NXP3875Y [NEXPERIA]
50 V, 150 mA NPN general-purpose transistors;
| 型号： | NXP3875Y |
| 厂家： | 
Nexperia |
| 描述： | 50 V, 150 mA NPN general-purpose transistors |
| 文件： | 总15页 (文件大小：1188K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Important notice
Dear Customer,
On 7 February 2017 the former NXP Standard Product business became a new company with the
tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS
semiconductors with its focus on the automotive, industrial, computing, consumer and wearable
application markets
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use
the references to Nexperia, as shown below.
Instead of http://www.nxp.com, http://www.philips.com/ or http://www.semiconductors.philips.com/,
use http://www.nexperia.com
Instead of sales.addresses@www.nxp.com or sales.addresses@www.semiconductors.philips.com, use
salesaddresses@nexperia.com (email)
Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on
the version, as shown below:
- © NXP N.V. (year). All rights reserved or © Koninklijke Philips Electronics N.V. (year). All rights
reserved
Should be replaced with:
- © Nexperia B.V. (year). All rights reserved.
If you have any questions related to the data sheet, please contact our nearest sales office via e-mail
or telephone (details via salesaddresses@nexperia.com). Thank you for your cooperation and
understanding,
Kind regards,
Team Nexperia
NXP3875Y; NXP3875G
SOT23
50 V, 150 mA NPN general-purpose transistors
Rev. 1 — 12 December 2012
Product data sheet
1. Product profile
1.1 General description
NPN general-purpose transistors in a small SOT23 (TO-236AB)
Surface-Mounted Device (SMD) plastic package.
1.2 Features and benefits
General-purpose transistors
Small SMD plastic packages
Two different current gain selections
AEC-Q101 qualified
1.3 Applications
General-purpose switching and amplification
1.4 Quick reference data
Table 1.
Symbol
VCEO
IC
Quick reference data
Parameter
Conditions
Min Typ Max Unit
collector-emitter voltage
collector current
DC current gain
NXP3875Y
open base
-
-
-
-
50
V
150 mA
hFE
VCE = 6 V; IC = 2 mA
120
200
-
-
240
400
NXP3875G
2. Pinning information
Table 2.
Pinning
Pin
1
Description
base
Simplified outline
Graphic symbol
3
3
2
emitter
3
collector
1
1
2
2
sym021
NXP3875Y; NXP3875G
NXP Semiconductors
50 V, 150 mA NPN general-purpose transistors
3. Ordering information
Table 3.
Ordering information
Type number
Package
Name
Description
Version
NXP3875Y
NXP3875G
TO-236AB plastic surface-mounted package; 3 leads
SOT23
4. Marking
Table 4.
Marking codes
Type number
NXP3875Y
NXP3875G
Marking code[1]
*JE
*JF
[1] * = placeholder for manufacturing site code.
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VCBO
VCEO
VEBO
IC
Parameter
Conditions
open emitter
open base
Min
Max
60
Unit
V
collector-base voltage
collector-emitter voltage
emitter-base voltage
collector current
-
-
-
-
-
50
V
open collector
5
V
150
200
mA
mA
ICM
peak collector current
single pulse;
tp 1 ms
IB
base current
30
mA
mA
IBM
peak base current
single pulse;
-
100
tp 1 ms
[1]
Ptot
Tj
total power dissipation
junction temperature
ambient temperature
storage temperature
Tamb 25 C
-
200
mW
C
-
150
Tamb
Tstg
65
65
+150
+150
C
C
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
NXP3875Y_NXP3875G
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 1 — 12 December 2012
2 of 14
NXP3875Y; NXP3875G
NXP Semiconductors
50 V, 150 mA NPN general-purpose transistors
006aad235
250
tot
P
(mW)
200
150
100
50
0
-75
-25
25
75
125
175
(°C)
T
amb
FR4 PCB, standard footprint
Fig 1. Power derating curve
6. Thermal characteristics
Table 6.
Thermal characteristics
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
[1]
Rth(j-a)
thermal resistance from
junction to ambient
in free air
-
-
625
K/W
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
006aad236
3
10
duty cycle = 1
Z
th(j-a)
0.75
0.5
0.33
(K/W)
2
10
0.2
0.1
0.05
0.02
10
0
0.01
1
-1
10
-5
-4
-3
-2
-1
2
3
10
10
10
10
10
1
10
10
10
t
p
(s)
FR4 PCB, standard footprint
Fig 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
NXP3875Y_NXP3875G
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 1 — 12 December 2012
3 of 14
NXP3875Y; NXP3875G
NXP Semiconductors
50 V, 150 mA NPN general-purpose transistors
7. Characteristics
Table 7.
