UPD7566A [NEC]

4-BIT SINGLE-CHIP MICROCOMPUTER; 4位单片机
UPD7566A
型号: UPD7566A
厂家: NEC    NEC
描述:

4-BIT SINGLE-CHIP MICROCOMPUTER
4位单片机

计算机
文件: 总58页 (文件大小:465K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DATA SHEET  
MOS INTEGRATED CIRCUIT  
µPD7566A, 7566A(A)  
4-BIT SINGLE-CHIP MICROCOMPUTER  
DESCRIPTION  
The µPD7566A is a product of the µPD7554, 7564 sub-series which is a low-end, low-cost version of the  
µPD7500 series microcomputers. This 4-bit single-chip microcomputer has fewer ports than the other products  
in the µPD7500 series, in order to reduce the package size, and is especially ideal for temperature control  
applications, as well as for application systems, such as air conditioners, microwave ovens, refrigerators, rice  
cooker, washing machines, and cassette deck controllers. Some of the output pins for the microcomputer can  
be used to directly drive triacs and LEDs.  
In addition, various I/O circuits can be selected by mask options, so that the number of necessary external  
circuits can be significantly reduced.  
A detailed function description is provided in the following user's manual.  
Be sure to read this manual when designing your system.  
µPD7556, 7566 User's Manual: IEM-1111D  
FEATURES  
PIN CONFIGURATION (Top View)  
45 instructions (subset of the µPD7500H SET B)  
Instruction cycle: 2.86 microseconds (700 kHz, at 5V) with  
ceramic oscillator  
P00/INT0  
P01/Vref  
P10/Cin0  
P11/Cin1  
P12/Cin2  
P13/Cin3  
P80  
1
2
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
14  
13  
VSS  
Program memory (ROM): 1,024 words x 8 bits  
Data memory (RAM): 64 words x 4 bits  
Test sources: 1 external and 1 internal  
8-bit timer/event counter  
19 I/O lines (total output current: 100 mA)  
. Five pins can be used to directly drive triacs and LEDS  
: P80 to P82, P90 to P91  
P91  
3
P90  
4
P113  
P112  
P111  
P110  
P103  
P102  
P101  
P100  
RESET  
µ
5
6
7
. Eight pins can be used to directly drive LEDs  
: P100 to P103, P110 to P113  
P81  
8
. Four comparator input pins: P10/Cin 0 to P13/Cin 3  
. Mask option functions available on all ports  
Standby functions (STOP/HALT)  
P82  
9
CL2  
10  
11  
12  
CL1  
Data memory contents can be retained on a low voltage  
Internal ceramic oscillator for system clock oscillation  
CMOS  
VDD  
Low-power dissipation  
Single power source (2.7 to 6.0V)  
APPLICATIONS  
µPD7566A  
: Air conditioner, microwave oven, refrigerator, audio  
equipment controller, etc.  
µPD7566A(A) : Automotive and transportation equipments, etc.  
The quality level and absolute maximum ratings of the µPD7566A and the µPD7566A(A) differ.  
Except where specifically noted, explanations here concern the µPD7566A as a representative product.  
If you are using the µPD7566A(A), use the information presented here after checking the functional  
differences.  
The information in this document is subject to change without notice.  
The mark shows major revised points.  
Document No. IC-2478D  
(O. D. No. IC-7885D)  
Date Published December 1994 P  
Printed in Japan  
1989
©
µPD7566A, 7566A(A)  
ORDERING INFORMATION  
Part Number  
Package  
Quality Grade  
µPD7566ACS-xxx  
µPD7566AG-xxx  
24-pin plastic shrink DIP (300 mil)  
24-pin plastic SOP (300 mil)  
Standard  
Standard  
Special  
µPD7566ACS(A)-xxx  
µPD7566AG(A)-xxx  
24-pin plastic shrink DIP (300 mil)  
24-pin plastic SOP (300 mil)  
Special  
Caution Be sure to specify mask options when placing your order.  
Remark xxx indicates ROM code number.  
Please refer to "Quality grade on NEC Semiconductor Devices" (Document number IEI-1209) published by  
NEC Corporation to know the specification of quality grade on the devices and its recommended applications.  
2
µ
INT0/P00  
CP  
INTT  
CLOCK  
TIMER/  
TEST  
CONTROL  
EVENT COUNTER  
CONTROL  
CL  
P00/INT0  
P01/Vref  
PORT0  
BUFFER  
PORT1  
PC(10)  
ALU(4)  
C
A(4)  
L(4)  
4
P10/Cin0 - P13/Cin3  
BUFFER  
/COMPARATOR  
PORT8  
LATCH  
BUFFER  
3
2
4
P80 - P82  
P90, P91  
H(2)  
PROGRAM MEMORY  
1024X8 BITS  
PORT9  
LATCH  
BUFFER  
SP(6)  
INSTRUCTION  
DECODER  
PORT10  
LATCH  
µ
P100 - P103  
CL  
Ø
BUFFER  
DATA MEMORY  
64X4 BITS  
SYSTEM  
PORT11  
LATCH  
STANDBY  
CONTROL  
CLOCK  
P110 - P113  
4
GENERATOR  
BUFFER  
CL1  
CL2  
VDD  
VSS  
RESET  
µPD7566A, 7566A(A)  
CONTENTS  
1. PIN FUNCTIONS...............................................................................................................................  
6
6
6
7
7
8
1.1  
1.2  
1.3  
1.4  
1.5  
1.6  
1.7  
PORT FUNCTIONS .................................................................................................................................  
OTHER FUNCTIONS...............................................................................................................................  
MASK OPTIONS FOR PINS ...................................................................................................................  
NOTES ON USING THE P00/INT0, AND RESET PINS.........................................................................  
PIN I/O CIRCUITS ...................................................................................................................................  
RECOMMENDED PROCESSING OF UNUSED PINS............................................................................ 10  
I/O PORT OPERATIONS ......................................................................................................................... 11  
2. INTERNAL FUNCTIONAL BLOCKS ................................................................................................. 13  
2.1  
2.2  
2.3  
2.4  
2.5  
2.6  
2.7  
2.8  
2.9  
PROGRAM COUNTER (PC).................................................................................................................... 13  
STACK POINTER (SP) ............................................................................................................................ 14  
PROGRAM MEMORY (ROM)................................................................................................................. 15  
GENERAL-PURPOSE REGISTERS ......................................................................................................... 15  
DATA MEMORY (RAM) ......................................................................................................................... 16  
ACCUMULATOR (A)............................................................................................................................... 17  
ARITHMETIC LOGIC UNIT (ALU) .......................................................................................................... 17  
PROGRAM STATUS WORD (PSW)....................................................................................................... 17  
SYSTEM CLOCK GENERATOR ............................................................................................................. 18  
2.10 CLOCK CONTROL CIRCUIT ................................................................................................................... 19  
2.11 TIMER/EVENT COUNTER ...................................................................................................................... 20  
2.12 TEST CONTROL CIRCUIT ...................................................................................................................... 21  
3. STANDBY FUNCTIONS ................................................................................................................... 22  
3.1  
3.2  
3.3  
3.4  
3.5  
STOP MODE ........................................................................................................................................... 22  
HALT MODE............................................................................................................................................ 22  
RELEASING STOP MODE BY USING RESET INPUT........................................................................... 22  
RELEASING HALT MODE BY USING TEST REQUEST FLAGS .......................................................... 23  
RELEASING HALT MODE BY USING RESET INPUT........................................................................... 23  
4. RESET FUNCTION............................................................................................................................ 24  
4.1 INITIALIZATION ...................................................................................................................................... 24  
5. INSTRUCTION SET .......................................................................................................................... 25  
6
ELECTRICAL SPECIFICATIONS ....................................................................................................... 30  
7. CHARACTERISTIC DATA ................................................................................................................. 36  
8. APPLICATION CIRCUITS ................................................................................................................. 38  
9. PACKAGE DRAWING ....................................................................................................................... 43  
4
µPD7566A, 7566A(A)  
10. RECOMMENDED PC BOARD PATTERN FOR SOP (REFERENCE)................................................ 47  
11. RECOMMENDED SOLDERING CONDITIONS ................................................................................ 48  
APPENDIX A. COMPARISON FOR µPD7566A SUB-SERIES PRODUCTS........................................... 49  
APPENDIX B. DEVELOPMENT SUPPORT TOOLS ............................................................................... 50  
APPENDIX C. RELATED DOCUMENTS................................................................................................. 55  
5
µPD7566A, 7566A(A)  
1. PIN FUNCTIONS  
1.1 PORT FUNCTIONS  
Pin  
Name  
Input/  
Output  
Shared  
with:  
I/O  
Circuit  
Type  
Function  
At Reset  
P00  
INT0  
Vref  
2-bit input port (PORT 0). P00 is also used to  
input count clocks (event pulses).  
S
T
Input  
Input  
Input  
Input  
P01  
P10-P13  
Cin0 - 4-bit input port (PORT 1)  
Cin3  
U
P80-P82  
P90, P91  
Output  
Output  
-
-
3-bit output port (PORT 8). High-current  
(15 mA), and medium-voltage (9V) output  
High  
impedance  
O
P
2-bit output port (PORT 9). High-current  
(15 mA), and medium-voltage (9V) output  
P100 -  
P103  
Input/  
Output  
-
4-bit I/O port (PORT 10). Medium-current  
(10 mA), and medium-voltage (9V) I/O  
High  
impedance  
or high-  
level  
P110-  
P113  
Input  
Output  
4-bit I/O port (PORT 11). Medium-current  
(10 mA), and medium-voltage (9V) I/O  
-
output  
1.2 OTHER FUNCTIONS  
Pin  
Name  
Input/  
Output  
Shared  
with:  
I/O  
Circuit  
Type  
Function  
At Reset  
Input  
INT0  
Vref  
Input  
Input  
P00  
P01  
Edge-detecting testable input pin (rising edge)  
S
T
Comparator reference voltage input pin  
