MTPT10012 [NELLSEMI]

Three-Phase Bridge Thyristor;
MTPT10012
型号: MTPT10012
厂家: NELL SEMICONDUCTOR CO., LTD    NELL SEMICONDUCTOR CO., LTD
描述:

Three-Phase Bridge Thyristor

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RoHS  
MTPT100 Series  
Nell High Power Products  
Three-Phase Bridge + Thyristor, 100A  
MTPT10008 Thru MTPT10016  
80  
32  
30  
20  
0
1
2
2- 5.5  
5
4
3
4
29  
20  
20  
6-M5 SCREWS  
93.5MAX  
All dimensions in millimeters  
FEATURES  
UL recognition file number E320098  
Three-phase bridge and a thyristor  
-
(2)  
(0)  
(1)  
R2  
+
High surge current capability  
Low thermal resistance  
Compliant to RoHS  
Isolation voltage up to 2500V  
Glass passivated chip junction  
(7)  
(6)  
K
G
(5)  
(4)  
(3)  
Applications  
lnverter for AC or DC motor control  
Current stablilzed power supply  
Switching power supply  
PRIMARY CHARACTERRISTICS  
IF(AV)  
100A  
800V to 1600V  
920A/1200A  
20 µA  
ADVANTAGE  
VRRM  
IFSM/ITSM  
IR  
International standard package  
Epoxy meets UL 94 V-O flammability rating  
Small volume, light weight  
VFM/VTM  
TJ max.  
1.3V/1.6V  
Small thermal resistance  
Weight: 250g (8.8 ozs)  
150ºC  
Page 1 of 5  
www.nellsemi.com  
RoHS  
MTPT100 Series  
Nell High Power Products  
Maximum Ratings for Diodes  
MAJOR RATINGS AND CHARACTERISTICS (T = 25°C unless otherwise noted)  
A
MTPT100  
SYMBOL  
PARAMETER  
UNIT  
08  
12  
16  
VRRM  
Maximum repetitive peak reverse voltage  
Peak reverse non-repetitive voltage  
800  
900  
1200  
1300  
100  
1600  
1700  
V
V
A
VRSM  
IO  
Output DC current three-phase full wave, Tc = 100°C  
Peak forward surge current single sine-wave superimposed on  
rated load  
IFSM  
A
920  
Rating (non-repetitive, for t greater than 1 ms and less than 8.3 ms)  
for fusing  
2
A s  
2
I t  
4230  
-40 to 150  
-40 to 125  
0.20  
Operating junction temperature range  
TJ  
ºC  
Storage temperature range  
TSTG  
RthJC  
RthCS  
ºC  
Thermal Impedance, junction to case  
Thermal Impedance, case to heatsink  
ºC/W  
0.10  
ºC/W  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
A
MTPT100  
TEST  
UNIT  
PARAMETER  
SYMBOL  
CONDITIONS  
IF = 100A  
08  
12  
1.3  
20  
6
16  
VF  
Maximum instantaneous forward drop per diode  
V
Maximum reverse DC current at rated DC blocking  
voltage per diod  
TA = 25°C  
µA  
mA  
IR  
TA = 150°C  
Maximum Ratings for Thyristor  
FORWARD CONDUCTION  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
VALUES  
100  
85  
UNITS  
A
Maximum average on-state current  
180° conduction, half sine wave ,50Hz  
IT(AV)  
at case temperature  
°C  
1200  
1260  
1008  
t = 10 ms  
No voltage  
reapplied  
t = 8.3 ms  
Maximum peak, one-cycle, on-state  
ITSM  
A
non-repetitive surge current  
t = 10 ms  
100%VRRM  
Sine half wave,  
initial TJ =  
reapplied  
t = 8.3 ms  
t = 10 ms  
1058  
7200  
No voltage  
TJ maximum  
t = 8.3 ms reapplied  
6590  
5080  
4645  
2
A s  
2
Maximum I t for fusing  
2
t
I
t = 10 ms  
100%VRRM  
reapplied  
t = 8.3 ms  
2
t
I
2
kA √  
2
Maximum I √  
t = 0.1 ms to 10 ms, no voltage reapplied  
72  
s
t for fusing  
Maximum on-state voltage drop  
VTM  
ITM = 300A, TJ = 25 °C, 180° conduction  
1.6  
150  
400  
V
Anode supply = 6 V, initial I  
= 25 °C  
T= 30 A, T  
Maximum holding current  
IH  
IL  
J
mA  
Anode supply = 6 V  
Maximum latching current  
Gate pulse: 10 V, 100 μs, TJ = 25 °C  
SWITCHING  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
VALUES  
UNITS  
td  
Typical delay time  
1
TJ = 25 °C ,gate current = 1A dlg/dt = 1 A/µs  
Vd = 0.67 VDRM  
Typical rise time  
tr  
2
μs  
ITM = 300A ; dl/dt = 15 A/µs ; TJ = TJ maximum,  
VR = 50V ; dV/dt = 20V/µs ; gate 0V ,100Ω  
