1PS74SB23 [NEXPERIA]
Schottky barrier diodeProduction;
| 型号： | 1PS74SB23 |
| 厂家： | 
Nexperia |
| 描述： | Schottky barrier diodeProduction 光电二极管 |
| 文件： | 总8页 (文件大小：169K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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Dear Customer,
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DISCRETE SEMICONDUCTORS
DATA SHEET
ok, halfpage
1PS74SB23
Schottky barrier diode
Product specification
2003 Aug 04
Supersedes data of 2001 Aug 27
Philips Semiconductors
Product specification
Schottky barrier diode
1PS74SB23
FEATURES
PINNING
• Ultra fast switching speed
• Low forward voltage
PIN
DESCRIPTION
1
2
3
4
5
6
anode
• Fast recovery time
cathode
anode
• Guard ring protected
• Small plastic SMD package
• Capability of absorbing very high surge current.
anode
cathode
anode
APPLICATIONS
• Rectification
• Circuit protection
handbook, halfpage
6
5
2
4
3
• Polarity protection
• Switched-mode power supplies.
1, 3,
4, 6
2, 5
DESCRIPTION
1
Planar Schottky barrier diode encapsulated in an SC-74
(SOT457) small plastic SMD package.
MAM421
Top view
Marking code: P1.
Fig.1 Simplified outline SC-74 (SOT457) and
symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
PARAMETER
continuous reverse voltage
continuous forward current
CONDITIONS
MIN.
MAX.
25
UNIT
VR
IF
−
−
−
V
1
A
A
IFSM
non-repetitive peak forward current
tp = 8.3 ms; half sinewave;
25
JEDEC method; note 1
IRSM
Tstg
Tj
non-repetitive peak reverse current
storage temperature
tp = 100 µs
−
0.5
A
−65
+150
125
°C
°C
junction temperature
−
Note
1. Pins 1, 3, 4 and 6 are connected in parallel; pins 2 and 5 are connected in parallel.
2003 Aug 04
2
Philips Semiconductors
Product specification
Schottky barrier diode
1PS74SB23
ELECTRICAL CHARACTERISTICS
Tamb = 25 °C unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
IF = 100 mA
TYP.
260
MAX.
UNIT
mV
VF
forward voltage
300
450
500
1
IF = 1 A
400
80
mV
µA
mA
pF
IR
reverse current
VR = 20 V; note 1; see Fig.3
VR = 25 V; note 1; see Fig.3
f = 1 MHz; VR = 4 V; see Fig.4
−
Cd
diode capacitance
100
−
Note
1. Pulse test: tp = 300 µs; δ = 0.02.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
thermal resistance from junction to ambient note 1
CONDITIONS
VALUE
250
UNIT
Rth j-a
K/W
Note
1. Refer to SC-74 (SOT457) standard mounting conditions.
2003 Aug 04
3
Philips Semiconductors
Product specification
Schottky barrier diode
1PS74SB23
GRAPHICAL DATA
MHB970
MBL886
5
handbook, halfpage
4
10
10
handbook, halfpage
I
(1)
R
(µA)
I
F
(mA)
(2)
(3)
4
10
3
10
3
10
(1)
(2)
2
10
(3)
(4)
(4)
2
10
10
10
1
0
1
0
10
20
30
V
(V)
200
400
600
800
R
V
(mV)
F
(1) Tamb = 125 °C.
(2) Tamb = 100 °C.
(3) Tamb = 75 °C.
(4) Tamb = 25 °C.
(1) Tamb = 125 °C.
(2) Tamb = 100 °C.
(3)
Tamb = 75 °C.
(4) Tamb = 25 °C.
Fig.2 Forward current as a function of forward
voltage; typical values.
Fig.3 Reverse current as a function of reverse
voltage; typical values.
MBK571
3
10
handbook, halfpage
C
d
(pF)
2
10
10
0
10
20
30
V
(V)
R
f = 1 MHz; Tamb = 25 °C.
Fig.4 Diode capacitance as a function of reverse
voltage; typical values.
2003 Aug 04
4
Philips Semiconductors
Product specification
Schottky barrier diode
1PS74SB23
PACKAGE OUTLINE
Plastic surface mounted package; 6 leads
SOT457
D
B
E
A
X
y
H
v
M
A
E
6
5
4
Q
pin 1
index
A
A
1
c
1
2
3
L
p
e
b
p
w
M B
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A
b
c
D
E
e
H
L
Q
v
w
y
p
1
p
E
0.1
0.013
0.40
0.25
1.1
0.9
0.26
0.10
3.1
2.7
1.7
1.3
3.0
2.5
0.6
0.2
0.33
0.23
mm
0.95
0.2
0.2
0.1
REFERENCES
JEDEC
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
EIAJ
97-02-28
01-05-04
SOT457
SC-74
2003 Aug 04
5
Philips Semiconductors
Product specification
Schottky barrier diode
1PS74SB23
DATA SHEET STATUS
DATA SHEET
STATUS(1)
PRODUCT
STATUS(2)(3)
LEVEL
DEFINITION
I
Objective data
Development This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
II
Preliminary data Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III
Product data
Production
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
DEFINITIONS
DISCLAIMERS
Short-form specification
The data in a short-form
Life support applications
These products are not
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes
Philips Semiconductors
reserves the right to make changes in the products -
including circuits, standard cells, and/or software -
described or contained herein in order to improve design
and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
Application information
Applications that are
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2003 Aug 04
6
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
© Koninklijke Philips Electronics N.V. 2003
SCA75
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
613514/03/pp7
Date of release: 2003 Aug 04
Document order number: 9397 750 11055
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