PDTA144TM [NEXPERIA]
PNP resistor-equipped transistors; R1 = 47 kOhm, R2 = openProduction;
| 型号： | PDTA144TM |
| 厂家： | 
Nexperia |
| 描述： | PNP resistor-equipped transistors; R1 = 47 kOhm, R2 = openProduction 开关 晶体管 |
| 文件： | 总15页 (文件大小：396K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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DISCRETE SEMICONDUCTORS
DATA SHEET
PDTA144T series
PNP resistor-equipped transistors;
R1 = 47 kΩ, R2 = open
Product data sheet
2004 Aug 05
Supersedes data of 2004 Apr 27
NXP Semiconductors
Product data sheet
PNP resistor-equipped transistors;
R1 = 47 kΩ, R2 = open
PDTA144T series
FEATURES
QUICK REFERENCE DATA
• Built-in bias resistors
SYMBOL
PARAMETER
TYP. MAX. UNIT
• Simplified circuit design
VCEO
collector-emitter
voltage
−
−50
V
• Reduction of component count
• Reduced pick and place costs.
IO
output current (DC)
bias resistor
open
−
−100 mA
R1
R2
47
−
−
−
kΩ
−
APPLICATIONS
• General purpose switching and amplification
• Inverter and interface circuits
• Circuit driver.
DESCRIPTION
PNP resistor-equipped transistor (see “Simplified outline,
symbol and pinning” for package details).
PRODUCT OVERVIEW
PACKAGE
TYPE NUMBER
MARKING CODE
NPN COMPLEMENT
PHILIPS
EIAJ
PDTA144TE
PDTA144TEF
PDTA144TK
PDTA144TM
PDTA144TS
PDTA144TT
PDTA144TU
SOT416
SOT490
SC-75
SC-89
SC-59
SC-101
SC-43
−
5B
2M
PDTC144TE
PDTC144TEF
PDTC144TK
PDTC144TM
PDTC144TS
PDTC144TT
PDTC144TU
SOT346
58
SOT883
F9
SOT54 (TO-92)
SOT23
TA144T
*AF(1)
*7A(1)
SOT323
SC-70
Note
1. * = p: Made in Hong Kong.
* = t: Made in Malaysia.
* = W: Made in China.
2004 Aug 05
2
NXP Semiconductors
Product data sheet
PNP resistor-equipped transistors;
R1 = 47 kΩ, R2 = open
PDTA144T series
SIMPLIFIED OUTLINE, SYMBOL AND PINNING
PINNING
TYPE NUMBER
SIMPLIFIED OUTLINE AND SYMBOL
PIN
1
DESCRIPTION
base
PDTA144TS
2
collector
emitter
3
handbook, halfpage
2
3
1
2
3
R1
1
MAM352
PDTA144TE
PDTA144TEF
PDTA144TK
PDTA144TT
PDTA144TU
1
2
3
base
emitter
collector
handbook, halfpage
3
3
2
R1
1
1
2
Top view
MDB272
PDTA144TM
1
2
3
base
emitter
collector
handbook, halfpage
3
R1
2
1
3
1
2
Bottom view
MDB268
2004 Aug 05
3
NXP Semiconductors
Product data sheet
PNP resistor-equipped transistors;
R1 = 47 kΩ, R2 = open
PDTA144T series
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
DESCRIPTION
VERSION
PDTA144TE
PDTA144TEF
PDTA144TK
PDTA144TM
−
−
−
−
plastic surface mounted package; 3 leads
plastic surface mounted package; 3 leads
plastic surface mounted package; 3 leads
SOT416
SOT490
SOT346
SOT883
leadless ultra small plastic package; 3 solder lands;
body 1.0 × 0.6 × 0.5 mm
PDTA144TS
PDTA144TT
PDTA144TU
−
−
−
plastic single-ended leaded (through hole) package; 3 leads
plastic surface mounted package; 3 leads
SOT54
SOT23
SOT323
plastic surface mounted package; 3 leads
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
PARAMETER
CONDITIONS
open emitter
MIN.
MAX.
−50
UNIT
VCBO
VCEO
VEBO
IO
collector-base voltage
collector-emitter voltage
emitter-base voltage
output current (DC)
