UPD78F4937 [NEC]

16-BIT SINGLE-CHIP MICROCONTROLLER; 16位单芯片微控制器
UPD78F4937
型号: UPD78F4937
厂家: NEC    NEC
描述:

16-BIT SINGLE-CHIP MICROCONTROLLER
16位单芯片微控制器

微控制器
文件: 总32页 (文件大小:247K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
PRELIMINARY PRODUCT INFORMATION  
MOS INTEGRATED CIRCUIT  
µPD78F4937  
16-BIT SINGLE-CHIP MICROCONTROLLER  
The µPD78F4937, 78K/IV Series' product, is a flash memory version of the µPD784937 with internal masked ROM.  
Data can be written to or erased from the flash memory of the µPD78F4937 with the microcontroller mounted on the  
printed wiring board.  
For specific functions and other detailed information, consult the following user's manuals.  
These manuals are required reading for design work.  
µPD784937 Subseries User's Manual, Hardware : To be created  
78K/IV Series User's Manual, Instruction  
:
U10905E  
FEATURES  
Pin-compatible with mask ROM model (except VPP pin)  
Flash memory: 192K bytes  
Internal RAM: 8,192 bytes  
Same operating voltage as mask ROM model (VDD = 4.0 to 5.5 V)  
ORDERING INFORMATION  
Part number  
Package  
Internal ROM  
µPD78F4937GC-8EU  
µPD78F4937GF-3BA  
100-pin plastic LQFP (fine pitch) (14 × 14 mm)  
100-pin plastic QFP (14 × 20 mm)  
Flash memory  
Flash memory  
The information contained in this document is being issued in advance of the production cycle for the  
device. The parameters for the device may change before final production or NEC Corporation, at its own  
discretion, may withdraw the device prior to its production.  
Document No. U13573EJ1V0PM00 (1st edition)  
Date Published August 1998 J CP(K)  
Printed in Japan  
1998  
©
µPD78F4937  
78K/IV SERIES PRODUCT DEVELOPMENT DIAGRAM  
: In production  
: Under development  
Standard Products Development  
Connectable to the I2C bus  
Connectable to the multimaster I2C bus  
µ
PD784038Y  
µ
PD784225Y  
µPD784038  
µ
PD784225  
Internal memory has been expanded.  
Pin-compatible with the µPD784026  
80 pins  
µ
ROM correction function has been added.  
PD784026  
Connectable to the multimaster I2C bus  
Connectable to the multimaster I2C bus  
A/D converters,  
16-bit timers, and  
power management  
functions have been  
enhanced.  
µ
µPD784216Y  
PD784218Y  
PD784218  
µPD784216  
µ
100 pins  
Internal memory has been expanded.  
I/O has been enhanced.  
Internal memory has been expanded.  
ROM correction function has been added.  
µ
PD784054  
µ
PD784046  
Built-in 10-bit A/D converter  
ASSP Development  
µ
PD784955  
DC inverter control  
µ
PD784937  
µ
PD784908  
Functions of the µPD784908 have been enhanced.  
Internal memory has been expanded.  
Built-in IEBusTM controller  
ROM correction function has been added.  
Connectable to the multimaster I2C bus  
µ
PD784928Y  
µ
PD784928  
µ
PD784915  
µ
Functions of the PD784915 have been enhanced.  
Software servo control  
Built-in analog circuit for VCR  
Timers have been enhanced.  
2
Preliminary Product Information  
µPD78F4937  
FUNCTIONS  
(1/2)  
Item  
Function  
Number of basic instructions  
(mnemonics)  
113  
General-purpose register  
8 bits × 16 registers × 8 banks, or 16 bits × 8 registers × 8 banks (memory mapping)  
160 ns/320 ns/636 ns/1.27 µs (at 12.58 MHz)  
Minimum instruction execution  
time  
Internal  
memory  
Flash memory  
RAM  
192K bytes  
8,192 bytes  
Memory space  
I/O ports  
Program and data: 1M byte  
Total  
80  
8
Input  
Input/output  
72  
24  
Additional  
function  
pinsNote  
LED direct  
drive outputs  
Transistor  
8
4
direct drive  
N-ch open  
drain  
Real-time output ports  
IEBus controller  
Timer/counter  
4 bits × 2, or 8 bits × 1  
Incorporated (simple version)  
Timer/counter 0 : Timer register × 1  
Pulse output capability  
Toggle output  
(16 bits)  
Capture register × 1  
Compare register × 2  
PWM/PPG output  
One-shot pulse output  
Timer/counter 1 : Timer register × 1  
Real-time output port  
(16 bits)  
Capture register × 1  
Capture/compare register × 1  
Compare register × 1  
Timer/counter 2 : Timer register × 1  
Pulse output capability  
Toggle output  
(16 bits)  
Capture register × 1  
Capture/compare register × 1  
Compare register × 1  
PWM/PPG output  
Timer 3  
(16 bits)  
:
Timer register × 1  
Compare register × 1  
Clock timer  
Interrupt requests are generated at 0.5-second intervals. (A clock timer oscillator is  
incorporated.)  
Either the main clock (12.58 MHz) or real-timer clock (32.768 kHz) can be selected as the  
input clock.  
Clock output  
PWM outputs  
Serial interface  
Selected from fCLK, fCLK/2, fCLK/4, fCLK/8, or fCLK/16 (can be used as a 1-bit output port)  
12-bit resolution × 2 channels  
UART/IOE (3-wire serial I/O) : 2 channels (incorporating baud rate generator)  
CSI (3-wire serial I/O)  
: 2 channels  
Note Additional function pins are included in the I/O pins.  
Preliminary Product Information  
3
µPD78F4937  
(2/2)  
Item  
Function  
A/D converter  
8-bit resolution × 8 channels  
Watchdog timer  
1 channel  
ROM correction function  
External expansion function  
Standby  
Internal (four correction addresses can be set.)  
