UPG188GR-E1 [NEC]
SP4T, 950MHz Min, 1500MHz Max, 10dB Insertion Loss-Max, PLASTIC, HTSSOP-16;
| 型号： | UPG188GR-E1 |
| 厂家： | 
NEC |
| 描述： | SP4T, 950MHz Min, 1500MHz Max, 10dB Insertion Loss-Max, PLASTIC, HTSSOP-16 |
| 文件： | 总10页 (文件大小：58K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATA SHEET
GaAs INTEGRATED CIRCUIT
µ
PG188GR
GaAs MMIC DBS 4 × 2 IF SWITCH MATRIX
DESCRIPTION
The µPG188GR is intended for use in Direct Broadcast Satellite (DBS) applications within the Low Noise Block
(LNB) down-converter for systems where at least multi LNB are required.
FEATURES
•
•
•
•
High isolation
: ISL = 30 dB TYP. (D/U-ratio)
Control voltage : Vcont = 0 V/+5 V
Insertion loss
: LINS = 8 dB TYP. (ZO = 50 Ω)
16-pin plastic HTSSOP package
ORDERING INFORMATION
Part Number
Package
16-pin plastic HTSSOP
Supplying Form
µPG188GR-E1
• Embossed tape 12 mm wide
• Qty 3 kpcs/reel
Remark To order evaluation samples, contact your nearby sales office.
Part number for sample order: µPG188GR
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
The information in this document is subject to change without notice. Before using this document, please confirm that
this is the latest version.
Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices
representative for availability and additional information.
Document No. PG10192EJ01V0DS (1st edition)
Date Published August 2002 CP(K)
Printed in Japan
NEC Compound Semiconductor Devices 2002
µPG188GR
ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified)
Parameter
Control Voltage 1 to 8
Total Power Dissipation
Input Power
Symbol
Vcont1 to 8
Ptot
Ratings
−1.0 to +6.0
2Note
Unit
V
W
Pin
+10
dBm
°C
Operating Ambient Temperature
Storage Temperature
TA
−40 to +85
−65 to +150
Tstg
°C
Note Mounted on double-sided copper-clad 50 × 50 × 1.6 mm epoxy glass PWB, TA = +85°C
RECOMMENDED OPERATING RENGE (TA = +25°C)
Parameter
Control Voltage (High)
Control Voltage (Low)
Symbol
Vcont(H)
Vcont(L)
MIN.
+4.5
−0.5
TYP.
+5.0
0
MAX.
+5.5
+0.5
Unit
V
V
ELECTRICAL CHARACTERISTICS
(TA = +25°C, Vcont = 0 V/+5 V, Pin = 0 dBm, ZO = 50 Ω, Each Port, unless otherwise specified)
Parameter
Insertion Loss 1
Symbol
LINS1
Test Conditions
f = 0.95 to 1.5 GHz
MIN.
−
TYP.
7.0
8.0
1.5
32
MAX.
9.0
10.0
3.0
−
Unit
dB
dB
dB
dB
dB
dB
mA
Insertion Loss 2
LINS2
f = 1.5 GHz to 2.15 GHz
LINS (0.95 GHz) − LINS (2.15 GHz)
f = 0.95 to 1.5 GHz
−
Insertion Loss Flatness
Isolation D/U-ratio 1Note1
Isolation D/U-ratio 2Note1
Output Return Loss
Control CurrentNote2
∆LINS
ISL1
ISL2
RLOUT
Icont
−
29
27
10
−
f = 1.5 to 2.15 GHz
30
−
f = 0.95 to 2.15 GHz
15
−
Vcont = +5 V/0 V, RF OFF
−
0.5
Notes 1. ‘Isolation D/U-ratio’ = ‘signal leakage (off-state)’ − ‘insertion loss (on-state)’
2. per 1 control pin
2
Data Sheet PG10192EJ01V0DS
µ
PG188GR
PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM
Pin No.
Pin Name
IN-C
Pin No.
9
Pin Name
OUT1
Vcont4
Top View
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
GND
10
IN-D
11
Vcont3
Vcont5
12
Vcont2
Vcont6
13
Vcont1
Vcont7
14
IN-A
Vcont8
15
GND
OUT2
16
IN-B
Remark Backside: GND
TRUTH TABLE
On Channel
Control Pin
OUT1
IN-A
IN-B
IN-C
IN-D
−
OUT2
Vcont1
High
Low
High
Low
−
Vcont2
Low
High
Low
High
−
Vcont3
High
High
Low
Low
−
Vcont4
Low
Low
High
High
−
Vcont5
−
Vcont6
−
Vcont7
Vcont8
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
IN-A
IN-B
IN-C
IN-D
Low
High
Low
High
High
Low
High
Low
Low
Low
High
High
High
High
Low
Low
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
3
Data Sheet PG10192EJ01V0DS
µ
PG188GR
EVALUATION CIRCUIT (Reference Only)
Vcont1 to Vcont8 = 0 V/+5 V, Pin = 0 dBm, ZO = 50 Ω, DC Blocking Capacitor = 56 pF
V
cont1
V
cont2
V
cont3
V
cont4
56 pF
56 pF
IN-A
IN-B
1 000 pF
51 Ω
56 pF
OUT1
16
9
1
8
56 pF
ZO = 50 Ω
ZO = 50 Ω
IN-C
IN-D
OUT2
56 pF
56 pF
51 Ω
1 000 pF
Vcont5
V
cont6
V
cont7
V
cont8
Caution For DC lines, chip capacitors and resistors are used to suppress unintended resonance.
