PIMN31 [NEXPERIA]
500 mA, 50 V NPN/NPN double resistor-equipped transistor; R1 = 1 kOhm, R2 = 10 kOhmProduction;型号: | PIMN31 |
厂家: | Nexperia |
描述: | 500 mA, 50 V NPN/NPN double resistor-equipped transistor; R1 = 1 kOhm, R2 = 10 kOhmProduction |
文件: | 总12页 (文件大小:204K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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PIMN31
500 mA, 50 V NPN/NPN double resistor-equipped transistor;
R1 = 1 kΩ, R2 = 10 kΩ
Rev. 01 — 19 June 2007
Product data sheet
1. Product profile
1.1 General description
500 mA, 50 V NPN/NPN double Resistor-Equipped Transistor (RET) in a small
SOT457 (SC-74) Surface-Mounted Device (SMD) plastic package.
1.2 Features
I 500 mA output current capability
I Built-in bias resistors
I Simplifies circuit design
I Reduces component count
I Reduces pick and place costs
I AEC-Q101 qualified
1.3 Applications
I Digital application in automotive and industrial segments
I Switching loads
1.4 Quick reference data
Table 1.
Symbol
Quick reference data
Parameter
Conditions
Min
Typ
Max Unit
Per transistor
VCEO
IO
collector-emitter voltage open base
output current
-
-
50
V
-
-
500
1.3
11
mA
kΩ
R1
bias resistor 1 (input)
bias resistor ratio
0.7
9
1
10
R2/R1
PIMN31
NXP Semiconductors
500 mA, 50 V NPN/NPN double RET; R1 = 1 kΩ, R2 = 10 kΩ
2. Pinning information
Table 2.
Pinning
Pin
1
Description
Simplified outline
Symbol
GND (emitter) TR1
input (base) TR1
output (collector) TR2
GND (emitter) TR2
input (base) TR2
output (collector) TR1
6
5
4
6
5
4
2
3
R1
R2
4
1
2
3
TR2
5
TR1
6
R2
R1
1
2
3
sym063
3. Ordering information
Table 3.
Ordering information
Type number Package
Name
Description
Version
PIMN31
SC-74
plastic surface-mounted package (TSOP6); 6 leads
SOT457
4. Marking
Table 4.
Marking codes
Type number
Marking code
PIMN31
4E
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
Per transistor
VCBO
VCEO
VEBO
VI
collector-base voltage
open emitter
open base
-
-
-
50
50
5
V
V
V
collector-emitter voltage
emitter-base voltage
input voltage
open collector
positive
-
-
-
-
+12
−5
V
negative
V
IO
output current
500
290
mA
mW
[1]
Ptot
total power dissipation
Tamb ≤ 25 °C
PIMN31_1
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 — 19 June 2007
2 of 11
PIMN31
NXP Semiconductors
500 mA, 50 V NPN/NPN double RET; R1 = 1 kΩ, R2 = 10 kΩ
Table 5.
Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Per device
Ptot
Parameter
Conditions
Min
Max
Unit
[1]
total power dissipation
junction temperature
ambient temperature
storage temperature
Tamb ≤ 25 °C
-
420
mW
°C
Tj
-
150
Tamb
−65
−65
+150
+150
°C
Tstg
°C
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
006aab054
500
P
tot
(mW)
400
300
200
100
0
−75
−25
25
75
125
175
(°C)
T
amb
FR4 PCB, standard footprint
Fig 1. Power derating curve
6. Thermal characteristics
Table 6.
Symbol
Per transistor
Thermal characteristics
Parameter
Conditions
Min
Typ
Max Unit
[1]
[1]
Rth(j-a)
thermal resistance from
junction to ambient
in free air
-
-
-
-
431
105
K/W
K/W
Rth(j-sp)
thermal resistance from
junction to solder point
Per device
Rth(j-a)
thermal resistance from
junction to ambient
in free air
-
-
298
K/W
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
PIMN31_1
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 — 19 June 2007
3 of 11
PIMN31
NXP Semiconductors
500 mA, 50 V NPN/NPN double RET; R1 = 1 kΩ, R2 = 10 kΩ
006aaa494
3
10
δ = 1
Z
th(j-a)
0.75
0.33
(K/W)
0.50
2
10
0.20
0.10
0.05
0.02
0.01
10
0
1
10
−5
−4
−3
−2
−1
2
3
10
10
10
10
1
10
10
10
t
(s)
p
FR4 PCB, standard footprint
Fig 2. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT457 (SC-74);
typical values
7. Characteristics
Table 7.
Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol Parameter Conditions
Per transistor
Min
Typ
Max Unit
ICBO
ICEO
IEBO
collector-base cut-off VCB = 50 V; IE = 0 A
current
-
-
-
-
-
-
100
0.5
nA
collector-emitter
cut-off current
VCE = 50 V; IB = 0 A
µA
emitter-base cut-off
current
VEB = 5 V; IC = 0 A
0.72 mA
-
hFE
DC current gain
VCE = 5 V; IC = 50 mA
IC = 50 mA; IB = 2.5 mA
70
-
-
-
VCEsat
collector-emitter
0.3
V
saturation voltage
VI(off)
VI(on)
R1
off-state input voltage VCE = 5 V; IC = 100 µA
on-state input voltage VCE = 0.3 V; IC = 20 mA
bias resistor 1 (input)
0.3
0.4
0.7
9
0.6
0.8
1
1
V
1.4
1.3
11
-
V
kΩ
R2/R1
Cc
bias resistor ratio
10
7
collector capacitance VCB = 10 V; IE = ie = 0 A;
f = 1 MHz
-
pF
PIMN31_1
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 — 19 June 2007
4 of 11
PIMN31
NXP Semiconductors
500 mA, 50 V NPN/NPN double RET; R1 = 1 kΩ, R2 = 10 kΩ
006aaa315
006aaa314
−1
3
10
10
(1)
(2)
(1)
(2)
(3)
h
FE
V
CEsat
(V)
(3)
2
10
10
−2
10
1
10
2
3
−1
2
3
1
10
10
10
1
10
10
10
I
(mA)
I
(mA)
C
C
VCE = 5 V
IC/IB = 20
(1) Tamb = 100 °C
(2) Tamb = 25 °C
(3) Tamb = −40 °C
(1) Tamb = 100 °C
(2) Tamb = 25 °C
(3) Tamb = −40 °C
Fig 3. DC current gain as a function of collector
current; typical values
Fig 4. Collector-emitter saturation voltage as a
function of collector current; typical values
006aab055
1
V
CEsat
(V)
(1)
(2)
(3)
−1
10
−2
10
2
3
1
10
10
10
I
(mA)
C
IC/IB = 50
(1) Tamb = 100 °C
(2) Tamb = 25 °C
(3) Tamb = −40 °C
Fig 5. Collector-emitter saturation voltage as a function of collector current; typical values
PIMN31_1
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 — 19 June 2007
5 of 11
PIMN31
NXP Semiconductors
500 mA, 50 V NPN/NPN double RET; R1 = 1 kΩ, R2 = 10 kΩ
006aaa317
006aaa316
1
10
(1)
(2)
V
V
I(off)
I(on)
(V)
(V)
(3)
1
(1)
(2)
(3)
−1
−1
10
10
−1
−1
2
3
10
1
10
10
1
10
10
10
I
(mA)
I
(mA)
C
C
VCE = 0.3 V
VCE = 5 V
(1) Tamb = −40 °C
(2) Tamb = 25 °C
(3) Tamb = 100 °C
(1) Tamb = −40 °C
(2) Tamb = 25 °C
(3) Tamb = 100 °C
Fig 6. On-state input voltage as a function of collector
current; typical values
Fig 7. Off-state input voltage as a function of collector
current; typical values
8. Test information
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 (Stress qualification for discrete semiconductors) and is suitable for
use in automotive critical applications.
PIMN31_1
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 — 19 June 2007
6 of 11
PIMN31
NXP Semiconductors
500 mA, 50 V NPN/NPN double RET; R1 = 1 kΩ, R2 = 10 kΩ
9. Package outline
3.1
2.7
1.1
0.9
6
5
4
0.6
0.2
3.0 1.7
2.5 1.3
pin 1 index
1
2
3
0.26
0.10
0.40
0.25
0.95
1.9
Dimensions in mm
04-11-08
Fig 8. Package outline SOT457 (SC-74)
10. Packing information
Table 8.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number Package
Description
Packing quantity
3000
10000
-135
[2]
[3]
PIMN31
SOT457
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T2
-115
-125
-165
[1] For further information and the availability of packing methods, see Section 14.
[2] T1: normal taping
[3] T2: reverse taping
PIMN31_1
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 — 19 June 2007
7 of 11
PIMN31
NXP Semiconductors
500 mA, 50 V NPN/NPN double RET; R1 = 1 kΩ, R2 = 10 kΩ
11. Soldering
3.45
1.95
solder lands
0.95
solder resist
0.45 0.55
2.825
3.30
occupied area
solder paste
1.60
1.70
3.10
msc422
3.20
Dimensions in mm
Fig 9. Reflow soldering footprint SOT457 (SC-74)
5.30
solder lands
solder resist
occupied area
5.05
0.45 1.45 4.45
msc423
1.40
4.30
Dimensions in mm
Fig 10. Wave soldering footprint SOT457 (SC-74)
PIMN31_1
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 — 19 June 2007
8 of 11
PIMN31
NXP Semiconductors
500 mA, 50 V NPN/NPN double RET; R1 = 1 kΩ, R2 = 10 kΩ
12. Revision history
Table 9.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PIMN31_1
20070619
Product data sheet
-
-
PIMN31_1
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 — 19 June 2007
9 of 11
PIMN31
NXP Semiconductors
500 mA, 50 V NPN/NPN double RET; R1 = 1 kΩ, R2 = 10 kΩ
13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
malfunction of a NXP Semiconductors product can reasonably be expected to
13.2 Definitions
result in personal injury, death or severe property or environmental damage.
NXP Semiconductors accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or applications and therefore
such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
13.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
14. Contact information
For additional information, please visit: http://www.nxp.com
For sales office addresses, send an email to: salesaddresses@nxp.com
PIMN31_1
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 — 19 June 2007
10 of 11
PIMN31
NXP Semiconductors
500 mA, 50 V NPN/NPN double RET; R1 = 1 kΩ, R2 = 10 kΩ
15. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
1.4
2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics. . . . . . . . . . . . . . . . . . . 3
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Test information. . . . . . . . . . . . . . . . . . . . . . . . . 6
Quality information . . . . . . . . . . . . . . . . . . . . . . 6
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7
Packing information. . . . . . . . . . . . . . . . . . . . . . 7
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 9
3
4
5
6
7
8
8.1
9
10
11
12
13
Legal information. . . . . . . . . . . . . . . . . . . . . . . 10
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 10
13.1
13.2
13.3
13.4
14
15
Contact information. . . . . . . . . . . . . . . . . . . . . 10
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2007.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 19 June 2007
Document identifier: PIMN31_1
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