Characteristics
Tamb = 25 C unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ
Max
100
5
Unit
nA
ICBO
collector-base
cut-off current
VCB = 60 V; IE = 0 A
-
-
-
-
VCB = 60 V; IE = 0 A;
A
Tj = 150 C
IEBO
hFE
emitter-base
cut-off current
VEB = 5 V; IC = 0 A
-
-
100
nA
DC current gain
NXP3875Y
VCE = 6 V; IC = 2 mA
120
200
-
-
-
-
240
400
250
NXP3875G
VCEsat
VBEsat
fT
collector-emitter
saturation voltage
IC = 100 mA; IB = 10 mA
IC = 100 mA; IB = 10 mA
mV
V
base-emitter
saturation voltage
-
-
-
-
-
1
transition frequency VCE = 10 V; IC = 1 mA;
f = 100 MHz
80
-
-
MHz
pF
Cc
collector capacitance VCB = 10 V; IE = ie = 0 A;
f = 1 MHz
3.5
10
NF
noise figure
IC = 0.1 mA; VCE = 6 V;
-
dB
RS = 10 k; f = 1 kHz;
NXP3875Y_NXP3875G
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 1 — 12 December 2012
4 of 14
NXP3875Y; NXP3875G
NXP Semiconductors
50 V, 150 mA NPN general-purpose transistors
006aad237
006aad238
3
3
10
10
h
h
FE
FE
(1)
(1)
(2)
(2)
(3)
(3)
2
2
10
10
10
10
10
10
-1
2
3
-1
2
3
1
10
10
10
1
10
10
10
I
C
(mA)
I (mA)
C
VCE = 1 V
amb = 100 C
VCE = 6 V
(1) Tamb = 100 C
(1)
T
(2) Tamb = 25 C
(3) Tamb = 55 C
(2) Tamb = 25 C
(3) Tamb = 55 C
Fig 3. NXP3875Y: DC current gain as a function of
collector current; typical values
Fig 4. NXP3875Y: DC current gain as a function of
collector current; typical values
006aad239
006aad240
200
1.2
I
B
= 7 mA
6.3 5.6 4.9
I
C
V
(V)
BE
(mA)
4.2
3.5
(1)
(2)
(3)
150
2.8
2.1
0.8
1.4
100
50
0
0.7
0.4
0
10
-1
2
3
0
2
4
6
1
10
10
10
V
(V)
I (mA)
C
CE
Tamb = 25 C
VCE = 6 V
(1) Tamb = 55 C
(2) amb = 25 C
(3) Tamb = 100 C
T
Fig 5. NXP3875Y: Collector current as a function of
collector-emmiter voltage; typical values
Fig 6. NXP3875Y: Base-emmiter voltage as a function
of collector current; typical values
NXP3875Y_NXP3875G
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 1 — 12 December 2012
5 of 14
NXP3875Y; NXP3875G
NXP Semiconductors
50 V, 150 mA NPN general-purpose transistors
006aad241
006aad242
1.2
1
V
BEsat
(V)
V
(1)
CEsat
(V)
0.8
0.4
0
(2)
(3)
-1
10
(1)
(2)
(3)
-2
10
-1
2
3
-1
2
3
10
1
10
10
10
10
1
10
10
10
I
C
(mA)
I (mA)
C
IC/IB = 10
IC/IB = 10
(1) Tamb = 55 C
(2) Tamb = 25 C
(1) Tamb = 100 C
(2) Tamb = 25 C
(3)
Tamb = 100 C
(3) Tamb = 55 C
Fig 7. NXP3875Y: Base-emitter saturation voltage as
a function of collector currant; typical values
Fig 8. NXP3875Y: Collector-emmiter saturation
voltage as a function of collector current;
typical values
006aad243
006aad244
3
3
10
10
f
T
(MHz)
(1)
(2)
h
FE
2
10
(3)
2
10
10
1
10
10
10
-1
2
3
-1
2
3
1
10
10
10
1
10
10
10
I
C
(mA)
I (mA)
C
VCE = 10 V; Tamb = 25 C
VCE = 1 V
(1) Tamb = 100 C
(2) amb = 25 C
(3) Tamb = 55 C
T
Fig 9. NXP3875Y: Transition frequency as a function
of collector current; typical values
Fig 10. NXP3875G: DC current gain as a function of
collector current; typical values
NXP3875Y_NXP3875G
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 1 — 12 December 2012
6 of 14
NXP3875Y; NXP3875G
NXP Semiconductors
50 V, 150 mA NPN general-purpose transistors
006aad245
006aad246
3
10
200
I
B
= 7 mA
6.3 5.6 4.9
I
C
4.2
3.5
(mA)
(1)
(2)
h
FE
150
2.8
2.1
(3)
1.4
2
10
100
50
0
0.7
10
10
-1
2
3
1
10
10
10
0
2
4
6
I
C
(mA)
V
(V)
CE
VCE = 6 V
Tamb = 25 C
(1) Tamb = 100 C
(2) Tamb = 25 C
(3)
Tamb = 55 C
Fig 11. NXP3875G: DC current gain as a function of
collector current; typical values
Fig 12. NXP3875G: Collector current as a function of
collector-emmiter voltage; typical values
006aad247
006aad248
1.2
1.2
V
(V)
V
BEsat
(V)
BE
(1)
(1)
(2)
(3)
0.8
0.8
(2)
(3)
0.4
0.4
0
10
0
10
-1
2
3
-1
2
3
1
10
10
10
1
10
10
10
I
C
(mA)
I (mA)
C
VCE = 6 V
amb = 55 C
IC/IB = 10
(1) Tamb = 55 C
(1)
T
(2) Tamb = 25 C
(3) Tamb = 100 C
(2) Tamb = 25 C
(3) Tamb = 100 C
Fig 13. NXP3875G: Base-emmiter voltage as a
function of collector current; typical values
Fig 14. NXP3875G: Base-emitter saturation voltage as
a function of collector currant; typical values
NXP3875Y_NXP3875G
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 1 — 12 December 2012
7 of 14
NXP3875Y; NXP3875G
