IP4234CZ6 [NEXPERIA]

Single USB 2.0 ESD protection to IEC 61000-4-2 level 4Production;
IP4234CZ6
型号: IP4234CZ6
厂家: Nexperia    Nexperia
描述:

Single USB 2.0 ESD protection to IEC 61000-4-2 level 4Production

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IP4234CZ6  
Single USB 2.0 ESD protection to IEC 61000-4-2 level 4  
Rev. 3.0 — 31 January 2018  
Product data sheet  
1 Product profile  
1.1 General description  
The IP4234CZ6 is designed to protect Input/Output (I/O) USB 2.0 ports, that are sensitive  
to capacitive loads, from being damaged by ElectroStatic Discharge (ESD). The π-  
filter structure is implemented with a small series resistor to provide the necessary  
protection to signal and supply components from ESD voltages greater than ±8 kV  
contact discharge according IEC 61000-4-2, level 4.  
The ESD protection is independent of the supply voltage due to the rail-to-rail diode  
architecture being connected to a Zener diode.  
The IP4234CZ6 is fabricated using monolithic silicon technology and integrates two ultra-  
low capacitance π-filter ESD protection diodes plus a Zener diode in a miniature 6-lead  
SOT457 package.  
1.2 Features  
Pb-free and RoHS compliant  
Simple, direct signal routing provides for high speed signal integrity  
ESD protection compliant to IEC 61000-4-2 level 4, ±8 kV contact discharge  
Four low input capacitance (3.1 pF typical) rail-to-rail ESD protection diodest  
Low voltage clamping due to an integrated Zener diode  
Small 6-lead SO6 (SOT457) package  
IEC 61000-4-5 15 A Lightning (8/20 μs) compliant  
1.3 Applications  
General-purpose downstream ESD protection high frequency analog signals and high-  
speed serial data transmission for ports inside:  
Cellular and PCS mobile handsets  
PC/Notebook USB2.0/IEEE1394 ports  
DVI interfaces  
HDMI interfaces  
Cordless telephones  
Wireless data (WAN/LAN) systems  
PDAs  
 
 
 
 
Nexperia  
IP4234CZ6  
Single USB 2.0 ESD protection to IEC 61000-4-2 level 4  
2 Pinning information  
Table 1. Pinning  
Pin Description  
Simplified outline  
Graphic symbol  
1
2
3
4
5
6
ESD protection I/O channel 1  
6
5
4
1
3
5
6
4
ground  
ESD protection I/O channel 1  
ESD protection I/O channel 2  
supply voltage  
R
R
1
2
3
ESD protection I/O channel 2  
2
001aaj950  
3 Ordering information  
Table 2. Ordering options  
Type number  
Package  
Name  
Description  
Version  
IP4234CZ6  
TSOP6  
plastic surface-mounted  
SOT457  
package (TSOP6); 6 leads  
4 Limiting values  
Table 3. Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol  
VI  
Parameter  
Conditions  
Min  
Max  
Unit  
V
input voltage  
GND - 0.5 +5.5  
Vesd  
electrostatic  
discharge voltage  
all pins; IEC 61000-4-2 level 4;  
contact discharge  
-15  
+15  
kV  
PPP  
Tstg  
peak pulse power  
tp = 8/20 μs; IEC 61000-4-5 15 A  
lightning  
-
100  
W
storage  
-55  
+125  
°C  
temperature  
5 Recommended operating conditions  
Table 4. Operating conditions  
Symbol  
Parameter  
Conditions  
Min  
Max  
Unit  
Tamb  
ambient temperature  
-40  
+85  
°C  
IP4234CZ6  
All information provided in this document is subject to legal disclaimers.  
© Nexperia B.V. 2018. All rights reserved.  
Product data sheet  
Rev. 3.0 — 31 January 2018  
2 / 11  
 
 
 
 
 
 
 