Provided (up to 1M byte)  
HALT/STOP/IDLE mode  
Interrupt  
27 (20 internals, 7 externals (sampling clock variable input: 1))  
BRK or BRKCS instruction, operand error  
1 internal, 1 external  
Hardware source  
Software  
Nonmaskable  
Maskable  
19 internals, 6 externals  
4-level programmable priority  
3 operation statuses: vectored interrupt, macro service, context switching  
Power supply voltage  
Package  
VDD = 4.0 to 5.5 V  
100-pin plastic LQFP (fine pitch) (14 × 14 mm)  
100-pin plastic QFP (14 × 20 mm)  
4
Preliminary Product Information  
µPD78F4937  
CONTENTS  
1. DIFFERENCES AMONG MODELS IN µPD784937 SUBSERIES....................................................6  
2. PIN CONFIGURATION (TOP VIEW) ................................................................................................7  
3. BLOCK DIAGRAM...........................................................................................................................10  
4. LIST OF PIN FUNCTIONS...............................................................................................................11  
4.1 Port Pins (1/2) .......................................................................................................................................11  
4.1 Port Pins (2/2) .......................................................................................................................................12  
4.2 Non-Port Pins (1/2) ...............................................................................................................................13  
4.2 Non-Port Pins (2/2) ...............................................................................................................................14  
4.3 I/O Circuits for Pins and Handling of Unused Pins ...........................................................................15  
5. INTERNAL MEMORY SWITCHING (IMS) REGISTER....................................................................18  
6. FLASH MEMORY PROGRAMMING................................................................................................19  
6.1 Selecting the Transmission Method ...................................................................................................19  
6.2 Flash Memory Programming Functions.............................................................................................20  
6.3 Connecting the Flashpro III .................................................................................................................20  
7. PACKAGE DRAWINGS ...................................................................................................................21  
APPENDIX A DEVELOPMENT TOOLS...............................................................................................23  
APPENDIX B RELATED DOCUMENTS ..............................................................................................26  
Preliminary Product Information  
5
µPD78F4937  
1. DIFFERENCES AMONG MODELS IN µPD784937 SUBSERIES  
The only difference among the µPD784935, µPD784936, and µPD784937 models lie in the internal memory  
capacity.  
The µPD78F4937 has a 192K-byte flash memory instead of the mask ROM featured by the µPD784935,  
µPD784936, and µPD784937. Table 1-1 shows the differences among these products.  
Table 1-1. Differences Among Models in µPD784937 Subseries  
Product  
µPD784935  
µPD784936  
µPD784937  
µPD78F4937  
Item  
Internal ROM  
96K bytes  
128K bytes  
192K bytes  
Mask ROM  
5,120 bytes  
Provided  
None  
Flash memory  
Internal RAM  
Regulator  
6,656 bytes  
8,192 bytes  
None  
Internal memory  
switching registerNote  
Provided  
IC pin  
Provided  
None  
None  
VPP pin  
Provided  
Note The internal flash memory capacity and internal RAM capacity can be changed by setting the internal  
memory switching register (IMS).  
6
Preliminary Product Information  
µPD78F4937  
2. PIN CONFIGURATION (TOP VIEW)  
100-pin plastic LQFP (fine pitch) (14 × 14 mm)  
µPD78F4937GC-8EU  
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76  
75  
P100  
P101  
P102  
P103  
P104  
1
P73/ANI3  
2
3
74  
73  
72  
71  
70  
69  
68  
67  
66  
65  
64  
63  
62  
61  
60  
59  
58  
57  
56  
55  
54  
53  
52  
51  
P72/ANI2  
P71/ANI1  
P70/ANI0  
4
5
6
7
8
9
V
PP  
P105/SCK3  
P106/SI3  
P107/SO3  
RESET  
XT2  
PWM1  
PWM0  
P17  
P16  
P15  
P14/TxD2/SO2  
P13/RxD2/SI2  
P12/ASCK2/SCK2  
P11  
P10  
ASTB/CLKOUT  
P90  
P91  
P92  
P93  
P94  
P95  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
XT1  
V
SS  
X2  
X1  
REGOFF  
REGC  
V
DD  
P00  
P01  
P02  
P03  
P04  
P05  
P06  
P07  
P96  
P97  
P40/AD0  
26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50  
Cautions 1. In normal operation, connect the VPP pin directly to the VSS pin.  
2. Connect the AVDD pin directly to the VDD pin.  
3. Connect the AVSS pin directly to the VSS pin.  
Preliminary Product Information  
7
µPD78F4937  
100-pin plastic QFP (14 × 20 mm)  
µPD78F4937GF-3BA  
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81  
80  
P36/T02  
P37/T03  
P100  
1
P76/ANI6  
P75/ANI5  
P74/ANI4  
P73/ANI3  
P72/ANI2  
P71/ANI1  
P70/ANI0  
2
79  
78  
77  
76  
75  
74  
73  
72  
71  
70  
69  
68  
67  
66  
65  
64  
63  
62  
61  
60  
59  
58  
57  
56  
55  
54  
53  
52  
51  
3
P101  
4
P102  
5
P103  
6
P104  
7
P105/SCK3  
P106/SI3  
P107/SO3  
RESET  
XT2  
8
VPP  
9
PWM1  
PWM0  
P17  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
P16  
XT1  
P15  
V
SS  
P14/TxD2/SO2  
P13/RxD2/SI2  
P12/ASCK2/SCK2  
P11  
X2  
X1  
REGOFF  
REGC  
P10  
V
DD  
ASTB/CLKOUT  
P90  
P00  
P01  
P91  
P02  
P92  
P03  
P93  
P04  
P94  
P05  
P06  
P95  
P96  
P07  
P97  
P67/REFRQ/HLDAK  
P66/WAIT/HLDRQ  
P65/WR  
P40/AD0  
P41/AD1  
P42/AD2  
31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50  
Cautions 1. In normal operation, connect the VPP pin directly to the VSS pin.  
