UPD7566A [NEC]
4-BIT SINGLE-CHIP MICROCOMPUTER; 4位单片机型号: | UPD7566A |
厂家: | NEC |
描述: | 4-BIT SINGLE-CHIP MICROCOMPUTER |
文件: | 总58页 (文件大小:465K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
DATA SHEET
MOS INTEGRATED CIRCUIT
µPD7566A, 7566A(A)
4-BIT SINGLE-CHIP MICROCOMPUTER
DESCRIPTION
The µPD7566A is a product of the µPD7554, 7564 sub-series which is a low-end, low-cost version of the
µPD7500 series microcomputers. This 4-bit single-chip microcomputer has fewer ports than the other products
in the µPD7500 series, in order to reduce the package size, and is especially ideal for temperature control
applications, as well as for application systems, such as air conditioners, microwave ovens, refrigerators, rice
cooker, washing machines, and cassette deck controllers. Some of the output pins for the microcomputer can
be used to directly drive triacs and LEDs.
In addition, various I/O circuits can be selected by mask options, so that the number of necessary external
circuits can be significantly reduced.
A detailed function description is provided in the following user's manual.
Be sure to read this manual when designing your system.
µPD7556, 7566 User's Manual: IEM-1111D
FEATURES
PIN CONFIGURATION (Top View)
•
•
45 instructions (subset of the µPD7500H SET B)
Instruction cycle: 2.86 microseconds (700 kHz, at 5V) with
ceramic oscillator
P00/INT0
P01/Vref
P10/Cin0
P11/Cin1
P12/Cin2
P13/Cin3
P80
1
2
24
23
22
21
20
19
18
17
16
15
14
13
VSS
•
•
•
•
•
Program memory (ROM): 1,024 words x 8 bits
Data memory (RAM): 64 words x 4 bits
Test sources: 1 external and 1 internal
8-bit timer/event counter
19 I/O lines (total output current: 100 mA)
. Five pins can be used to directly drive triacs and LEDS
: P80 to P82, P90 to P91
P91
3
P90
4
P113
P112
P111
P110
P103
P102
P101
P100
RESET
µ
5
6
7
. Eight pins can be used to directly drive LEDs
: P100 to P103, P110 to P113
P81
8
. Four comparator input pins: P10/Cin 0 to P13/Cin 3
. Mask option functions available on all ports
Standby functions (STOP/HALT)
P82
9
CL2
10
11
12
•
•
•
•
•
•
CL1
Data memory contents can be retained on a low voltage
Internal ceramic oscillator for system clock oscillation
CMOS
VDD
Low-power dissipation
★
Single power source (2.7 to 6.0V)
APPLICATIONS
µPD7566A
: Air conditioner, microwave oven, refrigerator, audio
equipment controller, etc.
µPD7566A(A) : Automotive and transportation equipments, etc.
The quality level and absolute maximum ratings of the µPD7566A and the µPD7566A(A) differ.
Except where specifically noted, explanations here concern the µPD7566A as a representative product.
If you are using the µPD7566A(A), use the information presented here after checking the functional
differences.
The information in this document is subject to change without notice.
The ★ mark shows major revised points.
Document No. IC-2478D
(O. D. No. IC-7885D)
Date Published December 1994 P
Printed in Japan
1989
©
µPD7566A, 7566A(A)
ORDERING INFORMATION
Part Number
Package
Quality Grade
µPD7566ACS-xxx
µPD7566AG-xxx
24-pin plastic shrink DIP (300 mil)
24-pin plastic SOP (300 mil)
Standard
Standard
Special
★
★
µPD7566ACS(A)-xxx
µPD7566AG(A)-xxx
24-pin plastic shrink DIP (300 mil)
24-pin plastic SOP (300 mil)
Special
Caution Be sure to specify mask options when placing your order.
Remark xxx indicates ROM code number.
Please refer to "Quality grade on NEC Semiconductor Devices" (Document number IEI-1209) published by
NEC Corporation to know the specification of quality grade on the devices and its recommended applications.
2
µ
INT0/P00
CP
INTT
CLOCK
TIMER/
TEST
CONTROL
EVENT COUNTER
CONTROL
CL
P00/INT0
P01/Vref
PORT0
BUFFER
PORT1
PC(10)
ALU(4)
C
A(4)
L(4)
4
P10/Cin0 - P13/Cin3
BUFFER
/COMPARATOR
PORT8
LATCH
BUFFER
3
2
4
P80 - P82
P90, P91
H(2)
PROGRAM MEMORY
1024X8 BITS
PORT9
LATCH
BUFFER
SP(6)
INSTRUCTION
DECODER
PORT10
LATCH
µ
P100 - P103
CL
Ø
BUFFER
DATA MEMORY
64X4 BITS
SYSTEM
PORT11
LATCH
STANDBY
CONTROL
CLOCK
P110 - P113
4
GENERATOR
BUFFER
CL1
CL2
VDD
VSS
RESET
µPD7566A, 7566A(A)
CONTENTS
1. PIN FUNCTIONS...............................................................................................................................
6
6
6
7
7
8
1.1
1.2
1.3
1.4
1.5
1.6
1.7
PORT FUNCTIONS .................................................................................................................................
OTHER FUNCTIONS...............................................................................................................................
MASK OPTIONS FOR PINS ...................................................................................................................
NOTES ON USING THE P00/INT0, AND RESET PINS.........................................................................
PIN I/O CIRCUITS ...................................................................................................................................
RECOMMENDED PROCESSING OF UNUSED PINS............................................................................ 10
I/O PORT OPERATIONS ......................................................................................................................... 11
2. INTERNAL FUNCTIONAL BLOCKS ................................................................................................. 13
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
PROGRAM COUNTER (PC).................................................................................................................... 13
STACK POINTER (SP) ............................................................................................................................ 14
PROGRAM MEMORY (ROM)................................................................................................................. 15
GENERAL-PURPOSE REGISTERS ......................................................................................................... 15
DATA MEMORY (RAM) ......................................................................................................................... 16
ACCUMULATOR (A)............................................................................................................................... 17
ARITHMETIC LOGIC UNIT (ALU) .......................................................................................................... 17
PROGRAM STATUS WORD (PSW)....................................................................................................... 17
SYSTEM CLOCK GENERATOR ............................................................................................................. 18
2.10 CLOCK CONTROL CIRCUIT ................................................................................................................... 19
2.11 TIMER/EVENT COUNTER ...................................................................................................................... 20
2.12 TEST CONTROL CIRCUIT ...................................................................................................................... 21
3. STANDBY FUNCTIONS ................................................................................................................... 22
3.1
3.2
3.3
3.4
3.5
STOP MODE ........................................................................................................................................... 22
HALT MODE............................................................................................................................................ 22
RELEASING STOP MODE BY USING RESET INPUT........................................................................... 22
RELEASING HALT MODE BY USING TEST REQUEST FLAGS .......................................................... 23
RELEASING HALT MODE BY USING RESET INPUT........................................................................... 23
4. RESET FUNCTION............................................................................................................................ 24
4.1 INITIALIZATION ...................................................................................................................................... 24
5. INSTRUCTION SET .......................................................................................................................... 25
6
ELECTRICAL SPECIFICATIONS ....................................................................................................... 30
7. CHARACTERISTIC DATA ................................................................................................................. 36
8. APPLICATION CIRCUITS ................................................................................................................. 38
9. PACKAGE DRAWING ....................................................................................................................... 43
4
µPD7566A, 7566A(A)
10. RECOMMENDED PC BOARD PATTERN FOR SOP (REFERENCE)................................................ 47
11. RECOMMENDED SOLDERING CONDITIONS ................................................................................ 48
APPENDIX A. COMPARISON FOR µPD7566A SUB-SERIES PRODUCTS........................................... 49
APPENDIX B. DEVELOPMENT SUPPORT TOOLS ............................................................................... 50
APPENDIX C. RELATED DOCUMENTS................................................................................................. 55
★
5
µPD7566A, 7566A(A)
1. PIN FUNCTIONS
1.1 PORT FUNCTIONS
Pin
Name
Input/
Output
Shared
with:
I/O
Circuit
Type
Function
At Reset
P00
INT0
Vref
2-bit input port (PORT 0). P00 is also used to
input count clocks (event pulses).
S
T
Input
Input
Input
Input
P01
P10-P13
Cin0 - 4-bit input port (PORT 1)
Cin3
U
P80-P82
P90, P91
Output
Output
-
-
3-bit output port (PORT 8). High-current
(15 mA), and medium-voltage (9V) output
High
impedance
O
P
2-bit output port (PORT 9). High-current
(15 mA), and medium-voltage (9V) output
P100 -
P103
Input/
Output
-
4-bit I/O port (PORT 10). Medium-current
(10 mA), and medium-voltage (9V) I/O
High
impedance
or high-
level
P110-
P113
Input
Output
4-bit I/O port (PORT 11). Medium-current
(10 mA), and medium-voltage (9V) I/O
-
output
1.2 OTHER FUNCTIONS
Pin
Name
Input/
Output
Shared
with:
I/O
Circuit
Type
Function
At Reset
Input
INT0
Vref
Input
Input
P00
P01
Edge-detecting testable input pin (rising edge)
S
T
Comparator reference voltage input pin
(Whether this pin is used as P01 or as Vref is
specified by a mask option.)
Input
4-bit comparator input pins (Whether these
Cin0-Cin3
Input
P10-P13 pins are used as digital input pins (P10 to P13)
or as comparator input pins (Cin0 to Cin3) is
specified by the mask option for each bit.
Input
U
CL1
CL2
A ceramic oscillator is connected across
these pins.
System reset input pin (high-level active).
A pull-down resistor can be interconnected
to this pin by a mask option.
RESET
R
VDD
VSS
Power pin
GND pin
6
µPD7566A, 7566A(A)
1.3 MASK OPTIONS FOR PINS
The following mask options are available. These mask options can be selected in bit units.