(Whether this pin is used as P01 or as Vref is  
specified by a mask option.)  
Input  
4-bit comparator input pins (Whether these  
Cin0-Cin3  
Input  
P10-P13 pins are used as digital input pins (P10 to P13)  
or as comparator input pins (Cin0 to Cin3) is  
specified by the mask option for each bit.  
Input  
U
CL1  
CL2  
A ceramic oscillator is connected across  
these pins.  
System reset input pin (high-level active).  
A pull-down resistor can be interconnected  
to this pin by a mask option.  
RESET  
R
VDD  
VSS  
Power pin  
GND pin  
6
µPD7566A, 7566A(A)  
1.3 MASK OPTIONS FOR PINS  
The following mask options are available. These mask options can be selected in bit units.  
Pin Name  
Mask Option  
P00  
No internally provided resistor  
Pull-down resistor internally provided  
Pull-up resistor internally provided  
P01/Vref  
External Vref input  
No internally provided resistor (CMOS input)  
Pull-down resistor internally provided (CMOS input)  
Pull-up resistor internally provided (CMOS input)  
P10/Cin0  
P11/Cin1  
P12/Cin2  
P13/Cin3  
Comparator input  
Pull-down resistor internally provided (CMOS input)  
Pull-up resistor internally provided (CMOS input)  
No internally provided register  
Comparator input  
Pull-down resistor internally provided (CMOS input)  
Pull-up resistor internally provided (CMOS input)  
No internally provided register  
Comparator input  
Pull-down resistor internally provided (CMOS input)  
Pull-up resistor internally provided (CMOS input)  
No internally provided register  
Comparator input  
No internally provided register  
Pull-down resistor internally provided (CMOS input)  
Pull-up resistor internally provided (CMOS input)  
P80  
P81  
P82  
P90  
P91  
P100  
N-channel open-drain output  
N-channel open-drain output  
N-channel open-drain output  
N-channel open-drain output  
N-channel open-drain output  
N-channel open-drain I/O  
CMOS (push-pull) output  
CMOS (push-pull) output  
CMOS (push-pull) output  
CMOS (push-pull) output  
CMOS (push-pull) output  
Push-pull I/O  
N-channel open-drain I/O with pull-up resistor internally provided  
N-channel open-drain I/O Push-pull I/O  
N-channel open-drain I/O with pull-up resistor internally provided  
N-channel open-drain I/O Push-pull I/O  
N-channel open-drain I/O with pull-up resistor internally provided  
N-channel open-drain I/O Push-pull I/O  
N-channel open-drain I/O with pull-up resistor internally provided  
N-channel open-drain I/O Push-pull I/O  
N-channel open-drain I/O with pull-up resistor internally provided  
N-channel open-drain I/O Push-pull I/O  
N-channel open-drain I/O with pull-up resistor internally provided  
N-channel open-drain I/O Push-pull I/O  
N-channel open-drain I/O with pull-up resistor internally provided  
N-channel open-drain I/O Push-pull I/O  
P101  
P102  
P103  
P110  
P111  
P112  
P113  
RESET  
N-channel open-drain I/O with pull-up resistor internally provided  
Pull-down resistor is not internally provided  
Pull-down resistor is internally provided  
Internal Vref  
setting Note  
Internal bias is not provided  
A 1/2 VDD internal bias is applied to Vref  
Note When any of pins P10-P13 is specified as “comparator“, and “internal bias is not provided“ is specified  
for the internal Vref setting, specify “external Vref input“ for pin P01.  
When none of pins P10-P13 is specified as “comparator“, specify “internal bias is not provided“ for  
the internal Vref setting.  
There is no mask option for PROM products. For more information, see the µPD75P66 Data Sheet (IC-7518).  
7
µPD7566A, 7566A(A)  
1.4 NOTES ON USING THE P00/INT0, AND RESET PINS  
In addition to the functions described in 1.1, 1.2, and 1.3, an exclusive function for setting the test mode, in which  
the internal functions of the µPD7566A are tested, is provided to the P00/INT0 and RESET pins.  
If a voltage less than VSS is applied to either of these pins, the µPD7566A is put into test mode. Therefore, even  
when the µPD7566A is in normal operation, if noise less than the VSS is input into any of these pins, the µPD7566A  
will enter the test mode, and this will cause problems for normal operation.  
As an example, if the wiring to the P00/INT0 pin or the RESET pin is long, stray noise may be picked up and the  
above mentioned problem may occur.  
Therefore, all wiring to these pins must be made short enough to not pick up stray noise. If noise cannot be  
avoided, suppress the noise using a capacitor or diode as shown in the figure below.  
Connect a diode having a low VF across  
P00/INT0 and RESET, and VSS.  
Connect a capacitor across P00/INT0 and RESET,  
and VSS.  
VDD  
VDD  
VDD  
VDD  
P00/INT0, RESET  
P00/INT0, RESET  
Low VF  
diode  
VSS  
VSS  
8
µPD7566A, 7566A(A)  
1.5 PIN I/O CIRCUITS  
Schematic drawings of the I/O circuits for the microcomputer’s pins are shown below.  
(1) Type O  
VDD  
data  
P-ch  
Mask option  
OUT  
N-ch (medium-voltage, high current)  
output  
disable  
(2) Type P  
VDD  
data  
P-ch  
Mask option  
IN/OUT  
output  
disable  
N-ch (medium-voltage, high-curren  
Medium-voltage, input buffer  
(3) Type R  
Mask Option  
9
µPD7566A, 7566A(A)  
(4) Type S  
VDD  
Mask Option  
IN  
(5) Type T  
VDD  
Mask option  
IN  
VDD  
Rref  
-
Mask option  
Rref  
+
(6) Type U  
V
DD  
Mask option  
+
IN  
-
Reference voltage  
10  
µPD7566A, 7566A(A)  
1.6 RECOMMENDED PROCESSING OF UNUSED PINS  
Pin  
Recommended Processing  
Connect to VSS  
P00/INT0  
P01/Vref  
Connect to VSS or VDD  
Open  
P10-P13  
P80-P82  
P90, P91  
P100-P103  
P110-P113  
Input : Connect to VSS or VDD  
Output: Open  
11  
µPD7566A, 7566A(A)  
1.7 I/O PORT OPERATIONS  
(1) P00, P01 (Port 0)  
Port 0 is a 2-bit input port and consists of pins P00 and P01. These pins are multiplexed, and P00 can  
also input count clocks or testable signal (INT0), while P01 is used, when so specified by a mask option,  
to input a reference voltage (Vref) to the internal comparator.  
To input a count clock from P00, set bits 2 and 1 (CM2 and 1) for the clock mode register to “01” (see  
2.10, Clock Control Circuit).  
To allow P00 to serve as INT0, set the SM3 flag to 1.  
Whether P01 is used to input a reference voltage (Vref) to the comparator is specified by a mask option.  
In this case, the port function for the P01 pin cannot be used. The data on P00 and P01 can be loaded to  
the lower 2 bits (A0 and A1) of the accumulator at any time, by executing a port input instruction (IPL, L  
= 0).  
(2) P10/Cin 0 to P13/Cin 3 (Port 1)  
Port 1 is a 4-bit input port consisting of these four pins, which can also be used to input analog voltages  
to the comparator, when so specified by mask options.  
To input analog voltages through Port 1, a comparator must be connected to each bit of the port by  
a mask option, and a port input instruction (IPL, L = 1) must be executed.  
The analog voltage input through these pins to the comparator is always compared with a reference  
voltage input through the Vref pin. It takes up to 3 machine cycles to accomplish this comparison.  
Therefore, to change the voltage applied to the Vref pin by port output to form an A/D converter by using  
a resistor ladder, wait for 3 machine cycles after executing a port output (OPL) instruction. Then carry out  
an input (IPL, L = 1) instruction to obtain the result of the comparison.  
If the output instruction is executed during a 3 machine cycle period that precedes the IPL instruction  
(L = 1), which inputs the comparison result, the comparator accuracy may be degraded. For this reason,  
do not execute the OPL instruction during 3 machine cycles immediately before the IPL instruction is  
executed.  
Example: LHLI  
0AH  
;
;
L = 10  
OPL  
NOP  
NOP  
LHLI  
IPL  
Port 10 output (Vref is changed)  
1
;
;
L = 1  
Input of comparison result  
(3) P80 to P82 (Port 8), and P90 to P91 (Port 9)  
Pins 80 to P82 constitute a 3-bit output port with output latch, Port 8, while P90 to P91 form a 2-bit output  
port with output latch, Port 9.  
When a port output instruction (OPL, L = 8, or L = 9) is executed, the contents of the accumulator are  
latched on the output latches, and, at the same time, output to these ports.  
Each bit in Ports 8 and 9 can be set or reset by SPBL or RPBL instruction.  
Two output modes can be selected for Ports 8 and 9 by a mask option: CMOS (push-pull) or N-channel  
open-drain mode.  
The N-channel open-drain output mode is useful for interfacing a circuit operating on a supply voltage  
different from that to the microcomputer, because the output buffer in this mode can withstand an applied  
9V.  
12  
µPD7566A, 7566A(A)  
(4) P100 to P103(Port 10), and P110 to P113 (Port 11)..........Pseudo-bidirectional I/O  
Pins P100 to P103 constitute a 4-bit I/O port with output latches, Port 10, while P110 to P113 form Port  
11, which is a 4-bit I/O port with output latches.  
When a port output instruction (OPL, L = 10 or L11) is executed, the accumulator contents are latched  
to the output latches and, at the same time, output to either of these ports.  
Data once written to the output latch and the state of the output buffer are retained until an output  
instruction that manipulates Port 10 or 11 is executed next, or until the RESET signal is input. Therefore,  
the states of the output latches and output buffer will not be changed, even when an input instruction is  
executed to these ports.  
Each bit of Ports 10 and 11 can be set or reset by SPBL or RPBL instruction. Three input modes can  
be selected for Ports 10 and 11 by mask options: N-channel open-drain I/O, N-channel open-drain I/O with  
pull-up resistors connected, and CMOS (push-pull) modes.  
The N-channel open-drain mode is useful for interfacing a circuit operating on a supply voltage different  
from that fed to the microcomputer, because the I/O buffer in this mode can withstand a 9V application.  
If the CMOS (push-pull) I/O mode has been selected and an output instruction has once been executed,  
the ports cannot return to the input mode. However, the pin states can be checked by executing a port  
input (IPL) instruction.  
In the N-channel open-drain mode, regardless of whether the pull-up resistors are connected or not,  
the ports are set in the input mode, when high-level signals are output to them, and the data on the 4 bits  
of each port can be loaded to the accumulator. Thus, the port serves as a pseudo-bidirectional port.  
The three I/O modes are selected under the following conditions:  
CMOS I/O  
i) To use all the 4-bits as input port pins  
ii) To use port pins as output pins from which no medium-voltage output is required  
N-channel open-drain I/O  
i) To use port pins in applications where inputting outputting a medium-voltage is required  
ii) To use some port pins as input pins and the others as output pins  
iii) To alternately input and output data through one port pin  
N-channel open-drain I/O with pull-up resistor connected  