Typical tum-off time  
tq  
50 to 150  
Page 2 of 5  
www.nellsemi.com  
RoHS  
MTPT100 Series  
Nell High Power Products  
BLOCKING  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
VALUES  
UNITS  
Maximum peak reverse and  
off-state leakage current  
IRRM  
IDRM  
mA  
TJ = 125 °C  
20  
50 Hz, circuit to base,  
VISO  
V
RMS isolation Voltage  
2500  
all terminals shorted, 25 ºC ,60s  
Critical rate of rise of  
off-state voltage  
TJ = TJ maximum,  
dV/dt  
Vs  
500  
exponential to 67 % rated VDRM  
TRIGGERING  
PARAMETER  
SYMBOL  
PGM  
PG(AV)  
IGM  
TEST CONDITIONS  
VALUES  
UNITS  
tp 5 ms, TJ = TJ maximum  
Maximum peak gate power  
Maximum average gate power  
Maximum peak gate current  
15  
5
W
f = 50 Hz, TJ = TJ maximum  
3
A
tp 5 ms, TJ = TJ maximum  
Maximum peak negative  
gate voltage  
- VGT  
10  
V
Maximum required DC  
gate voltage to trigger  
VGT  
3
Anode supply = 6V,  
TJ = 25 °C  
Ω
resistive load; Ra = 1  
Maximum required DC  
gate current to trigger  
IGT  
mA  
150  
Maximum gate voltage  
that will not trigger  
VGD  
V
0.25  
applied  
TJ = TJ maximum, 67% V  
DRM  
Maximum gate current  
that will not trigger  
IGD  
10  
mA  
TJ = 125ºC, VD = 0.5VDRM, IG = 100 mA,  
dIG/dt = 0.1 A/µs  
Maximum rate of rise of  
turned-on current  
As  
dI/dt  
150  
THERMAL AND MECHANICAL SPECIFICATIONS  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
VALUES  
UNITS  
junction operating and storage  
temperature range  
TJ Tstg  
,
- 40 to 125  
°C  
Maximum thermal resistance,  
0.36  
RthJC  
DC operation  
case per junction  
junction to  
Typical thermal resistance,  
case to heatsink per module  
°C/W  
RthCS  
Mounting surface, smooth , flat and greased  
0.10  
A mounting compound is recommended and the  
torque should be rechecked after a period of  
about 3 hours to allow for the  
3
to heatsink, M5  
to terminal, M5  
Mounting  
N.m  
torque ± 10 %  
3
spread of the compound.  
g
250  
8.8  
Approximate weight  
oz.  
Device code  
MTPT  
100 16  
3
1
2
-
-
1
2
3
Module type : “MTPT” for 3Ø Bridge + Thyristor  
IF(AV) rating : "100" for 100 A  
-
Voltage code : code x 100 = V  
RRM  
Page 3 of 5  
www.nellsemi.com  
RoHS  
MTPT100 Series  
Nell High Power Products  
Fig.1 Power dissipation  
(For Diodes)  
Fig.2 Forward current derating curve  
(For Diodes)  
300  
240  
180  
120  
60  
120  
100  
80  
60  
40  
20  
0
Three phase  
Three phase  
0
0
20  
40  
60  
80  
100  
0
50  
100  
150  
T (°C)  
c
Io(A)  
Fig.3 Transient thermal impedance  
(For Diodes)  
Fig.4 Max non-repetitive forward surge current  
(For Diodes)  
1000  
0.20  
50HZ  
Zth(j-C)  
Per one element  
500  
0.10  
Single phase half wave  
Tj=25°C start  
0
0
0.001  
10  
100  
0.01  
0.1  
1.0  
t (S)  
10  
100  
1
Cycles  
Fig.5 Forward characteristics  
(For Diodes)  
Fig.6 SCR power dissipation  
150  
120  
90  
1000  
max.  
100  
60  
30  
TJ=25°C  
10  
0
0
0.5  
1.0  
1.5  
2.0  
2.5  
20  
40  
60  
80  
100  
V (V)  
F
I (A)  
T
Page 4 of 5  
www.nellsemi.com  
RoHS  
MTPT100 Series  
Nell High Power Products  
Fig.7 SCR forward current derating curve  
Fig.8 SCR transient thermal impedance  
120  
0.50  
Zth(j-C)  
80  
40  
0
0.25  
0
0
50  
100  
150  
0.001  
0.01  
0.1  
1.0  
Time (S)  
10  
100  
T (°C)  
c
Fig.9 SCR forward characteristics  
Fig.10 Gate trigger characteristics  
1000  
100  
10  
20  
max.  
Peak Forward Gate Voltage (10V)  
10  
-40ºC  
1
25ºC  
125ºC  
Maximum Gate Non-Trigger Voltage  
T =25°C  
j
0.1  
10  
100  
1000  
10000  
0.5  
1.0  
1.5  
2.0  
2.5  
VTM(V)  
IG(mA)  
Page 5 of 5  
www.nellsemi.com  

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