PCMF3USB3B [NEXPERIA]
Common-mode EMI filter for differential channels with integrated bidirectional ESD protectionProduction;
| 型号： | PCMF3USB3B |
| 厂家： | 
Nexperia |
| 描述： | Common-mode EMI filter for differential channels with integrated bidirectional ESD protectionProduction |
| 文件： | 总20页 (文件大小：2188K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PCMFxUSB3B/C series
Common-mode EMI filter for differential channels with
integrated bidirectional ESD protection
Rev. 2 — 29 January 2019
Product data sheet
1. General description
Common-mode ElectroMagnetic Interference (EMI) filters with integrated bidirectional ElectroStatic
Discharge (ESD) protection for one, two and three differential channels. The devices are designed
to provide low insertion loss for differential high-speed signals on each channel while unwanted
common-mode signals are attenuated.
Each differential channel incorporates two signal lines that are coupled by integrated coils. Diodes
provide protection to downstream components from ESD voltages up to ±20 kV on each signal line.
Table 1. Product overview
Type number
Number of channels Package Name
PCMF1USB3B/C
PCMF2USB3B/C
PCMF3USB3B/C
1
2
3
WLCSP5
WLCSP10
WLCSP15
2. Features and benefits
•
One, two and three differential channels common-mode EMI filters with integrated ESD
protection
•
•
•
ESD protection up to ±20 kV contact discharge according to IEC 61000-4-2
Superior common-mode suppression over a wide frequency range
Superior RF performance compared to other integrated filters or discrete filters with external
ESD protection
•
•
Extremely high symmetry between line pairs
Industry-standard Wafer-Level Chip-Scale Packages: WLCSP5, 10 and 15 for smaller footprint
3. Applications
•
•
•
•
•
Smartphone, cellular and cordless phone
USB 3.2, USB 2.0, HDMI 2.0, HDMI 1.4
General-purpose downstream ESD protection for differential data lines
Tablet PC and Mobile Internet Device (MID)
MIPI M-PHY and D-PHY as used in Camera Serial Interface (CSI) and Display Serial Interface
(DSI)
Nexperia
PCMFxUSB3B/C series
Common-mode EMI filter for differential channels with integrated bidirectional ESD protection
4. Pinning information
Table 2. Pinning
Pin
Symbol
Description
Simplified outline
Graphic symbol
PCMF1USB3B/C (WLCSP5_2-1-2)
A1
A2
C1
C2
A1
A2
B1
C1
C2
CH1_IN+
channel 1+, external
channel 1-, external
ground channel 1
2
CH1_IN-
B1
GND_CH1
CH1_OUT+
CH1_OUT-
1
channel 1+, internal
channel 1-, internal
C
A
B
Transparent top view
WLCSP5_2-1-2
aaa-028492
B1
PCMF2USB3B/C (WLCSP10_4-2-4)
A1, 3
A2, 4
C1, 3
C2, 4
A1
A2
A3
A4
B1
B2
C1
C2
C3
C4
CH1_IN+
channel 1+, external
channel 1-, external
channel 2+, external
channel 2-, external
ground channel 1
4
3
2
CH1_IN-
B2
B1
CH2_IN+
CH2_IN-
GND_CH1
GND_CH2
CH1_OUT+
CH1_OUT-
CH2_OUT+
CH2_OUT-
ground channel 2
1
B1, B2 - no internal connection
channel 1+, internal
channel 1-, internal
channel 2+, internal
channel 2-, internal
C
A
B
aaa-028493
Transparent top view
WLCSP10_4-2-4
PCMF3USB3B/C (WLCSP15_6-3-6)
A1, 3, 5
A2, 4, 6
C1, 3, 5
C2, 4, 6
A1
A2
A3
A4
A5
A6
B1
B2
B3
C1
C2
C3
C4
C5
C6
CH1_IN+
channel 1+, external
channel 1-, external
channel 2+, external
channel 2-, external
channel 3+, external
channel 3-, external
ground channel 1
6
CH1_IN-
B3
B2
CH2_IN+
5
4
3
2
1
CH2_IN-
CH3_IN+
CH3_IN-
B1, B2, B3 - no internal connection
GND_CH1
GND_CH2
GND_CH3
CH1_OUT+
CH1_OUT-
CH2_OUT+
CH2_OUT-
CH3_OUT+
CH3_OUT-
aaa-028494
ground channel 2
B1
B
ground channel 3
channel 1+, internal
channel 1-, internal
channel 2+, internal
channel 2-, internal
channel 3+, internal
channel 3-, internal
C
A
Transparent top view
WLCSP15_6-3-6
©
PCMFxUSB3B/C_SER
All information provided in this document is subject to legal disclaimers.