i) To use some port pins as input pins and the other, as output pins in applications where pull-up  
resistors are required  
ii) To alternately input and output data through one port pin in application where a pull-up resistor  
is required  
Caution To use port pins as input pins in modes and above, it is necessary to write “1” to the output  
latch in advance and to turn off the N-channel transistor.  
13  
µPD7566A, 7566A(A)  
2. INTERNAL FUNCTIONAL BLOCKS  
2.1 PROGRAM COUNTER (PC) ...... 10 BITS  
This is a 10-bit binary counter that retains the address information for the program memory (ROM).  
Fig. 2-1 Program Counter  
PC9 PC8 PC7 PC6 PC5 PC4 PC3 PC2 PC1 PC0  
PC  
Normally, each time an instruction has been executed, the PC contents are automatically incremented by the  
number of bytes for the instruction.  
When a call instruction has been executed, the current contents of the PC (i.e., return address) are saved to the  
stack, and a new call address is loaded to the PC. When a return instruction has been executed, the contents of  
the stack (i.e., return address) are loaded to the PC. When a jump instruction has been executed, immediate data  
that indicates the jump destination is loaded to some or all of the bits for the PC.  
When a skip instruction has been executed, the PC contents are incremented by 2 or 3 during 1 machine cycle,  
depending on the number of bytes for the instruction to be executed next. All the PC bits are cleared to 0, when  
the RESET signal has been input.  
14  
µPD7566A, 7566A(A)  
2.2 STACK POINTER (SP) ...... 6 BITS  
Thisisa6-bitregister. Whenportofthedatamemoryisusedasalast-in, first-out(LIFO)stackarea, theSPretains  
the first address for the stack.  
Fig. 2-2 Stack Pointer  
SP5 SP4 SP3 SP2 SP1 SP0  
SP  
The SP contents are decremented when a call instruction has been executed, and are incremented when a return  
instruction has been executed.  
To obtain a stack area, the SP must be initialized by TAMSP instruction. Note, however, that 0 is is  
unconditionally loaded to the LSB for the SP (i.e., bit SP0) when TAMSP instruction has been executed. Stacking  
operation begins with decrementing the SP contents. Therefore, the highest address for the stack area +1 is set  
in the SP.  
If the highest address for the stack area is 3FH, which is the highest address in the data memory, the initial  
valuesfortheSP5to0bitsmustbe00H. However,keepthedatatobestoredinAMto40HwhenTAMSPinstruction  
is executed, so that the microcomputer can be easily emulated by µPD7500H (EVAKIT-7500B).  
Fig. 2-3 Executing TAMSP Instruction  
A3  
A2  
A1  
A0  
(HL)  
3
(HL)  
2
(HL)  
1
(HL)  
0
0
SP5  
SP4  
SP3  
SP2  
SP1  
SP0  
The SP contents cannot be read.  
Caution The SP contents are undefined, when the RESET signal has been input. Therefore, make sure that  
the SP is initialized at the beginning of the program.  
Example: LHLI  
00H  
0
LAI  
ST  
LAI  
4
TAMSP  
; SP = 40H  
15  
µPD7566A, 7566A(A)  
2.3 PROGRAM MEMORY (ROM) ...... 1,024 WORDS X 8 BITS  
This is a mask programmable ROM, consisting of 1,024 words by 8 bits. The ROM is addressed by the program  
counter (PC). The program is stored in the program memory.  
Address 000H in this memory is a reset start address.  
Fig. 2-4 Program Memory Map  
(0) 000H  
Reset start  
(1023) 3FFH  
2.4 GENERAL-PURPOSE REGISTERS  
Two general-purpose registers, H (2 bits) and L (4 bits), are available. Each of these registers can be manipulated  
independentlyfromtheother. Inaddition,theseregisterscanbeusedasapairregister(HL). Thepairregisterserves  
as a data pointer to address the data memory.  
Fig. 2-5 General-Purpose Registers  
1
0
3
0
H
L
The L register is also used to specify an I/O port or mode register, when an input/output instruction (IPL or OPL)  
is executed. This register is also used to specify the port bit to be set or reset by SPBL or RPBL instruction.  
16  
µPD7566A, 7566A(A)  
2.5 DATA MEMORY (RAM) ...... 64 WORDS X 4 BITS  
The data memory is static RAM configured of 64 words by 4 bits, and is used to store various data and as a stack  
area. The data memory is also used in pairs with the accumulator, making it possible to process 8-bit data.  
Fig. 2-6 Data Memory Map  
(0) 00H  
64 words x 4 bits  
(63) 3FH  
The data memory can be addressed in the following three addressing modes:  
Direct: In this mode, the data memory is directly addressed by the immediate data for an instruction.  
Register indirect: The data memory is indirectly addressed by the contents of pair register HL (including  
autoincrement and autodecrement).  
Stack: The data memory is indirectly addressed by the contents of the stack pointer (SP).  
Any space in the data memory can be used as stack. The boundary of the stack is determined by initializing  
the SP by TAMSP instruction. After that, the stack area is automatically accessed by call and return instructions.  
When a call instruction is executed, the contents of the PC and program status word (PSW) are stored in stack,  
as illustrated below.  
Stack area  
3
0
0
SP - 4  
SP - 3  
SP - 2  
SP - 1  
0
PC9 PC8  
PSWNote  
PC3 - PC0  
PC7 - PC4  
Note Bit 1 of PSW is always 0.  
When a return instruction has been executed, the PC contents are restored, but the PSW contents are not.  
The data memory contents can be retained on a low supply voltage in the STOP mode.  
17  
µPD7566A, 7566A(A)  
2.6 ACCUMULATOR (A) ...... 4 BITS  
This is a 4-bit register which plays a central role, when an arithmetic operation is performed. The accumulator  
can also be used in pairs with a data memory address, indicated by pair register HL, to process 8-bit data.  
Fig. 2-7 Accumulator  
A3  
A2  
A1  
A0  
A
2.7 ARITHMETIC LOGIC UNIT (ALU) ...... 4 BITS  
This is a 4-bit arithmetic operation circuit that carries out operations such as binary addition, logic operations,  
increment, decrement and comparison, as well as bit manipulation.  
2.8 PROGRAM STATUS WORD (PSW) ...... 4 BITS  
The PSW consists of two skip flags (SK1 and SK0) and a carry flag (C). Bit 1 of this register is always 0.  
Fig. 2-8 Program Status Word  
3
2
1
0
0
SK1 SK0  
C
PSW  
(1) Skip flags (SK1 and SK0)  
These flags retain the following skip conditions:  
• String effect by LAI instruction  
• String effect by LHLI instruction  
• Establishment of skip conditions by instructions other than string-effect instructions  
The skip flags are automatically set or reset each time an instruction has been executed.  
(2) Carry flag (C)  
This flag is set to 1, when an addition instruction (ACSC) is executed, and a carry is consequently  
generated from the bit 3 of the ALU. If a carry is not generated, the carry flag is cleared to 0. In addition,  
the carry flag can also be set by SC instruction, and cleared by RC instruction. The content of the flag can  
be tested by SKC instruction.  
The PSW contents are automatically stored in the stack area when a call instruction is executed, and  
are not restored even when a return instruction is implemented. When the RESET signal is input, the SK1  
and SK0 flags are cleared to 0, and the C flag content becomes undefined.  
18  
µPD7566A, 7566A(A)  
2.9 SYSTEM CLOCK GENERATOR  
The system clock generator consists of a ceramic oscillator, a 1/2 frequency divider, standby mode (STOP/HALT)  
control circuit, and other circuits.  
The ceramic oscillator can oscillate, when an external ceramic oscillator is connected across pins CL1 and CL2.  
The signal output by the internal ceramic oscillator is a system clock (CL), which is then divided in two to create  
a CPU clock (ø).  
The standby mode control circuit mainly consists of a STOP flip-flop and HALT flip-flop.  
The STOP flip-flop is set by a STOP instruction, stopping the clock supply. When the ceramic oscillator is  
operating, this flip-flop stops the oscillator, setting the microcomputer in the STOP mode.  
The STOP flip-flop is reset when a high-level RESET signal is input. As a result, the ceramic oscillator resumes  
its operation, and the clocks supply is started, when the RESET signal later goes low.  
The HALT flip-flop is set by a HALT instruction, disabling the input of the 1/2 frequency divider, which generates  
CPU clock ø, and thereby stopping only CPU clock ø (HALT mode).  
The HALT flip-flop is reset by the HALT RELEASE or the falling of RESET input (which becomes active when one  
of the test request flags has been set), allowing the supply of ø to be started.  
The HALT flip-flop remains set even while the RESET signal is active (high-level), and operates in the same  
manner as in the HALT mode.  
When Power-ON Reset is performed, the ceramic oscillator starts at the rising edge of the RESET signal. After  
the oscillator has started, however, a specific period is required for the oscillator to stabilize. To present the CPU  
from malfunctioning due to anstable clock, the HALT flip-flop is set to suppress the CPU clock ø while the RESET  
signal is high. Therefore, the high-level width of the RESET signal must be greater than the time required for the  
ceramic oscillator you use to stabilize.  
Fig. 2-9 System Clock Generator  
STOP F/F  
STOPNote  
S
Q
HALT F/F  
R
Q
S
R
HALTNote  
Oscillation  
stops  
RESET (high)  
CL1  
CL2  
HALT RELEASE  
Ceramic  
oscillator  
RESET (  
RESET (  
)
)
1/2  
ø (to CPU)  
CL (System clock)  
Note indicates that an instruction has been executed.  
19  
µPD7566A, 7566A(A)  
2.10 CLOCK CONTROL CIRCUIT  
The clock control circuit consists of a 2-bit clock mode register (made up of bits CM2 and 1), three prescalers  
(1, 2, and 3), and a multiplexer. This circuit inputs the output from the system clock generator (i.e., CL). An event  
pulse (from pin P00) selects a clock source and prescaler, as specified by the clock mode register, and supplies a  
count pulse (CP) to the timer/event counter.  
Fig. 2-10 Clock Control Circuit  
Internal Bus  
OPLNote  
CM1  
CM2  
PRESCALER 1  
(1/4)  
PRESCALER 2  
(1/8)  
PRESCALER 3  
(1/8)  
CL  
P00  
CP  
Note indicates that an instruction has been executed.  
A code is set in the clock mode register by an OPL (L = 12) instruction.  
Fig. 2-11 Clock Mode Register Format  
CM2 CM1  
Clock mode register  
CM2 CM1 Count pulse frequency (CP)  
0
0
1
1
0
1
0
1
CL x 1/256  
P00  
CL x 1/32  
CL x 1/4  
Caution When setting a code in the clock mode register by the OPL instruction, be sure to clear the bit 0 (which  
corresponds to CM0 of EVAKIT-7500B (µPD7500) during emulation) for the accumulator to 0.  
20  
µPD7566A, 7566A(A)  
2.11 TIMER/EVENT COUNTER  
The timer/event counter mainly consists of an 8-bit count register.  
Fig. 2-12 Timer/Event Counter  
Internal bus  
TCNTAMNote  
8
Count  
pending  
circuit  
INTT  
CP  
8-BIT COUNT REG  
CLR  
(to test control circuit)  
TIMERNote  
RESET  
Note indicates that an instruction has been executed.  
The 8-bit count register is a binary up-counter. The contents of this counter are incremented each time a count  
