UPD4712C [NEC]
RS-232 LINE DRIVER/RECEIVER; RS - 232线路驱动器/接收器
| 型号： | UPD4712C |
| 厂家： | 
NEC |
| 描述： | RS-232 LINE DRIVER/RECEIVER |
| 文件： | 总12页 (文件大小：82K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATA SHEET
MOS INTEGRATED CIRCUIT
µPD4712C/4712D
RS-232 LINE DRIVER/RECEIVER
The µPD4712C and 4712D are high-voltage silicon gate CMOS line driver/reciever conforming to the
EIA/TIA-232-E standard. It can operate with a single +5 V power source because it is provided with a DC-DC converter.
In addition, this line driver/receiver has many ancillary functions, including output control, threshold select, and
standby functions. Because the µPD4712C and 4712D are provided with four output driver circuits and four receiver
circuits, it can constitute an RS-232 interface circuit with a single chip.
FEATURES
• Conforms to EIA/TIA-232-E (RS-232C) standard
• +5 V single power source
• Threshold select pin selecting two types of threshold voltages
• Standby mode can be set by making standby pin high to reduce circuit current.
• Three-state output configuration. Both driver and receiver outputs go into high-impedance state in standby mode.
ORDERING INFORMATION
Part Number
µPD4712CCY
µPD4712DCY
µPD4712CGT
µPD4712DGT
Package
28-pin plastic DIP (400 mil)
28-pin plastic DIP (400 mil)
28-pin plastic SOP (375 mil)
28-pin plastic SOP (375 mil)
Document No. S10316EJ3V1DS00 (3rd edition)
Date Published April 1997 N
Printed in Japan
1995
©
µPD4712C/4712D
BLOCK DIAGRAM/PIN CONFIGURATION (Top View)
+10 V
+
DC-DC
+
1
2
3
V
DD
C
4
+
28
27
26
C
3
C
4
converter
C +
1
GND
+
+
–
C
1
V
CC
C
2
C4
C –
GND
1
4
5
6
V
SS
–10 V
Standby
25
24
23
+5 V
STBY
Bypass
capasitor
D
IN1
D
D
D
D
R
R
R
OUT1
OUT2
OUT3
OUT4
IN1
300 Ω
300 Ω
300 Ω
300 Ω
D
D
D
D
R
IN2
7
22
21
20
19
18
17
16
15
TTL/CMOS
INPUT
RS-232
IN3
8
OUTPUT
IN4
9
Output control
CON
OUT1
10
11
12
13
14
5.5 kΩ
5.5 kΩ
IN2
RS-232
INPUT
R
OUT2
OUT3
TTL/CMOS
OUTPUT
IN3
R
RIN4
5.5 kΩ
5.5 kΩ
R
OUT4
RCON
Threshold control
*
VDD and Vss are output pins of voltages internally boosted. Connecting a load directly to these pins is not
recommended.
** The standby pin is internally pulled down.
*** Use capacitors with a working voltage of 16 V or higher as C1 through C4. Insert a bypass capasitor about 0.1
to 1 µF between VCC pin to GND pin.
2
µPD4712C/4712D
TRUTH TABLE
Drivers
STBY
DCON
X
DIN
X
DOUT
Remark
Standby mode (DC-DC converter stops)
Mark level output
H
L
L
L
Z
L
L
X
H
L
H
L
Space level output
H
H
Mark level output
Receivers
STBY
RIN
ROUT
Z
Remark
H
L
L
X
L
Stanby mode (DC-DC converter stops)
Mark level input
H
H
L
Space level input
Receiver input threshold voltage
RCON
L
RIN1 to RIN2
A mode
RIN3 to RIN4
A mode
H
A mode
B mode*/C mode **
*: µPD4712C, **: µPD4712D
H: high level, L: low level, Z: high impedance, X: H or L
3
µPD4712C/4712D
ABSOLUTE MAXIMUM RATINGS (TA = 25˚C)
Parameter
Supply voltage
Symbol
VCC
DIN
Ratings
–0.5 to +6.0
–0.5 to VCC +0.5
–30.0 to +30.0
–25.0 to +25.0 Note1
–0.5 to VCC + 0.5
±60.0
Unit
V
Driver input voltage
V
Receiver input voltage
Driver output voltage
Receiver output voltage
Receiver input current
Operating temperature range
Storage temperature range
Power dissipation
RIN
V
DOUT
ROUT
IIN
V
V
mA
˚C
˚C
W
TA
–40 to +85
Tstg
–55 to +150
0.5
PT
Note 1. Pulse width: 1 ms, duty factor: 10 % MAX.