2. Connect the AVDD pin directly to the VDD pin.  
3. Connect the AVSS pin directly to the VSS pin.  
8
Preliminary Product Information  
µPD78F4937  
A8-A19  
: Address Bus  
PWM0, PWM1  
RD  
: Pulse Width Modulation Output  
AD0-AD7  
ANI0-ANI7  
: Address/Data Bus  
: Analog Input  
: Read Strobe  
REFRQ  
REGC  
: Refresh Request  
: Regulator Capacitance  
: Regulator Off  
ASCK, ASCK2 : Asynchronous Serial Clock  
ASTB  
AVDD  
: Address Strobe  
: Analog Power Supply  
: Reference Voltage  
: Analog Ground  
: Clock Input  
REGOFF  
RESET  
RX  
: Reset  
AVREF1  
AVSS  
: IEBus Receive Data  
: Receive Data  
: Serial Clock  
RxD, RxD2  
SCK0-SCK3  
SI0-SI3  
SO0-SO3  
TO0-TO3  
TX  
CI  
CLKOUT  
HLDAK  
HLDRQ  
: Clock Output  
: Serial Input  
: Hold Acknowledge  
: Hold Request  
: Serial Output  
: Timer Output  
INTP0-INTP5 : Interrupt from Peripherals  
: IEBus Transmit Data  
: Transmit Data  
: Power Supply  
: Programming Power Supply  
: Ground  
NMI  
: Non-maskable Interrupt  
: Port 0  
TxD, TxD2  
VDD  
P00-P07  
P10-P17  
P20-P27  
P30-P37  
P40-P47  
P50-P57  
P60-P67  
P70-P77  
P90-P97  
P100-P107  
: Port 1  
VPP  
: Port 2  
VSS  
: Port 3  
WAIT  
: Wait  
: Port 4  
WR  
: Write Strobe  
: Port 5  
X1, X2  
XT1, XT2  
: Crystal (Main System Clock)  
: Crystal (Watch)  
: Port 6  
: Port 7  
: Port 9  
: Port 10  
Preliminary Product Information  
9
µPD78F4937  
3. BLOCK DIAGRAM  
RxD/SI1  
UART/IOE2  
NMI  
PROGRAMMABLE  
INTERRUPT  
CONTROLLER  
TxD/SO1  
BAUD-RATE  
GENERATOR  
ASCK/SCK1  
INTP0-INTP5  
RxD2/SI2  
TxD2/SO2  
UART/IOE1  
INTP3  
TO0  
TIMER/COUNTER0  
(16 bits)  
BAUD-RATE  
GENERATOR  
ASCK2/SCK2  
TO1  
SCK0  
SO0  
SI0  
CLOCKED  
SERIAL  
INTERFACE  
TIMER/COUNTER1  
INTP0  
(16 bits)  
SCK3  
SO3  
SI3  
CLOCKED  
SERIAL  
INTERFACE3  
INTP1  
INTP2/CI  
TO2  
78 K/IV  
CPU CORE  
(RAM 512 bytes)  
FLASH  
MEMORY  
(192K bytes)  
TIMER/COUNTER2  
(16 bits)  
TO3  
CLOCK OUTPUT  
ASTB/CLKOUT  
AD0-AD7  
TIMER3  
(16 bits)  
A8-A15  
A16-A19  
RD  
WR  
P00-P03  
P04-P07  
BUS I/F  
REAL-TIME  
OUTPUT PORT  
WAIT/HLDRQ  
REFRQ/HLDAK  
D0-D7  
A0-A16  
CE  
OE  
PGM  
PWM0  
PWM1  
RAM  
(8,192 bytes)  
PWM  
PORT 0  
PORT 1  
PORT 2  
PORT 3  
PORT 4  
PORT 5  
PORT 6  
PORT 7  
PORT 9  
PORT 10  
P00-P07  
P10-P17  
P20-P27  
P30-P37  
P40-P47  
P50-P57  
P60-P67  
P70-P77  
P90-P97  
P100-P107  
ANI0-ANI7  
AVDD  
A/D  
CONVERTER  
AVREF1  
AVSS  
INTP5  
TX  
RX  
IEBus  
CONTROLLER  
RESET  
X1  
X2  
REGC  
REGOFF  
SYSTEM  
CONTROL  
(REGULATOR)  
WATCHDOG  
TIMER  
V
PP  
V
DD  
V
SS  
XT1  
XT2  
WATCH  
TIMER  
10  
Preliminary Product Information  
µPD78F4937  
4. LIST OF PIN FUNCTIONS  
4.1 Port Pins (1/2)  
Pin  
I/O  
I/O  
Dual-function  
Function  
P00-P07  
Port 0 (P0):  
8-bit I/O port.  
Functions as a real-time output port (4 bits × 2).  
Inputs and outputs can be specified bit by bit.  
The use of pull-up resistors can be simultaneously specified by software  
for all pins in input mode.  
Can drive a transistor.  
P10  
I/O  
Port 1 (P1):  
8-bit I/O port.  
P11  
Inputs and outputs can be specified bit by bit.  
The use of pull-up resistors can be simultaneously specified by software  
for all pins in input mode.  
P12  
ASCK2/SCK2  
RxD2/SI2  
TxD2/SO2  
P13  
Can drive LED.  
P14  
P15-P17  
P20  
Input  
NMI  
Port 2 (P2):  
8-bit input-only port.  
P21  
INTP0  
P20 does not function as a general-purpose port (nonmaskable interrupt).  
However, the input level can be checked by an interrupt service routine.  
The use of pull-up resistors can be specified by software for pins P22 to  
P27 (in units of 6 bits).  
P22  
INTP1  
P23  
INTP2/CI  
INTP3  
P24  
The P25/INTP4/ASCK/SCK1 pin functions as the SCK1 I/O pin by CSIM1.  
P25  
INTP4/ASCK/SCK1  
INTP5  
P26  
P27  
SI0  
P30  
I/O  
RxD/SI1  
TxD/SO1  
SCK0  
Port 3 (P3):  
8-bit I/O port.  
P31  
Inputs and outputs can be specified bit by bit.  
The use of pull-up resistors can be simultaneously specified by software  
for all pins in input mode.  
P32  
P33  
SO0  
P32 and P33 can be set as the N-ch open-drain pin.  
P34-P37  
P40-P47  
TO0-TO3  
AD0-AD7  
I/O  
Port 4 (P4):  
8-bit I/O port.  
Inputs and outputs can be specified bit by bit.  
The use of pull-up resistors can be simultaneously specified by software  
for all pins in input mode.  
Can drive LED.  
Preliminary Product Information  
11  
µPD78F4937  
4.1 Port Pins (2/2)  
Pin  
I/O  
I/O  
Dual-function  
A8-A15  
Function  
P50-P57  
Port 5 (P5):  
8-bit I/O port.  
Inputs and outputs can be specified bit by bit.  
The use of pull-up resistors can be simultaneously specified by software  
for all pins in input mode.  
Can drive LED.  
P60-P63  
P64  
I/O  
A16-A19  
RD  
Port 6 (P6):  
8-bit I/O port.  
Inputs and outputs can be specified bit by bit.  
The use of pull-up resistors can be simultaneously specified by software  
for all pins in input mode.  
P65  
WR  
P66  
WAIT/HLDRQ  
REFRQ/HLDAK  
ANI0-ANI7  
P67  
P70-P77  
I/O  
I/O  
Port 7 (P7):  
8-bit I/O port.  
Inputs and outputs can be specified bit by bit.  