pulse (CP) is input to the counter, and are cleared to 00H when TIMER instruction has been executed, when the  
RESET signal has been input, or when overflow (i.e., counting from FFH to 00H) has occurred in the counter.  
The following four count pulses can be selected by the clock mode register (see 2.10 Clock Control Circuit).  
1
4
1
32  
1
256  
CP: CL x  
, CL x  
, CL x  
, P00  
The count register always counts up as long as the count pulse is input to it. Therefore, the TIMER instruction  
clears the contents of the count register to 00H and triggers a timer operation.  
The count register contents are incremented in synchronization with CP (or the rising edge of the P00 signal,  
when an external clock is selected). When the number of counts reaches 256, the count value is returned from FFH  
to 00H. At this time, the count register generates an overflow signal (INTT), setting the INTT test flag (INTT RQF).  
The count register then starts counting up from 00H.  
Whether or not an overflow has occurred can be learned by testing the INT RQF flag, using the SKI instruction.  
When the timer/event counter operates as a timer, the reference time for the timer is determined by the CP  
frequency. The accuracy of the measured time is determined, when the system clock is selected, by the system  
clockoscillationfrequency. IfthesignalinputthroughtheP00pinisselectedastheclock,theaccuracyisdetermined  
by the frequency of the signal input to the P00 pin.  
The contents of the count register can always be made ready by TCNTAM instruction. By using this instruction,  
the current time for the timer can be checked, or it can be determined how many event pulses have been generated  
so far by inputting the event pulses to the P00 pin and counting them (event counter operation).  
The count pending circuit is to ignore changes in the count pulses (CPs) while TCNTAM instruction is executed.  
This is necessary because, when TCNTAM instruction is used to read the contents of the count register, unstable  
data may be read while the present count is being updated.  
The timer/event counter operates using the system clocks (CL) or the signals input to the P00 pin as count pulses.  
Therefore, the timer/event counter can be used to release the HALT mode, in which the supply of the CPU clock  
ø is stopped (see 3. STANDBY FUNCTIONS).  
21  
µPD7566A, 7566A(A)  
2.12 TEST CONTROL CIRCUIT  
The test control circuit consists of two test flags, a flag called SM3, and a test request flag control circuit. The  
test request flags, INT0 RQF and INTT RQF, are set by two kinds of test sources (external test input (INT0) and timer  
overflow (INTT)). The SM3 flag determines whether or not inputting signals to the INT0 pin is enabled. The test  
request flag control circuit checks the contents of the test request flags, when an SKI instruction is executed, and  
resets the flags.  
The SM3 flag is set by an OPL (L = 0FH) instruction (corresponding to A3). When this flag is 1, the INT0 input  
is enabled.  
The INT0 RQF flag is set when the rising edge is detected on the INT0 pin, and is reset by an SKI instruction.  
The INTT RQF flag is set when an overflow occurs in the timer, and is reset by an SKI or TIMER instruction.  
The signals output by the test request flags are used to release the HALT modes. If one of or both the flags were  
to be set, the HALT modes are released.  
When the RESET signal is input, both the test request flags and SM3 flag are reset. Therefore, INT0 input is  
disabled as the initial condition after the RESET signal has been applied.  
Fig. 2-13 Test Control Circuit  
Internal bus  
OPLNote  
SKINote  
SM3  
TEST RQF  
CONTROL  
S
R
Q
Q
NONSYNC  
INTT  
RQF  
INTT  
EDGE GATE  
TIMERNote  
HALT  
S
R
NONSYNC  
INT0  
RQF  
RELEASE  
INT0  
EDGE GATE  
Note indicates that an instruction has been executed.  
22  
µPD7566A, 7566A(A)  
3. STANDBY FUNCTIONS  
The µPD7566A can be set in two standby modes (STOP and HALT), in which the power dissipation for the  
microcomputer can be reduced while the program stands by. The STOP mode is set by a STOP instruction, while  
the HALT mode is set by a HALT Instruction. In the STOP mode, the supply of all the clocks is stopped, but the supply  
of only the CPU clock ø is stopped in the HALT mode. When the HALT mode is set, program execution is stopped,  
butthecontentsofalltheregistersanddatamemory,immediatelybeforetheHALTmodehasbeenset,areretained.  
The timer/event counter can operate even in the HALT mode.  
The STOP mode is released only by the input of the RESET signal. The HALT mode can be released by setting  
either or both the test request flags (INTT RQF and INT0 RQF), or by inputting the RESET signal. Therefore, the  
standby mode cannot be set, even when the STOP or HALT instruction is executed while one of the test request  
flags is set. To set the standby mode, when it is possible that one of the test request flags is set, execute an SKI  
instruction in advance to reset the test request flag.  
3.1 STOP MODE  
The STOP mode can be set any time by executing the STOP instruction, unless either or both the test request  
flags are set.  
In this mode, the data memory contents are retained, but all other functions are stopped and become invalid,  
except for the RESET signal, which is used to release the STOP mode. Consequently, the power dissipation for the  
microcomputer is minimized.  
Caution In the STOP mode, the CL1 pin is internally short-circuited to VDD (high level) to prevent the leakage  
current from the ceramic oscillator.  
3.2 HALT MODE  
In this mode, only the 1/2 frequency divider for the system clock generator is stopped. Consequently, the supply  
of system clock (CL) is not stopped and only the CPU clock (ø) is stopped. The operation of the CPU, which calls  
for the CPU clock, is therefore stopped.  
However, the clock control circuit is not stopped. The clock control circuit can therefore input the CL signal  
generated by the system clock generator and event pulses input from an external source through the P00 pin, can  
supply both the clocks to the timer/event counter as count pulses (CPs). The timer/event counter can therefore  
operate on both the count pulses and its operation will not be interrupted.  
3.3 RELEASING STOP MODE BY USING RESET INPUT  
When the RESET signal becomes high in the STOP mode, the HALT mode is set, and at the same time, ceramic  
oscillation starts.  
When the RESET signal goes low, the HALT mode is released followed by ordinary RESET operation. After that,  
the CPU starts executing the program from address 0. The STOP mode is thus released.  
The contents of the data memory are retained even while the mode is released, that the contents of registers  
become undefined.  
23  
µPD7566A, 7566A(A)  
Fig. 3-1 STOP Mode Release Timing  
STOP instruction  
RESET input  
STOP mode  
HALT mode  
(oscillator stabilization time)  
Released  
Ordinary reset operation  
(execution starts from  
address 0)  
Clock oscillation starts  
Caution The STOP mode is not released by setting the test request flags.  
3.4 RELEASING HALT MODE BY USING TEST REQUEST FLAGS  
The HALT is released when either or both of the test request flags (INTT RQF and INT0 RQF) are set, and program  
execution is resumed, starting from the instruction next to the HALT instruction.  
The contents of the registers and data memory, which have been retained during the HALT mode, are not  
affected by the release of the HALT mode.  
3.5 RELEASING HALT MODE BY USING RESET INPUT  
When the RESET signal is input, the HALT mode is unconditionally released, as illustrated in Fig. 3-2.  
Fig. 3-2 HALT Mode Release Timing by RESET Input  
RESET  
HALT mode  
Released  
Ordinary reset operation  
(execution starts from  
address 0)  
While the RESET signal is active (high level), the HALT mode continues. When the RESET signal goes low, the  
HALT mode is released. Ordinary resetting operation is then accomplished. Then, the program is executed starting  
from address 0.  
The contents of the data memory, retained during the HALT mode, are not affected by the RESET signal.  
However, the contents of the registers are affected and become undefined.  
24  
µPD7566A, 7566A(A)  
4. RESET FUNCTION  
The microcomputer is reset and initialized as follows, when an active-high RESET signal is input to the RESET  
pin:  
4.1 INITIALIZATION  
(1) The program counter (PC9 to PC0) is cleared to 0.  
(2) The skip flags (SK1 and SK0) for the program status word are reset to 0.  
(3) The count register for the timer/event counter is cleared to 00H.  
(4) The clock control circuit is initialized as follows:  
• Clock mode register (bits CM2 and 1) = 0  
1
256  
CP = CL x  
• Prescalers 1, 2, and 3 = 0  
(5) The SM3 flag is reset to 0, disabling the external test input (INT0).  
(6) The test request flags (INTT RQF and INT0 RQF) are reset to 0.  
(7) The contents of the data memory and the following registers will become undefined.  
Stack pointer (SP)  
Accumulator (A)  
Carry flag (C)  
General-purpose registers (H and L)  
Output latches for ports  
(8) The output buffers for all the ports are turned off and enter the output high-impedance state.  
The I/O ports are set in the input mode.  
Caution When the RESET signal is used to released the standby mode, the contents of the data memory do  
not become undefined, but are retained.  
When the RESET signal is removed, the program is executed starting from address 000H. However, initialize  
or reinitialize the contents for the registers by program.  
25  
µPD7566A, 7566A(A)  
5. INSTRUCTION SET  
(1) Operand representation format and description  
addr  
10-bit immediate data or label  
caddr  
10-bit immediate data or label  
caddr1  
Immediate data 100H-107H, 140H-147H or label  
Immediate data 180H-187H, 1C0H-1C7H or label  
mem  
6-bit immediate data or label  
n5  
n4  
n2  
5-bit immediate data or label  
4-bit immediate data or label  
2-bit immediate data or label  
bit  
pr  
2-bit immediate data or label  
HL-, HL+, HL  
(2) Legend for “Operation” column  
A
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
Accumulator  
H
H register  
L
L register  
HL  
pr  
Pair register (HL)  
Pair register (HL-, HL+, HL)  
Stack pointer  
SP  
PC  
C
Program counter  
Carry flag  
PSW  
CT  
In  
Program status word  
Count register  
Immediate data corresponding to n5, n4, or n2  
Immediate data corresponding to addr, caddr, or caddr1  
Immediate data corresponding to bit  
Immediate data corresponding to mem  
Immediate data corresponding to pr  
Contents addressed by xx  
Hexadecimal data  
Pn  
Bn  
Dn  
Rn  
(xx)  
xH  
26  
µPD7566A, 7566A(A)  
(3) Selection of port/mode register  
IPL Instruction  
L
Port  
0
1
Port 0  
Port 1  
Port 10  
Port 11  
AH  
BH  
OPL Instruction  
L
8
Port/mode register  
Port 8  
9
Port 9  
AH  
BH  
CH  
FH  
Port 10  
Port 11  
Clock mode register  
SM3 flag  
RPBL; SPBL Instruction  
L
FH  
3