RECOMMENDED OPERATING RANGE
Parameter
Supply voltage
Symbol
MIN.
4.5
TYP.
5.0
MAX.
Unit
V
V
CC
5.5
+30
80
Receiver input voltage
Operating temperature range
External capacitance
R
IN
–30
–20
4.7
V
TA
˚C
µF
Note 2
47
Note 2. The capacitance of an electrolytic capacitor decreases at a low temperature (0 ˚C or lower). Determine
the capacitance of the capacitor to be used taking this into consideration when the µPD4712C and 4712D
are used at a low temperature. Keep the wiring length between the capacitor and IC as short as possible.
ELECTRICAL CHARACTERISTICS (OVERALL)
(Unless otherwise specified, VCC = +5 V ±10 %, TA = –20 ˚C to +80 ˚C, C1 to C4 = 22 µF)
Parameter
Circuit current
Symbol
Conditions
MIN.
TYP.
9.0
MAX. Unit
VCC = +5 V, no load, RIN pin open
(Standby pin open)
ICC1
18.0
40.0
mA
mA
Circuit current
VCC = +5 V, RL = 3 kΩ (DOUT), DIN = GND,
RIN and ROUT pins open
ICC2
ICC
25.0
50
(Standby pin open)
Standby circuit current
VCC = +5 V, no load, RIN pin open
120
0.8
µA
(Standby) (Standby pin high)
Standby low-level
input voltage
VIL
Note 3
V
V
(Standby)
VIH
Standby high-level
input voltage
2.0
(Standby)
Input capacitance
Driver input and receiver input
VCC = +5 V, vs. GND, f = 1 MHz
CIN
10
pF
*
TYP.: Typical (reference) value at TA = 25 ˚C.
Note 3. Because the standby pin is internally pulled down, if the standby pin is left open, operating mode is in
effect.
4
µPD4712C/4712D
ELECTRICAL CHARACTERISTICS (DRIVER)
(Unless otherwise specified, VCC = +5 V ±10 %, TA = –20 ˚C to +80 ˚C, C1 to C4 = 22 µF)
Parameter
Low-level input voltage
High-level input voltage
Low-level input current
High-level input current
Output voltage
Symbol
VIL
Conditions
MIN.
TYP.
MAX. Unit
0.8
V
V
VIH
2.0
0
IIL
–1.0
1.0
µA
µA
V
IIH
0
VCC = +5.0 V, RL = ∞, TA = 25 ˚C
VCC = +5.0 V, RL = 3 kΩ
±9.7
VDO
±5.5
±5.0
V
VCC = +4.5 V, RL = 3 kΩ
V
Output short current
Slew rate
ISC
VCC = +5.0 V, vs. GND
±40
30
mA
V/µs
V/µs
±15
9
CL = 10 pF, RL = 3 to 7 kΩ
CL = 2500 pF, RL = 3 to 7 kΩ
1.5
1.5
SR
30
5
Note 4
Propagation delay time
Output resistance
tPHL
tPLH
RL = 3.5 kΩ, CL = 2500 pF
µs
0.8
VCC = VDD = VSS = 0 V
VOUT = ±2 V
Note 5
RO
300
Ω
4
Standby output transition time
Standby output transition time
tDAZ
tDZA
10
50
µs
25
Note 5
ms
*
TYP.: Typical (reference) value at TA = 25 ˚C.
Note 4. Test point
If the output control pin is made low, the driver output goes low regardless of the driver input state.
6 ns
6 ns
5
0
90 %
1.5 V
90 %
1.5 V
Driver input
10 %
10 %
t
PHL
V
OH
90 %
t
PLH
3 V
Driver output
3 V
–3 V
–3 V
10 %
V
OL
SR
SR
5
µPD4712C/4712D
Note 5. Test Point
5 V
0 V
Standby input
1.5 V
1.5 V
+5 V
VOH
+5 V
–5 V
High impedance
Driver output
–5 V
V
OL
t
DZA
t
DAZ
Do not perform communication within the standby output transition time tDZA on power application or on releasing
the standby mode.
