PMBD353 [NEXPERIA]
Schottky barrier double diodeProduction;
| 型号： | PMBD353 |
| 厂家： | 
Nexperia |
| 描述： | Schottky barrier double diodeProduction 二极管 |
| 文件： | 总8页 (文件大小：251K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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DISCRETE SEMICONDUCTORS
DATA SHEET
ook, halfpage
PMBD353
Schottky barrier double diode
Product data sheet
2001 Oct 15
Supersedes data of 1999 May 25
NXP Semiconductors
Product data sheet
Schottky barrier double diode
PMBD353
FEATURES
MARKING
PINNING
• Low forward voltage
• Small SMD package
• Low capacitance.
MARKING
CODE(1)
PIN
1
DESCRIPTION
TYPE NUMBER
cathode k1
PMBD353
∗4F
2
anode a2
3
common connection a1, k2
Note
APPLICATIONS
1. ∗ = p: Made in Hong Kong.
∗ = t: Made in Malaysia.
∗ = W: Made in China.
• UHF mixer
• Sampling circuits
• Modulators
• Phase detection.
3
DESCRIPTION
3
Planar Schottky barrier double diode
in a SOT23 small plastic SMD
package.
1
2
MGC487
1
2
Top view
MGC421
Fig.1 Simplified outline (SOT23) pin configuration and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
PARAMETER
MIN.
MAX.
UNIT
Per diode
VR
IF
continuous reverse voltage
−
−
4
V
continuous forward current
storage temperature
30
mA
°C
°C
Tstg
Tj
−65
+150
100
junction temperature
−
2001 Oct 15
2
NXP Semiconductors
Product data sheet
Schottky barrier double diode
PMBD353
ELECTRICAL CHARACTERISTICS
Tamb = 25 °C unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MAX.
UNIT
Per diode
VF
forward voltage
see Fig.2
IF = 0.1 mA
350
mV
IF = 1 mA
450
600
0.25
1
mV
mV
μA
pF
IF = 10 mA
IR
reverse current
VR = 3 V; note 1; see Fig.3
f = 1 MHz; VR = 0; see Fig.4
Cd
diode capacitance
Note
1. Pulse test: tp = 300 μs; δ = 0.02.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
thermal resistance from junction to ambient note 1
CONDITIONS
VALUE
UNIT
K/W
Rth j-a
500
Note
1. Refer to SOT23 standard mounting conditions.
2001 Oct 15
3
NXP Semiconductors
Product data sheet
Schottky barrier double diode
PMBD353
GRAPHICAL DATA
MLC795
MLC796
4
2
10
10
handbook, halfpage
handbook, halfpage
I
R
(nA)
I
F
(mA)
3
(1)
10
10
(2)
(3)
2
10
(1)
(2)
(3)
(4)
1
10
1
−1
10
(4)
−2
10
1
10
0
200
400
600
800
0
1
2
3
V
(V)
R
V
(mV)
F
(1) Tamb = 100 °C.
(2) Tamb = 60 °C.
(3) Tamb = 25 °C.
(4) Tamb = −40 °C.
(1) Tamb = 100 °C.
(2)
Tamb = 60 °C.
(3) Tamb = 25 °C.
(4) Tamb = −40 °C.
Fig.2 Forward current as a function of forward
voltage; typical values.
Fig.3 Reverse current as a function of reverse
voltage; typical values.
MLC797
0.8
handbook, halfpage
C
d
(pF)
0.7
0.6
0.5
0.4
0
1
2
3
4
(V)
V
R
f = 1 MHz; Tamb = 25 °C.
Fig.4 Diode capacitance as a function of reverse
voltage; typical values.
2001 Oct 15
4
NXP Semiconductors
Product data sheet
Schottky barrier double diode
PMBD353
PACKAGE OUTLINE
Plastic surface mounted package; 3 leads
SOT23
D
B
E
A
X
H
v
M
A
E
3
Q
A
A
1
c
1
2
e
b
w M
B
1
L
p
p
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
A
1
UNIT
b
c
D
E
e
e
H
L
Q
v
w
A
p
p
1
E
max.
1.1
0.9
0.48
0.38
0.15
0.09
3.0
2.8
1.4
1.2
2.5
2.1
0.45
0.15
0.55
0.45
mm
0.1
1.9
0.95
0.2
0.1
REFERENCES
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
JEDEC
EIAJ
97-02-28
99-09-13
SOT23
TO-236AB
2001 Oct 15
5
NXP Semiconductors
Product data sheet
Schottky barrier double diode
PMBD353
DATA SHEET STATUS
DOCUMENT
STATUS(1)
PRODUCT
STATUS(2)
DEFINITION
Objective data sheet
Development
This document contains data from the objective specification for product
development.
Preliminary data sheet
Product data sheet
Qualification
Production
This document contains data from the preliminary specification.
This document contains the product specification.
Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
DISCLAIMERS
above those given in the Characteristics sections of this
document is not implied. Exposure to limiting values for
extended periods may affect device reliability.
General ⎯ Information in this document is believed to be
accurate and reliable. However, NXP Semiconductors
does not give any representations or warranties,
expressed or implied, as to the accuracy or completeness
of such information and shall have no liability for the
consequences of use of such information.
Terms and conditions of sale ⎯ NXP Semiconductors
products are sold subject to the general terms and
conditions of commercial sale, as published at
http://www.nxp.com/profile/terms, including those
pertaining to warranty, intellectual property rights
infringement and limitation of liability, unless explicitly
otherwise agreed to in writing by NXP Semiconductors. In
case of any inconsistency or conflict between information
in this document and such terms and conditions, the latter
will prevail.
Right to make changes ⎯ NXP Semiconductors
reserves the right to make changes to information
published in this document, including without limitation
specifications and product descriptions, at any time and
without notice. This document supersedes and replaces all
information supplied prior to the publication hereof.
No offer to sell or license ⎯ Nothing in this document
may be interpreted or construed as an offer to sell products
that is open for acceptance or the grant, conveyance or
implication of any license under any copyrights, patents or
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Suitability for use ⎯ NXP Semiconductors products are
not designed, authorized or warranted to be suitable for
use in medical, military, aircraft, space or life support
equipment, nor in applications where failure or malfunction
of an NXP Semiconductors product can reasonably be
expected to result in personal injury, death or severe
property or environmental damage. NXP Semiconductors
accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at
the customer’s own risk.
Export control ⎯ This document as well as the item(s)
described herein may be subject to export control
regulations. Export might require a prior authorization from
national authorities.
Quick reference data ⎯ The Quick reference data is an
extract of the product data given in the Limiting values and
Characteristics sections of this document, and as such is
not complete, exhaustive or legally binding.
Applications ⎯ Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values ⎯ Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC 60134) may cause permanent damage to
the device. Limiting values are stress ratings only and
operation of the device at these or any other conditions
2001 Oct 15
6
NXP Semiconductors
Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors. No changes were
made to the content, except for the legal definitions and disclaimers.
Contact information
For additional information please visit: http://www.nxp.com
For sales offices addresses send e-mail to: salesaddresses@nxp.com
© NXP B.V. 2009
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
613514/04/pp7
Date of release: 2001 Oct 15
Document order number: 9397 750 08769
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NXP
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