EH  
2
DH  
1
CH  
0
BH  
3
AH  
2
9
1
8
0
5
1
4
0
2
2
1
1
0
0
Bit  
Port  
Port 11  
Port 10  
Port 9  
Port 8  
(4) Selection of addressing mode by pair register  
pr  
R1  
R0  
HL-  
HL+  
HL  
0
0
1
0
1
0
27  
OP Code  
Instructions  
Load/Store  
Mne-  
ope-  
rand  
Operation  
Skip  
monic  
B1  
B2  
Condition  
0 0 0 1 I3 I2 I1 I0  
LAI  
n4  
A
n4  
Loads n4 to accumulator  
String-effect  
LAI  
LHI  
n2  
pr  
0 0 1 0 1 0 I1 I0  
0 1 0 1 0 0 R1 R0  
H
A
n2  
Loads n2 to register H  
LAM  
(pr) pr = HL-, HL+, HL  
Loads memory contents addressed  
by pr to accumulator  
L = FH (HL-)  
L = 0 (HL+)  
LHLI  
ST  
n5  
1 1 0 I4 I3 I2 I1 I0  
0 1 0 1 0 1 1 1  
0 1 0 0 I3 I2 I1 I0  
H
0 I4, L  
I3-0  
Loads n5 to registerpair HL  
String-effect  
LHLI  
(HL)  
A
Stores accumulator contents to  
memory addressed by HL  
STII  
n4  
(HL) n4, L L+1  
Stores n4 in memory addressed by  
HL and then increments L register  
contents  
0 1 1 1 1 0 1 1  
0 1 0 1 0 1 R1 R0  
XAL  
A
A
L
Exchanges accumulator contents with  
L register contents  
XAM  
pr  
(pr) pr = HL-, HL+, HL  
Exchanges accumulator contents with L = FH (HL-)  
contents of memory addressed by pr L = 0 (HL+)  
0 0 0 0 I3 I2 I1 I0  
0 1 1 1 1 1 0 1  
Arithmetic  
Operation  
AISC  
ASC  
n4  
A
A
A + n4  
Adds accumulator contents to n4  
Carry  
Carry  
A + (HL)  
Adds accumulator contents to  
contents of memory addressed by HL  
ACSC  
EXL  
0 1 1 1 1 1 0 0  
0 1 1 1 1 1 1 0  
A, C A + (HL) + C  
Adds accumulator contents to  
contents of memory addressed by HL  
with carry flag  
Carry  
A
A V (HL)  
Exclusive-ORs accumulator contents  
with contents of memory addressed  
by HL  
Accumulator/  
Carry Flag  
Manipulation  
CMA  
RC  
0 1 1 1 1 1 1 1  
0 1 1 1 1 0 0 0  
0 1 1 1 1 0 0 1  
0 1 0 1 1 0 0 1  
0 0 1 1 1 1 0 1  
A
C
C
L
A
Complements accumulator contents  
Resets carry flag  
0
µ
SC  
1
Sets carry flag  
Increment/  
Decrement  
ILS  
L + 1  
Increments L register contents  
L = 0  
0 0 D5 D4 D3 D2 D1 D0  
0 0 D5 D4 D3 D2 D1 D0  
IDRS  
mem  
(mem) (mem) + 1  
Increments contents of memory  
addressed by mem  
(mem) = 0  
DLS  
0 1 0 1 1 0 0 0  
0 0 1 1 1 1 0 0  
L
L - 1  
Decrements L register contents  
L = FH  
DDRS  
mem  
bit  
(mem) (mem) - 1  
Decrements contents of memory  
addressed by mem  
(mem) = FH  
Memory bit  
Manipulation  
RMB  
SMB  
0 1 1 0 1 0 B1 B0  
0 1 1 0 1 1 B1 B0  
(HL)bit  
(HL)bit  
0
Resets bit, specified by B1-0, of  
memory addressed by HL  
bit  
1
Sets bit, specified by B1-0, of  
memory addressed by HL  
OP Code  
Instructions  
Mne-  
monic  
ope-  
rand  
Operation  
Skip  
Condition  
B1  
B2  
Jump  
JMP  
JCP  
addr  
0 0 1 0 0 0 P9 P8  
1 0 P5 P4 P3 P2 P1 P0  
P7 P6 P5 P4 P3 P2 P1 P0  
PC9-0  
P9-0  
Jumps to address indicated by P9-0  
addr  
PC5-0  
P5-0  
Jumps to address specified by P5-0  
which replaces PC5-0  
Subroutine/  
Stack  
Control  
CALL  
CAL  
caddr  
0 0 1 1 0 0 P9 P8  
1 1 1 P4 P3 P2 P1 P0  
P7 P6 P5 P4 P3 P2 P1 P0  
(SP-1)(SP-2)(SP-4) PC9-0  
Saves contents of PC and PSW to  
stack, decrements SP by 4, and  
calls address indicated by caddr  
(SP-3) PSW, SP SP - 4  
PC9-0  
P9-0  
caddr1  
(SP-1)(SP-2)(SP-4) PC9-0  
Saves contents of PC and PSW to  
stack, decrements SP by 4, and calls  
address indicated by caddr1  
(SP-3) PSW, SP SP - 4  
PC9-0  
0 1 P4P30 0 0 P2P1P0  
RT  
0 1 0 1 0 0 1 1  
0 1 0 1 1 0 1 1  
PC9-0 (SP)(SP+2)(SP+3)  
Restores contents of stack memory to  
PC and increments SP by 4  
SP SP + 4  
RTS  
PC9-0 (SP)(SP+2)(SP+3)  
Restores contents of stack memory to Un-  
PC, increments SP by 4, and skips  
unconditionally  
SP SP + 4  
conditionally  
then skip unconditionally  
TAMSP  
0 0 1 1 1 1 1 1 0 0 1 1 0 0 0 1  
SP5-4  
SP3-1  
A1-0  
Transfers lower 2 bits of accumulator  
to SP5-4, and higher 3 bits of  
contents of memory, addressed by  
HL, to SP3-1  
(HL)3-1, SP0  
0
Skip  
SKC  
0 1 0 1 1 0 1 0  
0 1 1 1 0 1 B1 B0  
Skip if C = 1  
Skips if carry flag is 1  
C = 1  
SKABT  
bit  
bit  
bit  
Skip if Abit = 1  
Skips if bit, specified by B1-0, of  
accumulator is 1  
Abit = 1  
SKMBT  
SKMBF  
SKAEM  
0 1 1 0 0 1 B1 B0  
0 1 1 0 0 0 B1 B0  
0 1 0 1 1 1 1 1  
Skip if (HL)bit = 1  
Skip if (HL)bit = 0  
Skip if A = (HL)  
Skips if bit, specified by B1-0, of  
memory addressed by HL is 1  
(HL)bit = 1  
(HL)bit = 0  
A = (HL)  
Skips if bit, specified by B1-0, of  
memory addressed by HL is 0  
Skips if accumulator contents are  
equal to contents of memory  
addressed by HL  
µ
SKAEI  
SKI  
n4  
n2  
0 0 1 1 1 1 1 1  
0 1 1 0 I3 I2 I1 I0  
Skip if A = n4  
Skips if accumulator contents are  
equal to n4  
A= n4  
0 0 1 1 1 1 1 1 0 1 0 0 0 0 I1 I0 Skip if INT RQF = 1  
Then reset INT RQF  
Skips if INT RQF is 1, and then  
clears INT RQF to 0  
INT RQF = 1  
OP Code  
Instructions  
Mne-  
monic  
ope-  
rand  
Operation  
Skip  
Condition  
B1  
B2  
TIMER  
0 0 1 1 1 1 1 1 0 0 1 1 0 0 1 0 Start Timer  
Starts timer operation  
Timer  
Control  
TCNTAM  
0 0 1 1 1 1 1 1 0 0 1 1 1 0 1 1  
A
CT7-4  
Transfers higher 4 bits of count  
register to accumulator, and lower 4  
bits to memory addressed by HL  
(HL) CT3-0  
Input/Output  
IPL  
0 1 1 1 0 0 0 0  
0 1 1 1 0 0 0 1  
0 1 1 1 0 0 1 0  
A
A
Port (L)  
Loads contents of port specified by L  
register to accumulator  
IP1  
Port 1  
Inputs contents of port to  
accumulator  
OPL  
Port/Mode reg.(L)  
A
Outputs accumulator contents to port  
or mode register specified by L  
register  
RPBL Note  
SPBL Note  
0 1 0 1 1 1 0 0  
0 1 0 1 1 1 0 1  
Port bit (L)  
Port bit (L)  
0
Resets bits of port 8, 10, or 11  
specified by L register  
1
Sets bits of port 8, 10, or 11  
specified by L register  
CPU Control  
HALT  
STOP  
NOP  
0 0 1 1 1 1 1 1 0 0 1 1 0 1 1 0 Set Halt mode  
0 0 1 1 1 1 1 1 0 0 1 1 0 1 1 1 Set Stop Mode  
Sets HALT mode  
Sets STOP mode  
0 0 0 0 0 0 0 0  
No operation  
Performs nothing but waits for 1  
machine cycle  
Note Although the SPBL and RPBL instructions are to set or reset a specified bit, they also output port contents (in 4-bit units) including the specified bit  
as soon as the specified bit has been set or reset (the contents of the output latch are output to pins other than the specified bit). Before executing  
these instructions, initialize the contents of the output latch by executing the OPL instruction.  
µ
µPD7566A, 7566A(A)  
6. ELECTRICAL SPECIFICATIONS  
µPD7566A: ABSOLUTE MAXIMUM RATINGS (Ta = 25°C)  
Item  
Symbol  
Condition  
Rating  
-0.3 to + 7.0  
-0.3 to VDD + 0.3  
-0.3 to VDD + 0.3  
-0.3 to +11  
-0.3 to VDD + 0.3  
-0.3 to VDD + 0.3  
-0.3 to +11  
-5  
Unit  
V
Supply Voltage  
VDD  
Other than ports 10 and 11  
V
Input Voltage  
VI  
Ports 10  
and 11  
Note 1  
Note 2  
V
V
Other than ports 8 to 11  
V
Output Voltage  
VO  
IOH  
IOL  
Ports 8  
to 11  
Note 1  
Note 2  
V
V
1 pin  
mA  
mA  
mA  
mA  
mA  
High-Level  
Output Current  
Total of all pins  
-15  
Ports 8 and 9  
Others  
30  
1 pin  
Low-Level  
Output Current  
15  
Total of all pins  
100  
Operating  
Temperature  
Topt  
-10 to +70  
°C  
°C  
Storage  
Temperature  
Tstg  
-65 to +150  
Shrink DIP  
Mini-flat  
480  
250  
Power  
Dissipation  
Pd  
Ta = 70°C  
mW  
Note 1. CMOS input/output or N-channel open-drain output with pull-up resistor connected  
2. N-channel open-drain input/output  
Caution Even if one of the parameters exceeds its absolute maximum rating even momentarily, the quality  
of the product may be degraded. The absolute maximum rating therefore specifies the upper or lower  
limit of the value at which the product can be used without physical damages. Be sure not to exceed  
or fall below this value when using the product.  
31  
µPD7566A, 7566A(A)  
µPD7566A(A): ABSOLUTE MAXIMUM RATINGS (Ta = 25°C)  
Item  
Symbol  
VDD  
Condition  
Rating  
-0.3 to + 7.0  
-0.3 to VDD + 0.3  
-0.3 to VDD + 0.3  
-0.3 to +11  
-0.3 to VDD + 0.3  
-0.3 to VDD + 0.3  
-0.3 to +11  
-5  
Unit  
V
Supply Voltage  
Other than ports 10 and 11  
V
Input Voltage  
VI  
Ports 10  
and 11  
Note 1  
Note 2  
V
V
Other than ports 8 to 11  
V
Output Voltage  
VO  
IOH  
IOL  
Ports 8  
to 11  
Note 1  
Note 2  
V
V
1 pin  
mA  
mA  
mA  
mA  
mA  
High-Level  
Output Current  
Total of all pins  
-15  
Ports 8 and 9  
Others  
30  
1 pin  
Low-Level  
Output Current  
15  
Total of all pins  
100  
Operating  
Temperature  
Topt  
-40 to +85  
°C  
°C  
Storage  
Temperature  
Tstg  
-65 to +150  
Shrink DIP  
Mini-flat  
350  
195  
Power  
Dissipation  
Pd  
Ta = 85°C  
mW  
Note 1. CMOS input/output or N-channel open-drain output with pull-up resistor connected  
2. N-channel open-drain input/output  
Caution Even if one of the parameters exceeds its absolute maximum rating even momentarily, the quality  
of the product may be degraded. The absolute maximum rating therefore specifies the upper or lower  
limit of the value at which the product can be used without physical damages. Be sure not to exceed  
or fall below this value when using the product.  
CAPACITANCE (Ta = 25°C, VDD = 0V)  
Item  
Symbol  
CIN  
Condition  
P00, P01, P10 to P13  
MIN. TYP. MAX. Unit  
Input Capacitance  
Output Capacitance  
15  
15  
35  
35  
pF  
pF  
pF  
pF  
f = 1 MHz  
COUT  
0V at pins  
other than  
measured pin  
Cin0 to Cin3  
Ports 8 and 9  
Ports 10 and 11  
Input/Output  
Capacitance  
CIO  
32  
µPD7566A, 7566A(A)  
OSCILLATOR CHARACTERISTICS µPD7566A  
: Ta = -10 to +70°C, VDD = 2.7 to 6.0V  
µPD7566A(A) : Ta = -40 to +85°C, VDD = 2.7 to 6.0V  
Oscillator  
External  
Circuit  
Item  
Condition  
MIN. TYP. MAX. Unit  
VDD = 4.5 to 6.0V  
VDD = 4.0 to 6.0V  
VDD = 3.5 to 6.0V  
VDD = 2.7 to 6.0V  
290 700 710 kHz  
290 500 510 kHz  
290 400 410 kHz  
290 300 310 kHz  
Oscillation  
frequency  
(fCC)  
CL1  
CL2  
R2  
C2  
Ceramic  
Oscillator Note  
C1  
After the  
Oscillation  
stabilization time  
(tOS)  
minimum value of  
the operating  
voltage range  
has been reached  
20  
ms  
Note The following ceramic oscillators are recommended:  
Operating  
Voltage Range  
[V]  
Recommended Constants  
Manufacturer  
Product  
Name  
C1 [pF]  
C2 [pF]  
330  
220  
100  
100  
470  
330  
220  
220  
120  
100  
82  
R2 [k]  
MIN.  
2.7  
MAX.  
6.0  
CSB300D  
CSB400P  
CSB500E  
CSB700A  
KBR-300B  
KBR-400B  
KBR-500B  
KBR-680B  
CRK-400  
CRK-500  
CRK-680  
330  
220  
100  
100  
470  
330  
220  
220  
120  
100  
82  
6.8  
6.8  
6.8  
6.8  
0
3.5  
4.0  
4.5  
2.7  
3.5  
4.0  
4.5  
3.5  
4.0  
4.5  
6.0  
6.0  
6.0  
6.0  
6.0  
6.0  
6.0  
6.0  
6.0  
6.0  
Murata Mfg. Co., Ltd.  
0
Kyoto Ceramic  
Co., Ltd.  
0
0
12  
12  
12  
Toko Inc.  
Caution 1. Locate the oscillation circuit as close as possible to the CL1 and CL2 pins.  
2. Do not route any other signal lines in the area enclosed by the dotted Line.  
33  
µPD7566A, 7566A(A)  
DC CHARACTERISTICS µPD7566A  
: Ta = -10 to +70°C, VDD = 2.7 to 6.0V  
µPD7566A(A) : Ta = -40 to +85°C, VDD = 2.7 to 6.0V  
Item  
Symbol  