4
Data Sheet PG10192EJ01V0DS
µPG188GR
TYPICAL CHARACTERISTICS
ON ROUTE
A
B
C
D
1
2
AC mode
IN-A to OUT1
INPUT RETURN LOSS vs. FREQUENCY
INSERTION LOSS vs. FREQUENCY
0
0
–10
–5
–20
–10
–30
–40
–15
–20
0
0.5
1.0
1.5
2.0
2.5
3.0
0
0.5
1.0
1.5
2.0
2.5
3.0
Frequency f (GHz)
Frequency f (GHz)
OUTPUT RETURN LOSS vs. FREQUENCY
0
–10
–20
–30
–40
0
0.5
1.0
1.5
2.0
2.5
3.0
Frequency f (GHz)
5
Data Sheet PG10192EJ01V0DS
µPG188GR
OFF ROUTE
A
B
C
D
1
2
DC mode
IN-A to OUT1
INPUT RETURN LOSS vs. FREQUENCY
SIGNAL LEAKAGE vs. FREQUENCY
0
0
–10
–20
–30
–40
–50
–60
–10
–20
–30
–40
0
0.5
1.0
1.5
2.0
2.5
3.0
0
0.5
1.0
1.5
2.0
2.5
3.0
Frequency f (GHz)
Frequency f (GHz)
OUTPUT RETURN LOSS vs. FREQUENCY
0
–10
–20
–30
–40
0
0.5
1.0
1.5
2.0
2.5
3.0
Frequency f (GHz)
Remark The graphs indicate nominal characteristics.
6
Data Sheet PG10192EJ01V0DS
µPG188GR
PACKAGE DIMENSIONS
16-PIN PLASTIC HTSSOP (UNIT: mm)
6.4±0.3
(1.8)
0.20±0.10
9
8
16
1
(0.1)
(2.5)
5.2±0.2
0.9±0.2
(1.5)
Remark ( ): Reference value
7
Data Sheet PG10192EJ01V0DS
µ
PG188GR
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Infrared Reflow
Soldering Conditions
Condition Symbol
IR260
Peak temperature (package surface temperature)
Time at peak temperature
: 260°C or below
: 10 seconds or less
: 60 seconds or less
: 120±30 seconds
: 3 times
Time at temperature of 220°C or higher
Preheating time at 120 to 180°C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
VPS
Peak temperature (package surface temperature)
Time at temperature of 200°C or higher
Preheating time at 120 to 150°C
: 215°C or below
: 25 to 40 seconds
: 30 to 60 seconds
: 3 times
VP215
WS260
HS350
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Wave Soldering
Partial Heating
Peak temperature (molten solder temperature)
Time at peak temperature
: 260°C or below
: 10 seconds or less
Preheating temperature (package surface temperature) : 120°C or below
Maximum number of flow processes
: 1 time
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (pin temperature)
: 350°C or below
Soldering time (per side of device)
: 3 seconds or less
: 0.2%(Wt.) or below
Maximum chlorine content of rosin flux (% mass)
Caution Do not use different soldering methods together (except for partial heating).
8
Data Sheet PG10192EJ01V0DS
µ
PG188GR
•
The information in this document is current as of August 2002. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or
data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all
products and/or types are available in every country. Please check with an NEC sales representative
for availability and additional information.
•
•
No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
•
•
•
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness
to support a given application.
(Note)
(1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd.
and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
M8E 00. 4-0110
9
Data Sheet PG10192EJ01V0DS
µ
PG188GR
SAFETY INFORMATION ON THIS PRODUCT
The product contains gallium arsenide, GaAs.
Caution GaAs Products
GaAs vapor and powder are hazardous to human health if inhaled or ingested.
• Do not destroy or burn the product.
• Do not cut or cleave off any part of the product.
• Do not crush or chemically dissolve the product.
• Do not put the product in the mouth.
Follow related laws and ordinances for disposal. The product should be excluded from general
industrial waste or household garbage.
Business issue
NEC Compound Semiconductor Devices, Ltd.
5th Sales Group, Sales Division TEL: +81-3-3798-6372 FAX: +81-3-3798-6783 E-mail: salesinfo@csd-nec.com
NEC Compound Semiconductor Devices Hong Kong Limited
Hong Kong Head Office
Taipei Branch Office
Korea Branch Office
TEL: +852-3107-7303
FAX: +852-3107-7309
TEL: +886-2-8712-0478 FAX: +886-2-2545-3859
TEL: +82-2-528-0301
FAX: +82-2-528-0302
NEC Electronics (Europe) GmbH
http://www.nec.de/
TEL: +49-211-6503-01 FAX: +49-211-6503-487
California Eastern Laboratories, Inc.
http://www.cel.com/
TEL: +1-408-988-3500 FAX: +1-408-988-0279
Technical issue
NEC Compound Semiconductor Devices, Ltd.
http://www.csd-nec.com/
Sales Engineering Group, Sales Division
E-mail: techinfo@csd-nec.com FAX: +81-44-435-1918
0207
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