UPG131G [NEC]
L-BAND SPDT SWITCH; L波段单刀双掷开关
| 型号： | UPG131G |
| 厂家： | 
NEC |
| 描述： | L-BAND SPDT SWITCH |
| 文件： | 总12页 (文件大小：88K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATA SHEET
GaAs INTEGRATED CIRCUIT
µPG133G
L-BAND SPDT SWITCH
DESCRIPTION
UPG133G is an L-Band SPDT (Single Pole Double Throw) GaAs FET switch which was developed for digital cellular
or cordless telephone application.
The device can operate from 100 MHz to 2.5 GHz, having the low insertion loss.
It housed in an original 8 pin SSOP that is smaller than usual 8 pin SOP and easy to install and contributes to
miniaturizing the system.
It can be used in wide-band switching applications.
FEATURES
•
•
•
•
Maximum transmission power : 0.25 W (typ.)
Low insertion loss
High switching speed
Small package
:
:
:
0.6 dB (typ.) at f = 2 GHz
10 ns
8 pins SSOP
APPLICATION
•
•
Digital cordless telephone
:
PHS, PCS, DECT etc.
Digital hand-held cellular phone, WLAN
ORDERING INFORMATION
PART NUMBER
PACKAGE
8 pin plastic SSOP
PACKING FORM
Carrier tape width 12 mm.
QTY 2kp/Reel.
µPG133G-E1
For evaluation sample order, please contact your local NEC sales office.
ABSOLUTE MAXIMUM RATINGS (TA = 25 ˚C)
Control Voltage
VCONT
Pin
–6 to +0.6
25
V
dBm
W
Input Power
Total Power Dissipation
Operating Case Temperature
Storage Temperature
Ptot
0.2
Topt
Tstg
–65 to +90
–65 to +150
˚C
˚C
CAUTION: The IC must be handled with care to prevent static discharge because its circuit is composed
of GaAs MES FET.
Document No. P10733EJ2V0DS00 (2nd edition)
Date Published April 1996 P
Printed in Japan
1996
©
µPG133G
PIN CONNECTION DIAGRAM (Top View)
1. VCONT2
2. OUT2
3. GND
4. GND
5. IN
1
2
3
4
8
7
6
5
6. GND
7. OUT1
8. VCONT1
SPDT SWITCH IC SERIES PRODUCTS
PART
Pin (1dB)
(dBm)
LINS
(dB)
ISL
VCONT
(V)
PACKAGE
APPLICATIONS
NUMBER
(dB)
µPG130GR
µPG131GR
µPG130G
µPG131G
µPG132G
µPG133G
+34
+30
+34
+30
+30
+25
0.5 @1G
0.6 @2G
0.5 @1G
0.6 @2G
0.6 @2G
0.6 @2G
32 @1G
23 @2G
32 @1G
23 @2G
22 @2G
20 @2G
–5/0
–4/0
–5/0
–4/0
+3/0
–3/0
8 pin SOP
(225 mil)
PDC, IS-136, PHS
PHS, PCS, WLAN
PDC, IS-136, PHS
PHS, PCS, WLAN
PHS, PCS, WLAN
DIVERSITY etc
8 pin SSOP
(175 mil)
Remark: As for detail information of series products, please refer to each data sheet.
EQUIVALENT CIRCUIT
OUT1
GND
VCONT1
IN
VCONT2
GND
OUT2
2
µPG133G
RECOMMENDED OPERATING CONDITIONS
PARAMETER
Control Voltage (ON)
Control Voltage (OFF)
Input Power Level
SYMBOL
VCONT
VCONT
Pin
MIN.
–0.2
–5.0
TYP.
0
MAX.
+0.2
–2.7
24
UNIT
V
–3.0
21
V
dBm
ELECTRICAL CHARACTERISTICS (TA = 25 ˚C)
CHARACTERISTICS
Insertion Loss
SYMBOL
MIN.
TYP.
0.6
MAX.
1.0
UNIT
dB
TEST CONDITION
LINS
Note1
0.8
f = 2.5 GHz
Isolation
ISL
20
dB
Note1
20
f = 2.5 GHz
Input Return Loss
Output Return Loss
RLin
RLout
11
11
21
20
20
25
dB
dB
f = 100 MHz to 2 GHz
VCONT1 = 0 V
VCONT2 = –3 V
Input Power at 1dB
Compression Point
Pin (1dB)Note2
dBm
or
Switching Speed
Control Current
tsw
10
ns
VCONT1 = –3 V
VCONT2 = 0 V
ICONT
50
µA
Notes 1: Characteristic for reference at 2.0 to 2.5 GHz
2: Pin (1dB) is measured the input power level when the insertion loss increase more 1dB than that of linear
range.