★
Pin Name
Mask Option
P00
➀ No internally provided resistor
➁ Pull-down resistor internally provided
➂ Pull-up resistor internally provided
P01/Vref
➀ External Vref input
➁ No internally provided resistor (CMOS input)
➂ Pull-down resistor internally provided (CMOS input)
➃ Pull-up resistor internally provided (CMOS input)
P10/Cin0
P11/Cin1
P12/Cin2
P13/Cin3
➀ Comparator input
➂ Pull-down resistor internally provided (CMOS input)
➃ Pull-up resistor internally provided (CMOS input)
➁ No internally provided register
➀ Comparator input
➂ Pull-down resistor internally provided (CMOS input)
➃ Pull-up resistor internally provided (CMOS input)
➁ No internally provided register
➀ Comparator input
➂ Pull-down resistor internally provided (CMOS input)
➃ Pull-up resistor internally provided (CMOS input)
➁ No internally provided register
➀ Comparator input
➁ No internally provided register
➂ Pull-down resistor internally provided (CMOS input)
➃ Pull-up resistor internally provided (CMOS input)
P80
P81
P82
P90
P91
P100
➀ N-channel open-drain output
➀ N-channel open-drain output
➀ N-channel open-drain output
➀ N-channel open-drain output
➀ N-channel open-drain output
➀ N-channel open-drain I/O
➁ CMOS (push-pull) output
➁ CMOS (push-pull) output
➁ CMOS (push-pull) output
➁ CMOS (push-pull) output
➁ CMOS (push-pull) output
➁ Push-pull I/O
➂ N-channel open-drain I/O with pull-up resistor internally provided
➀ N-channel open-drain I/O ➁ Push-pull I/O
➂ N-channel open-drain I/O with pull-up resistor internally provided
➀ N-channel open-drain I/O ➁ Push-pull I/O
➂ N-channel open-drain I/O with pull-up resistor internally provided
➀ N-channel open-drain I/O ➁ Push-pull I/O
➂ N-channel open-drain I/O with pull-up resistor internally provided
➀ N-channel open-drain I/O ➁ Push-pull I/O
➂ N-channel open-drain I/O with pull-up resistor internally provided
➀ N-channel open-drain I/O ➁ Push-pull I/O
➂ N-channel open-drain I/O with pull-up resistor internally provided
➀ N-channel open-drain I/O ➁ Push-pull I/O
➂ N-channel open-drain I/O with pull-up resistor internally provided
➀ N-channel open-drain I/O ➁ Push-pull I/O
P101
P102
P103
P110
P111
P112
P113
RESET
➂ N-channel open-drain I/O with pull-up resistor internally provided
➀ Pull-down resistor is not internally provided
➁ Pull-down resistor is internally provided
Internal Vref
setting Note
➀ Internal bias is not provided
➁ A 1/2 VDD internal bias is applied to Vref
Note When any of pins P10-P13 is specified as “➀ comparator“, and “➀ internal bias is not provided“ is specified
for the internal Vref setting, specify “➀ external Vref input“ for pin P01.
When none of pins P10-P13 is specified as “➀ comparator“, specify “➀ internal bias is not provided“ for
the internal Vref setting.
There is no mask option for PROM products. For more information, see the µPD75P66 Data Sheet (IC-7518).
7
µPD7566A, 7566A(A)
1.4 NOTES ON USING THE P00/INT0, AND RESET PINS
In addition to the functions described in 1.1, 1.2, and 1.3, an exclusive function for setting the test mode, in which
the internal functions of the µPD7566A are tested, is provided to the P00/INT0 and RESET pins.
If a voltage less than VSS is applied to either of these pins, the µPD7566A is put into test mode. Therefore, even
when the µPD7566A is in normal operation, if noise less than the VSS is input into any of these pins, the µPD7566A
will enter the test mode, and this will cause problems for normal operation.
As an example, if the wiring to the P00/INT0 pin or the RESET pin is long, stray noise may be picked up and the
above mentioned problem may occur.
Therefore, all wiring to these pins must be made short enough to not pick up stray noise. If noise cannot be
avoided, suppress the noise using a capacitor or diode as shown in the figure below.
•
Connect a diode having a low VF across
P00/INT0 and RESET, and VSS.
•
Connect a capacitor across P00/INT0 and RESET,
and VSS.
VDD
VDD
VDD
VDD
P00/INT0, RESET
P00/INT0, RESET
Low VF
diode
VSS
VSS
8
µPD7566A, 7566A(A)
1.5 PIN I/O CIRCUITS
Schematic drawings of the I/O circuits for the microcomputer’s pins are shown below.
(1) Type O
VDD
data
P-ch
Mask option
OUT
N-ch (medium-voltage, high current)
output
disable
(2) Type P
VDD
data
P-ch
Mask option
IN/OUT
output
disable
N-ch (medium-voltage, high-curren
Medium-voltage, input buffer
(3) Type R
Mask Option
9
µPD7566A, 7566A(A)
(4) Type S
VDD
Mask Option
IN
(5) Type T
VDD
Mask option
IN
VDD
Rref
-
Mask option
Rref
+
(6) Type U
V
DD
Mask option
+
IN
-
Reference voltage
10
µPD7566A, 7566A(A)
1.6 RECOMMENDED PROCESSING OF UNUSED PINS
Pin
Recommended Processing
Connect to VSS
P00/INT0
P01/Vref
Connect to VSS or VDD
Open
P10-P13
P80-P82
P90, P91
P100-P103
P110-P113
Input : Connect to VSS or VDD
Output: Open
11
µPD7566A, 7566A(A)
1.7 I/O PORT OPERATIONS
(1) P00, P01 (Port 0)
Port 0 is a 2-bit input port and consists of pins P00 and P01. These pins are multiplexed, and P00 can
also input count clocks or testable signal (INT0), while P01 is used, when so specified by a mask option,
to input a reference voltage (Vref) to the internal comparator.
To input a count clock from P00, set bits 2 and 1 (CM2 and 1) for the clock mode register to “01” (see
2.10, Clock Control Circuit).
To allow P00 to serve as INT0, set the SM3 flag to 1.
Whether P01 is used to input a reference voltage (Vref) to the comparator is specified by a mask option.
In this case, the port function for the P01 pin cannot be used. The data on P00 and P01 can be loaded to
the lower 2 bits (A0 and A1) of the accumulator at any time, by executing a port input instruction (IPL, L
= 0).
(2) P10/Cin 0 to P13/Cin 3 (Port 1)
Port 1 is a 4-bit input port consisting of these four pins, which can also be used to input analog voltages
to the comparator, when so specified by mask options.
To input analog voltages through Port 1, a comparator must be connected to each bit of the port by
a mask option, and a port input instruction (IPL, L = 1) must be executed.
The analog voltage input through these pins to the comparator is always compared with a reference
voltage input through the Vref pin. It takes up to 3 machine cycles to accomplish this comparison.
Therefore, to change the voltage applied to the Vref pin by port output to form an A/D converter by using
a resistor ladder, wait for 3 machine cycles after executing a port output (OPL) instruction. Then carry out
an input (IPL, L = 1) instruction to obtain the result of the comparison.
If the output instruction is executed during a 3 machine cycle period that precedes the IPL instruction
(L = 1), which inputs the comparison result, the comparator accuracy may be degraded. For this reason,
do not execute the OPL instruction during 3 machine cycles immediately before the IPL instruction is
executed.
Example: LHLI
0AH
;
;
L = 10
OPL
NOP
NOP
LHLI
IPL
Port 10 output (Vref is changed)
1
;
;
L = 1
Input of comparison result
(3) P80 to P82 (Port 8), and P90 to P91 (Port 9)
Pins 80 to P82 constitute a 3-bit output port with output latch, Port 8, while P90 to P91 form a 2-bit output
port with output latch, Port 9.
When a port output instruction (OPL, L = 8, or L = 9) is executed, the contents of the accumulator are
latched on the output latches, and, at the same time, output to these ports.
Each bit in Ports 8 and 9 can be set or reset by SPBL or RPBL instruction.
Two output modes can be selected for Ports 8 and 9 by a mask option: CMOS (push-pull) or N-channel
open-drain mode.
The N-channel open-drain output mode is useful for interfacing a circuit operating on a supply voltage
different from that to the microcomputer, because the output buffer in this mode can withstand an applied
9V.
12
µPD7566A, 7566A(A)
(4) P100 to P103(Port 10), and P110 to P113 (Port 11)..........Pseudo-bidirectional I/O
Pins P100 to P103 constitute a 4-bit I/O port with output latches, Port 10, while P110 to P113 form Port
11, which is a 4-bit I/O port with output latches.
When a port output instruction (OPL, L = 10 or L11) is executed, the accumulator contents are latched
to the output latches and, at the same time, output to either of these ports.
Data once written to the output latch and the state of the output buffer are retained until an output
instruction that manipulates Port 10 or 11 is executed next, or until the RESET signal is input. Therefore,
the states of the output latches and output buffer will not be changed, even when an input instruction is
executed to these ports.
Each bit of Ports 10 and 11 can be set or reset by SPBL or RPBL instruction. Three input modes can
be selected for Ports 10 and 11 by mask options: N-channel open-drain I/O, N-channel open-drain I/O with
pull-up resistors connected, and CMOS (push-pull) modes.
The N-channel open-drain mode is useful for interfacing a circuit operating on a supply voltage different
from that fed to the microcomputer, because the I/O buffer in this mode can withstand a 9V application.
If the CMOS (push-pull) I/O mode has been selected and an output instruction has once been executed,
the ports cannot return to the input mode. However, the pin states can be checked by executing a port
input (IPL) instruction.
In the N-channel open-drain mode, regardless of whether the pull-up resistors are connected or not,
the ports are set in the input mode, when high-level signals are output to them, and the data on the 4 bits
of each port can be loaded to the accumulator. Thus, the port serves as a pseudo-bidirectional port.
The three I/O modes are selected under the following conditions:
➀ CMOS I/O
i) To use all the 4-bits as input port pins
ii) To use port pins as output pins from which no medium-voltage output is required
➁ N-channel open-drain I/O
i) To use port pins in applications where inputting outputting a medium-voltage is required
ii) To use some port pins as input pins and the others as output pins
iii) To alternately input and output data through one port pin
➂ N-channel open-drain I/O with pull-up resistor connected
i) To use some port pins as input pins and the other, as output pins in applications where pull-up
resistors are required
ii) To alternately input and output data through one port pin in application where a pull-up resistor
is required
Caution To use port pins as input pins in modes ➁ and ➂ above, it is necessary to write “1” to the output
latch in advance and to turn off the N-channel transistor.