ELECTRICAL CHARACTERISTICS (RECEIVER)
(Unless otherwise specified, VCC = +5 V ±10 %, TA = –20 ˚C to +80 ˚C, C1 to C4 = 22 µF)
Parameter
Symbol
Conditions
MIN.
TYP.
MAX
0.4
Unit
V
Low-level output voltage
High-level output voltage
VOL
IOUT = 4 mA
VCC
VOH
IOUT = –4 mA
V
–0.8
Low-level input voltage
High-level input voltage
VIL
VIH
tPHL
tPLH
IIN
RCON pin
RCON pin
0.8
V
V
2.0
Note 7
Propagation delay time
RL = 1 kΩ, CL = 150 pF
0.13
µs
Input current
1
5
mA
kΩ
V
Input resistance
RI
3
7
Input pin release voltage
Input threshold A mode
(RCON pin low)
VIO
VIH
VIL
VH
Input threshold A mode only
VCC = +5 V
0.5
2.6
1.6
1.8
2.6
–3.0
5.4
–1.6
–3.0
1.8
1
1.6
0.6
2.2
1
V
VCC = +5 V
V
VCC = +5 V (hysteresis width)
VCC = +5 V
0.5
1.2
V
Note 6
Input threshold B mode
(RCON pin high)
VIH
VIL
VH
1.6
2.2
V
VCC = +5 V
–0.4
2.6
–1.8
4.0
V
Only applicable to the µPD4712C
VCC = +5 V (hysteresis width)
VCC = +5 V
V
Note 6
Input threshold C mode
VIH
VIL
VH
–0.4
–0.8
0.5
–0.8
–2.0
1.2
V
(RCON pin high)
VCC = +5 V
V
VCC = +5 V (hysteresis width)
Note 8
V
Only applicable to the µPD4712D
Standby output transition time
Standby output transiton time
tDAZ
tDZA
0.4
µs
ms
Note 8
0.03
10
* TYP.: Typical (reference) value at TA = 25 ˚C.
Note 6. This data is applicable to receivers 3 and 4 only. Receiver 1 and 2 are fixed in input threshold A mode.
6
µPD4712C/4712D
Note 7. Test Point
10 ns
10 ns
5
90 %
90 %
Receiver input
VIH TYP.
V
IL TYP.
10 %
10 %
–5
t
PHL
t
PLH
VOH
Receiver output
1.5 V
1.5 V
V
OL
Note 8. Test Point
5 V
0 V
Standby input
1.5 V
1.5 V
V
OH
90 %
10 %
High impedance
Receiver output
V
OL
t
DZA
t
DAZ
The receiver output is undefined during the standby output transition time tDZA. Do not perform communication
in the standby output transition time tDZA on power application or on releasing the standby mode.
7
µPD4712C/4712D
TEST CIRCUIT
Driver output voltage/Output current (+ side)
+10 V
+
DC-DC
1
+
V
DD
C
4
+
28
C3
C
4
converter
C +
1
2
3
GND 27
+
+
–
C1
26
V
CC
C2
C4
C –
GND
1
4
5
6
V
SS
–10 V
25
24
23
+5 V
STBY
300 Ω
300 Ω
300 Ω
300 Ω
7
22
21
20
19
18
17
16
15
8
9
10
11
12
13
14
5.5 kΩ
5.5 kΩ
V
I
DO
V
DO
5.5 kΩ
5.5 kΩ
Driver output voltage/Output current (– side)
+10 V
+
DC-DC
+
1
V
DD
C
4
+
28
27
26
C3
C
4
converter
+
1
C
2
3
GND
+
+
–
C1
V
CC
–
C
2
C4
C
1
4
5
6
V
SS
–10 V
25
24
23
+5 V
GND
STBY
300 Ω
300 Ω
300 Ω
300 Ω
7
22
21
20
19
18
17
16
15
8
9
10
11
12
13
14
5.5 kΩ
5.5 kΩ
V
I
DO
V
DO
5.5 kΩ
5.5 kΩ
8
µPD4712C/4712D
PACKAGE DRAWINGS
28PIN PLASTIC DIP (400 mil)
28
15
14
1
A
K
L
P
I
J
F
C
H
M
R
M
D
N
B
G
NOTES
ITEM MILLIMETERS
INCHES
1) Each lead centerline is located within 0.25 mm (0.01 inch) of
its true position (T.P.) at maximum material condition.
