PBHV9050Z [NEXPERIA]
500 V, 250 mA PNP high-voltage low VCEsat (BISS) transistorProduction;
| 型号： | PBHV9050Z |
| 厂家： | 
Nexperia |
| 描述： | 500 V, 250 mA PNP high-voltage low VCEsat (BISS) transistorProduction 开关 光电二极管 晶体管 |
| 文件： | 总14页 (文件大小：453K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Important notice
Dear Customer,
On 7 February 2017 the former NXP Standard Product business became a new company with the
tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS
semiconductors with its focus on the automotive, industrial, computing, consumer and wearable
application markets
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use
the references to Nexperia, as shown below.
Instead of http://www.nxp.com, http://www.philips.com/ or http://www.semiconductors.philips.com/,
use http://www.nexperia.com
Instead of sales.addresses@www.nxp.com or sales.addresses@www.semiconductors.philips.com, use
salesaddresses@nexperia.com (email)
Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on
the version, as shown below:
- © NXP N.V. (year). All rights reserved or © Koninklijke Philips Electronics N.V. (year). All rights
reserved
Should be replaced with:
- © Nexperia B.V. (year). All rights reserved.
If you have any questions related to the data sheet, please contact our nearest sales office via e-mail
or telephone (details via salesaddresses@nexperia.com). Thank you for your cooperation and
understanding,
Kind regards,
Team Nexperia
PBHV9050Z
500 V, 250 mA PNP high-voltage low VCEsat (BISS) transistor
Rev. 1 — 19 August 2010
Product data sheet
1. Product profile
1.1 General description
PNP high-voltage low VCEsat Breakthrough In Small Signal (BISS) transistor in a medium
power SOT223 (SC-73) Surface-Mounted Device (SMD) plastic package.
1.2 Features and benefits
High voltage
Low collector-emitter saturation voltage VCEsat
High collector current capability IC and ICM
High collector current gain (hFE) at high IC
AEC-Q101 qualified
Medium power SMD plastic package
1.3 Applications
Electronic ballasts
LED driver for LED chain module
LCD backlighting
Automotive motor management
Flyback converters
Hook switch for wired telecom
Switch Mode Power Supply (SMPS)
1.4 Quick reference data
Table 1.
Symbol
VCESM
Quick reference data
Parameter
Conditions
Min
Typ
Max Unit
collector-emitter peak
voltage
VBE = 0
-
-
−500
V
VCEO
IC
collector-emitter voltage
collector current
open base
-
-
−500
V
-
-
−0.25 A
[1]
hFE
DC current gain
VCE = −10 V;
IC = −50 mA
80
160
300
[1] Pulse test: tp ≤ 300 μs; δ ≤ 0.02.
PBHV9050Z
NXP Semiconductors
500 V, 250 mA PNP high-voltage low VCEsat (BISS) transistor
2. Pinning information
Table 2.
Pinning
Pin
1
Description
base
Simplified outline
Graphic symbol
4
2, 4
2
collector
emitter
3
1
4
collector
1
2
3
3
sym028
3. Ordering information
Table 3.
Ordering information
Type number
Package
Name
Description
Version
PBHV9050Z
SC-73
plastic surface-mounted package with increased
heat sink; 4 leads
SOT223
4. Marking
Table 4.
Marking codes
Type number
Marking code
PBHV9050Z
V9050Z
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VCBO
Parameter
Conditions
open emitter
open base
VBE = 0
Min
Max
Unit
V
collector-base voltage
collector-emitter voltage
-
-
-
−500
−500
−500
VCEO
V
VCESM
collector-emitter peak
voltage
V
VEBO
IC
emitter-base voltage
collector current
open collector
-
-
-
−6
V
A
A
−0.25
−0.5
ICM
peak collector current
single pulse;
tp ≤ 1 ms
IBM
peak base current
single pulse;
-
−200
mA
tp ≤ 1 ms
PBHV9050Z
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 19 August 2010
2 of 13
PBHV9050Z
NXP Semiconductors
500 V, 250 mA PNP high-voltage low VCEsat (BISS) transistor
Table 5.
Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
700
Unit
mW
mW
°C
[1]
[2]
Ptot
total power dissipation
Tamb ≤ 25 °C
-
-
1400
150
Tj
junction temperature
ambient temperature
storage temperature
-
Tamb
Tstg
−55
−65
+150
+150
°C
°C
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for collector 6 cm2.
006aab155
1600
(1)
P
tot
(mW)
1200
800
400
0
(2)
−75
−25
25
75
125
175
(°C)
T
amb
(1) FR4 PCB, mounting pad for collector 6 cm2
(2) FR4 PCB, standard footprint
Fig 1. Power derating curves
6. Thermal characteristics
Table 6.
Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max Unit
[1]
[2]
Rth(j-a)
thermal resistance from
junction to ambient
in free air
-
-
-
-
-
-
175
90
K/W
K/W
K/W
Rth(j-sp)
thermal resistance from
junction to solder point
20
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for collector 6 cm2.