 
Nexperia  
IP4234CZ6  
Single USB 2.0 ESD protection to IEC 61000-4-2 level 4  
6 Characteristics  
Table 5. Characteristics  
Tamb = 25 °C unless otherwise specified.  
Symbol Parameter  
Conditions  
Min Typ Max Unit  
[1]  
[1]  
C(I/O-GND) input/output to ground pins 1, 3, 4, 6; VI = 0 V;  
-
3.1  
40  
-
3.8  
pF  
pF  
nA  
V
capacitance  
f = 1 MHz; VCC = 3.0 V  
C(zd-GND) Zener diode to ground pin 5 to pin 2; VI = 0 V;  
-
-
capacitance  
f = 1 MHz; VCC = 3.0 V  
ILR  
reverse leakage  
current  
pins 1, 3, 4, 6 to ground;  
VI = 3.0 V  
-
100  
9
VBRzd  
Zener diode  
breakdown voltage  
pin 5 to pin 2; I = 1 mA  
Tcase = 25 °C  
6
-
[1]  
[1]  
VF  
Rs  
forward voltage  
series resistance  
-
-
0.7  
0.5  
-
-
V
[1] Guaranteed by design.  
7 Application information  
7.1 Universal serial bus 2.0 protection  
The IP4234CZ6 is optimized to protect a USB 2.0 port from ESD. The device is capable  
of protecting both USB data lines and the VBUS supply. A typical application is shown  
below.  
V
BUS  
6
5
4
D-  
USB 2.0/  
IEEE1394  
R
R
TRANSCEIVER  
D+  
1
2
3
GND  
001aaj951  
Figure 1. Typical application of IP4234CZ6  
To avoid a short circuit on the data lines when VBUS is shut down, a back drive protection  
diode can be attached to the IP4234CZ6.  
IP4234CZ6  
All information provided in this document is subject to legal disclaimers.  
© Nexperia B.V. 2018. All rights reserved.  
Product data sheet  
Rev. 3.0 — 31 January 2018  
3 / 11  
 
 
 
 
 
 
Nexperia  
IP4234CZ6  
Single USB 2.0 ESD protection to IEC 61000-4-2 level 4  
8 Package outline  
Plastic surface-mounted package (TSOP6); 6 leads  
SOT457  
D
B
E
A
X
y
H
v
M
A
E
6
5
4
Q
pin 1  
index  
A
A
1
c
1
2
3
L
p
e
b
p
w
M B  
detail X  
0
1
2 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
UNIT  
A
A
1
b
c
D
e
H
L
Q
v
w
y
E
p
p
E
0.1  
0.013  
0.40  
0.25  
1.1  
0.9  
0.26  
0.10  
3.1  
2.7  
1.7  
1.3  
3.0  
2.5  
0.6  
0.2  
0.33  
0.23  
mm  
0.95  
0.2  
0.2  
0.1  
REFERENCES  
JEDEC JEITA  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
05-11-07  
06-03-16  
SOT457  
SC-74  
Figure 2. Package outline SOT457 (TSOP6)  
IP4234CZ6  
All information provided in this document is subject to legal disclaimers.  
© Nexperia B.V. 2018. All rights reserved.  
Product data sheet  
Rev. 3.0 — 31 January 2018  
4 / 11  
 
 
Nexperia  
IP4234CZ6  
Single USB 2.0 ESD protection to IEC 61000-4-2 level 4  
9 Soldering of SMD packages  
This text provides a very brief insight into a complex technology. A more in-depth account  
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow  
soldering description”.  
9.1 Introduction to soldering  
Soldering is one of the most common methods through which packages are attached  
to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides  
both the mechanical and the electrical connection. There is no single soldering method  
that is ideal for all IC packages. Wave soldering is often preferred when through-hole  
and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is  
not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high  
densities that come with increased miniaturization.  
9.2 Wave and reflow soldering  
Wave soldering is a joining technology in which the joints are made by solder coming  
from a standing wave of liquid solder. The wave soldering process is suitable for the  
following:  
Through-hole components  
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board  
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless  
packages which have solder lands underneath the body, cannot be wave soldered. Also,  
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,  
due to an increased probability of bridging.  
The reflow soldering process involves applying solder paste to a board, followed by  
component placement and exposure to a temperature profile. Leaded packages,  
packages with solder balls, and leadless packages are all reflow solderable.  
Key characteristics in both wave and reflow soldering are:  
Board specifications, including the board finish, solder masks and vias  
Package footprints, including solder thieves and orientation  
The moisture sensitivity level of the packages  
Package placement  
Inspection and repair  
Lead-free soldering versus SnPb soldering  
9.3 Wave soldering  
Key characteristics in wave soldering are:  
Process issues, such as application of adhesive and flux, clinching of leads, board  
transport, the solder wave parameters, and the time during which components are  
exposed to the wave  
Solder bath specifications, including temperature and impurities  
IP4234CZ6  
All information provided in this document is subject to legal disclaimers.  
© Nexperia B.V. 2018. All rights reserved.  
Product data sheet  
Rev. 3.0 — 31 January 2018  
5 / 11  
 