P90-P97  
Port 9 (P9):  
8-bit I/O port.  
Inputs and outputs can be specified bit by bit.  
The use of pull-up resistors can be simultaneously specified by software  
for all pins in input mode.  
P100-P104  
P105  
I/O  
SCK3  
SI3  
Port 10 (P10):  
8-bit I/O port.  
Inputs and outputs can be specified bit by bit.  
The use of pull-up resistors can be simultaneously specified by software  
for all pins in input mode.  
P106  
P107  
SO3  
P105 and P107 can be set as the N-ch open-drain pin.  
12  
Preliminary Product Information  
µPD78F4937  
4.2 Non-Port Pins (1/2)  
Pin  
TO0-TO3  
CI  
I/O  
Output  
Input  
Dual-function  
P34-P37  
Function  
Timer output  
P23/INTP2  
P30/SI1  
P13/SI2  
P31/SO1  
P14/SO2  
P25/INTP4/SCK1  
P12/SCK2  
P27  
Input of a count clock for timer/counter 2  
Serial data input (UART0)  
RxD  
Input  
RxD2  
TxD  
Serial data input (UART2)  
Output  
Input  
Serial data output (UART0)  
TxD2  
ASCK  
ASCK2  
SI0  
Serial data output (UART2)  
Baud rate clock input (UART0)  
Baud rate clock input (UART2)  
Serial data input (3-wire serial I/O0)  
Serial data input (3-wire serial I/O1)  
Serial data input (3-wire serial I/O2)  
Serial data input (3-wire serial I/O3)  
Serial data output (3-wire serial I/O0)  
Serial data output (3-wire serial I/O1)  
Serial data output (3-wire serial I/O2)  
Serial data output (3-wire serial I/O3)  
Serial clock I/O (3-wire serial I/O0)  
Serial clock I/O (3-wire serial I/O1)  
Serial clock I/O (3-wire serial I/O2)  
Serial clock I/O (3-wire serial I/O3)  
External interrupt request  
Input  
SI1  
P30/RxD  
P13/RxD2  
P106  
SI2  
SI3  
SO0  
Output  
P33  
SO1  
P31/TxD  
P14/TxD2  
P107  
SO2  
SO3  
SCK0  
SCK1  
SCK2  
SCK3  
NMI  
I/O  
P32  
P25/INTP4/ASCK  
P12/ASCK  
P105  
Input  
P20  
INTP0  
P21  
Input of a count clock for timer/counter 1  
Capture/trigger signal for CR11 or CR12  
INTP1  
INTP2  
INTP3  
P22  
Input of a count clock for timer/counter 2  
Capture/trigger signal for CR22  
P23/CI  
P24  
Input of a count clock for timer/counter 2  
Capture/trigger signal for CR21  
Input of a count clock for timer/counter 0  
Capture/trigger signal for CR02  
INTP4  
INTP5  
AD0-AD7  
A8-A15  
A16-A19  
RD  
P25/ASCK/SCK1  
P26  
Input of a conversion start trigger for A/D converter  
Time multiplexing address/data bus (for connecting external memory)  
High-order address bus (for connecting external memory)  
High-order address during address expansion (for connecting external memory)  
Strobe signal output for reading the contents of external memory  
Strobe signal output for writing on external memory  
Wait signal insertion  
I/O  
P40-P47  
P50-P57  
P60-P63  
P64  
Output  
Output  
Output  
Output  
Input  
WR  
P65  
WAIT  
P66/HLDRQ  
P67/HLDAK  
P66/WAIT  
P67/REFRQ  
CLKOUT  
REFRQ  
HLDRQ  
HLDAK  
ASTB  
Output  
Input  
Refresh pulse output to external pseudo static memory  
Input of bus hold request  
Output  
Output  
Output of bus hold response  
Latch timing output of time multiplexing address (A0-A7) (for connecting  
external memory)  
Preliminary Product Information  
13  
µPD78F4937  
4.2 Non-Port Pins (2/2)  
Pin  
CLKOUT  
PWM0  
PWM1  
RX  
I/O  
Output  
Output  
Output  
Input  
Output  
Dual-function  
ASTB  
Function  
Clock output  
PWM output 0  
PWM output 1  
Data input (IEBus)  
Data output (IEBus)  
TX  
REGC  
REGOFF  
RESET  
X1  
Capacitor connection for stabilizing the regulator output  
Signal for specifying regulator operation  
Chip reset  
Input  
Input  
Crystal input for system clock oscillation (A clock pulse can also be input to the  
X1 pin.)  
X2  
XT1  
Input  
Real-time clock connection pin  
XT2  
ANI0-ANI7  
AVREF1  
AVDD  
Input  
P70-P77  
Analog voltage inputs for the A/D converter  
Application of A/D converter reference voltage  
Positive power supply for the A/D converter  
Ground for the A/D converter  
Positive power supply  
AVSS  
VDD  
VSS  
Ground  
VPP  
Input  
This pin is used to set the flash memory programming mode and applies a high  
voltage when a program is written or verified. In normal operation mode,  
connect this pin directly to the VSS pin.  
14  
Preliminary Product Information  
µPD78F4937  
4.3 I/O Circuits for Pins and Handling of Unused Pins  
Table 4-1 describes the types of I/O circuits for pins and the handling of unused pins.  
Figure 4-1 shows the configuration of these various types of I/O circuits.  
Table 4-1. Types of I/O Circuits for Pins and Handling of Unused Pins (1/2)  
Pin  
I/O circuit type  
5-A  
I/O  
I/O  
Recommended connection method for unused pins  
Input state: Connect these pins to the VDD pin.  
P00-P07  
P10, P11  
Output state: Leave these pins open.  
P12/ASCK2/SCK2  
P13/RxD2/SI2  
P14/TxD2/SO2  
P15-P17  
8-A  
5-A  
P20/NMI  
2
Input  
Connect these pins to the VDD or VSS pin.  
Connect these pins to the VDD pin.  
P21/INTP0  
P22/INTP1  
2-A  
P23/INTP2/CI  
P24/INTP3  
P25/INTP4/ASCK/SCK1  
8-A  
2-A  
I/O  
Input state:  
Connect this pin to the VDD pin.  
Output state: Leave this pin open.  
P26/INTP5  
Input  
Connect these pins to the VDD pin.  
P27/SI0  
P30/RxD/SI1  
P31/TxD/SO1  
P32/SCK0  
5-A  
10-A  
5-A  
I/O  
Input state:  
Connect these pins to the VDD pin.  
