PIMC31 [NEXPERIA]

500 mA, 50 V NPN/PNP double resistor-equipped transistor; R1 = 1 kOhm, R2 = 10 kOhmProduction;


型号：	PIMC31
厂家：	Nexperia
描述：	500 mA, 50 V NPN/PNP double resistor-equipped transistor; R1 = 1 kOhm, R2 = 10 kOhmProduction 开关光电二极管晶体管
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Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on

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PIMC31

500 mA, 50 V NPN/PNP double resistor-equipped transistor;

R1 = 1 kΩ, R2 = 10 kΩ

Rev. 01 — 24 March 2009

Product data sheet

1. Product proﬁle

1.1 General description

500 mA, 50 V NPN/PNP double Resistor-Equipped Transistor (RET) in a small

SOT457 (SC-74) Surface-Mounted Device (SMD) plastic package.

NPN/NPN complement: PIMN31

1.2 Features

I 500 mA output current capability

I Built-in bias resistors

I Simpliﬁes circuit design

I Reduces component count

I Reduces pick and place costs

I AEC-Q101 qualiﬁed

1.3 Applications

I Digital application in automotive and industrial segments

I Switching loads

1.4 Quick reference data

Table 1.

Symbol

Quick reference data

Parameter

Conditions

Min

Typ

Max Unit

Per transistor; for the PNP transistor with negative polarity

V_CEO

I_O

collector-emitter voltage open base

output current

500

1.3

kΩ

bias resistor 1 (input)

bias resistor ratio

0.7

R2/R1

PIMC31

NXP Semiconductors

500 mA, 50 V NPN/PNP double RET; R1 = 1 kΩ, R2 = 10 kΩ

2. Pinning information

Table 2.

Pinning

Description

Simpliﬁed outline

Graphic symbol

GND (emitter) TR1

input (base) TR1

output (collector) TR2

GND (emitter) TR2

input (base) TR2

output (collector) TR1

TR2

TR1

006aaa143

3. Ordering information

Table 3.

Ordering information

Type number Package

Name

Description

Version

PIMC31

SC-74

plastic surface-mounted package (TSOP6); 6 leads

SOT457

4. Marking

Table 4.

Marking codes

Type number

Marking code

PIMC31

5. Limiting values

Table 5.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Parameter

Conditions

Min

Max

Unit

Per transistor; for the PNP transistor with negative polarity

V_CBO

V_CEO

V_EBO

V_I

collector-base voltage

collector-emitter voltage

emitter-base voltage

input voltage TR1

positive

open emitter

open base

open collector

+10

negative

−5

input voltage TR2

positive

negative

−10

PIMC31_1

Product data sheet

Rev. 01 — 24 March 2009

2 of 13

PIMC31

NXP Semiconductors

500 mA, 50 V NPN/PNP double RET; R1 = 1 kΩ, R2 = 10 kΩ

Table 5.

Limiting values …continued

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

I_O

Parameter

Conditions

Min

Max

500

290

Unit

output current

[1]

P_tot

total power dissipation

_amb≤ 25 °C

Per device

P_tot

total power dissipation

junction temperature

ambient temperature

storage temperature

420

°C

T_j

150

T_amb

T_stg

−55

−65

+150

°C

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard

footprint.

006aab531

500

tot

(mW)

400

300

200

100

−75

−25

125

175

(°C)

amb

FR4 PCB, standard footprint

Fig 1. Power derating curve

6. Thermal characteristics

Table 6.

Symbol

Per transistor

Thermal characteristics

Parameter

Conditions

Min

Typ

Max Unit

[1]

R_th(j-a)

thermal resistance from

junction to ambient

in free air

431

105

K/W

R_th(j-sp)

thermal resistance from

junction to solder point

Per device

R_th(j-a)

thermal resistance from

junction to ambient

in free air

298

K/W

[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

PIMC31_1

Product data sheet

Rev. 01 — 24 March 2009

3 of 13

PIMC31

NXP Semiconductors

500 mA, 50 V NPN/PNP double RET; R1 = 1 kΩ, R2 = 10 kΩ

006aaa494

δ = 1

th(j-a)

0.75

0.33

(K/W)

0.50

0.20

0.10

0.05

0.02

0.01

−5

−4

−3

−2

−1

(s)

FR4 PCB, standard footprint

Fig 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

7. Characteristics

Table 7.