Nexperia B.V. 2019. All rights reserved
Product data sheet
Rev. 2 — 29 January 2019
2 / 20
Nexperia
PCMFxUSB3B/C series
Common-mode EMI filter for differential channels with integrated bidirectional ESD protection
5. Ordering information
Table 3. Ordering information
Type number
Package
Name
Description
PCMF1USB3B/C
PCMF2USB3B/C
PCMF3USB3B/C
WLCSP5
WLCSP10
WLCSP15
wafer level chip-size package; 5 bumps (2-1-2)
wafer level chip-size package; 10 bumps (4-2-4)
wafer level chip-size package; 15 bumps (6-3-6)
6. Marking
Table 4. Marking codes
Type number
Marking code
PF1B
PCMF1USB3B/C
PCMF2USB3B/C
PCMF3USB3B/C
PF2B
PF3B
7. Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VI
Parameter
Conditions
Min
Max
Unit
input voltage
-4
4
V
VESD
electrostatic discharge IEC 61000-4-2, level 4;all
voltage
input pins to ground
-20
-20
20
20
kV
kV
•
•
contact discharge
air discharge
IEC 61000-4-2, level 4;all
output pins to ground
-2
2
kV
kV
A
•
•
contact discharge
air discharge
-2
2
IPPM
rated peak-pulse
current
tp = 8/20 μs
-9.5
9.5
Tstg
storage temperature
ambient temperature
-40
-40
+125
+125
°C
°C
Tamb
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PCMFxUSB3B/C_SER
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Nexperia B.V. 2019. All rights reserved
Product data sheet
Rev. 2 — 29 January 2019
3 / 20
Nexperia
PCMFxUSB3B/C series
Common-mode EMI filter for differential channels with integrated bidirectional ESD protection
8. Characteristics
8.1. Channel characteristics
Table 6. Channel characteristics
Tamb = 25 °C unless otherwise specified.
Symbol parameter
Conditions
Min
Typ
Max
Unit
RS(ch)
channel
series
single line; input
to output
-
-
2.6
-
Ω
resistance
Cd
diode
capacitance 2.5 V
f = 1 MHz; VI =
[1]
-
-
0.3
1
-
pF
nA
IRM
reverse
leakage
current
per line;
VI = 4 V
100
VBR
breakdown
voltage
IR = 1 mA
6
-
9
-
-
-
V
Ω
Ω
Rdyn
dynamic
resistance
TLP; positive
transient
[2]
[2]
0.22
0.22
TLP; negative
transient
-
[1] This parameter is guaranteed by design
[2] 100 ns Transmission Line Pulse (TLP); 50 Ω; pulser at 70 ns to 90 ns.
8.2. Frequency characteristics
Table 7. Frequency characteristics
Tamb = 25 °C unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ
Max Unit
Differential mode: Sdd21
f-3dB
cut-off frequency
[1] -
8.1
-
GHz
[1] Normalized to attenuation at 1 MHz.