13
µPD7566A, 7566A(A)
2. INTERNAL FUNCTIONAL BLOCKS
2.1 PROGRAM COUNTER (PC) ...... 10 BITS
This is a 10-bit binary counter that retains the address information for the program memory (ROM).
Fig. 2-1 Program Counter
PC9 PC8 PC7 PC6 PC5 PC4 PC3 PC2 PC1 PC0
PC
Normally, each time an instruction has been executed, the PC contents are automatically incremented by the
number of bytes for the instruction.
When a call instruction has been executed, the current contents of the PC (i.e., return address) are saved to the
stack, and a new call address is loaded to the PC. When a return instruction has been executed, the contents of
the stack (i.e., return address) are loaded to the PC. When a jump instruction has been executed, immediate data
that indicates the jump destination is loaded to some or all of the bits for the PC.
When a skip instruction has been executed, the PC contents are incremented by 2 or 3 during 1 machine cycle,
depending on the number of bytes for the instruction to be executed next. All the PC bits are cleared to 0, when
the RESET signal has been input.
14
µPD7566A, 7566A(A)
2.2 STACK POINTER (SP) ...... 6 BITS
Thisisa6-bitregister. Whenportofthedatamemoryisusedasalast-in, first-out(LIFO)stackarea, theSPretains
the first address for the stack.
Fig. 2-2 Stack Pointer
SP5 SP4 SP3 SP2 SP1 SP0
SP
The SP contents are decremented when a call instruction has been executed, and are incremented when a return
instruction has been executed.
To obtain a stack area, the SP must be initialized by TAMSP instruction. Note, however, that 0 is is
unconditionally loaded to the LSB for the SP (i.e., bit SP0) when TAMSP instruction has been executed. Stacking
operation begins with decrementing the SP contents. Therefore, the highest address for the stack area +1 is set
in the SP.
If the highest address for the stack area is 3FH, which is the highest address in the data memory, the initial
valuesfortheSP5to0bitsmustbe00H. However,keepthedatatobestoredinAMto40HwhenTAMSPinstruction
is executed, so that the microcomputer can be easily emulated by µPD7500H (EVAKIT-7500B).
Fig. 2-3 Executing TAMSP Instruction
A3
A2
A1
A0
(HL)
3
(HL)
2
(HL)
1
(HL)
0
0
SP5
SP4
SP3
SP2
SP1
SP0
The SP contents cannot be read.
Caution The SP contents are undefined, when the RESET signal has been input. Therefore, make sure that
the SP is initialized at the beginning of the program.
Example: LHLI
00H
0
LAI
ST
LAI
4
TAMSP
; SP = 40H
15
µPD7566A, 7566A(A)
2.3 PROGRAM MEMORY (ROM) ...... 1,024 WORDS X 8 BITS
This is a mask programmable ROM, consisting of 1,024 words by 8 bits. The ROM is addressed by the program
counter (PC). The program is stored in the program memory.
Address 000H in this memory is a reset start address.
Fig. 2-4 Program Memory Map
(0) 000H
Reset start
(1023) 3FFH
2.4 GENERAL-PURPOSE REGISTERS
Two general-purpose registers, H (2 bits) and L (4 bits), are available. Each of these registers can be manipulated
independentlyfromtheother. Inaddition,theseregisterscanbeusedasapairregister(HL). Thepairregisterserves
as a data pointer to address the data memory.
Fig. 2-5 General-Purpose Registers
1
0
3
0
H
L
The L register is also used to specify an I/O port or mode register, when an input/output instruction (IPL or OPL)
is executed. This register is also used to specify the port bit to be set or reset by SPBL or RPBL instruction.
16
µPD7566A, 7566A(A)
2.5 DATA MEMORY (RAM) ...... 64 WORDS X 4 BITS
The data memory is static RAM configured of 64 words by 4 bits, and is used to store various data and as a stack
area. The data memory is also used in pairs with the accumulator, making it possible to process 8-bit data.
Fig. 2-6 Data Memory Map
(0) 00H
64 words x 4 bits
(63) 3FH
The data memory can be addressed in the following three addressing modes:
•
•
Direct: In this mode, the data memory is directly addressed by the immediate data for an instruction.
Register indirect: The data memory is indirectly addressed by the contents of pair register HL (including
autoincrement and autodecrement).
•
Stack: The data memory is indirectly addressed by the contents of the stack pointer (SP).
Any space in the data memory can be used as stack. The boundary of the stack is determined by initializing
the SP by TAMSP instruction. After that, the stack area is automatically accessed by call and return instructions.
When a call instruction is executed, the contents of the PC and program status word (PSW) are stored in stack,
as illustrated below.
Stack area
3
0
0
SP - 4
SP - 3
SP - 2
SP - 1
0
PC9 PC8
PSWNote
PC3 - PC0
PC7 - PC4
Note Bit 1 of PSW is always 0.
When a return instruction has been executed, the PC contents are restored, but the PSW contents are not.
The data memory contents can be retained on a low supply voltage in the STOP mode.
17
µPD7566A, 7566A(A)
2.6 ACCUMULATOR (A) ...... 4 BITS
This is a 4-bit register which plays a central role, when an arithmetic operation is performed. The accumulator
can also be used in pairs with a data memory address, indicated by pair register HL, to process 8-bit data.
Fig. 2-7 Accumulator
A3
A2
A1
A0
A
2.7 ARITHMETIC LOGIC UNIT (ALU) ...... 4 BITS
This is a 4-bit arithmetic operation circuit that carries out operations such as binary addition, logic operations,
increment, decrement and comparison, as well as bit manipulation.
2.8 PROGRAM STATUS WORD (PSW) ...... 4 BITS
The PSW consists of two skip flags (SK1 and SK0) and a carry flag (C). Bit 1 of this register is always 0.
Fig. 2-8 Program Status Word
3
2
1
0
0
SK1 SK0
C
PSW
(1) Skip flags (SK1 and SK0)
These flags retain the following skip conditions:
• String effect by LAI instruction
• String effect by LHLI instruction
• Establishment of skip conditions by instructions other than string-effect instructions
The skip flags are automatically set or reset each time an instruction has been executed.
(2) Carry flag (C)
This flag is set to 1, when an addition instruction (ACSC) is executed, and a carry is consequently
generated from the bit 3 of the ALU. If a carry is not generated, the carry flag is cleared to 0. In addition,
the carry flag can also be set by SC instruction, and cleared by RC instruction. The content of the flag can
be tested by SKC instruction.
The PSW contents are automatically stored in the stack area when a call instruction is executed, and
are not restored even when a return instruction is implemented. When the RESET signal is input, the SK1
and SK0 flags are cleared to 0, and the C flag content becomes undefined.
18
µPD7566A, 7566A(A)
2.9 SYSTEM CLOCK GENERATOR
The system clock generator consists of a ceramic oscillator, a 1/2 frequency divider, standby mode (STOP/HALT)
control circuit, and other circuits.
The ceramic oscillator can oscillate, when an external ceramic oscillator is connected across pins CL1 and CL2.
The signal output by the internal ceramic oscillator is a system clock (CL), which is then divided in two to create
a CPU clock (ø).
The standby mode control circuit mainly consists of a STOP flip-flop and HALT flip-flop.
The STOP flip-flop is set by a STOP instruction, stopping the clock supply. When the ceramic oscillator is
operating, this flip-flop stops the oscillator, setting the microcomputer in the STOP mode.
The STOP flip-flop is reset when a high-level RESET signal is input. As a result, the ceramic oscillator resumes
its operation, and the clocks supply is started, when the RESET signal later goes low.
The HALT flip-flop is set by a HALT instruction, disabling the input of the 1/2 frequency divider, which generates
CPU clock ø, and thereby stopping only CPU clock ø (HALT mode).
The HALT flip-flop is reset by the HALT RELEASE or the falling of RESET input (which becomes active when one
of the test request flags has been set), allowing the supply of ø to be started.
The HALT flip-flop remains set even while the RESET signal is active (high-level), and operates in the same
manner as in the HALT mode.
When Power-ON Reset is performed, the ceramic oscillator starts at the rising edge of the RESET signal. After
the oscillator has started, however, a specific period is required for the oscillator to stabilize. To present the CPU
from malfunctioning due to anstable clock, the HALT flip-flop is set to suppress the CPU clock ø while the RESET
signal is high. Therefore, the high-level width of the RESET signal must be greater than the time required for the
ceramic oscillator you use to stabilize.
Fig. 2-9 System Clock Generator
STOP F/F
STOPNote
S
Q
HALT F/F
R
Q
S
R
HALTNote
Oscillation
stops
RESET (high)
CL1
CL2
HALT RELEASE
Ceramic
oscillator
RESET (
RESET (
)
)
1/2
ø (to CPU)
CL (System clock)
Note indicates that an instruction has been executed.
19
µPD7566A, 7566A(A)
2.10 CLOCK CONTROL CIRCUIT
The clock control circuit consists of a 2-bit clock mode register (made up of bits CM2 and 1), three prescalers
(1, 2, and 3), and a multiplexer. This circuit inputs the output from the system clock generator (i.e., CL). An event
pulse (from pin P00) selects a clock source and prescaler, as specified by the clock mode register, and supplies a
count pulse (CP) to the timer/event counter.
Fig. 2-10 Clock Control Circuit
Internal Bus
OPLNote
CM1
CM2
PRESCALER 1
(1/4)
PRESCALER 2
(1/8)
PRESCALER 3
(1/8)
CL
P00
CP
Note indicates that an instruction has been executed.
A code is set in the clock mode register by an OPL (L = 12) instruction.
Fig. 2-11 Clock Mode Register Format
CM2 CM1
Clock mode register
CM2 CM1 Count pulse frequency (CP)
0
0
1
1
0
1
0
1
CL x 1/256
P00
CL x 1/32
CL x 1/4
Caution When setting a code in the clock mode register by the OPL instruction, be sure to clear the bit 0 (which
corresponds to CM0 of EVAKIT-7500B (µPD7500) during emulation) for the accumulator to 0.