A
B
C
35.56 MAX.
1.27 MAX.
2.54 (T.P.)
1.400 MAX.
0.050 MAX.
0.100 (T.P.)
2) ltem "K" to center of leads when formed parallel.
+0.004
0.020
D
0.50±0.10
–0.005
F
G
H
I
1.1 MIN.
3.5±0.3
0.043 MIN.
0.138±0.012
0.020 MIN.
0.170 MAX.
0.226 MAX.
0.400 (T.P.)
0.339
0.51 MIN.
4.31 MAX.
5.72 MAX.
10.16 (T.P.)
8.6
J
K
L
+0.10
0.25
+0.004
0.010
M
–0.05
–0.003
N
P
R
0.25
0.01
0.9 MIN.
0~15°
0.035 MIN.
0~15°
P28C-100-400-1
9
µPD4712C/4712D
28 PIN PLASTIC SOP (375 mil)
28
15
detail of lead end
1
14
A
H
I
J
L
B
C
N
M
D
M
NOTE
ITEM MILLIMETERS
INCHES
Each lead centerline is located within 0.12 mm (0.005 inch) of
its true position (T.P.) at maximum material condition.
A
B
C
18.07 MAX.
0.78 MAX.
1.27 (T.P.)
0.712 MAX.
0.031 MAX.
0.050 (T.P.)
+0.10
0.40
+0.004
0.016
D
–0.05
–0.003
E
F
0.1±0.1
2.9 MAX.
2.50
0.004±0.004
0.115 MAX.
0.098
G
+0.012
0.406
H
10.3±0.3
–0.013
I
7.2
1.6
0.283
0.063
J
+0.004
0.006
+0.10
0.15
K
L
–0.002
–0.05
+0.009
0.031
0.8±0.2
–0.008
M
N
0.12
0.15
0.005
0.006
+7°
3°
+7°
3°
P
–3°
–3°
P28GM-50-375B-3
10
µPD4712C/4712D
RECOMMENDED SOLDERING CONDITIONS
Soldering the µPD4712C and 4712D under the conditions listed in the table below is recommended.
For soldering methods and conditions other than those recommended, consult NEC.
Surface mount type
For the details of the recommended soldering conditions of the surface mount type, refer to Information document
“Semiconductor Device Mounting Technology Manual” (C10535EJ7V0IF00)
µPD4712CGT, 4712DGT
Soldering Method
Infrared reflow
Soldering Condition
Recommended Condition Symbol
Package peak temperature: 235 ˚C, Time: 3 0 seconds MAX. IR35-00-2
(210 ˚C MIN.), Number of times: 2, Number of days: not
limited*
VPS
Package peak temperature: 215 ˚C, Time: 40 seconds MAX. VP15-00-2
(200 ˚C MIN.), Number of times: 2, Number of days: not
limited*
Wave soldering
Soldering bath temperature: 260 ˚C MAX., Time: 10 seconds
WS60-00-1
MAX., Number of times: 1, Number of days: not limited*
Pin partial heating Pin temperature: 300 ˚C MAX. (lead temperature), Time: 3
seconds MAX. (per lead pin), Number of days: not limited*
*
The number of days the device can be stored at 25 ˚C, 65 % RH MAX. after the dry pack has been opened.
Caution Do not use two or more soldering methods in combination (except the pin partial heating method).
Throught-hole type
µPD4712CCY, 4712DCY
Soldering Method
Wave soldering
Soldering Conditions
Soldering bath temperature: 260 ˚C MAX., Time: 10 seconds MAX.
REFERENCE DOCUMENTS
“NEC Semiconductor Device Reliability/Quality Control System” (IEI-1212)
“Quality Grade on NEC Semiconductor Devices” (IEI-1209)
“Semiconductor Device Mounting Technology Manual” (C10535EJ7V0IF00)
11
µPD4712C/4712D
[MEMO]
No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
Anti-radioactive design is not implemented in this product.
M4 96.5
相关型号：
UPD4712CCY-A
Line Transceiver, 4 Func, 4 Driver, 4 Rcvr, CMOS, PDIP28, 0.400 INCH, PLASTIC, DIP-28
RENESAS
UPD4712DCY-A
Line Transceiver, 1 Func, 4 Driver, 4 Rcvr, CMOS, PDIP28, 0.400 INCH, PLASTIC, DIP-28
NEC
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