BAT54CM [NEXPERIA]
Schottky barrier double diodeProduction;
| 型号： | BAT54CM |
| 厂家： | 
Nexperia |
| 描述： | Schottky barrier double diodeProduction |
| 文件： | 总8页 (文件大小：351K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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Dear Customer,
On 7 February 2017 the former NXP Standard Product business became a new company with the
tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS
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DISCRETE SEMICONDUCTORS
DATA SHEET
BAT54CM
Schottky barrier double diode
Product data sheet
2003 Nov 11
NXP Semiconductors
Product data sheet
Schottky barrier double diode
BAT54CM
FEATURES
PINNING
• Low forward voltage
PIN
1
DESCRIPTION
• Leadless ultra small plastic package
(1.0 × 0.6 × 0.5 mm)
• Boardspace 1.17 mm2 (approx. 10% of SOT23)
anode (a1)
anode (a2)
2
3
common cathode
• Power dissipation comparable to SOT23.
APPLICATIONS
• Ultra high-speed switching
• Voltage clamping
handbook, halfpage
1
2
• Protection circuits
3
• Mobile communications, digital (still) cameras, PDAs
and PCMCIA cards.
cathode mark
DESCRIPTION
Planar Schottky barrier double diode encapsulated in a
SOT883 leadless ultra small plastic package.
Top view
MARKING
1
2
TYPE NUMBER
BAT54CM
MARKING CODE
3
S3
Bottom view
MLE232
Fig.1 Simplified outline (SOT883) and symbol.
ORDERING INFORMATION
TYPE NUMBER
PACKAGE
NAME
DESCRIPTION
VERSION
SOT883
BAT54CM
−
leadless ultra small plastic package; 3 solder lands;
body 1.0 × 0.6 × 0.5 mm
2003 Nov 11
2
NXP Semiconductors
Product data sheet
Schottky barrier double diode
BAT54CM
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
30
UNIT
VR
continuous reverse voltage
continuous forward current
repetitive peak forward current
non-repetitive peak forward current
storage temperature
−
−
−
−
V
IF
200
300
600
+150
150
250
mA
mA
mA
°C
IFRM
IFSM
Tstg
Tj
tp ≤ 1 s; δ ≤ 0.5
tp < 10 ms
−65
−
junction temperature
°C
Ptot
total power dissipation (per package) Tamb ≤ 25 °C; note 1
−
mW
Note
1. Refer to SOT883 standard mounting conditions (footprint); FR4 with 60 μm copper strip line.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Rth j-a
thermal resistance from junction to
ambient
note 1
500
K/W
Note
1. Refer to SOT883 standard mounting conditions (footprint), FR4 with 60 μm copper strip line.
Soldering
Reflow soldering is the only recommended soldering method.
ELECTRICAL CHARACTERISTICS
Tamb = 25 °C unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MAX.
UNIT
Per diode
VF
forward voltage
see Fig.2;
IF = 0.1 mA
240
320
400
500
800
2
mV
mV
mV
mV
mV
μA
IF = 1 mA
IF = 10 mA
IF = 30 mA
IF = 100 mA
IR
continuous reverse current
diode capacitance
VR = 25 V; note 1; see Fig.3
f = 1 MHz; VR = 1 V; see Fig.4
Cd
10
pF
Note
1. Pulsed test: tp ≤ 300 μs; δ ≤ 0.02.
2003 Nov 11
3
NXP Semiconductors
Product data sheet
Schottky barrier double diode
BAT54CM
MSA892
MSA893
3
2
3
10
10
handbook, halfpage
I
(1)
I
(1) (2) (3)
R
(μA)
F
(mA)
2
10
10
(2)
10
10
(1)
1
(2) (3)
1
1
(3)
1
10
10
0
10
20
30
0
0.4
0.8
1.2
V
(V)
V
(V)
R
F
(1) Tamb = 125 °C.
(2) Tamb = 85 °C.
(3) Tamb = 25 °C.
(1) Tamb = 125 °C.