20
µPD7566A, 7566A(A)
2.11 TIMER/EVENT COUNTER
The timer/event counter mainly consists of an 8-bit count register.
Fig. 2-12 Timer/Event Counter
Internal bus
TCNTAMNote
8
Count
pending
circuit
INTT
CP
8-BIT COUNT REG
CLR
(to test control circuit)
TIMERNote
RESET
Note indicates that an instruction has been executed.
The 8-bit count register is a binary up-counter. The contents of this counter are incremented each time a count
pulse (CP) is input to the counter, and are cleared to 00H when TIMER instruction has been executed, when the
RESET signal has been input, or when overflow (i.e., counting from FFH to 00H) has occurred in the counter.
The following four count pulses can be selected by the clock mode register (see 2.10 Clock Control Circuit).
1
4
1
32
1
256
CP: CL x
, CL x
, CL x
, P00
The count register always counts up as long as the count pulse is input to it. Therefore, the TIMER instruction
clears the contents of the count register to 00H and triggers a timer operation.
The count register contents are incremented in synchronization with CP (or the rising edge of the P00 signal,
when an external clock is selected). When the number of counts reaches 256, the count value is returned from FFH
to 00H. At this time, the count register generates an overflow signal (INTT), setting the INTT test flag (INTT RQF).
The count register then starts counting up from 00H.
Whether or not an overflow has occurred can be learned by testing the INT RQF flag, using the SKI instruction.
When the timer/event counter operates as a timer, the reference time for the timer is determined by the CP
frequency. The accuracy of the measured time is determined, when the system clock is selected, by the system
clockoscillationfrequency. IfthesignalinputthroughtheP00pinisselectedastheclock,theaccuracyisdetermined
by the frequency of the signal input to the P00 pin.
The contents of the count register can always be made ready by TCNTAM instruction. By using this instruction,
the current time for the timer can be checked, or it can be determined how many event pulses have been generated
so far by inputting the event pulses to the P00 pin and counting them (event counter operation).
The count pending circuit is to ignore changes in the count pulses (CPs) while TCNTAM instruction is executed.
This is necessary because, when TCNTAM instruction is used to read the contents of the count register, unstable
data may be read while the present count is being updated.
The timer/event counter operates using the system clocks (CL) or the signals input to the P00 pin as count pulses.
Therefore, the timer/event counter can be used to release the HALT mode, in which the supply of the CPU clock
ø is stopped (see 3. STANDBY FUNCTIONS).
21
µPD7566A, 7566A(A)
2.12 TEST CONTROL CIRCUIT
The test control circuit consists of two test flags, a flag called SM3, and a test request flag control circuit. The
test request flags, INT0 RQF and INTT RQF, are set by two kinds of test sources (external test input (INT0) and timer
overflow (INTT)). The SM3 flag determines whether or not inputting signals to the INT0 pin is enabled. The test
request flag control circuit checks the contents of the test request flags, when an SKI instruction is executed, and
resets the flags.
The SM3 flag is set by an OPL (L = 0FH) instruction (corresponding to A3). When this flag is 1, the INT0 input
is enabled.
The INT0 RQF flag is set when the rising edge is detected on the INT0 pin, and is reset by an SKI instruction.
The INTT RQF flag is set when an overflow occurs in the timer, and is reset by an SKI or TIMER instruction.
The signals output by the test request flags are used to release the HALT modes. If one of or both the flags were
to be set, the HALT modes are released.
When the RESET signal is input, both the test request flags and SM3 flag are reset. Therefore, INT0 input is
disabled as the initial condition after the RESET signal has been applied.
Fig. 2-13 Test Control Circuit
Internal bus
OPLNote
SKINote
SM3
TEST RQF
CONTROL
S
R
Q
Q
NONSYNC
INTT
RQF
INTT
EDGE GATE
TIMERNote
HALT
S
R
NONSYNC
INT0
RQF
RELEASE
INT0
EDGE GATE
Note indicates that an instruction has been executed.
22
µPD7566A, 7566A(A)
3. STANDBY FUNCTIONS
The µPD7566A can be set in two standby modes (STOP and HALT), in which the power dissipation for the
microcomputer can be reduced while the program stands by. The STOP mode is set by a STOP instruction, while
the HALT mode is set by a HALT Instruction. In the STOP mode, the supply of all the clocks is stopped, but the supply
of only the CPU clock ø is stopped in the HALT mode. When the HALT mode is set, program execution is stopped,
butthecontentsofalltheregistersanddatamemory,immediatelybeforetheHALTmodehasbeenset,areretained.
The timer/event counter can operate even in the HALT mode.
The STOP mode is released only by the input of the RESET signal. The HALT mode can be released by setting
either or both the test request flags (INTT RQF and INT0 RQF), or by inputting the RESET signal. Therefore, the
standby mode cannot be set, even when the STOP or HALT instruction is executed while one of the test request
flags is set. To set the standby mode, when it is possible that one of the test request flags is set, execute an SKI
instruction in advance to reset the test request flag.
3.1 STOP MODE
The STOP mode can be set any time by executing the STOP instruction, unless either or both the test request
flags are set.
In this mode, the data memory contents are retained, but all other functions are stopped and become invalid,
except for the RESET signal, which is used to release the STOP mode. Consequently, the power dissipation for the
microcomputer is minimized.
Caution In the STOP mode, the CL1 pin is internally short-circuited to VDD (high level) to prevent the leakage
current from the ceramic oscillator.
3.2 HALT MODE
In this mode, only the 1/2 frequency divider for the system clock generator is stopped. Consequently, the supply
of system clock (CL) is not stopped and only the CPU clock (ø) is stopped. The operation of the CPU, which calls
for the CPU clock, is therefore stopped.
However, the clock control circuit is not stopped. The clock control circuit can therefore input the CL signal
generated by the system clock generator and event pulses input from an external source through the P00 pin, can
supply both the clocks to the timer/event counter as count pulses (CPs). The timer/event counter can therefore
operate on both the count pulses and its operation will not be interrupted.
3.3 RELEASING STOP MODE BY USING RESET INPUT
When the RESET signal becomes high in the STOP mode, the HALT mode is set, and at the same time, ceramic
oscillation starts.
When the RESET signal goes low, the HALT mode is released followed by ordinary RESET operation. After that,
the CPU starts executing the program from address 0. The STOP mode is thus released.
The contents of the data memory are retained even while the mode is released, that the contents of registers
become undefined.
23
µPD7566A, 7566A(A)
Fig. 3-1 STOP Mode Release Timing
STOP instruction
RESET input
STOP mode
HALT mode
(oscillator stabilization time)
Released
Ordinary reset operation
(execution starts from
address 0)
Clock oscillation starts
Caution The STOP mode is not released by setting the test request flags.
3.4 RELEASING HALT MODE BY USING TEST REQUEST FLAGS
The HALT is released when either or both of the test request flags (INTT RQF and INT0 RQF) are set, and program
execution is resumed, starting from the instruction next to the HALT instruction.
The contents of the registers and data memory, which have been retained during the HALT mode, are not
affected by the release of the HALT mode.
3.5 RELEASING HALT MODE BY USING RESET INPUT
When the RESET signal is input, the HALT mode is unconditionally released, as illustrated in Fig. 3-2.
Fig. 3-2 HALT Mode Release Timing by RESET Input
RESET
HALT mode
Released
Ordinary reset operation
(execution starts from
address 0)
While the RESET signal is active (high level), the HALT mode continues. When the RESET signal goes low, the
HALT mode is released. Ordinary resetting operation is then accomplished. Then, the program is executed starting
from address 0.
The contents of the data memory, retained during the HALT mode, are not affected by the RESET signal.
However, the contents of the registers are affected and become undefined.
24
µPD7566A, 7566A(A)
4. RESET FUNCTION
The microcomputer is reset and initialized as follows, when an active-high RESET signal is input to the RESET
pin:
4.1 INITIALIZATION
(1) The program counter (PC9 to PC0) is cleared to 0.
(2) The skip flags (SK1 and SK0) for the program status word are reset to 0.
(3) The count register for the timer/event counter is cleared to 00H.
(4) The clock control circuit is initialized as follows:
• Clock mode register (bits CM2 and 1) = 0
1
256
➝ CP = CL x
• Prescalers 1, 2, and 3 = 0
(5) The SM3 flag is reset to 0, disabling the external test input (INT0).
(6) The test request flags (INTT RQF and INT0 RQF) are reset to 0.
(7) The contents of the data memory and the following registers will become undefined.
Stack pointer (SP)
Accumulator (A)
Carry flag (C)
General-purpose registers (H and L)
Output latches for ports
(8) The output buffers for all the ports are turned off and enter the output high-impedance state.
The I/O ports are set in the input mode.
Caution When the RESET signal is used to released the standby mode, the contents of the data memory do
not become undefined, but are retained.
When the RESET signal is removed, the program is executed starting from address 000H. However, initialize
or reinitialize the contents for the registers by program.