All other characteristics are measured in linear range.
NOTE ON CORRECT USE
•
Insertion loss and isolation of the IN-OUT2 is better than that of IN-OUT1, because No. 7 pin (OUT1) is placed
to same side of No. 5 pin (IN).
•
The distance between IC’s GND pins and ground pattern of substrate should be as shorter as possible to avoid
parasitic parameters.
3
µPG133G
TYPICAL CHARACTERISTICS (TA = 25 ˚C)
Note This data is including loss of the test fixture.
IN-OUT1 INSERTION LOSS vs. FREQUENCY
+2.0
IN-OUT1 ISOLATION vs. FREQUENCY
0
VCONT1 = –3 V
CONT2 = 0 V
VCONT1 = 0 V
CONT2 = –3 V
V
P
V
P
in = 0 dBm
in = 0 dBm
+1.0
0
–10
–20
–30
–1.0
–2.0
–3.0
–40
–50
100 M 200 M
500 M 1 G
2 G 3 G
100 M 200 M
500 M 1 G
ISL
2 G 3 G
f - Frequency - Hz
f - Frequency - Hz
LINS
OUT1
OUT2
OUT1
OUT2
IN
IN
50 Ω
50 Ω
IN-OUT1 INPUT RETURN LOSS vs. FREQUENCY
+10
IN-OUT1 OUTPUT RETURN LOSS vs. FREQUENCY
+10
V
CONT1 = –3 V
CONT2 = 0 V
V
CONT1 = –3 V
CONT2 = 0 V
V
V
P
in = 0 dBm
P
in = 0 dBm
0
–10
– 20
0
–10
–20
– 30
– 40
–30
–40
100 M 200 M
500 M 1 G
2 G 3 G
100 M 200 M
500 M 1 G
2 G 3 G
f - Frequency - Hz
f - Frequency - Hz
RLOUT
RLin
OUT1
OUT2
OUT1
OUT2
IN
IN
50 Ω
50 Ω
4
µPG133G
IN-OUT2 ISOLATION vs. FREQUENCY
IN-OUT2 INSERTION LOSS vs. FREQUENCY
+2.0
0
–10
–20
–30
V
V
CONT1 = 0 V
V
V
CONT1 = –3 V
CONT2 = 0 V
CONT2 = –3 V
Pin = 0 dBm
Pin = 0 dBm
+1.0
0
–1.0
–2.0
–3.0
–40
–50
100 M 200 M
500 M 1 G
2 G 3 G
100 M 200 M
500 M 1 G
2 G 3 G
f - Frequency - Hz
f - Frequency - Hz
OUT1
OUT1
50 Ω
50 Ω
IN
IN
ISL
OUT2
OUT2
LINS
IN-OUT2 INPUT RETURN LOSS vs. FREQUENCY
+10
IN-OUT2 OUTPUT RETURN LOSS vs. FREQUENCY
+10
V
V
CONT1 = 0 V
V
V
CONT1 = 0 V
CONT2 = –3 V
CONT2 = –3 V
Pin = 0 dBm
Pin = 0 dBm
0
–10
– 20
0
–10
–20
– 30
– 40
–30
–40
100 M 200 M
500 M 1 G
2 G 3 G
100 M 200 M
500 M 1 G
2 G 3 G
f - Frequency - Hz
f - Frequency - Hz
RLin
OUT1
50 Ω
OUT1
IN
50 Ω
OUT2
IN
RLOUT
OUT2
5
µPG133G
IN-OUT2 Pin vs. Pout
V
V
CONT1 = 0 V
CONT2 = –3 V
30
28
f = 1.9 GHz
26
24
OUT1
50 Ω
IN
22
20
18
OUT2
18 20 22 24 26 28 30
Pin - Input Power - dBm
INSERTION LOSS, 2fo, 3fo vs.
AMBIENT TEMPERATURE
INPUT POWER vs. OUTPUT POWER
VCONT1 = 0 V
VCONT1 = 0 V
VCONT2 = –3 V
f = 2GHz
Non-modulated
signal input (CW)
VCONT2 = –3 V
f = 2 GHz
1.0
0.8
Pin = +20 dBm
Signal input (CW)
LINS
30
25
20
15
–50
–60
–70
0.6
3fo
2fo
TA = –50 ˚C
TA = +25 ˚C
TA = +90 ˚C
–100
–50
0
+50
+100
15
20
25
30
Pin (dBm)
TA (˚C)
6
µPG133G
TEST BOARD
IN
0.9 mm width.