VIH1  
Condition  
Other than ports 10 and 11  
Ports 10 and 11Note 1  
MIN.  
0.7VDD  
0.7VDD  
0
TYP.  
MAX.  
VDD  
Unit  
V
High-Level Input Voltage  
Low-Level Input Voltage  
VIH2  
9
V
VIL  
0.3VDD  
V
VDD = 4.5 to 6.0V  
IOH = -1 mA  
VDD-2.0  
VDD-1.0  
V
V
V
High-Level Output Voltage  
VOH  
Ports 8 to 11  
IOH = -100 µA  
VDD = 4.5 to 6.0V  
IOL = 1.6 mA  
0.4  
2.0  
Ports 10 and 11  
VDD = 4.5 to 6.0V  
IOL = 10 mA  
V
Low-Level Output Voltage  
VOL  
IOL = 400 µA  
0.5  
2.0  
V
V
VDD = 4.5 to 6.0V  
IOL = 15 mA  
Port 8 and 9  
IOL = 600 µA  
0.5  
3
V
ILIH1  
ILIH2  
VIN = VDD  
µA  
µA  
High-Level Input Leakage Current  
VIN = 9V, Ports 10 and 11Note 1  
10  
Low-Level Input  
Leakage Current  
ILIL  
VIN = 0V  
-3  
µA  
ILOH1  
VOUT = VDD  
3
µA  
µA  
High-Level Output Leakage Current  
ILOH2  
VOUT = 9V, Ports 8, 9, 10 and 11Note 1  
10  
Low-Level Output  
Leakage Current  
ILOL  
VOUT = 0V  
-3  
µA  
k  
kΩ  
µA  
µA  
µA  
µA  
Resistor Interconnected To  
Input Pin (Pull-Up, Pull-Down)  
Ports 0 and 1, RESET  
Ports 10 and 11  
23.5  
7.5  
47  
15  
70.5  
22.5  
2200  
360  
Resistor Interconnected To  
Output Pin (Pull-Up)  
VDD = 5V+10%  
fCC = 700 kHz  
650  
120  
450  
65  
IDD1  
Operation mode  
VDD = 3V+10%  
fCC = 300 kHz  
VDD = 5V+10%  
fCC = 700 kHz  
1500  
200  
Supply CurrentNote 2  
IDD2  
HALT mode  
VDD = 3V+10%  
fCC = 300 kHz  
VDD = 5V+10%  
STOP mode  
0.1  
0.1  
10  
5
µA  
µA  
IDD3  
VDD = 3V+10%  
Note 1. With N-channel open-drain input/output selected  
2. Excludingcurrentflowingthroughinternalpull-upandpull-downresistors,comparator,andinternalbias  
resistor  
34  
µPD7566A, 7566A(A)  
COMPARATOR CHARACTERISTICS µPD7566A  
: Ta = -10 to +70°C, VDD = 3.0 to 6.0V  
µPD7566A(A) : Ta = -40 to +85°C, VDD = 3.0 to 6.0V  
Item  
Symbol  
Condition  
Cin 0 to Cin 3,  
MIN.  
25  
TYP. MAX. Unit  
Ccomparator Current  
DissipationNote  
1 circuit  
50  
100  
µA  
VDD = 5V±10%  
Input Voltage  
Range  
Vcin  
Vref  
0
2
VDD  
V
Response Time  
4
tCY  
mV  
mV  
VDD =5V±10%  
10  
50  
Comparator  
Input  
Resolution  
100  
Input Leakage  
Current  
±3  
µA  
kΩ  
Internal Bias  
Resistor  
Rref  
50  
100  
200  
Note Excluding current flowing through internal bias resistor  
AC CHARACTERISTICS µPD7566A  
: Ta = -10 to +70°C, VDD = 2.7 to 6.0V  
µPD7566A(A) : Ta = -40 to +85°C, VDD = 2.7 to 6.0V  
Item  
Symbol  
Condition  
MIN.  
2.8  
6.4  
0
TYP. MAX. Unit  
VDD =4.5 to 6.0V  
6.9  
6.9  
710  
350  
0.2  
µs  
µs  
Note  
Internal Clock Cycle Time  
tCY  
VDD = 4.5 to 6.0V  
kHz  
kHz  
µs  
duty  
= 50%  
P00 Event Input Frequency  
P00 Input Rise and Fall Time  
fP0  
0
tP0R, tP0F  
VDD = 4.5 to 6.0V  
0.7  
1.45  
10  
µs  
P00 Input High- and  
Low-Level Widths  
tP0H,  
tP0L  
µs  
INT0 High- and Low-Level Widths  
tI0H, tI0L  
µs  
Reset High- and Low-Level Widths  
tRSH, tRSL  
10  
µs  
Note tCY = 2/fCC (Refer to the characteristic curve for the power requirement not listed above.)  
AC TIMING MEASURING POINTS (other than CL1 input)  
0.7 VDD  
0.3 VDD  
0.7 VDD  
0.3 VDD  
Measuring  
points  
35  
µPD7566A, 7566A(A)  
DATA MEMORY DATA RETENTION CHARACTERISTICS IN STOP MODE  
µPD7566A : Ta = -10 to +70°C  
µPD7566A(A): Ta = -40 to +85°C  
Item  
Symbol  
VDDDR  
IDDDR  
tSRS  
Condition  
MIN.  
2.0  
TYP. MAX. Unit  
Supply Voltage for Data Retention  
Supply Current for Data Retention  
Reset Setup Time  
6.0  
5
V
VDDDR = 2.0V  
0.1  
µA  
µs  
0
Oscillation Stabilization Time  
tOS  
After VDD reached 4.5V  
20  
ms  
DATA RETENTION TIMING  
HALT  
mode  
Operation  
mode  
STOP mode  
Data retention mode  
VDD  
VDDDR  
tSRS  
STOP instruction  
is carried out  
RESET  
tOS  
36  
µPD7566A, 7566A(A)  
CLOCK TIMING  
1/fC  
tCL  
t
CH  
CL1 input  
tCR  
tCF  
1/fP0  
tP0L  
tP0H  
P00 input  
tP0R  
tP0F  
TEST INPUT TIMING  
I0L  
tI0H  
t
INT0  
RESET INPUT TIMING  
tRSL  
tRSH  
RESET  
37  
µPD7566A, 7566A(A)  
7. CHARACTERISTIC DATA  
fCC vs. VDD Guaranteed Operation Range  
a
: T = –10 to +70 °C  
: T = –40 to +85 °C  
PD7566A  
PD7566A(A)  
µ
µ
a
CL1 CL2  
R2  
C2  
C1  
1000  
50  
Guaranteed  
operation range  
100  
0
1
2
3
4
5
6
Supply voltage VDD [V]  
fPO vs. VDD Guaranteed Operation Range  
a
: T = –10 to +70 °C  
: Ta = –40 to +85 °C  
PD7566A  
PD7566A(A)  
µ
µ
t1  
t2  
1
t1  
>t2:fx  
=
2t  
2
1000  
500  
1
t1  
<t2:fx  
=
2t  
1
Guaranteed  
operation range  
100  
10  
0
1
2
3
4
5
6
Supply voltage VDD [V]  
38  
µPD7566A, 7566A(A)  
IDD vs. VDD Characteristic Example  
(Reference Value)  
(Ta = 25°C)  
CL1  
CL2  
CL1  
CL2  
6.8 k  
330 100  
pF pF  
6.8 k  
fcc = 700 kHz  
100 Operation mode  
330  
pF  
pF  
1000  
500  
HALT mode  
CSB300D  
CSB700A  
µ
fcc = 300 kHz  
Operation mode  
100  
50  
HALT mode  
10  
0
1
2
3
4
5
6
Supply voltage VDD [V]  
IOL vs. VOL Characteristic Example  
(Reference Value)  
(Ports 8 and 9)  
(Ta = 25°C)  
30  
25  
20  
15  
10  
5
VDD = 5 V  
VDD = 3 V  
Caution The absolute maximum rating is 30 mA per pin.  
0
0
1
2
3
4
5
6
Low-level output voltage V0L [V]  
39  
µPD7566A, 7566A(A)  
IOL vs. VOL Characteristic Example  
(Reference Value)  
(Ports 10 and 11)  
(Ta = 25°C)  
30  
25  
20  
15  
10  
5
VDD = 5 V  
Caution The absolute maximum rating is 15 mA per pin.  
VDD = 3 V  
0
0
1
2
3
4
5
6
Low-level output voltage V0L [V]  
IOH vs. VOH Characteristic Example  
(Reference Value)  
(Ta = 25°C)  
–5  
–4  
–3  
–2  
–1  
0
VDD = 5 V  
Caution The absolute maximum rating is –5 mA per pin.  
VDD = 3 V  
0
1
2
3
4
5
6
VDD – V0H [V]  
40  
µPD7566A, 7566A(A)  
8. APPLICATION CIRCUITS  
(1) Refrigerator and Air Conditioner  
LED×4  
AC03DGM, etc.  
AC16DGM, etc.  
MAX.  
9 V  
RES P80 P81 P82 P90 P91  
Comparator inputs  
Cin0  
Cin1  
Cin2  
Cin3  
2SC945A  
+
+
P113  
(CMOS output)  
RD  
5.1E  
AC100V  
µ
PD7566A  
Thermistors  
Vref  
(Pull-down resistor  
interconnected)  
P100  
P101  
P102  
P103  
CL1  
Overcurrent  
detector  
2SA733  
INT0  
CMOS output  
P110  
P111  
P112  
CL2  
Switch input  
(door switch)  
The above example shows a circuit for a refrigerator. A circuit for an air conditioner can be implemented by  
replacing only the heater with a fan motor.  
41  
µPD7566A, 7566A(A)  
(2) Rice Cooker  
2SA733  
LED×4  
RD  
10E  
+
AC03DGM, etc.  
RES P80 P81 P82 P90 P91  
Open-drain outputs  
RL  
+
RD  
5.1E  
Cin 0  
Comparator input  
RD  
24E  
P111  
AC100 V  
µ
PD7566A  
P110  
Vref  
P112  
CMOS outputs  
BZ  
Piezoelectric  
buzzer  
P100  
P101  
P102  
P103  
P00  
P11  
P12  
P13  
CL2  
CL1  
42  
µPD7566A, 7566A(A)  
(3) Washing Machine  
2SA733  
AC0V8DGM AC03DGM  
etc. etc.  
AC08DGM  
etc.  
RES P90 P91  
Open-drain  
P100  
P102  
(open-drain  
input)  
2SC945A  
P101  
× 2  
M
+
CMOS  
outputs  
+
AC100V  
RD  
5.6E  
P110  
to  
Driver µPA80C  
LED×12  
P113  
µ
PD7566A  
P103  
(CMOS output)  
Piezoelectric buzzer  
BZ  
P80  
P81  
P82  
P10  
P11  
P12  
P00  
P01  
P13  
CL2  
CL1  
Input 12 keys  
43  
µPD7566A, 7566A(A)  
(4) Cassette Deck Controller  
µPD7566A  
P91  
P100  
P101  
2SA733  
Motor  
plunger  
driver  
LED×8  
3
P110-P112  
Recording signal  
Mute signal  
P113  
P102  
P103  
Leader signal  
P80  
P81  
P82  
P90  
P10  
P11  
P12  
Tape end detection  
Pause input  
INT0  
P01  
P13  
Voltage detection  
CL1  
CL2  
12 keys  
44  
µPD7566A, 7566A(A)  
(5) Remote Controller  
µ
PD7566A  
P80  
(CMOS Output)  
70 keys max.  
RESET  
(with pull-down resistor  
interconnected)  
2SA733  
P00  
P01  
P10  
P11  
Inputs with pull-up  
resistor  
interconnected  
P12  
P13  
P100  
P101  
P102  
P103  
P82  
P90  
P91  
N-channel,  
open-drain  
output  
P110  
P111  
P112  
P113  
P81  
2SA952  
CL1  
CL2  
Ceramic oscillator  
304 kHz  
Infrared  
light-emitting  
diode  
SE307-C  
45  
µPD7566A, 7566A(A)  
9. PACKAGE DRAWINGS  
DRAWINGS OF MASS-PRODUCTION PRODUCT PACKAGES (1/2)  
24 PIN PLASTIC SHRINK DIP (300 mil)  
24  
13  
1
12  
A
K
L
F
C
B
M
D
N
M
R
NOTE  
ITEM MILLIMETERS  
INCHES  
1) Each lead centerline is located within 0.17 mm (0.007 inch) of  
its true position (T.P.) at maximum material condition.  
A
B
C
23.12 MAX.  
1.78 MAX.  
1.778 (T.P.)  
0.911 MAX.  
0.070 MAX.  
0.070 (T.P.)  
2) Item "K" to center of leads when formed parallel.  
+0.004  
0.020  
D
0.50±0.10  
–0.005  
F
G
H
I
0.85 MIN.  
3.2±0.3  
0.033 MIN.  
0.126±0.012  
0.020 MIN.  
0.170 MAX.  
0.200 MAX.  
0.300 (T.P.)  
0.256  
0.51 MIN.  
4.31 MAX.  
5.08 MAX.  
7.62 (T.P.)  
6.5  
J
K
L
+0.004  
0.010  
+0.10  
0.25  
M
–0.003  
–0.05  
N
R
0.17  
0.007  
0~15°  
0~15°  
S24C-70-300B-1  
Caution Dimensions of ES products are different from those of mass-production products. Refer to DRAWINGS  
OF ES PRODUCT PACKAGES (1/2).  
46  
µPD7566A, 7566A(A)  
DRAWINGS OF MASS-PRODUCTION PRODUCT PACKAGES (2/2)  
24 PIN PLASTIC SOP (300 mil)  
24  
13  
detail of lead end  
1
12  
A
H
I
J
L
B
C
N
M
M
D
NOTE  
ITEM MILLIMETERS  
INCHES  
Each lead centerline is located within 0.12 mm (0.005 inch) of  
its true position (T.P.) at maximum material condition.  
A
B
C
15.54 MAX.  
0.78 MAX.  
1.27 (T.P.)  
0.612 MAX.  
0.031 MAX.  
0.050 (T.P.)  
+0.10  
0.40  
+0.004  
0.016  
D
–0.05  
–0.003  
E
F
G
H
I
0.1±0.1  
1.8 MAX.  
1.55  
0.004±0.004  
0.071 MAX.  
0.061  
7.7±0.3  
5.6  
0.303±0.012  
0.220  
J
1.1  
0.043  
+0.004  
0.008  
+0.10  
0.20  
K
L
–0.002  
–0.05  
+0.008  
0.024  
0.6±0.2  
–0.009  
M
N
0.12  
0.10  
0.005  
0.004  
+7°  
3°  
+7°  
3°  
P
–3°  
–3°  
P24GM-50-300B-4  
Caution Dimensions and materials of ES products are different from those of mass-production products. Refer  
to DRAWINGS OF ES PRODUCT PACKAGES (2/2).  
47  
µPD7566A, 7566A(A)  
DRAWINGS OF ES PRODUCT PACKAGES (1/2)  
ES 24 PIN SHRINK DIP (REFERENCE) (UNIT: mm)  
48  
µPD7566A, 7566A(A)  
DRAWINGS OF ES PRODUCT PACKAGES (2/2)  
ES 24 PIN CERAMIC SOP (REFERENCE) (UNIT: mm)  
49  
µPD7566A, 7566A(A)  
10. RECOMMENDED PC BOARD PATTERN FOR SOP (REFERENCE) (UNIT: mm)  
7.62  
1.27  
The pattern shown above conforms to the Integrated Circuit Dimensions Rule (IC-74-2) stipulated by the  
Electric Industry Association of Japan (EIAJ).  
ThedimensionsofthispatternareapplicabletoalltheproductscalledflatDIP(mini-flat)formA300miltype”.  
If there is a possibility that solder bridges could be formed, shorten the pitch (0.76 mm) between pads, without  
changing the length for each pad (1.27 mm).  
50  
µPD7566A, 7566A(A)  
11. RECOMMENDED SOLDERING CONDITIONS  
For the µPD7566A, soldering must be performed under the following conditions.  
For details of recommended conditions for surface mounting, refer to information document "Semiconductor  
device mounting technology manual" (IEI-1207).  
For other soldering methods, please consult with NEC sales personnel.  
Table 11-1 Soldering Conditions of Surface Mount Type  
µPD7566AG-XXX: 24-pin plastic SOP (300 mil)  
µPD7566AG(A)-XXX: 24-pin plastic SOP (300 mil)  
Recommended  
Soldering Method  
Infrared Reflow  
VPS  
Soldering Conditions  