25
µPD7566A, 7566A(A)
5. INSTRUCTION SET
(1) Operand representation format and description
addr
10-bit immediate data or label
caddr
10-bit immediate data or label
caddr1
Immediate data 100H-107H, 140H-147H or label
Immediate data 180H-187H, 1C0H-1C7H or label
mem
6-bit immediate data or label
n5
n4
n2
5-bit immediate data or label
4-bit immediate data or label
2-bit immediate data or label
bit
pr
2-bit immediate data or label
HL-, HL+, HL
(2) Legend for “Operation” column
A
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
Accumulator
H
H register
L
L register
HL
pr
Pair register (HL)
Pair register (HL-, HL+, HL)
Stack pointer
SP
PC
C
Program counter
Carry flag
PSW
CT
In
Program status word
Count register
Immediate data corresponding to n5, n4, or n2
Immediate data corresponding to addr, caddr, or caddr1
Immediate data corresponding to bit
Immediate data corresponding to mem
Immediate data corresponding to pr
Contents addressed by xx
Hexadecimal data
Pn
Bn
Dn
Rn
(xx)
xH
26
µPD7566A, 7566A(A)
(3) Selection of port/mode register
IPL Instruction
L
Port
0
1
Port 0
Port 1
Port 10
Port 11
AH
BH
OPL Instruction
L
8
Port/mode register
Port 8
9
Port 9
AH
BH
CH
FH
Port 10
Port 11
Clock mode register
SM3 flag
RPBL; SPBL Instruction
L
FH
3
EH
2
DH
1
CH
0
BH
3
AH
2
9
1
8
0
5
1
4
0
2
2
1
1
0
0
Bit
Port
Port 11
Port 10
Port 9
Port 8
(4) Selection of addressing mode by pair register
pr
R1
R0
HL-
HL+
HL
0
0
1
0
1
0
27
OP Code
Instructions
Load/Store
Mne-
ope-
rand
Operation
Skip
monic
B1
B2
Condition
→
0 0 0 1 I3 I2 I1 I0
LAI
n4
A
n4
Loads n4 to accumulator
String-effect
LAI
→
LHI
n2
pr
0 0 1 0 1 0 I1 I0
0 1 0 1 0 0 R1 R0
H
A
n2
Loads n2 to register H
→
LAM
(pr) pr = HL-, HL+, HL
Loads memory contents addressed
by pr to accumulator
L = FH (HL-)
L = 0 (HL+)
→
→
LHLI
ST
n5
1 1 0 I4 I3 I2 I1 I0
0 1 0 1 0 1 1 1
0 1 0 0 I3 I2 I1 I0
H
0 I4, L
I3-0
Loads n5 to registerpair HL
String-effect
LHLI
→
(HL)
A
Stores accumulator contents to
memory addressed by HL
→
→
STII
n4
(HL) n4, L L+1
Stores n4 in memory addressed by
HL and then increments L register
contents
0 1 1 1 1 0 1 1
0 1 0 1 0 1 R1 R0
XAL
A
A
L
Exchanges accumulator contents with
L register contents
XAM
pr
(pr) pr = HL-, HL+, HL
Exchanges accumulator contents with L = FH (HL-)
contents of memory addressed by pr L = 0 (HL+)
0 0 0 0 I3 I2 I1 I0
0 1 1 1 1 1 0 1
Arithmetic
Operation
AISC
ASC
n4
A
A
A + n4
Adds accumulator contents to n4
Carry
Carry
→
A + (HL)
Adds accumulator contents to
contents of memory addressed by HL
→
ACSC
EXL
0 1 1 1 1 1 0 0
0 1 1 1 1 1 1 0
A, C A + (HL) + C
Adds accumulator contents to
contents of memory addressed by HL
with carry flag
Carry
→
A
A V (HL)
Exclusive-ORs accumulator contents
with contents of memory addressed
by HL
→
Accumulator/
Carry Flag
Manipulation
CMA
RC
0 1 1 1 1 1 1 1
0 1 1 1 1 0 0 0
0 1 1 1 1 0 0 1
0 1 0 1 1 0 0 1
0 0 1 1 1 1 0 1
A
C
C
L
A
Complements accumulator contents
Resets carry flag
→
0
µ
→
SC
1
Sets carry flag
→
Increment/
Decrement
ILS
L + 1
Increments L register contents
L = 0
→
0 0 D5 D4 D3 D2 D1 D0
0 0 D5 D4 D3 D2 D1 D0
IDRS
mem
(mem) (mem) + 1
Increments contents of memory
addressed by mem
(mem) = 0
→
DLS
0 1 0 1 1 0 0 0
0 0 1 1 1 1 0 0
L
L - 1
Decrements L register contents
L = FH
→
DDRS
mem
bit
(mem) (mem) - 1
Decrements contents of memory
addressed by mem
(mem) = FH
→
Memory bit
Manipulation
RMB
SMB
0 1 1 0 1 0 B1 B0
0 1 1 0 1 1 B1 B0
(HL)bit
(HL)bit
0
Resets bit, specified by B1-0, of
memory addressed by HL
→
bit
1
Sets bit, specified by B1-0, of
memory addressed by HL
OP Code
Instructions
Mne-
monic
ope-
rand
Operation
Skip
Condition
B1
B2
→
Jump
JMP
JCP
addr
0 0 1 0 0 0 P9 P8
1 0 P5 P4 P3 P2 P1 P0
P7 P6 P5 P4 P3 P2 P1 P0
PC9-0
P9-0
Jumps to address indicated by P9-0
→
addr
PC5-0
P5-0
Jumps to address specified by P5-0
which replaces PC5-0
→
Subroutine/
Stack
Control
CALL
CAL
caddr
0 0 1 1 0 0 P9 P8
1 1 1 P4 P3 P2 P1 P0
P7 P6 P5 P4 P3 P2 P1 P0
(SP-1)(SP-2)(SP-4) PC9-0
Saves contents of PC and PSW to
stack, decrements SP by 4, and
calls address indicated by caddr
→
→
(SP-3) PSW, SP SP - 4
→
PC9-0
P9-0
→
→
caddr1
(SP-1)(SP-2)(SP-4) PC9-0
Saves contents of PC and PSW to
stack, decrements SP by 4, and calls
address indicated by caddr1
→
(SP-3) PSW, SP SP - 4
→
PC9-0
0 1 P4P30 0 0 P2P1P0
→
RT
0 1 0 1 0 0 1 1
0 1 0 1 1 0 1 1
PC9-0 (SP)(SP+2)(SP+3)
Restores contents of stack memory to
PC and increments SP by 4
→
SP SP + 4
→
RTS
PC9-0 (SP)(SP+2)(SP+3)
Restores contents of stack memory to Un-
PC, increments SP by 4, and skips
unconditionally
→
SP SP + 4
conditionally
then skip unconditionally
→
TAMSP
0 0 1 1 1 1 1 1 0 0 1 1 0 0 0 1
SP5-4
SP3-1
A1-0
Transfers lower 2 bits of accumulator
to SP5-4, and higher 3 bits of
contents of memory, addressed by
HL, to SP3-1
→
→
(HL)3-1, SP0
0
Skip
SKC
0 1 0 1 1 0 1 0
0 1 1 1 0 1 B1 B0
Skip if C = 1
Skips if carry flag is 1
C = 1
SKABT
bit
bit
bit
Skip if Abit = 1
Skips if bit, specified by B1-0, of
accumulator is 1
Abit = 1
SKMBT
SKMBF
SKAEM
0 1 1 0 0 1 B1 B0
0 1 1 0 0 0 B1 B0
0 1 0 1 1 1 1 1
Skip if (HL)bit = 1
Skip if (HL)bit = 0
Skip if A = (HL)
Skips if bit, specified by B1-0, of
memory addressed by HL is 1
(HL)bit = 1
(HL)bit = 0
A = (HL)
Skips if bit, specified by B1-0, of
memory addressed by HL is 0
Skips if accumulator contents are
equal to contents of memory
addressed by HL
µ
SKAEI
SKI
n4
n2
0 0 1 1 1 1 1 1
0 1 1 0 I3 I2 I1 I0
Skip if A = n4
Skips if accumulator contents are
equal to n4
A= n4
0 0 1 1 1 1 1 1 0 1 0 0 0 0 I1 I0 Skip if INT RQF = 1
Then reset INT RQF
Skips if INT RQF is 1, and then
clears INT RQF to 0
INT RQF = 1
OP Code
Instructions
Mne-
monic
ope-
rand
Operation
Skip
Condition
B1
B2
TIMER
0 0 1 1 1 1 1 1 0 0 1 1 0 0 1 0 Start Timer
Starts timer operation
Timer
→
Control
TCNTAM
0 0 1 1 1 1 1 1 0 0 1 1 1 0 1 1
A
CT7-4
Transfers higher 4 bits of count
register to accumulator, and lower 4
bits to memory addressed by HL
→
(HL) CT3-0
→
Input/Output
IPL
0 1 1 1 0 0 0 0
0 1 1 1 0 0 0 1
0 1 1 1 0 0 1 0
A
A
Port (L)
Loads contents of port specified by L
register to accumulator
→
IP1
Port 1
Inputs contents of port to
accumulator
→
OPL
Port/Mode reg.(L)
A
Outputs accumulator contents to port
or mode register specified by L
register
→
RPBL Note
SPBL Note
0 1 0 1 1 1 0 0
0 1 0 1 1 1 0 1
Port bit (L)
Port bit (L)
0
Resets bits of port 8, 10, or 11
specified by L register
→
1
Sets bits of port 8, 10, or 11
specified by L register
CPU Control
HALT
STOP
NOP
0 0 1 1 1 1 1 1 0 0 1 1 0 1 1 0 Set Halt mode
0 0 1 1 1 1 1 1 0 0 1 1 0 1 1 1 Set Stop Mode
Sets HALT mode
Sets STOP mode
0 0 0 0 0 0 0 0
No operation
Performs nothing but waits for 1
machine cycle
Note Although the SPBL and RPBL instructions are to set or reset a specified bit, they also output port contents (in 4-bit units) including the specified bit
as soon as the specified bit has been set or reset (the contents of the output latch are output to pins other than the specified bit). Before executing
these instructions, initialize the contents of the output latch by executing the OPL instruction.
µ
µPD7566A, 7566A(A)
6. ELECTRICAL SPECIFICATIONS
µPD7566A: ABSOLUTE MAXIMUM RATINGS (Ta = 25°C)
Item
Symbol
Condition
Rating
-0.3 to + 7.0
-0.3 to VDD + 0.3
-0.3 to VDD + 0.3
-0.3 to +11
-0.3 to VDD + 0.3
-0.3 to VDD + 0.3
-0.3 to +11
-5
Unit
V
Supply Voltage
VDD
Other than ports 10 and 11
V
Input Voltage
VI
Ports 10
and 11
Note 1
Note 2
V
V
Other than ports 8 to 11
V
Output Voltage
VO
IOH
IOL
Ports 8
to 11
Note 1
Note 2
V
V
1 pin
mA
mA
mA
mA
mA
High-Level
Output Current
Total of all pins
-15
Ports 8 and 9
Others
30
1 pin
Low-Level
Output Current
15
Total of all pins
100
Operating
Temperature
Topt
-10 to +70
°C
°C
Storage
Temperature
Tstg
-65 to +150
Shrink DIP
Mini-flat
480
250
Power
Dissipation
Pd
Ta = 70°C
mW
Note 1. CMOS input/output or N-channel open-drain output with pull-up resistor connected
2. N-channel open-drain input/output
Caution Even if one of the parameters exceeds its absolute maximum rating even momentarily, the quality
of the product may be degraded. The absolute maximum rating therefore specifies the upper or lower
limit of the value at which the product can be used without physical damages. Be sure not to exceed
or fall below this value when using the product.