Characteristics

T_amb= 25 °C unless otherwise speciﬁed.

Symbol Parameter Conditions

Per transistor; for the PNP transistor with negative polarity

Min

Typ

Max Unit

I_CBO

I_CEO

I_EBO

collector-base cut-off V_CB= 50 V; I_E= 0 A

current

100

0.5

collector-emitter

cut-off current

V_CE= 50 V; I_B= 0 A

µA

emitter-base cut-off

current

V_EB= 5 V; I_C= 0 A

0.72 mA

h_FE

DC current gain

V_CE= 5 V; I_C= 50 mA

I_C= 50 mA; I_B= 2.5 mA

V_CEsat

collector-emitter

0.3

saturation voltage

V_I(off)

V_I(on)

off-state input voltage V_CE= 5 V; I_C= 100 µA

on-state input voltage V_CE= 0.3 V; I_C= 20 mA

bias resistor 1 (input)

0.3

0.4

0.7

0.6

0.8

1.4

1.3

kΩ

R2/R1

C_c

bias resistor ratio

collector capacitance V_CB= 10 V; I_E= i_e= 0 A;

f = 1 MHz

TR1 (NPN)

TR2 (PNP)

PIMC31_1

Product data sheet

Rev. 01 — 24 March 2009

4 of 13

PIMC31

NXP Semiconductors

500 mA, 50 V NPN/PNP double RET; R1 = 1 kΩ, R2 = 10 kΩ

006aaa315

006aaa314

−1

(1)

(2)

(1)

(2)

(3)

CEsat

(V)

(3)

−2

−1

(mA)

V_CE= 5 V

I_C/I_B= 20

(1) T_amb= 100 °C

(2) T_amb= 25 °C

(3) T_amb= −40 °C

(1) T_amb= 100 °C

(2) T_amb= 25 °C

(3) T_amb= −40 °C

Fig 3. TR1 (NPN): DC current gain as a function of

collector current; typical values

Fig 4. TR1 (NPN): Collector-emitter saturation

voltage as a function of collector current;

typical values

006aab055

CEsat

(V)

(1)

(2)

(3)

−1

−2

(mA)

I_C/I_B= 50

(1) T_amb= 100 °C

(2) T_amb= 25 °C

(3) T_amb= −40 °C

Fig 5. TR1 (NPN): Collector-emitter saturation voltage as a function of collector current; typical values

PIMC31_1

Product data sheet

Rev. 01 — 24 March 2009

5 of 13

PIMC31

NXP Semiconductors

500 mA, 50 V NPN/PNP double RET; R1 = 1 kΩ, R2 = 10 kΩ

006aaa317

006aaa316

(1)

(2)

I(off)

I(on)

(V)

(3)

(1)

(2)

(3)

−1

(mA)

V_CE= 0.3 V

V_CE= 5 V

(1) T_amb= −40 °C

(2) T_amb= 25 °C

(3) T_amb= 100 °C

(1) T_amb= −40 °C

(2) T_amb= 25 °C

(3) T_amb= 100 °C

Fig 6. TR1 (NPN): On-state input voltage as a

function of collector current; typical values

Fig 7. TR1 (NPN): Off-state input voltage as a

function of collector current; typical values

PIMC31_1

Product data sheet

Rev. 01 — 24 March 2009

6 of 13

PIMC31

NXP Semiconductors

500 mA, 50 V NPN/PNP double RET; R1 = 1 kΩ, R2 = 10 kΩ

006aaa349

006aaa350

−1

−10

(1)

(2)

(3)

(1)

(2)

CEsat

(V)

(3)

−2

−10

−1

−10

−1

−10

(mA)

I (mA)