Output state: Leave these pins open.  
P33/SO0  
P34/TO0-P37/TO3  
P40/AD0-P47/AD7  
P50/A8-P57/A15  
P60/A16-P63/A19  
P64/RD  
P65/WR  
P66/WAIT/HLDRQ  
P67/REFRQ/HLDAK  
P70/ANI0-P77/ANI7  
P90-P97  
20  
I/O  
Input state:  
Connect these pins to the VDD or VSS pin.  
Output state: Leave these pins open.  
5-A  
P100-P104  
P105/SCK3  
10-A  
8-A  
10-A  
4
P106/SI3  
P107/SO3  
ASTB/CLKOUT  
Output Leave this pin open.  
Preliminary Product Information  
15  
µPD78F4937  
Table 4-1. Types of I/O Circuits for Pins and Handling of Unused Pins (2/2)  
Pin  
I/O circuit type  
I/O  
Input  
Recommended connection method for unused pins  
RESET  
XT2  
2
1
3
2
3
Leave this pin open.  
XT1  
Input  
Connect this pin to the VSS pin.  
Connect these pins to the VDD pin.  
REGOFF  
REGC  
PWM0, PWM1  
Output Leave this pin open.  
RX  
Input  
Connect this pin to the VDD or VSS pin.  
TX  
Output Leave this pin open.  
AVREF1  
AVSS  
AVDD  
VPP  
Connect these pins to the VSS pin.  
Connect this pin to the VDD pin.  
Connect this pin directly to the VSS pin.  
Input  
Caution When the I/O mode of an I/O dual-function pin is unpredictable, connect the pin to VDD through a  
resistor of 10 to 100 kilohms (particularly when the voltage of the reset input pin becomes higher  
than that of the low level input at power-on or when I/O is switched by software).  
Remark Since type numbers are consistent in the 78K Series, those numbers are not always serial in each  
product. (Some circuits are not included.)  
16  
Preliminary Product Information  
µPD78F4937  
Figure 4-1. I/O Circuits for Pins  
Type 1  
Type 2-A  
VDD  
VDD  
P
Pull-up  
enable  
P
IN  
N
IN  
Type 2  
Schmitt trigger input with hysteresis characteristics  
IN  
Type 5-A  
VDD  
Schmitt trigger input with hysteresis characteristics  
Type 3  
Pull-up  
enable  
P
V
DD  
V
P
DD  
Data  
P-ch  
IN/OUT  
Data  
OUT  
Output  
disable  
N
N-ch  
Input  
enable  
Type 4  
Type 8-A  
VDD  
VDD  
Data  
P
Pull-up  
enable  
P
OUT  
V
P
DD  
Output  
disable  
N
Data  
IN/OUT  
Output  
disable  
N
Push-pull output which can output high impedance  
(both the positive and negative channels are off.)  
Type 10-A  
V
DD  
Type 20  
Pull-up  
enable  
P
VDD  
Data  
P
V
DD  
Data  
P
IN/OUT  
IN/OUT  
Open  
Output  
disable  
drain  
N
N
Output  
disable  
Comparator  
P
N
+
Type 12  
V
REF  
(Threshold voltage)  
P
N
Analog output  
voltage  
OUT  
Input  
enable  
Preliminary Product Information  
17  
µPD78F4937  
5. INTERNAL MEMORY SWITCHING (IMS) REGISTER  
This register enables the software to avoid using part of the internal memory. The IMS register can be set to  
establish the same memory mapping as used in ROM products that have different internal memory (ROM and RAM)  
configurations.  
The IMS register is set using 8-bit memory operation instructions.  
A RESET input sets the IMS register to FFH.  
Figure 5-1. Internal Memory Switching (IMS) Register  
Address: 0FFFCH  
7
When reset: FFH  
W/R  
6
1
5
4
3
1
2
1
1
0
IMS  
1
ROM1  
ROM0  
RAM1  
RAM0  
ROM1  
ROM0  
Internal ROM capacity selection  
0
0
1
1
0
1
0
1
Not to be set  
96K bytes  
128K bytes  
192K bytes  
RAM1  
RAM0  
Internal RAM capacity selection  
0
0
1
1
0
1
0
1
Not to be set  
5,120 bytes  
6,656 bytes  
8,192 bytes  
Caution The IMS is not contained in a mask ROM product (µPD784935, µPD784936, or µPD784937).  
The IMS setting to obtain the same memory map as masked ROM products are shown in Table 5-1.  
Table 5-1. Internal Memory Switching Register (IMS) Setting Value  
Product  
IMS setting value  
µPD784935  
µPD784936  
µPD784937  
DDH  
EEH  
FFH  
18  
Preliminary Product Information  
µPD78F4937  
6. FLASH MEMORY PROGRAMMING  
The flash memory can be written even while the device is mounted in the target system (on-board write). To write  
a program into the flash memory, connect the dedicated flash writer (Flashpro III) to both the host machine and target  
system.  
Remark The Flashpro III is manufactured by Naito Densei Machida Mfg. Co., Ltd.  
6.1 Selecting the Transmission Method  
The Flashpro III writes into flash memory by means of serial transmission. The transmission method to be used  
for writing is selected from those listed in Table 6-1. To select a transmission method, use the format shown in  
Figure 6-1, according to the number of VPP pulses listed in Table 6-1.  
Table 6-1. Transmission Methods  
Transmission method  
3-wire serial I/O  
Number of channels  
1
Pins  
Number of VPP pulses  
0
SCK3/P105  
SO3/P107  
SI3/P106  
UART  
1
TxD/SO1/P31  
RxD/SI1/P30  
8
Caution To select a transmission method, always use the corresponding number of VPP pulses listed in  
Table 6-1.  
Figure 6-1. Format of Transmission Method Selection  
10 V  
V
DD  
SS  
V
PP  
1
2
n
V
V
V
DD  
SS  
RESET  
Preliminary Product Information  
19  
µPD78F4937  
6.2 Flash Memory Programming Functions  
Flash memory writing and other operations can be performed by transmitting/receiving commands and data  
according to the selected transmission method. Table 6-2 lists the main flash memory programming functions.  
Table 6-2. Main Flash Memory Programming Functions  
Function  
Description  
Batch erase  
Block erase  
Erases the entire contents of memory.  
Erases the contents of specified memory block.  
Batch blank check  
Block blank check  
Data write  
Checks that the entire contents of memory have been erased.  