NXP Semiconductors
50 V, 150 mA NPN general-purpose transistors
006aad249
006aad250
3
1
10
f
T
(MHz)
V
CEsat
(V)
2
10
-1
10
(1)
10
(2)
(3)
-2
10
1
10
-1
2
3
-1
2
3
10
1
10
10
10
1
10
10
10
I
C
(mA)
I (mA)
C
IC/IB = 10
VCE = 10 V; Tamb = 25 C
(1) Tamb = 100 C
(2) Tamb = 25 C
(3)
Tamb = 55 C
Fig 15. NXP3875G: Collector-emmiter saturation
voltage as a function of collector current;
typical values
Fig 16. NXP3875G: Transition frequency as a function
of collector current; typical values
8. Test information
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
NXP3875Y_NXP3875G
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 1 — 12 December 2012
8 of 14
NXP3875Y; NXP3875G
NXP Semiconductors
50 V, 150 mA NPN general-purpose transistors
9. Package outline
3.0
2.8
1.1
0.9
3
0.45
0.15
2.5 1.4
2.1 1.2
1
2
0.48
0.38
0.15
0.09
1.9
Dimensions in mm
04-11-04
Fig 17. Package outline SOT23 (TO-236AB)
10. Packing information
Table 8.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type
Package
Description
Packing quantity
number
1000
-215
4000
NXP3875Y
NXP3875G
SOT23
4 mm pitch, 8 mm tape and reel
-235
[1] For further information and the availability of packing methods, see Section 14.
NXP3875Y_NXP3875G
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 1 — 12 December 2012
9 of 14
NXP3875Y; NXP3875G
NXP Semiconductors
50 V, 150 mA NPN general-purpose transistors
11. Soldering
3.3
2.9
1.9
solder lands
solder resist
2
3
1.7
solder paste
occupied area
0.6
0.7
(3×)
(3×)
Dimensions in mm
0.5
(3×)
0.6
(3×)
1
sot023_fr
Fig 18. Reflow soldering footprint SOT23 (TO-236AB)
2.2
1.2
(2×)
1.4
(2×)
solder lands
solder resist
occupied area
2.6
4.6
Dimensions in mm
1.4
preferred transport direction during soldering
2.8
4.5
sot023_fw
Fig 19. Wave soldering footprint SOT23 (TO-236AB)
NXP3875Y_NXP3875G
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 1 — 12 December 2012
10 of 14
NXP3875Y; NXP3875G
NXP Semiconductors
50 V, 150 mA NPN general-purpose transistors
12. Revision history
Table 9.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
NXP3875Y_NXP3875G v.1
20121212
Product data sheet
-
-
NXP3875Y_NXP3875G
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 1 — 12 December 2012
11 of 14
NXP3875Y; NXP3875G
NXP Semiconductors
50 V, 150 mA NPN general-purpose transistors
13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
Suitability for use in automotive applications — This NXP
13.2 Definitions
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
13.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
NXP3875Y_NXP3875G
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 1 — 12 December 2012
12 of 14
NXP3875Y; NXP3875G
NXP Semiconductors
50 V, 150 mA NPN general-purpose transistors
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP3875Y_NXP3875G
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 1 — 12 December 2012
13 of 14
NXP3875Y; NXP3875G
NXP Semiconductors
50 V, 150 mA NPN general-purpose transistors
15. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
1.4
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits. . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 1
2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics . . . . . . . . . . . . . . . . . . 3
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Test information. . . . . . . . . . . . . . . . . . . . . . . . . 8
Quality information . . . . . . . . . . . . . . . . . . . . . . 8
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
Packing information . . . . . . . . . . . . . . . . . . . . . 9
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 11
3
4
5
6
7
8
8.1
9
10
11
12
13
Legal information. . . . . . . . . . . . . . . . . . . . . . . 12
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 13
13.1
13.2
13.3
13.4
14
15
Contact information. . . . . . . . . . . . . . . . . . . . . 13
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 12 December 2012
Document identifier: NXP3875Y_NXP3875G
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