peak collector current
total power dissipation
SOT23
−
−
−
−
−
V
open base
−50
−5
V
open collector
V
−100
−100
mA
mA
ICM
Ptot
Tamb ≤ 25 °C
note 1
−
−
−
−
−
−
−
250
500
200
250
150
250
250
+150
150
+150
mW
mW
mW
mW
mW
mW
mW
°C
SOT54
note 1
SOT323
note 1
SOT346
note 1
SOT416
note 1
SOT490
notes 1 and 2
notes 2 and 3
SOT883
Tstg
Tj
storage temperature
junction temperature
operating ambient temperature
−65
−
°C
Tamb
−65
°C
Notes
1. Refer to standard mounting conditions.
2. Reflow soldering is the only recommended soldering method.
3. Refer to SOT883 standard mounting conditions; FR4 with 60 μm copper strip line.
2004 Aug 05
4
NXP Semiconductors
Product data sheet
PNP resistor-equipped transistors;
R1 = 47 kΩ, R2 = open
PDTA144T series
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
in free air
VALUE
UNIT
Rth(j-a)
thermal resistance from junction to ambient
SOT23
note 1
500
250
625
500
833
500
500
K/W
K/W
K/W
K/W
K/W
K/W
K/W
SOT54
note 1
SOT323
SOT346
SOT416
SOT490
SOT883
note 1
note 1
note 1
notes 1 and 2
notes 2 and 3
Notes
1. Refer to standard mounting conditions.
2. Reflow soldering is the only recommended soldering method.
3. Refer to SOT883 standard mounting conditions; FR4 with 60 μm copper strip line.
CHARACTERISTICS
Tamb = 25 °C unless otherwise specified.
SYMBOL
ICBO
PARAMETER
CONDITIONS
MIN.
TYP. MAX. UNIT
collector-base cut-off current
collector-emitter cut-off current
VCB = −50 V; IE = 0 A
−
−
−100
−1
nA
μA
μA
nA
ICEO
VCE = −30 V; IB = 0 A
−
−
VCE = −30 V; IB = 0; Tj = 150 °C
VEB = −5 V; IC = 0 A
−
−
−50
−100
−
IEBO
hFE
emitter-base cut-off current
DC current gain
−
−
VCE = −5 V; IC = −1 mA
100
−
−
VCEsat
R1
collector-emitter saturation voltage IC = −10 mA; IB = −0.5 mA
−
−150
61
mV
kΩ
pF
input resistor
33
−
47
−
Cc
collector capacitance
IE = ie = 0; VCB = −10 V;
3
f = 1 MHz
2004 Aug 05
5
NXP Semiconductors
Product data sheet
PNP resistor-equipped transistors;
R1 = 47 kΩ, R2 = open
PDTA144T series
PACKAGE OUTLINES
Plastic single-ended leaded (through hole) package; 3 leads
SOT54
c
E
d
A
L
b
1
2
e
1
e
D
3
b
1
L
1
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
L
1
UNIT
A
b
b
c
D
d
E
e
e
L
1
1
max.
5.2
5.0
0.48
0.40
0.66
0.55
0.45
0.38
4.8
4.4
1.7
1.4
4.2
3.6
14.5
12.7
mm
2.54
1.27
2.5
Note
1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
04-06-28
04-11-16
SOT54
TO-92
SC-43A
2004 Aug 05
6
NXP Semiconductors
Product data sheet
PNP resistor-equipped transistors;
R1 = 47 kΩ, R2 = open
PDTA144T series
Plastic surface-mounted package; 3 leads
SOT23
D
B
E
A
X
H
v
M
A
E
3
Q
A
A
1
c
1
2
e
b
w M
B
1
L
p
p
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
A
1
UNIT
b
c
D
E
e
e
H
L
Q
v
w
A
p
p
1
E
max.
1.1
0.9
0.48
0.38
0.15
0.09
3.0
2.8
1.4
1.2
2.5
2.1
0.45
0.15
0.55
0.45
mm
0.1
1.9
0.95
0.2
0.1
REFERENCES
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
JEDEC
JEITA
04-11-04
06-03-16
SOT23
TO-236AB
2004 Aug 05
7
NXP Semiconductors
Product data sheet
PNP resistor-equipped transistors;
R1 = 47 kΩ, R2 = open
PDTA144T series
Plastic surface-mounted package; 3 leads
SOT346
E
A
D
B
X
H
v
M
A
E
3
Q
A
A
1
c
1
2
L
p
e
b
w M
B
1
p
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
b
c
D
E
e
e
H
L
Q
v
w
A
p
1
p
1
E
1.3
1.0
0.1
0.013
0.50
0.35
0.26
0.10
3.1
2.7
1.7
1.3
3.0
2.5
0.6
0.2
0.33
0.23
mm
1.9
0.95
0.2
0.2
REFERENCES
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
JEDEC
JEITA
04-11-11
06-03-16
SOT346
TO-236
SC-59A
2004 Aug 05
8
NXP Semiconductors
Product data sheet
PNP resistor-equipped transistors;
R1 = 47 kΩ, R2 = open
PDTA144T series
Plastic surface-mounted package; 3 leads
SOT323
D
B
E
A
X
H
y
v M
A
E
3
Q
A
A
1
c
1
2
L
p
e
b
w
M B
1
p
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
A
1
max
A
UNIT
b
c
D
E
e
e
H
E
L
Q
v
w
p
p
1
1.1
0.8
0.4
0.3
0.25
0.10
2.2
1.8
1.35
1.15
2.2
2.0
0.45
0.15
0.23
0.13
mm
0.1
1.3
0.65
0.2
0.2
REFERENCES
JEDEC JEITA
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
04-11-04
06-03-16
SOT323
SC-70
2004 Aug 05
9
NXP Semiconductors
Product data sheet
PNP resistor-equipped transistors;
R1 = 47 kΩ, R2 = open
PDTA144T series
Plastic surface-mounted package; 3 leads
SOT416
D
B
E
A
X
H
v
M
A
E
3
Q
A
A
1
1
2
c
e
b
w
M
B
1
p
L
p
e
detail X
0
0.5
1 mm
scale
DIMENSIONS (mm are the original dimensions)
A
1
A
UNIT
b
c
D
E
e
e
H
L
p
Q
v
w
p
1
E
max
0.30
0.15
0.25
0.10
1.8
1.4
0.9
0.7
1.75
1.45
0.45
0.15
0.23
0.13
0.95
0.60
mm
0.1
1
0.5
0.2
0.2
REFERENCES
JEDEC JEITA
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
04-11-04
06-03-16
SOT416
SC-75
2004 Aug 05
10
NXP Semiconductors
Product data sheet
PNP resistor-equipped transistors;
R1 = 47 kΩ, R2 = open
PDTA144T series
Plastic surface-mounted package; 3 leads
SOT490
D
B
E
A
X
H
v