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PCMFxUSB3B/C_SER
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Nexperia B.V. 2019. All rights reserved
Product data sheet
Rev. 2 — 29 January 2019
4 / 20
Nexperia
PCMFxUSB3B/C series
Common-mode EMI filter for differential channels with integrated bidirectional ESD protection
aaa-028346
aaa-028347
0
0
S
(dB)
dd21
S
(dB)
cc21
-1
-10
-2
-3
-4
-5
-20
-30
-40
7
8
9
10
11
8
9
10
10
10
10
10
10
10
10
10
f (Hz)
f (Hz)
Fig. 1. Differential mode insertion loss; typical values Fig. 2. Common-mode insertion loss; typical values
aaa-028348
115
aaa-028363
0
Z
(Ω)
dif
S
(dB)
dd21
-10
105
Z reference
-20
-30
-40
95
Z DUT
44.3
85
43.9
44.1
44.5
44.7
t (ns)
8
9
10
10
10
10
f (Hz)
tr = 200 ps
CH1 to CH2
Fig. 3. Differential crosstalk; typical values
Fig. 4. Differential Time Domain Reflectometer (TDR)
plot; typical values
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PCMFxUSB3B/C_SER
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Product data sheet
Rev. 2 — 29 January 2019
5 / 20
Nexperia
PCMFxUSB3B/C series
Common-mode EMI filter for differential channels with integrated bidirectional ESD protection
Fig. 5. USB 3.2 eye diagram 10 Gbps, test board with PCMFxUSB3B/C; typical values
Fig. 6. USB 3.2 eye diagram 10 Gbps, test board without device; typical values
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PCMFxUSB3B/C_SER
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Nexperia B.V. 2019. All rights reserved
Product data sheet
Rev. 2 — 29 January 2019
6 / 20
Nexperia
PCMFxUSB3B/C series
Common-mode EMI filter for differential channels with integrated bidirectional ESD protection
Fig. 7. USB 3.2 eye diagram 5 Gbps, test board with PCMFxUSB3B/C; typical values
Fig. 8. USB 3.2 eye diagram 5 Gbps, test board without device; typical values
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PCMFxUSB3B/C_SER
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Product data sheet
Rev. 2 — 29 January 2019
7 / 20
Nexperia
PCMFxUSB3B/C series
Common-mode EMI filter for differential channels with integrated bidirectional ESD protection
1080p, 6 Gbps
Fig. 9. HDMI 2.0 eye diagram TP1, test board with PCMFxUSB3B/C; typical values
1080p, 6 Gbps
Fig. 10. HDMI 2.0 eye diagram TP1, test board without device; typical values
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PCMFxUSB3B/C_SER
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Nexperia B.V. 2019. All rights reserved
Product data sheet
Rev. 2 — 29 January 2019
8 / 20
Nexperia
PCMFxUSB3B/C series
Common-mode EMI filter for differential channels with integrated bidirectional ESD protection
1080p, 6 Gbps
Fig. 11. HDMI 2.0 eye diagram TP2, test board with PCMFxUSB3B/C; typical values
1080p, 6 Gbps
Fig. 12. HDMI 2.0 eye diagram TP2, test board without device; typical values
©
PCMFxUSB3B/C_SER
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Product data sheet
Rev. 2 — 29 January 2019
9 / 20
Nexperia
PCMFxUSB3B/C series
Common-mode EMI filter for differential channels with integrated bidirectional ESD protection
aaa-028357
aaa-028358
25
0
I
I
(A)
(A)
20
15
10
5
-5
-10
-15
-20
-25
0
0
5
10
15
20
25
-25
-20
-15
-10
-5
0
V
(V)
V
(V)
CL
CL
Transmission Line Pulse (TLP) = 100 ns;
measured CH_IN to GND
Transmission Line Pulse (TLP) = 100 ns;
measured CH_IN to GND
Fig. 13. Dynamic resistance with positive clamping;
typical values
Fig. 14. Dynamic resistance with negative clamping;
typical values
aaa-028359
aaa-028360
80
0
I
I
(A)
(A)
60
40
20
0
-20
-40
-60
-80
0
20
40
60
80
-80
-60
-40
-20
0
V
(V)
V
(V)
CL
CL
Very-Fast Transmission Line Pulse
(VF-TLP) = 5 ns;
Very-Fast Transmission Line Pulse
(VF-TLP) = 5 ns;
measured CH_IN to GND
measured CH_IN to GND
Fig. 15. Dynamic resistance with positive clamping;
typical values
Fig. 16. Dynamic resistance with negative clamping;
typical values
The device uses an advanced clamping structure showing a negative dynamic resistance.