0.4 mm thickness
teflon glass
R = 50 Ω
NEC
G130/131
Using the same board that of
µPG130/131G
R
R
OUT1
VCONT1
V
CONT2
OUT2
TEST CIRCUIT
1 000 pF
50 Ω
50 Ω
V
CONT1 = –3 V/0 V
1
2
3
4
8
7
6
5
V
CONT2 = 0 V/–3 V
1 000 pF
OUT2
OUT1
IN
Z
O
O
= 50 Ω
= 50 Ω
ZO = 50 Ω
Z
7
µPG133G
µPG133G TRUTH TABLE OF SWITCHING BY CONDITION OF CONTROL VOLTAGE
VCONT1
0 V
–3 V
OUT1
OUT2
OUT1
OUT2
IN
IN
0 V
VCONT2
OUT1
OUT2
OUT1
OUT2
–3 V
IN
IN
8-PIN PLASTIC SHRINK SOP (175 mil) (Unit mm)
8
5
Detail of lead end
1
4
4.94 ±0.2
3.2 ±0.1
3.0 MAX.
0.87 ±0.2
0.5 ±0.2
0.65
0.575 MAX.
0.3+–00..0150
0.15
0.10
M
8
µPG133G
Floating the µPG133G
It is possible to use the µPG133G with only a single +3 V supply by employing a technique known as “floating”.
When the IC is floated using a +3 V supply, the voltage levels used to control the switch are elevated above ground
by +3 V.
When the µPG133G is floated it is necessary to use DC blocking (C2, C3, C5) and grounding (C1, C4) capacitors.
This enables the IC to isolated so that +3 V can be applied to RF line. The value for DC blocking capacitors should
be chosen to accommodate the frequency of operation. Grounding capacitors are required to float the IC above
ground. The value for grounding capacitor should be chosen to accommodate the frequency of operation.
It is not recommended to float the µPG133G for wide band application.
(Floating the µPG133G with +3 V/0 V supply at 2 GHz-band, BW ≤ 50 MHz)
GND
C2
C1
4
OUT2
1
VCONT2
PIN CONNECTIONS
1. VCONT2
2. OUT2
3. GND
V
CONT1
8
5
C3
4. GND
IN
5. IN
6. GND
7. OUT1
8. VCONT1
OUT1
C4
C5
GND
C1, C4 = 10 pF below : Grounding capacitor
C2, C3, C5 = 100 pF : DC blocking capacitor
The distance between grounding capacitor and IC’s GND pins, grounding capacitor and ground of the
substrate should be as shorter as possible to avoid the parasitic parameters. IC’s GND pin, No. 3, No. 4 and No.
6 are connected inside of the IC.
9
µPG133G
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered in the following recommended conditions. Other soldering methods and conditions
than the recommended conditions are to be consulted with our sales representatives.
[µPG133G]
Recommended condition
Soldering process
Infrared ray reflow
Soldering conditions
Package peak temperature: 230 ˚C
symbol
IR30-00-2
Hour: within 30 s. (more than 210 ˚C)
Note
Time: 2 time, Limited days: no.
VPS
Package peak temperature: 215 ˚C
Hour: within 40 s. (more than 200 ˚C),
VP15-00-2
WS60-00-1
Note
Time: 2 time, Limited days: no.
Wave Soldering
Pin part heating
Soldering tub temperature: less than 260 ˚C, Hour: within 10 s.
Note
Time: 1 time, Limited days: no.
Pin area temperature: less than 300 ˚C, Hour: within 10 s.
Note
Limited days: no.
Note It is storage days after opening a dry pack, the storage conditions are 25 ˚C, less than 65 %, RH.
Caution The combined use of soldering method is to be avoided (However, except the pin area heating
method).
10
µPG133G
[MEMO]
11
µPG133G
Caution
The Great Care must be taken in dealing with the devices in this guide.
The reason is that the material of the devices is GaAs (Gallium Arsenide), which is
designated as harmful substance according to the Japanese law concerned.
Keep the law concerned and so on, especially in case of removal.
No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this
document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from use of a device described herein or any other liability arising
from use of such device. No license, either express, implied or otherwise, is granted under any patents,
copyrights or other intellectual property rights of NEC Corporation or others.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customer must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades:
“Standard“, “Special“, and “Specific“. The Specific quality grade applies only to devices developed based on
a customer designated “quality assurance program“ for a specific application. The recommended applications
of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each
device before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices in “Standard“ unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact NEC Sales Representative in advance.
Anti-radioactive design is not implemented in this product.
M4 94.11
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