Checks that the contents of specified block have been erased.  
Write to the flash memory according to the specified write start address and number of bytes  
of data to be written.  
Batch verify  
Block verify  
Compares the entire contents of memory with the input data.  
Compares the contents of specified memory block with the input data.  
6.3 Connecting the Flashpro III  
The connection between the Flashpro III and µPD78F4937 varies with the transmission method. Figures 6-2 and  
6-3 show the connection for each transmission method.  
Figure 6-2. Flashpro III Connection in 3-Wire Serial I/O Mode  
Flashpro III  
µPD78F4937  
V
PP  
V
V
PP  
DD  
V
DD  
RESET  
SCK  
SO  
RESET  
SCK  
SI  
SI  
SO  
VSS  
V
SS  
Figure 6-3. Flashpro III Connection in UART Mode  
Flashpro III  
µ
PD78F4937  
V
PP  
V
V
PP  
DD  
V
DD  
RESET  
SO  
RESET  
RxD  
SI  
TxD  
V
SS  
VSS  
20  
Preliminary Product Information  
µPD78F4937  
7. PACKAGE DRAWINGS  
100PIN PLASTIC QFP (14x20)  
A
B
51  
50  
80  
81  
detail of lead end  
C D  
S
R
Q
31  
30  
100  
1
F
J
G
M
H
I
P
K
M
N
L
NOTE  
ITEM MILLIMETERS  
INCHES  
Each lead centerline is located within 0.15 mm (0.006 inch) of  
its true position (T.P.) at maximum material condition.  
A
23.6±0.4  
0.929±0.016  
+0.009  
0.795  
B
20.0±0.2  
–0.008  
REMARK  
+0.009  
0.551  
C
14.0±0.2  
–0.008  
The shape and material of the ES product is the same as the  
mass produced product.  
D
F
17.6±0.4  
0.8  
0.693±0.016  
0.031  
G
0.6  
0.024  
+0.004  
0.012  
H
0.30±0.10  
–0.005  
I
0.15  
0.006  
J
0.65 (T.P.)  
0.026 (T.P.)  
+0.008  
0.071  
K
L
1.8±0.2  
0.8±0.2  
–0.009  
+0.009  
0.031  
–0.008  
+0.10  
0.15  
+0.004  
0.006  
M
–0.05  
–0.003  
N
P
0.10  
0.004  
+0.005  
0.106  
2.7±0.1  
–0.004  
Q
R
S
0.1±0.1  
5°±5°  
0.004±0.004  
5°±5°  
3.0 MAX.  
0.119 MAX.  
P100GF-65-3BA1-3  
Preliminary Product Information  
21  
µPD78F4937  
100 PIN PLASTIC LQFP (FINE PITCH) (14×14)  
A
B
75  
76  
51  
50  
detail of lead end  
S
C
D
R
Q
100  
1
26  
25  
F
M
H
I
J
G
K
L
P
M
N
NOTE  
ITEM MILLIMETERS  
INCHES  
Each lead centerline is located within 0.08 mm (0.003 inch) of  
its true position (T.P.) at maximum material condition.  
A
B
16.00±0.20  
14.00±0.20  
0.630±0.008  
+0.009  
0.551  
–0.008  
REMARK  
+0.009  
0.551  
C
D
14.00±0.20  
16.00±0.20  
–0.008  
The shape and material of the ES product is the same as the  
mass produced product.  
0.630±0.008  
F
1.00  
1.00  
0.039  
0.039  
G
+0.05  
0.22  
H
0.009±0.002  
–0.04  
I
0.08  
0.003  
J
0.50 (T.P.)  
0.020 (T.P.)  
+0.009  
0.039  
K
L
1.00±0.20  
0.50±0.20  
–0.008  
+0.008  
0.020  
–0.009  
+0.03  
0.17  
+0.001  
0.007  
M
–0.07  
–0.003  
N
P
Q
0.08  
0.003  
1.40±0.05  
0.10±0.05  
0.055±0.002  
0.004±0.002  
+7°  
3°  
+7°  
3°  
R
S
–3°  
–3°  
1.60 MAX.  
0.063 MAX.  
S100GC-50-8EU  
22  
Preliminary Product Information  
µPD78F4937  
APPENDIX A DEVELOPMENT TOOLS  
The following development tools are available for system development using the µPD78F4937.  
See also (5).  
(1) Language processing software  
RA78K4  
Assembler package used in common with 78K/IV Series  
C compiler package used in common with 78K/IV Series  
Device file for µPD784937 Subseries  
CC78K4  
DF784937  
CC78K4-L  
C compiler library source file used in common with 78K/IV Series  
(2) Flash memory write tools  
Flashpro IllNote  
(PG-FPIII)  
Flash writer used only for microcontrollers with internal flash memory  
FA-100GF  
Flash memory writing adapter for 100-pin plastic QFP (GF-3BA type).  
Wiring must be performed according to product being used.  
FA-100GC  
Flash memory writing adapter for 100-pin plastic LQFP (GC-8EU type).  
Wiring must be performed according to product being used.  
Flashpro III controllerNote  
Program controlled by a personal computer and which is supported by Flashpro III.  
Runs under WindowsTM95, etc.  
(3) Debugging tools  
When using the in-circuit emulator IE-78K4-NS  
IE-78K4-NS  
In-circuit emulator used in common with 78K/IV Series  
Power supply unit for IE-78K4-NS  
IE-70000-MC-PS-B  
IE-70000-98-IF-C  
Interface adapter when the PC-9800 series computer (other than a notebook) is  
used as the host machine  
IE-70000-CD-IF-C  
IE-70000-PC-IF-C  
PC card and interface cable when a PC-9800 series notebook is used as the host  
machine  
Interface adapter when the IBM PC/ATTM compatible is used as the host machine  
IE-784937-NS-EM1Note  
NP-100GF  
Emulation board for emulating µPD784937 Subseries  
Emulation probe for 100-pin plastic QFP (GF-3BA type)  
Emulation probe for 100-pin plastic LQFP (GC-8EU type)  
NP-100GC  
EV-9200-GF-100  
Socket for mounting on target system board made for 100-pin plastic QFP (GF-  
3BA type)  
TGC-100SDW  
Conversion adapter for connecting the target system board made for 100-pin plastic  
LQFP (GC-8EU type) with NP-100GC  
ID78K4-NS  
SM78K4  
Integrated debugger for IE-78K4-NS  
System simulator used in common with 78K/IV Series  
Device file for µPD784937 Subseries  
DF789437  
Note Under development  
Preliminary Product Information  
23  
µPD78F4937  
When using the in-circuit emulator IE-784000-R  
IE-784000-R  
In-circuit emulator used in common with 78K/IV Series  
IE-70000-98-IF-B  
IE-70000-98-IF-C  
Interface adapter when the PC-9800 series computer (other than a notebook) is  
used as the host machine  
IE-70000-98N-IF  
Interface adapter and cable when a PC-9800 series notebook is used as the host  
machine  
IE-70000-PC-IF-B  
IE-70000-PC-IF-C  
Interface adapter when the IBM PC/AT compatible is used as the host machine  
IE-78000-R-SV3  
Interface adapter and cable when the EWS is used as the host machine  
IE-784937-NS-EM1Note  
IE-784937-R-EM1Note  
Emulation board for emulating µPD784937 Subseries  
IE-78400-R-EM  
Emulation board used in common with 78K/IV Series  
IE-78K4-R-EX2Note  
Conversion board for emulation probes required to use the IE-784937-NS-EM1 on  
the IE-784000-R. The board is not needed when the IE-784937-R-EM1 is used.  