 
 
 
Nexperia  
IP4234CZ6  
Single USB 2.0 ESD protection to IEC 61000-4-2 level 4  
9.4 Reflow soldering  
Key characteristics in reflow soldering are:  
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to  
higher minimum peak temperatures (see Figure 3) than a SnPb process, thus reducing  
the process window  
Solder paste printing issues including smearing, release, and adjusting the process  
window for a mix of large and small components on one board  
Reflow temperature profile; this profile includes preheat, reflow (in which the board  
is heated to the peak temperature) and cooling down. It is imperative that the peak  
temperature is high enough for the solder to make reliable solder joints (a solder  
paste characteristic). In addition, the peak temperature must be low enough that the  
packages and/or boards are not damaged. The peak temperature of the package  
depends on package thickness and volume and is classified in accordance with Table 6  
and 7  
Table 6. SnPb eutectic process (from J-STD-020C)  
Package thickness (mm)  
Package reflow temperature (°C)  
Volume (mm3)  
< 350  
235  
≥350  
220  
< 2.5  
≥ 2.5  
220  
220  
Table 7. Lead-free process (from J-STD-020C)  
Package thickness (mm) Package reflow temperature (°C)  
Volume (mm3)  
< 350  
260  
350 to 2000  
> 2000  
260  
< 1.6  
260  
250  
245  
1.6 to 2.5  
> 2.5  
260  
245  
250  
245  
Moisture sensitivity precautions, as indicated on the packing, must be respected at all  
times.  
Studies have shown that small packages reach higher temperatures during reflow  
soldering, see Figure 3.  
IP4234CZ6  
All information provided in this document is subject to legal disclaimers.  
© Nexperia B.V. 2018. All rights reserved.  
Product data sheet  
Rev. 3.0 — 31 January 2018  
6 / 11  
 
 
 
Nexperia  
IP4234CZ6  
Single USB 2.0 ESD protection to IEC 61000-4-2 level 4  
maximum peak temperature  
= MSL limit, damage level  
temperature  
minimum peak temperature  
= minimum soldering temperature  
peak  
temperature  
time  
001aac844  
MSL: Moisture Sensitivity Level  
Figure 3. Temperature profiles for large and small components  
For further information on temperature profiles, refer to Application Note AN10365  
“Surface mount reflow soldering description”.  
10 Abbreviations  
Table 8. Abbreviations  
Acronym  
DVI  
Description  
Digital Video Interface  
ESD  
ElectroStatic Discharge  
High Definition Multimedia interface  
Local Area Network  
HDMI  
LAN  
PCS  
Personal Computing System  
Personal Digital Assistant  
Restriction of Hazardous Substances  
Universal Serial Bus  
PDA  
RoHS  
USB  
WAN  
Wide Area Network  
11 Revision history  
Table 9. Revision history  
Document ID  
Release date  
Data sheet status  
Change notice  
Supersedes  
IP4234CZ6 v.3  
20180131  
Product data sheet  
-
IP4234CZ6 v.2  
Data sheet changed to Product status  
IP4234CZ6 v.2  
IP4234CZ6_1  
20180109  
20090416  
Preliminary data sheet  
Product data sheet  
-
-
IP4234CZ6_1  
-
IP4234CZ6  
All information provided in this document is subject to legal disclaimers.  
© Nexperia B.V. 2018. All rights reserved.  
Product data sheet  
Rev. 3.0 — 31 January 2018  
7 / 11  
 
 
 
 
 