(2) Tamb = 85 °C.
(3) Tamb = 25 °C.
Fig.2 Forward current as a function of forward
voltage; typical values.
Fig.3 Reverse current as a function of reverse
voltage; typical values.
MSA891
15
handbook, halfpage
C
d
(pF)
10
5
0
0
10
20
30
V
(V)
R
f = 1 MHz; Tamb = 25 °C.
Fig.4 Diode capacitance as a function of reverse
voltage; typical values.
2003 Nov 11
4
NXP Semiconductors
Product data sheet
Schottky barrier double diode
BAT54CM
PACKAGE OUTLINE
Leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.5 mm
SOT883
L
L
1
2
b
3
b
e
1
1
e
1
A
A
1
E
D
0
0.5
1 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
1
UNIT
A
b
b
D
E
e
e
L
L
1
1
1
max.
0.50
0.46
0.20 0.55 0.62 1.02
0.12 0.47 0.55 0.95
0.30 0.30
0.22 0.22
mm
0.03
0.35 0.65
Note
1. Including plating thickness
REFERENCES
JEDEC
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEITA
03-02-05
03-04-03
SOT883
SC-101
2003 Nov 11
5
NXP Semiconductors
Product data sheet
Schottky barrier double diode
BAT54CM
DATA SHEET STATUS
DOCUMENT
STATUS(1)
PRODUCT
STATUS(2)
DEFINITION
Objective data sheet
Development
This document contains data from the objective specification for product
development.
Preliminary data sheet
Product data sheet
Qualification
Production
This document contains data from the preliminary specification.
This document contains the product specification.
Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
DISCLAIMERS
above those given in the Characteristics sections of this
document is not implied. Exposure to limiting values for
extended periods may affect device reliability.
General ⎯ Information in this document is believed to be
accurate and reliable. However, NXP Semiconductors
does not give any representations or warranties,
expressed or implied, as to the accuracy or completeness
of such information and shall have no liability for the
consequences of use of such information.
Terms and conditions of sale ⎯ NXP Semiconductors
products are sold subject to the general terms and
conditions of commercial sale, as published at
http://www.nxp.com/profile/terms, including those
pertaining to warranty, intellectual property rights
infringement and limitation of liability, unless explicitly
otherwise agreed to in writing by NXP Semiconductors. In
case of any inconsistency or conflict between information
in this document and such terms and conditions, the latter
will prevail.
Right to make changes ⎯ NXP Semiconductors
reserves the right to make changes to information
published in this document, including without limitation
specifications and product descriptions, at any time and
without notice. This document supersedes and replaces all
information supplied prior to the publication hereof.
No offer to sell or license ⎯ Nothing in this document
may be interpreted or construed as an offer to sell products
that is open for acceptance or the grant, conveyance or
implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use ⎯ NXP Semiconductors products are
not designed, authorized or warranted to be suitable for
use in medical, military, aircraft, space or life support
equipment, nor in applications where failure or malfunction
of an NXP Semiconductors product can reasonably be
expected to result in personal injury, death or severe
property or environmental damage. NXP Semiconductors
accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at
the customer’s own risk.
Export control ⎯ This document as well as the item(s)
described herein may be subject to export control
regulations. Export might require a prior authorization from
national authorities.
Quick reference data ⎯ The Quick reference data is an
extract of the product data given in the Limiting values and
Characteristics sections of this document, and as such is
not complete, exhaustive or legally binding.
Applications ⎯ Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values ⎯ Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC 60134) may cause permanent damage to
the device. Limiting values are stress ratings only and
operation of the device at these or any other conditions
2003 Nov 11
6
NXP Semiconductors
Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors. No changes were
made to the content, except for the legal definitions and disclaimers.
Contact information
For additional information please visit: http://www.nxp.com
For sales offices addresses send e-mail to: salesaddresses@nxp.com
© NXP B.V. 2009
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R76/01/pp7
Date of release: 2003 Nov 11
Document order number: 9397 750 11909
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