EP-78064GF-R  
EP-78064GC-R  
EV-9200GF-100  
Emulation probe for 100-pin plastic QFP (GF-3BA type)  
Emulation probe for 100-pin plastic LQFP (GC-8EU type)  
Socket for mounting on target system board made for 100-pin plastic QFP  
(GF-3BA type)  
TGC-100SDW  
Conversion adapter for connecting the target system board made for 100-pin  
plastic LQFP (GC-8EU type) with NP-100GC  
ID78K4  
Integrated debugger for IE-784000-R  
SM78K4  
DF784937  
System simulator used in common with 78K/IV Series  
Device file for µPD784937 Subseries  
Note Under development  
(4) Real-time OS  
RX78K/IV  
MX78K4  
Real-time OS for 78K/IV Series  
OS for the 78K/IV Series  
24  
Preliminary Product Information  
µPD78F4937  
(5) Notes when using development tools  
The ID78K4-NS, ID78K4, and SM78K4 can be used in combination with the DF784937.  
The CC78K4 and RX78K/IV can be used in combination with the RA78K4 and DF784937.  
The Flashpro III, FA-100GF, FA-100GC, NP-100GF, and NP-100GC are manufactured by Naito Densei  
Machida Mfg. Co., Ltd. (044-822-3813). Consult the NEC sales representative for purchasing.  
The TGC-100SDW is a product from TOKYO ELETECH CORPORATION.  
Refer to: Daimaru Kogyo, Ltd.  
Tokyo Electronic Components Division (03-3820-7112)  
Osaka Electronic Components Division (06-244-6672)  
The host machines and operating systems corresponding to each software are shown below.  
Host machine  
[OS]  
PC  
EWS  
HP9000 series 700TM [HP-UXTM  
SPARCstationTM [SunOSTM, SolarisTM  
]
PC-9800 series [Windows]  
IBM PC/AT compatibles  
]
NEWSTM (RISC) [NEWS-OSTM  
]
[Japanese/English Windows]  
Software  
ΟNote  
RA78K4  
CC78K4  
Ο
Ο
ΟNote  
ID78K4-NS  
ID78K4  
Ο
Ο
Ο
SM78K4  
RX78K/IV  
Ο
ΟNote  
ΟNote  
Ο
MX78K4  
Ο
Note Software under MS-DOS  
Preliminary Product Information  
25  
µPD78F4937  
APPENDIX B RELATED DOCUMENTS  
Documents Related to Devices  
Document name  
Document No.  
Japanese  
U13572J  
English  
To be created  
This manual  
To be created  
µPD784935, 784936, 784937 Preliminary Product Information  
µPD78F4937 Preliminary Product Information  
µPD784937 Subseries User's Manual, Hardware  
µPD784937 Subseries Special Function Registers  
78K/IV Series User's Manual, Instruction  
U13573J  
To be created  
To be created  
U10905J  
U10905E  
78K/IV Series Instruction Summary Sheet  
78K/IV Series Instruction Set  
U10594J  
U10595J  
78K/IV Series Application Note, Software Basic  
U10095J  
U10095E  
Documents Related to Development Tools (User's Manual)  
Document name  
Document No.  
Japanese  
U11334J  
English  
U11334E  
RA78K Series Assembler Package  
Operation  
Language  
U11162J  
U11162E  
RA78K Series Structured Assembler Preprocessor  
CC78K Series C Compiler  
U11743J  
U11743E  
Operation  
Language  
U11571J  
U11571E  
U11572J  
U11572E  
IE-78K4-NS  
U13356J  
To be created  
EEU-1534  
To be created  
To be created  
EEU-1469  
U10093E  
IE-784000-R  
U12903J  
IE-784937-R-EM1  
To be created  
To be created  
EEU-934  
IE-784937-NS-EM1  
EP-78064  
SM78K4 System Simulator Windows Base  
SM78K Series System Simulator  
Reference  
U10093J  
U10092J  
U10092E  
External Parts User Open  
Interface Specifications  
ID78K4-NS Integrated Debugger  
Reference  
Reference  
Reference  
U12796J  
U10440J  
U11960J  
U12796E  
U10440E  
U11960E  
ID78K4 Integrated Debugger Windows Base  
ID78K4 Integrated Debugger HP-UX, SunOS, NEWS-OS Base  
Caution The above documents may be revised without notice. Use the latest versions when you design  
application systems.  
26  
Preliminary Product Information  
µPD78F4937  
Documents Related to Software to Be Incorporated into the Product (User's Manual)  
Document name  
Document No.  
Japanese English  
U10603E  
78K/IV Series Real-Time OS  
Basic  
U10603J  
U10604J  
U10364J  
U11779J  
Installation  
Debugger  
U10604E  
OS for 78K/IV Series MX78K4  
Other Documents  
Document name  
Document No.  
Japanese English  
IC PACKAGE MANUAL  
C10943X  
C10535J  
C11531J  
C10983J  
C11892J  
C12769J  
U11416J  
SMD Surface Mount Technology Manual  
C10535E  
C11531E  
C10983E  
C11892E  
Quality Grades on NEC Semiconductor Device  
NEC Semiconductor Device Reliability/Quality Control System  
Guide to Prevent Damage for Semiconductor Devices by Electrostatic Discharge (ESD)  
Semiconductor Device Quality Control/Reliability Handbook  
Guide for Products Related to Microcomputer: Other Companies  
Caution The above documents may be revised without notice. Use the latest versions when you design  
application systems.  