Conditions  
Reference Code  
Package peak temperature 230°C, Time: 30 secondes max.  
(210°C min.), Number of soldering operations: 1,  
IR30-00-1  
VP15-00-1  
Package peak temperature 215°C, Time: 40 seconds max.  
(200°C min.), Number of soldering operations: 1  
Wave Soldering  
Solder bath temperature: 260°C max., Time: 10 seconds max., WS60-00-1  
Preparatory heating temperature: 120°C max.  
(Package surface temperature)  
Pin Partial Heating  
Pin temperature: 300°C max., Time: 3 seconds max. (Per side)  
Caution Do not use one soldering method in combination with another (however, pin partial heating can be  
performed with other soldering methods).  
Table 11-2 Soldering Conditions of Through-Hole Type  
µPD7566ACS-XXX: 24-pin plastic shrink DIP (300 mil)  
µPD7566ACS(A)-XXX: 24-pin plastic shrink DIP (300 mil)  
Soldering Method  
Soldering Conditions  
Wave Soldering  
Solder bath temperature: 260°C max., Time: 10 seconds max.  
(Only for pin part)  
Pin Partial Heating  
Pin temperature: 300°C max., Time: 3 seconds max. (Per pin)  
Caution The wave soldering must be performed at the pin part only. Note that the solder must not be directly  
contacted to the package body.  
51  
Product  
µPD7556  
µPD75P56  
µPD7556A µPD7556A(A) µPD7566  
µPD75P66  
µPD7566A µPD7566A(A)  
Item  
Instruction  
RC  
4 µs/500 kHz  
Cycle/System  
External  
Ceramic  
2.86 µs/700 kHz  
Clock (5 V)  
2.86 µs/700 kHz  
Instruction Set  
ROM  
45 (SET B)  
1024 × 8  
64 × 4  
RAM  
I/O Ports  
Total  
20  
14 or 15  
20  
19  
14  
19  
µ
Port 0  
Port 1  
Port 8  
P00, P01  
P10-P13  
P00  
P00, P01  
P10-P13  
P00, P01  
P10-P13  
P00  
P00, P01  
P10-P13  
P80-P82,  
P83/CL2  
P80-P82,  
P83(CL2)  
P80-P82,  
P83/CL2  
P80-P82  
– – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – –  
Breakdown  
12 V  
9 V  
12 V  
9 V  
Voltage Limit  
Port 9, 10, 11  
P90, P91, P100-P103, P110-P113  
– – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – –  
Breakdown  
12 V  
9 V  
12 V  
9 V  
Voltage Limit  
Timer/Event Counter  
Comparator  
8 bits  
µ
4 channels  
Supply Voltage Range  
Package  
2.5-6.0 V  
4.5-6.0 V  
2.0-6.0 V  
2.7-6.0 V  
2.7-6.0 V  
4.5-6.0 V  
2.7-6.0 V  
2.7-6.0 V  
24-pin plastic shrink DIP  
24-pin plastic SOP  
µPD7566A, 7566A(A)  
APPENDIX B. DEVELOPMENT SUPPORT TOOLS  
The following development support tools are available for developing a system in which the µPD7566A is  
employed.  
Language Processor  
This absolute assembler is a program which converts a program written in  
mnemonic to object code, so that it can be executed by microcomputer.  
In addition, this absolute assembler is provided with a function which  
automatically performs branch instruction optimization.  
µPD7550, 7560 Series  
Absolute Assembler  
Host machine  
PC-9800 series  
IBM PC/ATTM  
Order code  
OS  
Media  
3.5"2HD  
5.25" 2HD  
(Product name)  
MS-DOSTM  
Ver.3.10  
to  
µS5A13AS7554  
µS5A10AS7554  
Ver.5.00ANote  
PC DOSTM  
(Ver.3.1 )  
5.25" 2HC  
µS7B10AS7554  
PROM Programming Tool  
PROM programmer that can easily program typical PROMs of 256K to 4M  
bits or single-chip microcomputers with built-in PROMs in the stand-alone  
mode or remotely from the host machine by connecting the accessory  
boards and separately sold program adapters.  
PG-1500  
Hardware  
PA-75P56CS  
PROM programmer adapter to be connected to the PG-1500 for programming  
the µPD75P56 or the µPD75P66.  
Allows controlling the PG-1500 connected to the host machine via the serial  
and parallel interface, from the host machine.  
Host machine  
PC-9800 series  
IBM PC/AT  
Order code  
OS  
Media  
3.5"2HD  
5.25" 2HD  
(Product name)  
Software  
PG-1500  
Controller  
MS-DOS  
Ver.3.10  
to  
µS5A13PG1500  
µS5A10PG1500  
Ver.5.00ANote  
PC DOS  
(Ver.3.1 )  
5.25" 2HC  
µS7B10PG1500  
Note Although Ver. 5.00/5.00A is provided with a task swap function, this function cannot be used with this  
software.  
Remark The operations of the assembler and PG-1500 controller are guaranteed only on the above host  
machine and OS.  
53  
µPD7566A, 7566A(A)  
Debugging Tool  
The EVAKIT-7500B is an evaluation board which can be used commonly with  
the µPD7500 series products.  
For system development with the µPD7566A, the and the EV-7554A option  
EVAKIT-7500B board are used together.  
EVAKIT-7500B Although the EVAKIT-7500B can operate in the stand-alone mode, the  
EVAKIT-7500B has 2 serial interface channels on its board to which a  
console, such as RS-232C, etc., can be connected for debugging.  
Additionally, the EVAKIT-7500B has real-time tracing function, so that the  
conditions of the program counter and the output ports can be traced on a  
real-time basis.  
Hardware  
The EVAKIT-7500B also has a PROM programmer for effective debugging.  
EV-7554A  
SE-7554A  
The EV-7554A is used together with the EVAKIT-7500B to evaluate the µPD7566A.  
The SE-7554A is a simulation board for evaluating a system by mounting the  
program, developed by the EVAKIT-7500B, in place of the µPD7566A.  
The EVAKIT-7500 control program controls the EVAKIT-7500B from the host  
machine by connecting the EVAKIT-7500B to the host machine via the RS-232C.  
EVAKIT-7500 Host machine  
Order code  
Control  
Program  
(EVAKIT  
OS  
Media  
3.5"2HD  
5.25" 2HD  
(Product name)  
Software  
MS-DOS  
Ver.3.10  
to  
µS5A13EV7500-P01  
µS5A10EV7500-P01  
controller)  
PC-9800 series  
IBM PC series  
Ver.5.00ANote  
PC DOS  
(Ver.3.1 )  
5.25" 2D  
µS7B11EV7500-P01  
Note Although Ver. 5.00/5.00A is provided with a task swap function, this function cannot be used with this  
software.  
Caution It is not possible to internally mount a pull-up resistor in a port in the EVAKIT-7500B. When  
evaluating, arrange to have a pull-up resistor mounted in the user system.  
Remark Operations of the EVAKIT controller are guaranteed on the above listed host machines with the listed  
operating system.  
54  
µPD7566A, 7566A(A)  
APPENDIX C. RELATED DOCUMENTS  
DOCUMENT RELATED TO DEVICE  
Document Name  
User's Manual  
Document No.  
IEU-1111D  
IF-1027G  
µPD7500-series Selection Guide  
DOCUMENT RELATED TO DEVELOPMENT TOOL  
Document Name  
Document No.  
EEU-1017C  
EEU-1034A  
EEU-1335B  
EEM-1006  
EVAKIT-7500B User's Manual  
Hardware  
Software  
EV-7554A User's Manual  
PG-1500 User's Manual  
µPD7550, 7560-series Abusolute Assembler User's Manual  
MS-DOS base  
PC DOS base  
EEM-1356  
EEM-1049  
EEU-1291B  
EVAKIT-7500 Control Program User's Manual  
PG-1500 Controller User's Manual  
OTHER RELATED DOCUMENT  
Document Name  
Document No.  
Package Manual  
IEI-1213  
IEI-1207  
IEI-1209A  
IEI-1203A  
IEI-1201  
MEI-1202  
Note  
Semiconductor Device Mounting Technology Manual  
Quality Grade on NEC Semiconductor Devices  
NEC Semiconductor Device Reliability/Quality Control System  
Static Electricity Discharge (ESD) Guarantee Guide  
Semiconductor Device Quality Guarantee Guide  
Microcomputer-Related Product Guide -Third Party Product  
Remark These documents above are subject to change without notice. Be sure to use the latest document  
for designing.  
Note To be published.  
55  
µPD7566A, 7566A(A)  
[MEMO]  
56  
µPD7566A, 7566A(A)  
NOTES FOR CMOS DEVICES  
1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS  
Note: Strong electric field, when exposed to a MOS device, can cause destruction of  
the gate oxide and ultimately degrade the device operation. Steps must be  
taken to stop generation of static electricity as much as possible, and quickly  
dissipate it once, when it has occurred. Environmental control must be  
adequate. When it is dry, humidifier should be used. It is recommended to  
avoid using insulators that easily build static electricity. Semiconductor  
devices must be stored and transported in an anti-static container, static  
shielding bag or conductive material. All test and measurement tools including  
work bench and floor should be grounded. The operator should be grounded  
using wrist strap. Semiconductor devices must not be touched with bare  
hands. Similar precautions need to be taken for PW boards with semiconductor  
devices on it.  
2 HANDLING OF UNUSED INPUT PINS FOR CMOS  
Note: No connection for CMOS device inputs can be cause of malfunction. If no  
connection is provided to the input pins, it is possible that an internal input  
level may be generated due to noise, etc., hence causing malfunction. CMOS  
device behave differently than Bipolar or NMOS devices. Input levels of CMOS  
devices must be fixed high or low by using a pull-up or pull-down circuitry. Each  
unused pin should be connected to VDD or GND with a resistor, if it is considered  
to have a possibility of being an output pin. All handling related to the unused  
pins must be judged device by device and related specifications governing the  
devices.  
3 STATUS BEFORE INITIALIZATION OF MOS DEVICES  
Note: Power-on does not necessarily define initial status of MOS device. Production  
process of MOS does not define the initial operation status of the device.  
Immediately after the power source is turned ON, the devices with reset  
function have not yet been initialized. Hence, power-on does not guarantee  
out-pin levels, I/O settings or contents of registers. Device is not initialized  
until the reset signal is received. Reset operation must be executed immedi-  
ately after power-on for devices having reset function.  
57  
µPD7566A, 7566A(A)  
[MEMO]  
The application circuits and their parameters are for references only and are not intended for use in actual design-in's.  
No part of this document may be copied or reproduced in any form or by any means without the prior written  
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this  
document.  
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual  
property rights of third parties by or arising from use of a device described herein or any other liability arising  
from use of such device. No license, either express, implied or otherwise, is granted under any patents,  
copyrights or other intellectual property rights of NEC Corporation or others.  
The devices listed in this document are not suitable for use in aerospace equipment, submarine cables, nuclear  
reactor control systems and life support systems. If customers intend to use NEC devices for above applications  
or they intend to use "Standard" quality grade NEC devices for applications not intended by NEC, please contact  
our sales people in advance.  
Application examples recommended by NEC Corporation  
Standard: Computer, Office equipment, Communication equipment, Test and Measurement equipment,  
Machine tools, Industrial robots, Audio and Visual equipment, Other consumer products, etc.  
Special: Automotive and Transportation equipment, Traffic control systems, Antidisaster systems, Anticrime  
systems, etc.  
M4 92.6  
MS-DOS is a trademark of Microsoft Corporation.  
PC DOS and PC/AT are trademarks of IBM Corporation.  