V_CE= −5 V

I_C/I_B= 20

(1) T_amb= 100 °C

(2) T_amb= 25 °C

(3) T_amb= −40 °C

(1) T_amb= 100 °C

(2) T_amb= 25 °C

(3) T_amb= −40 °C

Fig 8. TR2 (PNP): DC current gain as a function of

collector current; typical values

Fig 9. TR2 (PNP): Collector-emitter saturation

voltage as a function of collector current;

typical values

006aab428

−1

CEsat

(V)

(1)

(2)

(3)

−1

−10

−2

−10

−1

−10

(mA)

I_C/I_B= 50

(1) T_amb= 100 °C

(2) T_amb= 25 °C

(3) T_amb= −40 °C

Fig 10. TR2 (PNP): Collector-emitter saturation voltage as a function of collector current; typical values

PIMC31_1

Product data sheet

Rev. 01 — 24 March 2009

7 of 13

PIMC31

NXP Semiconductors

500 mA, 50 V NPN/PNP double RET; R1 = 1 kΩ, R2 = 10 kΩ

006aaa351

006aaa352

−10

I(on)

I(off)

(V)

(1)

(2)

(3)

(1)

(2)

(3)

−1

−10

−1

−10

−1

−10

−1

−10

(mA)

I (mA)

V_CE= −0.3 V

V_CE= −5 V

(1) T_amb= −40 °C

(2) T_amb= 25 °C

(3) T_amb= 100 °C

(1) T_amb= −40 °C

(2) T_amb= 25 °C

(3) T_amb= 100 °C

Fig 11. TR2 (PNP): On-state input voltage as a

function of collector current; typical values

Fig 12. TR2 (PNP): Off-state input voltage as a

function of collector current; typical values

PIMC31_1

Product data sheet

Rev. 01 — 24 March 2009

8 of 13

PIMC31

NXP Semiconductors

500 mA, 50 V NPN/PNP double RET; R1 = 1 kΩ, R2 = 10 kΩ

8. Test information

8.1 Quality information

This product has been qualiﬁed in accordance with the Automotive Electronics Council

(AEC) standard Q101 - Stress test qualiﬁcation for discrete semiconductors, and is

suitable for use in automotive applications.

9. Package outline

3.1

2.7

1.1

0.9

0.6

0.2

3.0 1.7

2.5 1.3

pin 1 index

0.26

0.10

0.40

0.25

0.95

1.9

Dimensions in mm

04-11-08

Fig 13. Package outline SOT457 (SC-74)

10. Packing information

Table 8.

Packing methods

The indicated -xxx are the last three digits of the 12NC ordering code.^[1]

Type number Package

Description

Packing quantity

3000

10000

-135

[2]

[3]

PIMC31

SOT457

4 mm pitch, 8 mm tape and reel; T1

4 mm pitch, 8 mm tape and reel; T2

-115

-125

-165

[1] For further information and the availability of packing methods, see Section 14.

[2] T1: normal taping

[3] T2: reverse taping

PIMC31_1

Product data sheet

Rev. 01 — 24 March 2009

9 of 13

PIMC31

NXP Semiconductors

500 mA, 50 V NPN/PNP double RET; R1 = 1 kΩ, R2 = 10 kΩ

11. Soldering

3.45

1.95

0.55

(6×)

solder lands

solder resist

0.45

(6×)

0.95

3.3 2.825

solder paste

occupied area

0.7

Dimensions in mm

(6×)

0.8

(6×)

2.4

sot457_fr

Fig 14. Reﬂow soldering footprint SOT457 (SC-74)

5.3

1.5

(4×)

solder lands

solder resist

occupied area

1.475

0.45

(2×)

5.05

Dimensions in mm

preferred transport

direction during soldering

1.45

(6×)

2.85

sot457_fw

Fig 15. Wave soldering footprint SOT457 (SC-74)

PIMC31_1

Product data sheet

Rev. 01 — 24 March 2009

10 of 13

PIMC31

NXP Semiconductors

500 mA, 50 V NPN/PNP double RET; R1 = 1 kΩ, R2 = 10 kΩ

12. Revision history

Table 9.