Preliminary Product Information  
27  
µPD78F4937  
[MEMO]  
28  
Preliminary Product Information  
µPD78F4937  
NOTES FOR CMOS DEVICES  
1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS  
Note: Strong electric field, when exposed to a MOS device, can cause destruction  
of the gate oxide and ultimately degrade the device operation. Steps must  
be taken to stop generation of static electricity as much as possible, and  
quickly dissipate it once, when it has occurred. Environmental control must  
be adequate. When it is dry, humidifier should be used. It is recommended  
to avoid using insulators that easily build static electricity. Semiconductor  
devices must be stored and transported in an anti-static container, static  
shielding bag or conductive material. All test and measurement tools  
including work bench and floor should be grounded. The operator should  
be grounded using wrist strap. Semiconductor devices must not be touched  
with bare hands. Similar precautions need to be taken for PW boards with  
semiconductor devices on it.  
2 HANDLING OF UNUSED INPUT PINS FOR CMOS  
Note: No connection for CMOS device inputs can be cause of malfunction. If no  
connection is provided to the input pins, it is possible that an internal input  
level may be generated due to noise, etc., hence causing malfunction. CMOS  
devices behave differently than Bipolar or NMOS devices. Input levels of  
CMOS devices must be fixed high or low by using a pull-up or pull-down  
circuitry. Each unused pin should be connected to VDD or GND with a  
resistor, if it is considered to have a possibility of being an output pin. All  
handling related to the unused pins must be judged device by device and  
related specifications governing the devices.  
3 STATUS BEFORE INITIALIZATION OF MOS DEVICES  
Note: Power-on does not necessarily define initial status of MOS device. Production  
process of MOS does not define the initial operation status of the device.  
Immediately after the power source is turned ON, the devices with reset  
function have not yet been initialized. Hence, power-on does not guarantee  
out-pin levels, I/O settings or contents of registers. Device is not initialized  
until the reset signal is received. Reset operation must be executed imme-  
diately after power-on for devices having reset function.  
Preliminary Product Information  
29  
µPD78F4937  
IEBus is a trademark of NEC Corporation.  
Windows is a registered trademark or a trademark of Microsoft Corporation in the United States and/or other  
countries.  
PC/AT is a trademark of IBM Corporation.  
HP9000 series 700 and HP-UX are trademarks of Hewlett-Packard Company.  
SPARCstation is a trademark of SPARC International, Inc.  
Solaris and SunOS are trademarks of Sun Microsystems, Inc.  
NEWS and NEWS-OS are trademarks of SONY Corporation.  
30  
Preliminary Product Information  
µPD78F4937  
Regional Information  
Some information contained in this document may vary from country to country. Before using any NEC  
product in your application, pIease contact the NEC office in your country to obtain a list of authorized  
representatives and distributors. They will verify:  
Device availability  
Ordering information  
Product release schedule  
Availability of related technical literature  
Development environment specifications (for example, specifications for third-party tools and  
components, host computers, power plugs, AC supply voltages, and so forth)  
Network requirements  
In addition, trademarks, registered trademarks, export restrictions, and other legal issues may also vary  
from country to country.  
NEC Electronics Inc. (U.S.)  
Santa Clara, California  
Tel: 408-588-6000  
800-366-9782  
NEC Electronics (Germany) GmbH NEC Electronics Hong Kong Ltd.  
Benelux Office  
Hong Kong  
Eindhoven, The Netherlands  
Tel: 040-2445845  
Tel: 2886-9318  
Fax: 2886-9022/9044  
Fax: 408-588-6130  
800-729-9288  
Fax: 040-2444580  
NEC Electronics Hong Kong Ltd.  
Seoul Branch  
Seoul, Korea  
Tel: 02-528-0303  
Fax: 02-528-4411  
NEC Electronics (France) S.A.  
Velizy-Villacoublay, France  
Tel: 01-30-67 58 00  
NEC Electronics (Germany) GmbH  
Duesseldorf, Germany  
Tel: 0211-65 03 02  
Fax: 01-30-67 58 99  
Fax: 0211-65 03 490  
NEC Electronics Singapore Pte. Ltd.  
United Square, Singapore 1130  
Tel: 65-253-8311  
NEC Electronics (France) S.A.  
Spain Office  
Madrid, Spain  
NEC Electronics (UK) Ltd.  
Milton Keynes, UK  
Tel: 01908-691-133  
Fax: 65-250-3583  
Tel: 01-504-2787  
Fax: 01908-670-290  
Fax: 01-504-2860  
NEC Electronics Taiwan Ltd.  
Taipei, Taiwan  
Tel: 02-719-2377  
NEC Electronics Italiana s.r.1.  
Milano, Italy  
Tel: 02-66 75 41  
NEC Electronics (Germany) GmbH  
Scandinavia Office  
Taeby, Sweden  
Fax: 02-719-5951  
Fax: 02-66 75 42 99  
Tel: 08-63 80 820  
NEC do Brasil S.A.  
Cumbica-Guarulhos-SP, Brasil  
Tel: 011-6465-6810  
Fax: 08-63 80 388  
Fax: 011-6465-6829  
J98. 2  
Preliminary Product Information  
31  
µPD78F4937  
Some related documents may be preliminary versions. Note that, however, what documents are preliminary is not  
indicated in this document.  
No part of this document may be copied or reproduced in any form or by any means without the prior written  
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this  
document.  
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual  
property rights of third parties by or arising from use of a device described herein or any other liability arising  
from use of such device. No license, either express, implied or otherwise, is granted under any patents,  
copyrights or other intellectual property rights of NEC Corporation or others.  
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,  
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or  
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety  
measures in its design, such as redundancy, fire-containment, and anti-failure features.  
NEC devices are classified into the following three quality grades:  
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on  
a customer designated "quality assurance program" for a specific application. The recommended applications  
of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each  
device before using it in a particular application.  
Standard: Computers, office equipment, communications equipment, test and measurement equipment,  
audio and visual equipment, home electronic appliances, machine tools, personal electronic  
equipment and industrial robots  
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster  
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed  
for life support)  
Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life  
support systems or medical equipment for life support, etc.  
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC’s Data Sheets or Data Books.  
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,  
they should contact an NEC sales representative in advance.  
Anti-radioactive design is not implemented in this product.  
M4 96. 5  

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