Nexperia  
IP4234CZ6  
Single USB 2.0 ESD protection to IEC 61000-4-2 level 4  
12 Legal information  
12.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Definition  
Objective [short] data sheet  
Development  
This document contains data from the objective specification for product  
development.  
Preliminary [short] data sheet  
Product [short] data sheet  
Qualification  
Production  
This document contains data from the preliminary specification.  
This document contains the product specification.  
[1] Please consult the most recently issued document before initiating or completing a design.  
[2] The term 'short data sheet' is explained in section "Definitions".  
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple  
devices. The latest product status information is available on the Internet at URL http://www.nexperia.com.  
systems or equipment, nor in applications where failure or malfunction  
of an Nexperia product can reasonably be expected to result in personal  
12.2 Definitions  
injury, death or severe property or environmental damage. Nexperia and its  
suppliers accept no liability for inclusion and/or use of Nexperia products in  
Draft — The document is a draft version only. The content is still under  
such equipment or applications and therefore such inclusion and/or use is at  
internal review and subject to formal approval, which may result in  
the customer’s own risk.  
modifications or additions. Nexperia does not give any representations or  
warranties as to the accuracy or completeness of information included herein  
and shall have no liability for the consequences of use of such information.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. Nexperia makes no representation  
or warranty that such applications will be suitable for the specified use  
Short data sheet — A short data sheet is an extract from a full data sheet  
without further testing or modification. Customers are responsible for the  
with the same product type number(s) and title. A short data sheet is  
design and operation of their applications and products using Nexperia  
intended for quick reference only and should not be relied upon to contain  
products, and Nexperia accepts no liability for any assistance with  
detailed and full information. For detailed and full information see the  
applications or customer product design. It is customer’s sole responsibility  
relevant full data sheet, which is available on request via the local Nexperia  
to determine whether the Nexperia product is suitable and fit for the  
sales office. In case of any inconsistency or conflict with the short data sheet,  
customer’s applications and products planned, as well as for the planned  
the full data sheet shall prevail.  
application and use of customer’s third party customer(s). Customers should  
provide appropriate design and operating safeguards to minimize the risks  
associated with their applications and products. Nexperia does not accept  
Product specification — The information and data provided in a Product  
data sheet shall define the specification of the product as agreed between  
any liability related to any default, damage, costs or problem which is based  
Nexperia and its customer, unless Nexperia and customer have explicitly  
on any weakness or default in the customer’s applications or products, or  
agreed otherwise in writing. In no event however, shall an agreement be  
the application or use by customer’s third party customer(s). Customer is  
valid in which the Nexperia product is deemed to offer functions and qualities  
beyond those described in the Product data sheet.  
responsible for doing all necessary testing for the customer’s applications  
and products using Nexperia products in order to avoid a default of the  
applications and the products or of the application or use by customer’s third  
party customer(s). Nexperia does not accept any liability in this respect.  
12.3 Disclaimers  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) will cause permanent  
Limited warranty and liability — Information in this document is believed  
damage to the device. Limiting values are stress ratings only and (proper)  
to be accurate and reliable. However, Nexperia does not give any  
operation of the device at these or any other conditions above those  
representations or warranties, expressed or implied, as to the accuracy  
given in the Recommended operating conditions section (if present) or the  
or completeness of such information and shall have no liability for the  
Characteristics sections of this document is not warranted. Constant or  
consequences of use of such information. Nexperia takes no responsibility  
repeated exposure to limiting values will permanently and irreversibly affect  
for the content in this document if provided by an information source outside  
the quality and reliability of the device.  
of Nexperia. In no event shall Nexperia be liable for any indirect, incidental,  
punitive, special or consequential damages (including - without limitation -  
lost profits, lost savings, business interruption, costs related to the removal  
Terms and conditions of commercial sale — Nexperia products are  
sold subject to the general terms and conditions of commercial sale, as  
or replacement of any products or rework charges) whether or not such  
published at http://www.nexperia.com/profile/terms, unless otherwise agreed  
damages are based on tort (including negligence), warranty, breach of  
in a valid written individual agreement. In case an individual agreement is  
contract or any other legal theory. Notwithstanding any damages that  
concluded only the terms and conditions of the respective agreement shall  
customer might incur for any reason whatsoever, Nexperia's aggregate and  
apply. Nexperia hereby expressly objects to applying the customer’s general  
cumulative liability towards customer for the products described herein shall  
terms and conditions with regard to the purchase of Nexperia products by  
customer.  
be limited in accordance with the Terms and conditions of commercial sale of  
Nexperia.  
No offer to sell or license — Nothing in this document may be interpreted  
Right to make changes — Nexperia reserves the right to make changes  
or construed as an offer to sell products that is open for acceptance or  
to information published in this document, including without limitation  
the grant, conveyance or implication of any license under any copyrights,  
patents or other industrial or intellectual property rights.  
specifications and product descriptions, at any time and without notice. This  
document supersedes and replaces all information supplied prior to the  
publication hereof.  
Export control — This document as well as the item(s) described herein  
may be subject to export control regulations. Export might require a prior  
authorization from competent authorities.  
Suitability for use — Nexperia products are not designed, authorized or  
warranted to be suitable for use in life support, life-critical or safety-critical  
IP4234CZ6  
All information provided in this document is subject to legal disclaimers.  
© Nexperia B.V. 2018. All rights reserved.  
Product data sheet  
Rev. 3.0 — 31 January 2018  
8 / 11  
 