Revision history

Document ID

Release date

Data sheet status

Change notice

Supersedes

PIMC31_1

20090324

Product data sheet

PIMC31_1

Product data sheet

Rev. 01 — 24 March 2009

11 of 13

PIMC31

NXP Semiconductors

500 mA, 50 V NPN/PNP double RET; R1 = 1 kΩ, R2 = 10 kΩ

13. Legal information

13.1 Data sheet status

Document status^[1][2]

Product status^[3]

Development

Deﬁnition

Objective [short] data sheet

This document contains data from the objective speciﬁcation for product development.

This document contains data from the preliminary speciﬁcation.

This document contains the product speciﬁcation.

Preliminary [short] data sheet Qualiﬁcation

Product [short] data sheet Production

[1]

[2]

[3]

Please consult the most recently issued document before initiating or completing a design.

The term ‘short data sheet’ is explained in section “Deﬁnitions”.

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

damage. NXP Semiconductors accepts no liability for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

13.2 Deﬁnitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modiﬁcations or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

speciﬁed use without further testing or modiﬁcation.

Limiting values — Stress above one or more limiting values (as deﬁned in

the Absolute Maximum Ratings System of IEC 60134) may cause permanent

damage to the device. Limiting values are stress ratings only and operation of

the device at these or any other conditions above those given in the

Characteristics sections of this document is not implied. Exposure to limiting

values for extended periods may affect device reliability.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

ofﬁce. In case of any inconsistency or conﬂict with the short data sheet, the

full data sheet shall prevail.

Terms and conditions of sale — NXP Semiconductors products are sold

subject to the general terms and conditions of commercial sale, as published

at http://www.nxp.com/proﬁle/terms, including those pertaining to warranty,

intellectual property rights infringement and limitation of liability, unless

explicitly otherwise agreed to in writing by NXP Semiconductors. In case of

any inconsistency or conﬂict between information in this document and such

terms and conditions, the latter will prevail.

13.3 Disclaimers

General — Information in this document is believed to be accurate and

reliable. However, NXP Semiconductors does not give any representations or

warranties, expressed or implied, as to the accuracy or completeness of such

information and shall have no liability for the consequences of use of such

information.

No offer to sell or license — Nothing in this document may be interpreted

or construed as an offer to sell products that is open for acceptance or the

grant, conveyance or implication of any license under any copyrights, patents

or other industrial or intellectual property rights.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation speciﬁcations and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from national authorities.

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in medical, military, aircraft,

space or life support equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

13.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

14. Contact information

For more information, please visit: http://www.nxp.com

For sales ofﬁce addresses, please send an email to: salesaddresses@nxp.com

PIMC31_1

Product data sheet

Rev. 01 — 24 March 2009

12 of 13

PIMC31

NXP Semiconductors

500 mA, 50 V NPN/PNP double RET; R1 = 1 kΩ, R2 = 10 kΩ

15. Contents

Product proﬁle . . . . . . . . . . . . . . . . . . . . . . . . . . 1

General description. . . . . . . . . . . . . . . . . . . . . . 1

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Quick reference data. . . . . . . . . . . . . . . . . . . . . 1

1.1

1.2

1.3

1.4

Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

Ordering information. . . . . . . . . . . . . . . . . . . . . 2

Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2

Thermal characteristics. . . . . . . . . . . . . . . . . . . 3

Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4

Test information. . . . . . . . . . . . . . . . . . . . . . . . . 9

Quality information . . . . . . . . . . . . . . . . . . . . . . 9

Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9

Packing information. . . . . . . . . . . . . . . . . . . . . . 9

Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Revision history. . . . . . . . . . . . . . . . . . . . . . . . 11

8.1

Legal information. . . . . . . . . . . . . . . . . . . . . . . 12

Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12

Deﬁnitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12

13.1

13.2

13.3

13.4

Contact information. . . . . . . . . . . . . . . . . . . . . 12

Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 24 March 2009

Document identifier: PIMC31_1

PIMC31 [NEXPERIA]

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