This snap-back behavior strongly reduces the clamping voltage to the system behind the ESD
protection during an ESD event. Do not connect unlimited DC current sources to the data lines to
avoid keeping the ESD protection device in snap-back state after exceeding breakdown voltage
(due to an ESD pulse for instance).
©
PCMFxUSB3B/C_SER
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Nexperia B.V. 2019. All rights reserved
Product data sheet
Rev. 2 — 29 January 2019
10 / 20
Nexperia
PCMFxUSB3B/C series
Common-mode EMI filter for differential channels with integrated bidirectional ESD protection
aaa-028361
aaa-028362
10
0
-2
-4
-6
-8
I
I
(A)
(A)
8
6
4
2
0
0
-10
-10
2
4
6
8
10
-8
-6
-4
-2
0
V
(V)
V
(V)
CL
CL
IEC61000-4-5; tp = 8/20 μs; positive pulse
IEC61000-4-5; tp = 8/20 μs; negative pulse
Fig. 17. Dynamic resistance with positive clamping;
typical values
Fig. 18. Dynamic resistance with negative clamping;
typical values
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PCMFxUSB3B/C_SER
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Product data sheet
Rev. 2 — 29 January 2019
11 / 20
Nexperia
PCMFxUSB3B/C series
Common-mode EMI filter for differential channels with integrated bidirectional ESD protection
9. Application information
The device is designed to provide high-level ESD protection for differential high-speed data line
pairs such as:
•
•
•
•
•
•
USB 3.2
HDMI 2.0
Transition-Minimized Differential Signaling (TMDS)
DisplayPort
external Serial Advanced Technology Attachment (eSATA)
Low Voltage Differential Signaling (LVDS)
When designing the Printed-Circuit Board (PCB), give careful consideration to impedance matching
and signal coupling. Do not connect the protected signal lines to unlimited current sources like, for
example, a battery.
Fig. 19. Application diagram: protecting the differential data lines of a USB Type-C
connector evaluation dongle with PCMF1USB3B/C
Since the SuperSpeed TX/RX lines are separated by GND or VBUS from the Hi-Speed lines,
PCMF1USB3B/C makes it easy to achieve same signal lengths, straight routing, and optimal
positioning for ESD protection directly at the connector.
©
PCMFxUSB3B/C_SER
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Nexperia B.V. 2019. All rights reserved
Product data sheet
Rev. 2 — 29 January 2019
12 / 20
Nexperia
PCMFxUSB3B/C series
Common-mode EMI filter for differential channels with integrated bidirectional ESD protection
10. Package outline
WLCSP5: wafer level chip-size package; 5 bumps (2-1-2)
PCMF1USB3B/C
D
bump A1
index area
A
1
E
A
detail X
e
1/2 e
b
C
e
1
B1
e
B
A
2
1
2
bump A1
index area
X
0
1 mm
scale
Dimensions (mm are the original dimensions)
Unit
max 0.64 0.42 0.31 0.82 1.22
A
A
b
D
E
e
e
e
2
1
1
nom
min
mm
0.61 0.41 0.26 0.77 1.17 0.40 0.40 0.80
0.58 0.40 0.21 0.72 1.12
pcmf1usb3b-c_po
Issue date
References
Outline
version
European
projection
IEC
JEDEC
JEITA
18-03-23
PCMF1USB3B/C
Fig. 20. Package outline WLCSP5
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PCMFxUSB3B/C_SER
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Nexperia B.V. 2019. All rights reserved
Product data sheet
Rev. 2 — 29 January 2019
13 / 20
Nexperia
PCMFxUSB3B/C series
Common-mode EMI filter for differential channels with integrated bidirectional ESD protection
WLCSP10: wafer level chip-size package; 10 bumps (4-2-4)
PCMF2USB3B/C
D
bump A1
index area
A
1
E
A
detail X
e
b
C
B
A
e
1
B1
B2
e
2
bump A1
index area
1
2
3
4
e
3
X
1/2 e
0
1 mm
scale
Dimensions (mm are the original dimensions)
Unit