Nexperia  
IP4234CZ6  
Single USB 2.0 ESD protection to IEC 61000-4-2 level 4  
Non-automotive qualified products — Unless this data sheet expressly  
states that this specific Nexperia product is automotive qualified, the  
product is not suitable for automotive use. It is neither qualified nor tested in  
accordance with automotive testing or application requirements. Nexperia  
accepts no liability for inclusion and/or use of non-automotive qualified  
products in automotive equipment or applications. In the event that customer  
uses the product for design-in and use in automotive applications to  
automotive specifications and standards, customer (a) shall use the product  
without Nexperia's warranty of the product for such automotive applications,  
use and specifications, and (b) whenever customer uses the product for  
automotive applications beyond Nexperia's specifications such use shall be  
solely at customer’s own risk, and (c) customer fully indemnifies Nexperia  
for any liability, damages or failed product claims resulting from customer  
design and use of the product for automotive applications beyond Nexperia's  
standard warranty and Nexperia's product specifications.  
Translations — A non-English (translated) version of a document is for  
reference only. The English version shall prevail in case of any discrepancy  
between the translated and English versions.  
12.4 Trademarks  
Notice: All referenced brands, product names, service names and  
trademarks are the property of their respective owners.  
IP4234CZ6  
All information provided in this document is subject to legal disclaimers.  
© Nexperia B.V. 2018. All rights reserved.  
Product data sheet  
Rev. 3.0 — 31 January 2018  
9 / 11  
Nexperia  
IP4234CZ6  
Single USB 2.0 ESD protection to IEC 61000-4-2 level 4  
Tables  
Tab. 1.  
Tab. 2.  
Tab. 3.  
Tab. 4.  
Tab. 5.  
Pinning ...............................................................2  
Tab. 6.  
Tab. 7.  
Tab. 8.  
Tab. 9.  
SnPb eutectic process (from J-STD-020C) ....... 6  
Lead-free process (from J-STD-020C) ..............6  
Abbreviations .....................................................7  
Revision history .................................................7  
Ordering options ................................................2  
Limiting values .................................................. 2  
Operating conditions ......................................... 2  
Characteristics ...................................................3  
Figures  
Fig. 1.  
Fig. 2.  
Typical application of IP4234CZ6 ......................3  
Package outline SOT457 (TSOP6) ................... 4  
Fig. 3.  
Temperature profiles for large and small  
components .......................................................7  
IP4234CZ6  
All information provided in this document is subject to legal disclaimers.  
© Nexperia B.V. 2018. All rights reserved.  
Product data sheet  
Rev. 3.0 — 31 January 2018  
10 / 11  
Nexperia  
IP4234CZ6  
Single USB 2.0 ESD protection to IEC 61000-4-2 level 4  
Contents  
1
Product profile .................................................... 1  
1.1  
1.2  
1.3  
2
3
4
5
6
7
7.1  
8
General description ............................................1  
Features .............................................................1  
Applications ........................................................1  
Pinning information ............................................ 2  
Ordering information .......................................... 2  
Limiting values ....................................................2  
Recommended operating conditions ................2  
Characteristics .................................................... 3  
Application information ......................................3  
Universal serial bus 2.0 protection .................... 3  
Package outline ...................................................4  
Soldering of SMD packages ...............................5  
Introduction to soldering .................................... 5  
Wave and reflow soldering ................................5  
Wave soldering ..................................................5  
Reflow soldering ................................................ 6  
Abbreviations ...................................................... 7  
Revision history .................................................. 7  
Legal information ................................................8  
9
9.1  
9.2  
9.3  
9.4  
10  
11  
12  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section 'Legal information'.  
© Nexperia B.V. 2018.  
All rights reserved.  
For more information, please visit: http://www.nexperia.com  
For sales office addresses, please send an email to: salesaddresses@nexperia.com  
Date of release: 31 January 2018  
Document identifier: IP4234CZ6  

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