (10 pF) is not exceeded.
Test Circuit Example 7. (Power-off fall time)
PD
1
V
CC (IF OUT)
V
CC (IF)
3
V
CC (MIX)
12
4
V
CC
V
CC
SG
Storage
oscilloscope
Current probe
Input signal from SG
3 V
0 V
50 µSEC
1 SEC
22
µPC8002
Test Circuit Example 8. (Conversion gain, –1 dB compression level)
MIX OUT
2
LO IN
5
MIX IN1
8
470 pF
470 pF
82 pF
50 Ω
See 6. TEST METHODS (1)
Spectrum
analyzer
SG
239.3 MHz
SG
250 MHz
Test Circuit Example 9. (Third order intercept output level)
MIX OUT
2
LO IN
5
MIX IN1
8
470 pF
470 pF
82 pF
50 Ω
See 6. TEST METHODS (2)
Spectrum
analyzer
SG
239.3 MHz
Test Circuit Example 10. (Local separation)
MIX OUT
2
LO IN
5
470 pF
82 pF
50 Ω
Spectrum
analyzer
SG
239.3 MHz
23
µPC8002
Test Circuit Example 11. (Power-on input voltage, power-off input voltage, power-on input current)
PD
1
A
V
VCC
Test Circuit Example 12. (Noise factor)
MIX OUT
2
LO IN
5
MIX IN1
8
470 pF
470 pF
82 pF
See 6. TEST METHODS (1)
50 Ω
NF meter
Noise Source
24
70 mm
µPC8002
1
C1
VCC
C2
C3
C5
50 mm
C4
C6
IF2 OUT
C7 R1
Plated wire
KC-8002GR
µ
IF1 IN
MIX OUT
VCC
R2
C9
C
8
BPF
C
10
C11
1
C
BPF
10
R3
C
9
C11
C10
LOCAL IN
C12
C
R4
13
L2
RSSI OUT
L1
IF2 OUT
MIX IN
µ
µPC8002
C1 : 1 µF
R1 : 10 kΩ
R2 : 50 Ω
R3 : 50 Ω
R4 : 50 Ω
C2 : 1000 pF
C3 : 1000 pF
C4 : 1 µF
C5 : 1 µF
L1
L2
: 58 nH (reference value)
: 10 nH (reference value)
C6 : 1000 pF
C7 : 10 pFNote
C8 : 330 pF
C9 : 0.01 µF
C10 : 0.01 µF
C11 : 470 pF
C12 : 470 pF
C13 : 10 pFNote
Note For the IF2 OUT and RSSI OUT capacitance values, see 9. WIRING PATTERN CAPACITANCE DIAGRAM
(REFERENCE).
Remarks 1. Both L in the case of LC matching and R in the case of 50 Ω termination are connected to MIX IN.
Remove
in the case of LC matching, and
and
in the case of 50 Ω termination.
L2
R4
2. Change the location of the plated wires according to the evaluation items.
3. Cut the wiring pattern to connect
L1
.
L2
27
µPC8002
9. WIRING PATTERN CAPACITANCE DIAGRAM (REFERENCE)
The wiring pattern capacitances to ground are shown here.
For pin 11, the capacitance is 8.1 pF when the entire pattern (from pin 11 to point B) is used. In this case,
the usable probe input capacitance is 1.9 pF (MAX.).
From pin 11 up to point A, the capacitance is 1.4 pF, and therefore an 8.6 pF (MAX.) probe can be used.
For pin 10, the capacitance is 4 pF when the entire pattern is used.
A
Pin 11
IF2 OUT
3.0 pF
0.9 pF
0.5 pF
2.9 pF
B
0.8 pF
Pin 10
RSSI OUT
28
µPC8002
10. PACKAGE DRAWINGS
20 PIN PLASTIC SHRINK SOP (225mil)
20
11
detail of lead end
H
I
1
10
A
J
N
B
L
C
M
M
D
NOTE
ITEM MILLIMETERS
INCHES
Each lead centerline is located within 0.10 mm (0.004 inch) of
its true position (T.P.) at maximum material condition.
A
B
C
7.00 MAX.
0.575 MAX.
0.65 (T.P.)
0.276 MAX.
0.023 MAX.
0.026 (T.P.)
+0.10
0.22
+0.004
0.009
D
–0.05
–0.003
E
F
0.1±0.1
0.004±0.004
0.057 MAX.
1.45 MAX.
+0.005
0.045
G
H
I
1.15±0.1
6.4±0.2
4.4±0.1
–0.004
0.252±0.008
+0.005
0.173
–0.004
+0.009
0.039
J
K
L
1.0±0.2
–0.008
+0.10
0.15
+0.004
0.006
–0.05
–0.002
+0.008
0.020
0.5±0.2
–0.009
M
N
0.10
0.10
0.004
0.004
+7˚
3˚
+7˚
3˚
P
–3˚
–3˚
P20GR-65-225C-1
29
µPC8002
11. RECOMMENDED SOLDERING CONDITIONS
The following conditions ( see table below) must be met when soldering this product.
For more details, refer to our document "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY
MANUAL" (C10535E).
Please consult with our sales offices in case other soldering process or condition is used.
TYPE OF SURFACE MOUNT DEVICE
µPC8002GR
Soldering process
Infrared Ray Reflow
Symbol
Soldering conditions
Peak package's surface temperature: 235 ˚C or below.
Reflow time : 30 seconds or below (210 ˚C or higher),
IR35-107-2
Number of reflow processes : MAX.2
Note
Exposure limit
: 7 days
(10 hours pre-baking is required at 125 ˚C afterwards)
VP15-107-2
Peak package's temperature: 215 ˚C or below.
VPS
Reflow time : 40 seconds or below (200 ˚C or higher),
Number of reflow processes : MAX. 2
Note
Exposure limit
: 7 days
(10 hours pre-baking is required at 125 ˚C afterwards)
Partial heating
method
Terminal temperature : 300 ˚C or below,
Time : 3 seconds or below (Per side of pin position)
Note Exposure limit before soldering after dry-pack package is opened.
Storage conditions : 25 ˚C and relative humidity at 65 % or less.
Caution Do not apply more than one soldering method at any one time, except for " Partial heating
method".
30
µPC8002
[MEMO]
31
µPC8002
The application circuits and their parameters are for references only and are not intended for use in actual design-in's.
No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
Anti-radioactive design is not implemented in this product.
M4 96.5
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