★
31
µPD7566A, 7566A(A)
★
µPD7566A(A): ABSOLUTE MAXIMUM RATINGS (Ta = 25°C)
Item
Symbol
VDD
Condition
Rating
-0.3 to + 7.0
-0.3 to VDD + 0.3
-0.3 to VDD + 0.3
-0.3 to +11
-0.3 to VDD + 0.3
-0.3 to VDD + 0.3
-0.3 to +11
-5
Unit
V
Supply Voltage
Other than ports 10 and 11
V
Input Voltage
VI
Ports 10
and 11
Note 1
Note 2
V
V
Other than ports 8 to 11
V
Output Voltage
VO
IOH
IOL
Ports 8
to 11
Note 1
Note 2
V
V
1 pin
mA
mA
mA
mA
mA
High-Level
Output Current
Total of all pins
-15
Ports 8 and 9
Others
30
1 pin
Low-Level
Output Current
15
Total of all pins
100
Operating
Temperature
Topt
-40 to +85
°C
°C
Storage
Temperature
Tstg
-65 to +150
Shrink DIP
Mini-flat
350
195
Power
Dissipation
Pd
Ta = 85°C
mW
Note 1. CMOS input/output or N-channel open-drain output with pull-up resistor connected
2. N-channel open-drain input/output
Caution Even if one of the parameters exceeds its absolute maximum rating even momentarily, the quality
of the product may be degraded. The absolute maximum rating therefore specifies the upper or lower
limit of the value at which the product can be used without physical damages. Be sure not to exceed
or fall below this value when using the product.
CAPACITANCE (Ta = 25°C, VDD = 0V)
Item
Symbol
CIN
Condition
P00, P01, P10 to P13
MIN. TYP. MAX. Unit
Input Capacitance
Output Capacitance
15
15
35
35
pF
pF
pF
pF
f = 1 MHz
COUT
0V at pins
other than
measured pin
Cin0 to Cin3
Ports 8 and 9
Ports 10 and 11
Input/Output
Capacitance
CIO
32
µPD7566A, 7566A(A)
OSCILLATOR CHARACTERISTICS µPD7566A
: Ta = -10 to +70°C, VDD = 2.7 to 6.0V
µPD7566A(A) : Ta = -40 to +85°C, VDD = 2.7 to 6.0V
Oscillator
External
Circuit
Item
Condition
MIN. TYP. MAX. Unit
VDD = 4.5 to 6.0V
VDD = 4.0 to 6.0V
VDD = 3.5 to 6.0V
VDD = 2.7 to 6.0V
290 700 710 kHz
290 500 510 kHz
290 400 410 kHz
290 300 310 kHz
Oscillation
frequency
(fCC)
CL1
CL2
R2
C2
Ceramic
Oscillator Note
C1
After the
Oscillation
stabilization time
(tOS)
minimum value of
the operating
voltage range
has been reached
20
ms
Note The following ceramic oscillators are recommended:
Operating
Voltage Range
[V]
Recommended Constants
Manufacturer
Product
Name
C1 [pF]
C2 [pF]
330
220
100
100
470
330
220
220
120
100
82
R2 [kΩ ]
MIN.
2.7
MAX.
6.0
CSB300D
CSB400P
CSB500E
CSB700A
KBR-300B
KBR-400B
KBR-500B
KBR-680B
CRK-400
CRK-500
CRK-680
330
220
100
100
470
330
220
220
120
100
82
6.8
6.8
6.8
6.8
0
3.5
4.0
4.5
2.7
3.5
4.0
4.5
3.5
4.0
4.5
6.0
6.0
6.0
6.0
6.0
6.0
6.0
6.0
6.0
6.0
Murata Mfg. Co., Ltd.
0
Kyoto Ceramic
Co., Ltd.
0
0
12
12
12
Toko Inc.
Caution 1. Locate the oscillation circuit as close as possible to the CL1 and CL2 pins.
2. Do not route any other signal lines in the area enclosed by the dotted Line.
33
µPD7566A, 7566A(A)
DC CHARACTERISTICS µPD7566A
: Ta = -10 to +70°C, VDD = 2.7 to 6.0V
µPD7566A(A) : Ta = -40 to +85°C, VDD = 2.7 to 6.0V
Item
Symbol
VIH1
Condition
Other than ports 10 and 11
Ports 10 and 11Note 1
MIN.
0.7VDD
0.7VDD
0
TYP.
MAX.
VDD
Unit
V
High-Level Input Voltage
Low-Level Input Voltage
VIH2
9
V
VIL
0.3VDD
V
VDD = 4.5 to 6.0V
IOH = -1 mA
VDD-2.0
VDD-1.0
V
V
V
High-Level Output Voltage
VOH
Ports 8 to 11
IOH = -100 µA
VDD = 4.5 to 6.0V
IOL = 1.6 mA
0.4
2.0
Ports 10 and 11
VDD = 4.5 to 6.0V
IOL = 10 mA
V
Low-Level Output Voltage
VOL
IOL = 400 µA
0.5
2.0
V
V
VDD = 4.5 to 6.0V
IOL = 15 mA
Port 8 and 9
IOL = 600 µA
0.5
3
V
ILIH1
ILIH2
VIN = VDD
µA
µA
High-Level Input Leakage Current
VIN = 9V, Ports 10 and 11Note 1
10
Low-Level Input
Leakage Current
ILIL
VIN = 0V
-3
µA
ILOH1
VOUT = VDD
3
µA
µA
High-Level Output Leakage Current
ILOH2
VOUT = 9V, Ports 8, 9, 10 and 11Note 1
10
Low-Level Output
Leakage Current
ILOL
VOUT = 0V
-3
µA
kΩ
kΩ
µA
µA
µA
µA
Resistor Interconnected To
Input Pin (Pull-Up, Pull-Down)
Ports 0 and 1, RESET
Ports 10 and 11
23.5
7.5
47
15
70.5
22.5
2200
360
Resistor Interconnected To
Output Pin (Pull-Up)
VDD = 5V+10%
fCC = 700 kHz
650
120
450
65
IDD1
Operation mode
VDD = 3V+10%
fCC = 300 kHz
VDD = 5V+10%
fCC = 700 kHz
1500
200
Supply CurrentNote 2
IDD2
HALT mode
VDD = 3V+10%
fCC = 300 kHz
VDD = 5V+10%
STOP mode
0.1
0.1
10
5
µA
µA
IDD3
VDD = 3V+10%
Note 1. With N-channel open-drain input/output selected
2. Excludingcurrentflowingthroughinternalpull-upandpull-downresistors,comparator,andinternalbias
resistor
34
µPD7566A, 7566A(A)
COMPARATOR CHARACTERISTICS µPD7566A
: Ta = -10 to +70°C, VDD = 3.0 to 6.0V
µPD7566A(A) : Ta = -40 to +85°C, VDD = 3.0 to 6.0V
Item
Symbol
Condition
Cin 0 to Cin 3,
MIN.
25
TYP. MAX. Unit
Ccomparator Current
DissipationNote
1 circuit
50
100
µA
★
VDD = 5V±10%
Input Voltage
Range
Vcin
Vref
0
2
VDD
V
Response Time
4
tCY
mV
mV
VDD =5V±10%
10
50
Comparator
Input
Resolution
100
Input Leakage
Current
±3
µA
kΩ
★
Internal Bias
Resistor
Rref
50
100
200
Note Excluding current flowing through internal bias resistor
AC CHARACTERISTICS µPD7566A
: Ta = -10 to +70°C, VDD = 2.7 to 6.0V
µPD7566A(A) : Ta = -40 to +85°C, VDD = 2.7 to 6.0V
Item
Symbol
Condition
MIN.
2.8
6.4
0
TYP. MAX. Unit
VDD =4.5 to 6.0V
6.9
6.9
710
350
0.2
µs
µs
Note
Internal Clock Cycle Time
tCY
VDD = 4.5 to 6.0V
kHz
kHz
µs
duty
= 50%
P00 Event Input Frequency
P00 Input Rise and Fall Time
fP0
0
tP0R, tP0F
VDD = 4.5 to 6.0V
0.7
1.45
10
µs
P00 Input High- and
Low-Level Widths
tP0H,
tP0L
µs
INT0 High- and Low-Level Widths
tI0H, tI0L
µs
Reset High- and Low-Level Widths
tRSH, tRSL
10
µs
Note tCY = 2/fCC (Refer to the characteristic curve for the power requirement not listed above.)
AC TIMING MEASURING POINTS (other than CL1 input)
0.7 VDD
0.3 VDD
0.7 VDD
0.3 VDD
Measuring
points
35
µPD7566A, 7566A(A)
DATA MEMORY DATA RETENTION CHARACTERISTICS IN STOP MODE
µPD7566A : Ta = -10 to +70°C
µPD7566A(A): Ta = -40 to +85°C
Item
Symbol
VDDDR
IDDDR
tSRS
Condition
MIN.