M
A
E
3
A
c
1
2
e
b
w M
1
B
p
L
p
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
b
c
D
E
e
e
H
L
v
w
A
p
p
1
E
0.8
0.6
0.33
0.23
0.2
0.1
1.7
1.5
0.95
0.75
1.7
1.5
0.5
0.3
mm
1.0
0.5
0.1
0.1
REFERENCES
JEDEC JEITA
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
05-07-28
06-03-16
SOT490
SC-89
2004 Aug 05
11
NXP Semiconductors
Product data sheet
PNP resistor-equipped transistors;
R1 = 47 kΩ, R2 = open
PDTA144T series
Leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.5 mm
SOT883
L
L
1
2
b
3
b
e
1
1
e
1
A
A
1
E
D
0
0.5
1 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
1
UNIT
A
b
b
D
E
e
e
L
L
1
1
1
max.
0.50
0.46
0.20 0.55 0.62 1.02
0.12 0.47 0.55 0.95
0.30 0.30
0.22 0.22
mm
0.03
0.35 0.65
Note
1. Including plating thickness
REFERENCES
JEDEC
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEITA
03-02-05
03-04-03
SOT883
SC-101
2004 Aug 05
12
NXP Semiconductors
Product data sheet
PNP resistor-equipped transistors;
R1 = 47 kΩ, R2 = open
PDTA144T series
DATA SHEET STATUS
DOCUMENT
STATUS(1)
PRODUCT
STATUS(2)
DEFINITION
Objective data sheet
Development
This document contains data from the objective specification for product
development.
Preliminary data sheet
Product data sheet
Qualification
Production
This document contains data from the preliminary specification.
This document contains the product specification.
Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
DISCLAIMERS
above those given in the Characteristics sections of this
document is not implied. Exposure to limiting values for
extended periods may affect device reliability.
General ⎯ Information in this document is believed to be
accurate and reliable. However, NXP Semiconductors
does not give any representations or warranties,
expressed or implied, as to the accuracy or completeness
of such information and shall have no liability for the
consequences of use of such information.
Terms and conditions of sale ⎯ NXP Semiconductors
products are sold subject to the general terms and
conditions of commercial sale, as published at
http://www.nxp.com/profile/terms, including those
pertaining to warranty, intellectual property rights
infringement and limitation of liability, unless explicitly
otherwise agreed to in writing by NXP Semiconductors. In
case of any inconsistency or conflict between information
in this document and such terms and conditions, the latter
will prevail.
Right to make changes ⎯ NXP Semiconductors
reserves the right to make changes to information
published in this document, including without limitation
specifications and product descriptions, at any time and
without notice. This document supersedes and replaces all
information supplied prior to the publication hereof.
No offer to sell or license ⎯ Nothing in this document
may be interpreted or construed as an offer to sell products
that is open for acceptance or the grant, conveyance or
implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use ⎯ NXP Semiconductors products are
not designed, authorized or warranted to be suitable for
use in medical, military, aircraft, space or life support
equipment, nor in applications where failure or malfunction
of an NXP Semiconductors product can reasonably be
expected to result in personal injury, death or severe
property or environmental damage. NXP Semiconductors
accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at
the customer’s own risk.
Export control ⎯ This document as well as the item(s)
described herein may be subject to export control
regulations. Export might require a prior authorization from
national authorities.
Quick reference data ⎯ The Quick reference data is an
extract of the product data given in the Limiting values and
Characteristics sections of this document, and as such is
not complete, exhaustive or legally binding.
Applications ⎯ Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values ⎯ Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC 60134) may cause permanent damage to
the device. Limiting values are stress ratings only and
operation of the device at these or any other conditions
2004 Aug 05
13
NXP Semiconductors
Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal
definitions and disclaimers. No changes were made to the technical content, except for package outline
drawings which were updated to the latest version.
Contact information
For additional information please visit: http://www.nxp.com
For sales offices addresses send e-mail to: salesaddresses@nxp.com
© NXP B.V. 2009
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R75/03/pp14
Date of release: 2004 Aug 05
Document order number: 9397 750 13661
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