PBHV9050Z
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 19 August 2010
3 of 13
PBHV9050Z
NXP Semiconductors
500 V, 250 mA PNP high-voltage low VCEsat (BISS) transistor
006aab156
3
10
Z
th(j-a)
(K/W)
duty cycle = 1
2
0.75
0.5
0.33
10
0.2
0.1
10
0.05
0.02
0.01
1
0
−1
10
10
−5
−4
−3
−2
−1
2
3
10
10
10
10
1
10
10
10
t
p
(s)
FR4 PCB, standard footprint
Fig 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
006aab157
3
10
Z
th(j-a)
(K/W)
duty cycle = 1
2
10
0.75
0.5
0.33
0.2
10
0.1
0.05
0.02
0
0.01
1
−1
10
10
−5
−4
−3
−2
−1
2
3
10
10
10
10
1
10
10
10
t
p
(s)
FR4 PCB, mounting pad for collector 6 cm2
Fig 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
PBHV9050Z
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 19 August 2010
4 of 13
PBHV9050Z
NXP Semiconductors
500 V, 250 mA PNP high-voltage low VCEsat (BISS) transistor
7. Characteristics
Table 7.
Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max Unit
ICBO
collector-base cut-off
current
VCB = −360 V; IE = 0 A
-
-
-
-
−100 nA
VCB = −360 V; IE = 0 A;
Tj = 150 °C
−10
μA
ICES
IEBO
hFE
collector-emitter cut-off VCE = −360 V; VBE = 0 V
current
-
-
-
-
−100 nA
−100 nA
emitter-base cut-off
current
VEB = −5 V; IC = 0 A
DC current gain
VCE = −10 V
[1]
[1]
[1]
[1]
[1]
[1]
IC = −10 mA
100
80
70
-
160
160
150
300
300
-
IC = −50 mA
IC = −100 mA
VCEsat
collector-emitter
saturation voltage
IC = −20 mA; IB = −2 mA
IC = −50 mA; IB = −10 mA
−115 −200 mV
−95 −200 mV
−140 −350 mV
-
IC = −100 mA;
IB = −20 mA
-
[1]
VBEsat
base-emitter saturation IC = −50 mA; IB = −10 mA
-
−0.75 −0.9
V
voltage
td
tr
delay time
VCC = −20 V;
IC = −0.05 A;
IBon = −5 mA;
IBoff = 10 mA
-
-
-
-
-
-
-
75
-
-
-
-
-
-
-
ns
rise time
1600
1675
1200
550
1750
50
ns
ton
ts
turn-on time
storage time
fall time
ns
ns
tf
ns
toff
fT
turn-off time
transition frequency
ns
VCE = −10 V;
MHz
IE = −10 mA; f = 100 MHz
Cc
Ce
collector capacitance
emitter capacitance
VCB = −20 V; IE = ie = 0 A;
f = 1 MHz
-
-
6
-
-
pF
pF
VEB = −0.5 V;
170
IC = ic = 0 A; f = 1 MHz
[1] Pulse test: tp ≤ 300 μs; δ ≤ 0.02.
PBHV9050Z
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 19 August 2010
5 of 13
PBHV9050Z
NXP Semiconductors
500 V, 250 mA PNP high-voltage low VCEsat (BISS) transistor
006aab692
006aab693
240
−0.5
I
B
(mA) = −200
−180
I
C
(1)
h
(A)
FE
−0.4
−160
−140
180
(2)
−120
−100
−0.3
−0.2
−0.1
0.0
−80
−60
−40
120
(3)
−20
60
0
−10
−1
2
3
−1
−10
−10
−10
0
−1
−2
−3
−4
−5
(V)
I
C
(mA)
V
CE
VCE = −10 V
Tamb = 25 °C
(1) Tamb = 100 °C
(2) Tamb = 25 °C
(3) Tamb = −55 °C
Fig 4. DC current gain as a function of collector
current; typical values
Fig 5. Collector current as a function of
collector-emitter voltage; typical values
006aab694
006aab695
−1.00
−1.2
V
(V)
V
BE
BEsat
(V)
(1)
−0.75
−0.9
−0.6
−0.3
0.0
(1)
(2)
(3)
(2)
(3)
−0.50
−0.25
0.0
−1
2
3
−1
2
3
−10
−1
−10
−10
−10
−10
−1
−10
−10
−10
I
C
(mA)
I (mA)
C
VCE = −10 V
IC/IB = 5
(1) Tamb = −55 °C
(2) Tamb = 25 °C
(3) Tamb = 100 °C
(1) Tamb = −55 °C
(2) Tamb = 25 °C
(3) Tamb = 100 °C
Fig 6. Base-emitter voltage as a function of collector
current; typical values
Fig 7. Base-emitter saturation voltage as a function
of collector current; typical values
PBHV9050Z
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 19 August 2010
6 of 13
PBHV9050Z
NXP Semiconductors
500 V, 250 mA PNP high-voltage low VCEsat (BISS) transistor
006aab696
006aab697
−1
−1
V
V
CEsat
(V)
CEsat
(V)
(1)
(2)
(3)
−1
−1
(1)
−10
−10
(2)
(3)
−2
−10
−2
−10
−10
−10
−1
2
3
−1
2
3
−1
−10
−10
−10
−1
−10
−10
−10
I
C
(mA)
I (mA)
C
IC/IB = 5
Tamb = 25 °C
(1) IC/IB = 20
(1) Tamb = 100 °C
(2) Tamb = 25 °C
(3) Tamb = −55 °C
(2) IC/IB = 10
(3) IC/IB = 5
Fig 8. Collector-emitter saturation voltage as a
function of collector current; typical values
Fig 9. Collector-emitter saturation voltage as a
function of collector current; typical values
006aab698
006aab699
4
4
10
10
R
CEsat
R
CEsat
(Ω)
(Ω)
3
3
10
10
2
2
10
10
(1)
(1)
(2)
(3)
10
10
(2)
(3)
1
1
−1
−10
−1
−10
10
10
−1
2
3
−1
2
3