2.0
TYP. MAX. Unit
Supply Voltage for Data Retention
Supply Current for Data Retention
Reset Setup Time
6.0
5
V
VDDDR = 2.0V
0.1
µA
µs
0
Oscillation Stabilization Time
tOS
After VDD reached 4.5V
20
ms
DATA RETENTION TIMING
HALT
mode
Operation
mode
STOP mode
Data retention mode
VDD
VDDDR
tSRS
STOP instruction
is carried out
RESET
tOS
36
µPD7566A, 7566A(A)
CLOCK TIMING
1/fC
tCL
t
CH
CL1 input
tCR
tCF
1/fP0
tP0L
tP0H
P00 input
tP0R
tP0F
TEST INPUT TIMING
I0L
tI0H
t
INT0
RESET INPUT TIMING
tRSL
tRSH
RESET
37
µPD7566A, 7566A(A)
7. CHARACTERISTIC DATA
fCC vs. VDD Guaranteed Operation Range
a
: T = –10 to +70 °C
: T = –40 to +85 °C
PD7566A
PD7566A(A)
µ
µ
a
CL1 CL2
R2
C2
C1
1000
50
Guaranteed
operation range
100
0
1
2
3
4
5
6
Supply voltage VDD [V]
fPO vs. VDD Guaranteed Operation Range
a
: T = –10 to +70 °C
: Ta = –40 to +85 °C
PD7566A
PD7566A(A)
µ
µ
t1
t2
1
t1
>t2:fx
=
2t
2
1000
500
1
t1
<t2:fx
=
2t
1
Guaranteed
operation range
100
10
0
1
2
3
4
5
6
Supply voltage VDD [V]
38
µPD7566A, 7566A(A)
IDD vs. VDD Characteristic Example
(Reference Value)
(Ta = 25°C)
CL1
CL2
CL1
CL2
6.8 k
330 100
pF pF
Ω
6.8 k
Ω
fcc = 700 kHz
100 Operation mode
330
pF
pF
1000
500
HALT mode
CSB300D
CSB700A
µ
fcc = 300 kHz
Operation mode
100
50
HALT mode
10
0
1
2
3
4
5
6
Supply voltage VDD [V]
IOL vs. VOL Characteristic Example
(Reference Value)
(Ports 8 and 9)
(Ta = 25°C)
30
25
20
15
10
5
VDD = 5 V
VDD = 3 V
Caution The absolute maximum rating is 30 mA per pin.
0
0
1
2
3
4
5
6
Low-level output voltage V0L [V]
39
µPD7566A, 7566A(A)
IOL vs. VOL Characteristic Example
(Reference Value)
(Ports 10 and 11)
(Ta = 25°C)
30
25
20
15
10
5
VDD = 5 V
Caution The absolute maximum rating is 15 mA per pin.
VDD = 3 V
0
0
1
2
3
4
5
6
Low-level output voltage V0L [V]
IOH vs. VOH Characteristic Example
(Reference Value)
(Ta = 25°C)
–5
–4
–3
–2
–1
0
VDD = 5 V
Caution The absolute maximum rating is –5 mA per pin.
VDD = 3 V
0
1
2
3
4
5
6
VDD – V0H [V]
40
µPD7566A, 7566A(A)
8. APPLICATION CIRCUITS
(1) Refrigerator and Air Conditioner
LED×4
AC03DGM, etc.
AC16DGM, etc.
MAX.
9 V
RES P80 P81 P82 P90 P91
Comparator inputs
Cin0
Cin1
Cin2
Cin3
2SC945A
+
+
P113
(CMOS output)
RD
5.1E
AC100V
µ
PD7566A
Thermistors
Vref
(Pull-down resistor
interconnected)
P100
P101
P102
P103
CL1
Overcurrent
detector
2SA733
INT0
CMOS output
P110
P111
P112
CL2
Switch input
(door switch)
The above example shows a circuit for a refrigerator. A circuit for an air conditioner can be implemented by
replacing only the heater with a fan motor.
41
µPD7566A, 7566A(A)
(2) Rice Cooker
2SA733
LED×4
RD
10E
+
AC03DGM, etc.
RES P80 P81 P82 P90 P91
Open-drain outputs
RL
+
RD
5.1E
Cin 0
Comparator input
RD
24E
P111
AC100 V
µ
PD7566A
P110
Vref
P112
CMOS outputs
BZ
Piezoelectric
buzzer
P100
P101
P102
P103
P00
P11
P12
P13
CL2
CL1
42
µPD7566A, 7566A(A)
(3) Washing Machine
2SA733
AC0V8DGM AC03DGM
etc. etc.
AC08DGM
etc.
RES P90 P91
Open-drain
P100
P102
(open-drain
input)
2SC945A
P101
× 2
M
+
CMOS
outputs
+
AC100V
RD
5.6E
P110
to
Driver µPA80C
LED×12
P113
µ
PD7566A
P103
(CMOS output)
Piezoelectric buzzer
BZ
P80
P81
P82
P10
P11
P12
P00
P01
P13
CL2
CL1
Input 12 keys
43
µPD7566A, 7566A(A)
(4) Cassette Deck Controller
µPD7566A
P91
P100
P101
2SA733
Motor
plunger
driver
LED×8
3
P110-P112
Recording signal
Mute signal
P113
P102
P103
Leader signal
P80
P81
P82
P90
P10
P11
P12
Tape end detection
Pause input
INT0
P01
P13
Voltage detection
CL1
CL2
12 keys
44
µPD7566A, 7566A(A)
(5) Remote Controller
µ
PD7566A
P80
(CMOS Output)
70 keys max.
RESET
(with pull-down resistor
interconnected)
2SA733
P00
P01
P10
P11
Inputs with pull-up
resistor
interconnected
P12
P13
P100
P101
P102
P103
P82
P90
P91
N-channel,
open-drain
output
P110
P111
P112
P113
P81
2SA952
CL1
CL2
Ceramic oscillator
304 kHz
Infrared
light-emitting
diode
SE307-C
45
µPD7566A, 7566A(A)
9. PACKAGE DRAWINGS
DRAWINGS OF MASS-PRODUCTION PRODUCT PACKAGES (1/2)
24 PIN PLASTIC SHRINK DIP (300 mil)
24
13
1
12
A
K
L
F
C
B
M
D
N
M
R
NOTE
ITEM MILLIMETERS
INCHES
1) Each lead centerline is located within 0.17 mm (0.007 inch) of
its true position (T.P.) at maximum material condition.
A
B
C
23.12 MAX.
1.78 MAX.
1.778 (T.P.)
0.911 MAX.
0.070 MAX.
0.070 (T.P.)
2) Item "K" to center of leads when formed parallel.
+0.004
0.020
D
0.50±0.10
–0.005
F
G
H
I
0.85 MIN.
3.2±0.3
0.033 MIN.
0.126±0.012
0.020 MIN.
0.170 MAX.
0.200 MAX.
0.300 (T.P.)
0.256
0.51 MIN.
4.31 MAX.
5.08 MAX.
7.62 (T.P.)
6.5
J
K
L
+0.004
0.010
+0.10
0.25
M
–0.003
–0.05
N
R
0.17
0.007
0~15°
0~15°
S24C-70-300B-1
Caution Dimensions of ES products are different from those of mass-production products. Refer to DRAWINGS
OF ES PRODUCT PACKAGES (1/2).
★
46
µPD7566A, 7566A(A)
DRAWINGS OF MASS-PRODUCTION PRODUCT PACKAGES (2/2)
24 PIN PLASTIC SOP (300 mil)
24
13
detail of lead end
1
12
A
H
I
J
L
B
C
N
M
M
D
NOTE
ITEM MILLIMETERS
INCHES
Each lead centerline is located within 0.12 mm (0.005 inch) of
its true position (T.P.) at maximum material condition.
A
B
C
15.54 MAX.
0.78 MAX.
1.27 (T.P.)
0.612 MAX.
0.031 MAX.
0.050 (T.P.)
+0.10
0.40
+0.004
0.016
D
–0.05
–0.003
E
F
G
H
I
0.1±0.1
1.8 MAX.
1.55
0.004±0.004
0.071 MAX.
0.061
7.7±0.3
5.6
0.303±0.012
0.220
J
1.1
0.043
+0.004
0.008
+0.10
0.20
K
L
–0.002
–0.05
+0.008
0.024
0.6±0.2
–0.009
M
N
0.12
0.10
0.005
0.004
+7°
3°
+7°
3°
P
–3°
–3°
P24GM-50-300B-4
Caution Dimensions and materials of ES products are different from those of mass-production products. Refer
to DRAWINGS OF ES PRODUCT PACKAGES (2/2).
★
47
µPD7566A, 7566A(A)
DRAWINGS OF ES PRODUCT PACKAGES (1/2)
ES 24 PIN SHRINK DIP (REFERENCE) (UNIT: mm)
48
µPD7566A, 7566A(A)
DRAWINGS OF ES PRODUCT PACKAGES (2/2)
ES 24 PIN CERAMIC SOP (REFERENCE) (UNIT: mm)
49
µPD7566A, 7566A(A)
10. RECOMMENDED PC BOARD PATTERN FOR SOP (REFERENCE) (UNIT: mm)
7.62
1.27
•
The pattern shown above conforms to the Integrated Circuit Dimensions Rule (IC-74-2) stipulated by the
Electric Industry Association of Japan (EIAJ).
•
•
ThedimensionsofthispatternareapplicabletoalltheproductscalledflatDIP(mini-flat)“formA300miltype”.
If there is a possibility that solder bridges could be formed, shorten the pitch (0.76 mm) between pads, without
changing the length for each pad (1.27 mm).
50
µPD7566A, 7566A(A)
★
11. RECOMMENDED SOLDERING CONDITIONS
For the µPD7566A, soldering must be performed under the following conditions.
For details of recommended conditions for surface mounting, refer to information document "Semiconductor
device mounting technology manual" (IEI-1207).
For other soldering methods, please consult with NEC sales personnel.
Table 11-1 Soldering Conditions of Surface Mount Type
µPD7566AG-XXX: 24-pin plastic SOP (300 mil)
µPD7566AG(A)-XXX: 24-pin plastic SOP (300 mil)
Recommended
Soldering Method
Infrared Reflow
VPS
Soldering Conditions
Conditions
Reference Code
Package peak temperature 230°C, Time: 30 secondes max.
(210°C min.), Number of soldering operations: 1,
IR30-00-1
VP15-00-1
Package peak temperature 215°C, Time: 40 seconds max.
(200°C min.), Number of soldering operations: 1
Wave Soldering
Solder bath temperature: 260°C max., Time: 10 seconds max., WS60-00-1
Preparatory heating temperature: 120°C max.
(Package surface temperature)
Pin Partial Heating
Pin temperature: 300°C max., Time: 3 seconds max. (Per side)
–
Caution Do not use one soldering method in combination with another (however, pin partial heating can be
performed with other soldering methods).