max 0.64 0.42 0.31 1.62 1.22
A
A
b
D
E
e
e
e
2
e
3
1
1
nom
min
mm
0.61 0.41 0.26 1.57 1.17 0.40 0.40 0.80 0.80
0.58 0.40 0.21 1.52 1.12
pcmf2usb3b-c_po
Issue date
References
Outline
version
European
projection
IEC
JEDEC
JEITA
18-03-23
PCMF2USB3B/C
Fig. 21. Package outline WLCSP10
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PCMFxUSB3B/C_SER
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Nexperia B.V. 2019. All rights reserved
Product data sheet
Rev. 2 — 29 January 2019
14 / 20
Nexperia
PCMFxUSB3B/C series
Common-mode EMI filter for differential channels with integrated bidirectional ESD protection
WLCSP15: wafer level chip-size package; 15 bumps (6-3-6)
PCMF3USB3B/C
D
bump A1
index area
A
1
E
A
detail X
e
1/2 e
b
C
B
A
e
1
B1
B2
B3
e
2
1
2
3
4
5
6
bump A1
index area
e
3
X
0
1 mm
scale
Dimensions (mm are the original dimensions)
Unit
max 0.64 0.42 0.31 2.42 1.22
A
A
b
D
E
e
e
e
2
e
3
1
1
nom
min
mm
0.61 0.41 0.26 2.37 1.17 0.40 0.40 0.80 0.80
0.58 0.40 0.21 2.32 1.12
pcmf3usb3b-c_po
Issue date
References
Outline
version
European
projection
IEC
JEDEC
JEITA
18-03-23
PCMF3USB3B/C
Fig. 22. Package outline WLCSP15
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PCMFxUSB3B/C_SER
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Product data sheet
Rev. 2 — 29 January 2019
15 / 20
Nexperia
PCMFxUSB3B/C series
Common-mode EMI filter for differential channels with integrated bidirectional ESD protection
11. Soldering
WLCSP5: Solder footprint and stencil aperture
PCMF1USB3B/C
Hx
P
see
detail X
P
solder land (SL)
Hy
solder paste deposit (SP)
solder land plus solder paste
solder resist opening (SR)
occupied area
SL = SP
SR
detail X
Dimensions in mm
recommend stencil thickness: 0.1 mm
18-03-23
P
SL SP SR Hx Hy
0.40 0.25 0.25 0.325 1.00 1.40
pcmf1usb3b-c_fr
Fig. 23. Soldering footprint WLCSP5 (PCMF1USB3B/C)
WLCSP10: Solder footprint and stencil aperture
PCMF2USB3B/C
Hx
P
see
detail X
P
solder land (SL)
Hy
solder paste deposit (SP)
solder land plus solder paste
solder resist opening (SR)
occupied area
SL = SP
SR
P1
detail X
Dimensions in mm
recommend stencil thickness: 0.1 mm
18-03-23
P
P1
SL SP SR Hx
Hy
0.40 0.80 0.25 0.25 0.325 1.80 1.40
pcmf2usb3b-c_fr
Fig. 24. Soldering footprint WLCSP10 (PCMF2USB3B/C)
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PCMFxUSB3B/C_SER
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Product data sheet
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16 / 20
Nexperia
PCMFxUSB3B/C series
Common-mode EMI filter for differential channels with integrated bidirectional ESD protection
WLCSP15: Solder footprint and stencil aperture
PCMF3USB3B/C
Hx
P
see
detail X
P
solder land (SL)
Hy
solder paste deposit (SP)
solder land plus solder paste
solder resist opening (SR)
occupied area
SL = SP
SR
P1
detail X
Dimensions in mm
recommend stencil thickness: 0.1 mm
18-03-23
P
P1
SL SP SR Hx
Hy
0.40 0.80 0.25 0.25 0.325 2.60 1.40
pcmf3usb3b-c_fr
Fig. 25. Soldering footprint WLCSP15 (PCMF3USB3B/C)
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PCMFxUSB3B/C_SER
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Product data sheet
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Nexperia
PCMFxUSB3B/C series
Common-mode EMI filter for differential channels with integrated bidirectional ESD protection
12. Revision history
Table 8. Revision history
Document ID
Release
date
Data sheet status
Change
notice
Supersedes
PCMFxUSB3B_C_SER v.2
Modifications:
20190129
Product data sheet
-
PCMFxUSB3B_C_SER v.1
•
•
•
Limiting values: Tamb updated.