−1
−10
−10
−10
−1
−10
−10
−10
I
C
(mA)
I (mA)
C
IC/IB = 5
Tamb = 25 °C
(1) Tamb = 100 °C
(2) Tamb = 25 °C
(3) Tamb = −55 °C
(1) IC/IB = 20
(2) IC/IB = 10
(3) IC/IB = 5
Fig 10. Collector-emitter saturation resistance as a
function of collector current; typical values
Fig 11. Collector-emitter saturation resistance as a
function of collector current; typical values
PBHV9050Z
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 19 August 2010
7 of 13
PBHV9050Z
NXP Semiconductors
500 V, 250 mA PNP high-voltage low VCEsat (BISS) transistor
8. Test information
V
V
CC
BB
R
R
C
B
V
o
(probe)
(probe)
oscilloscope
oscilloscope
450 Ω
450 Ω
R2
V
I
DUT
R1
mgd624
Fig 12. Test circuit for switching times
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
9. Package outline
6.7
6.3
3.1
2.9
1.8
1.5
4
1.1
0.7
7.3 3.7
6.7 3.3
1
2
3
0.8
0.6
0.32
0.22
2.3
4.6
Dimensions in mm
04-11-10
Fig 13. Package outline SOT223 (SC-73)
10. Packing information
Table 8.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number Package
Description
Packing quantity
1000
-115
4000
PBHV9050Z
SOT223
8 mm pitch, 12 mm tape and reel
-135
[1] For further information and the availability of packing methods, see Section 14.
PBHV9050Z
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 19 August 2010
8 of 13
PBHV9050Z
NXP Semiconductors
500 V, 250 mA PNP high-voltage low VCEsat (BISS) transistor
11. Soldering
7
3.85
3.6
3.5
0.3
1.3 1.2
(4×) (4×)
solder lands
4
solder resist
6.1
3.9
7.65
solder paste
occupied area
1
2
3
Dimensions in mm
2.3
2.3
1.2
(3×)
1.3
(3×)
6.15
sot223_fr
Fig 14. Reflow soldering footprint SOT223 (SC-73)
8.9
6.7
1.9
solder lands
4
solder resist
6.2
8.7
occupied area
Dimensions in mm
1
2
3
preferred transport
direction during soldering
1.9
(3×)
2.7
2.7
1.9
(2×)
1.1
sot223_fw
Fig 15. Wave soldering footprint SOT223 (SC-73)
PBHV9050Z
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 19 August 2010
9 of 13
PBHV9050Z
NXP Semiconductors
500 V, 250 mA PNP high-voltage low VCEsat (BISS) transistor
12. Revision history
Table 9.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PBHV9050Z v.1
20100819
Product data sheet
-
-
PBHV9050Z
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 19 August 2010
10 of 13
PBHV9050Z
NXP Semiconductors
500 V, 250 mA PNP high-voltage low VCEsat (BISS) transistor
13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
malfunction of an NXP Semiconductors product can reasonably be expected
13.2 Definitions
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
13.3 Disclaimers
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
PBHV9050Z
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 19 August 2010
11 of 13
PBHV9050Z
NXP Semiconductors
500 V, 250 mA PNP high-voltage low VCEsat (BISS) transistor
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
PBHV9050Z
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 19 August 2010
12 of 13
PBHV9050Z
NXP Semiconductors
500 V, 250 mA PNP high-voltage low VCEsat (BISS) transistor
15. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits. . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
1.4
2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics . . . . . . . . . . . . . . . . . . 3
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 5
Test information. . . . . . . . . . . . . . . . . . . . . . . . . 8
Quality information . . . . . . . . . . . . . . . . . . . . . . 8
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
Packing information . . . . . . . . . . . . . . . . . . . . . 8
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 10
3
4
5
6
7
8
8.1
9
10
11
12
13
Legal information. . . . . . . . . . . . . . . . . . . . . . . 11
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12
13.1
13.2
13.3
13.4
14
15
Contact information. . . . . . . . . . . . . . . . . . . . . 12
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 19 August 2010
Document identifier: PBHV9050Z
相关型号：
©2020 ICPDF网 联系我们和版权申明