Table 11-2 Soldering Conditions of Through-Hole Type
µPD7566ACS-XXX: 24-pin plastic shrink DIP (300 mil)
µPD7566ACS(A)-XXX: 24-pin plastic shrink DIP (300 mil)
Soldering Method
Soldering Conditions
Wave Soldering
Solder bath temperature: 260°C max., Time: 10 seconds max.
(Only for pin part)
Pin Partial Heating
Pin temperature: 300°C max., Time: 3 seconds max. (Per pin)
Caution The wave soldering must be performed at the pin part only. Note that the solder must not be directly
contacted to the package body.
51
Product
µPD7556
µPD75P56
µPD7556A µPD7556A(A) µPD7566
µPD75P66
µPD7566A µPD7566A(A)
Item
Instruction
RC
4 µs/500 kHz
–
–
Cycle/System
External
Ceramic
2.86 µs/700 kHz
Clock (5 V)
–
2.86 µs/700 kHz
Instruction Set
ROM
45 (SET B)
1024 × 8
64 × 4
RAM
I/O Ports
Total
20
14 or 15
20
19
14
19
µ
Port 0
Port 1
Port 8
P00, P01
P10-P13
P00
–
P00, P01
P10-P13
P00, P01
P10-P13
P00
P00, P01
P10-P13
–
P80-P82,
P83/CL2
P80-P82,
P83(CL2)
P80-P82,
P83/CL2
P80-P82
– – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – –
Breakdown
12 V
9 V
12 V
9 V
Voltage Limit
Port 9, 10, 11
P90, P91, P100-P103, P110-P113
– – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – –
Breakdown
12 V
9 V
12 V
9 V
Voltage Limit
Timer/Event Counter
Comparator
8 bits
µ
4 channels
Supply Voltage Range
Package
2.5-6.0 V
4.5-6.0 V
2.0-6.0 V
2.7-6.0 V
2.7-6.0 V
4.5-6.0 V
2.7-6.0 V
2.7-6.0 V
24-pin plastic shrink DIP
24-pin plastic SOP
µPD7566A, 7566A(A)
APPENDIX B. DEVELOPMENT SUPPORT TOOLS
The following development support tools are available for developing a system in which the µPD7566A is
employed.
Language Processor
This absolute assembler is a program which converts a program written in
mnemonic to object code, so that it can be executed by microcomputer.
In addition, this absolute assembler is provided with a function which
automatically performs branch instruction optimization.
µPD7550, 7560 Series
Absolute Assembler
Host machine
PC-9800 series
IBM PC/ATTM
Order code
OS
Media
3.5"2HD
5.25" 2HD
(Product name)
MS-DOSTM
Ver.3.10
to
µS5A13AS7554
µS5A10AS7554
Ver.5.00ANote
PC DOSTM
(Ver.3.1 )
5.25" 2HC
µS7B10AS7554
PROM Programming Tool
PROM programmer that can easily program typical PROMs of 256K to 4M
bits or single-chip microcomputers with built-in PROMs in the stand-alone
mode or remotely from the host machine by connecting the accessory
boards and separately sold program adapters.
PG-1500
Hardware
PA-75P56CS
PROM programmer adapter to be connected to the PG-1500 for programming
the µPD75P56 or the µPD75P66.
Allows controlling the PG-1500 connected to the host machine via the serial
and parallel interface, from the host machine.
Host machine
PC-9800 series
IBM PC/AT
Order code
OS
Media
3.5"2HD
5.25" 2HD
(Product name)
Software
PG-1500
Controller
MS-DOS
Ver.3.10
to
µS5A13PG1500
µS5A10PG1500
Ver.5.00ANote
PC DOS
(Ver.3.1 )
5.25" 2HC
µS7B10PG1500
Note Although Ver. 5.00/5.00A is provided with a task swap function, this function cannot be used with this
software.
Remark The operations of the assembler and PG-1500 controller are guaranteed only on the above host
machine and OS.
53
µPD7566A, 7566A(A)
Debugging Tool
The EVAKIT-7500B is an evaluation board which can be used commonly with
the µPD7500 series products.
For system development with the µPD7566A, the and the EV-7554A option
EVAKIT-7500B board are used together.
EVAKIT-7500B Although the EVAKIT-7500B can operate in the stand-alone mode, the
EVAKIT-7500B has 2 serial interface channels on its board to which a
console, such as RS-232C, etc., can be connected for debugging.
Additionally, the EVAKIT-7500B has real-time tracing function, so that the
conditions of the program counter and the output ports can be traced on a
real-time basis.
Hardware
The EVAKIT-7500B also has a PROM programmer for effective debugging.
EV-7554A
SE-7554A
The EV-7554A is used together with the EVAKIT-7500B to evaluate the µPD7566A.
The SE-7554A is a simulation board for evaluating a system by mounting the
program, developed by the EVAKIT-7500B, in place of the µPD7566A.
The EVAKIT-7500 control program controls the EVAKIT-7500B from the host
machine by connecting the EVAKIT-7500B to the host machine via the RS-232C.
EVAKIT-7500 Host machine
Order code
Control
Program
(EVAKIT
OS
Media
3.5"2HD
5.25" 2HD
(Product name)
Software
MS-DOS
Ver.3.10
to
µS5A13EV7500-P01
µS5A10EV7500-P01
controller)
PC-9800 series
IBM PC series
Ver.5.00ANote
PC DOS
(Ver.3.1 )
5.25" 2D
µS7B11EV7500-P01
Note Although Ver. 5.00/5.00A is provided with a task swap function, this function cannot be used with this
software.
★
Caution It is not possible to internally mount a pull-up resistor in a port in the EVAKIT-7500B. When
evaluating, arrange to have a pull-up resistor mounted in the user system.
Remark Operations of the EVAKIT controller are guaranteed on the above listed host machines with the listed
operating system.
54
µPD7566A, 7566A(A)
APPENDIX C. RELATED DOCUMENTS
DOCUMENT RELATED TO DEVICE
★
Document Name
User's Manual
Document No.
IEU-1111D
IF-1027G
µPD7500-series Selection Guide
DOCUMENT RELATED TO DEVELOPMENT TOOL
Document Name
Document No.
EEU-1017C
EEU-1034A
EEU-1335B
EEM-1006
EVAKIT-7500B User's Manual
Hardware
Software
EV-7554A User's Manual
PG-1500 User's Manual
µPD7550, 7560-series Abusolute Assembler User's Manual
MS-DOS base
PC DOS base
EEM-1356
EEM-1049
EEU-1291B
EVAKIT-7500 Control Program User's Manual
PG-1500 Controller User's Manual
OTHER RELATED DOCUMENT
Document Name
Document No.
Package Manual
IEI-1213
IEI-1207
IEI-1209A
IEI-1203A
IEI-1201
MEI-1202
Note
Semiconductor Device Mounting Technology Manual
Quality Grade on NEC Semiconductor Devices
NEC Semiconductor Device Reliability/Quality Control System
Static Electricity Discharge (ESD) Guarantee Guide
Semiconductor Device Quality Guarantee Guide
Microcomputer-Related Product Guide -Third Party Product
Remark These documents above are subject to change without notice. Be sure to use the latest document
for designing.
Note To be published.
55
µPD7566A, 7566A(A)
[MEMO]
56
µPD7566A, 7566A(A)
NOTES FOR CMOS DEVICES
1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS
Note: Strong electric field, when exposed to a MOS device, can cause destruction of
the gate oxide and ultimately degrade the device operation. Steps must be
taken to stop generation of static electricity as much as possible, and quickly
dissipate it once, when it has occurred. Environmental control must be
adequate. When it is dry, humidifier should be used. It is recommended to
avoid using insulators that easily build static electricity. Semiconductor
devices must be stored and transported in an anti-static container, static
shielding bag or conductive material. All test and measurement tools including
work bench and floor should be grounded. The operator should be grounded
using wrist strap. Semiconductor devices must not be touched with bare
hands. Similar precautions need to be taken for PW boards with semiconductor
devices on it.
2 HANDLING OF UNUSED INPUT PINS FOR CMOS
Note: No connection for CMOS device inputs can be cause of malfunction. If no
connection is provided to the input pins, it is possible that an internal input
level may be generated due to noise, etc., hence causing malfunction. CMOS
device behave differently than Bipolar or NMOS devices. Input levels of CMOS
devices must be fixed high or low by using a pull-up or pull-down circuitry. Each
unused pin should be connected to VDD or GND with a resistor, if it is considered
to have a possibility of being an output pin. All handling related to the unused
pins must be judged device by device and related specifications governing the
devices.
3 STATUS BEFORE INITIALIZATION OF MOS DEVICES
Note: Power-on does not necessarily define initial status of MOS device. Production
process of MOS does not define the initial operation status of the device.
Immediately after the power source is turned ON, the devices with reset
function have not yet been initialized. Hence, power-on does not guarantee
out-pin levels, I/O settings or contents of registers. Device is not initialized
until the reset signal is received. Reset operation must be executed immedi-
ately after power-on for devices having reset function.
57
µPD7566A, 7566A(A)
[MEMO]
The application circuits and their parameters are for references only and are not intended for use in actual design-in's.
No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this
document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from use of a device described herein or any other liability arising
from use of such device. No license, either express, implied or otherwise, is granted under any patents,
copyrights or other intellectual property rights of NEC Corporation or others.
The devices listed in this document are not suitable for use in aerospace equipment, submarine cables, nuclear
reactor control systems and life support systems. If customers intend to use NEC devices for above applications
or they intend to use "Standard" quality grade NEC devices for applications not intended by NEC, please contact
our sales people in advance.
Application examples recommended by NEC Corporation
Standard: Computer, Office equipment, Communication equipment, Test and Measurement equipment,
Machine tools, Industrial robots, Audio and Visual equipment, Other consumer products, etc.
Special: Automotive and Transportation equipment, Traffic control systems, Antidisaster systems, Anticrime
systems, etc.
M4 92.6
MS-DOS is a trademark of Microsoft Corporation.
PC DOS and PC/AT are trademarks of IBM Corporation.
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