Channel characteristics: Sentence inserted; RS(ch) inserted.
Frequency characteristics: Sentence inserted; Fig 2 updated.
PCMFxUSB3B_C_SER v.1
20180507
Product data sheet
-
-
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PCMFxUSB3B/C_SER
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Product data sheet
Rev. 2 — 29 January 2019
18 / 20
Nexperia
PCMFxUSB3B/C series
Common-mode EMI filter for differential channels with integrated bidirectional ESD protection
injury, death or severe property or environmental damage. Nexperia and its
suppliers accept no liability for inclusion and/or use of Nexperia products in
such equipment or applications and therefore such inclusion and/or use is at
the customer’s own risk.
13. Legal information
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Data sheet status
Document status Product
Definition
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. Nexperia makes no representation
or warranty that such applications will be suitable for the specified use
without further testing or modification.
[1][2]
status [3]
Objective [short]
data sheet
Development
This document contains data from
the objective specification for
product development.
Customers are responsible for the design and operation of their applications
and products using Nexperia products, and Nexperia accepts no liability for
any assistance with applications or customer product design. It is customer’s
sole responsibility to determine whether the Nexperia product is suitable
and fit for the customer’s applications and products planned, as well as
for the planned application and use of customer’s third party customer(s).
Customers should provide appropriate design and operating safeguards to
minimize the risks associated with their applications and products.
Preliminary [short]
data sheet
Qualification
Production
This document contains data from
the preliminary specification.
Product [short]
data sheet
This document contains the product
specification.
[1] Please consult the most recently issued document before initiating or
completing a design.
Nexperia does not accept any liability related to any default, damage, costs
or problem which is based on any weakness or default in the customer’s
applications or products, or the application or use by customer’s third party
customer(s). Customer is responsible for doing all necessary testing for the
customer’s applications and products using Nexperia products in order to
avoid a default of the applications and the products or of the application or
use by customer’s third party customer(s). Nexperia does not accept any
liability in this respect.
[2] The term 'short data sheet' is explained in section "Definitions".
[3] The product status of device(s) described in this document may have
changed since this document was published and may differ in case of
multiple devices. The latest product status information is available on
the internet at https://www.nexperia.com.
Definitions
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those
given in the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
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Trademarks
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©
PCMFxUSB3B/C_SER
All information provided in this document is subject to legal disclaimers.
Nexperia B.V. 2019. All rights reserved
Product data sheet
Rev. 2 — 29 January 2019
19 / 20
Nexperia
PCMFxUSB3B/C series
Common-mode EMI filter for differential channels with integrated bidirectional ESD protection
Contents
1. General description......................................................1
2. Features and benefits.................................................. 1
3. Applications.................................................................. 1
4. Pinning information......................................................2
5. Ordering information....................................................3
6. Marking..........................................................................3
7. Limiting values............................................................. 3
8. Characteristics..............................................................4
8.1. Channel characteristics............................................... 4
8.2. Frequency characteristics............................................4
9. Application information............................................. 12
10. Package outline........................................................ 13
11. Soldering................................................................... 16
12. Revision history........................................................18
13. Legal information......................................................19
© Nexperia B.V. 2019. All rights reserved
For more information, please visit: http://www.nexperia.com
For sales office addresses, please send an email to: salesaddresses@nexperia.com
Date of release: 29 January 2019
©
PCMFxUSB3B/C_SER
All information provided in this document is subject to legal disclaimers.
Nexperia B.V. 2019. All rights reserved
Product data sheet
Rev. 2 — 29 January 2019
20 / 20
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Common-mode EMI filter for differential channels with integrated bidirectional ESD protectionProduction
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PCMF3USB3S
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