相关型号:

UPD7566AA

4-BIT SINGLE-CHIP MICROCOMPUTER
NEC

UPD7566ACS

4-BIT SINGLE-CHIP MICROCOMPUTER
NEC

UPD7566ACS(A)-XXX

Microcontroller, 4-Bit, MROM, 0.71MHz, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24
NEC

UPD7566ACS-XXX

暂无描述
NEC

UPD7566ACSA

4-BIT SINGLE-CHIP MICROCOMPUTER
NEC

UPD7566AG

4-BIT SINGLE-CHIP MICROCOMPUTER
NEC

UPD7566AG(A)-XXX

Microcontroller, 4-Bit, MROM, 0.71MHz, CMOS, PDSO24, 0.300 INCH, PLASTIC, SOP-24
NEC

UPD7566AG-XXX

暂无描述
NEC

UPD7566AGA

4-BIT SINGLE-CHIP MICROCOMPUTER
NEC

UPD7566CS

4-BIT, SINGLE-CHIP CMOS MICROCOMPUTERS WITH COMPARATOR
NEC

UPD7566CS-XXX

Microcontroller, 4-Bit, MROM, 0.71MHz, CMOS, PDIP24, SHRINK, PLASTIC, DIP-24
NEC

UPD7566G

4-BIT, SINGLE-CHIP CMOS MICROCOMPUTERS WITH COMPARATOR
NEC