PMEG1020EA [NEXPERIA]
2 A ultra low VF MEGA Schottky barrier rectifierProduction;
| 型号： | PMEG1020EA |
| 厂家： | 
Nexperia |
| 描述： | 2 A ultra low VF MEGA Schottky barrier rectifierProduction PC 功效 测试 光电二极管 |
| 文件： | 总10页 (文件大小：175K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Important notice
Dear Customer,
On 7 February 2017 the former NXP Standard Product business became a new company with the
tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS
semiconductors with its focus on the automotive, industrial, computing, consumer and wearable
application markets
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use
the references to Nexperia, as shown below.
Instead of http://www.nxp.com, http://www.philips.com/ or http://www.semiconductors.philips.com/,
use http://www.nexperia.com
Instead of sales.addresses@www.nxp.com or sales.addresses@www.semiconductors.philips.com, use
salesaddresses@nexperia.com (email)
Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on
the version, as shown below:
- © NXP N.V. (year). All rights reserved or © Koninklijke Philips Electronics N.V. (year). All rights
reserved
Should be replaced with:
- © Nexperia B.V. (year). All rights reserved.
If you have any questions related to the data sheet, please contact our nearest sales office via e-mail
or telephone (details via salesaddresses@nexperia.com). Thank you for your cooperation and
understanding,
Kind regards,
Team Nexperia
PMEG1020EA
2 A ultra low VF MEGA Schottky barrier rectifier
Rev. 04 — 30 December 2008
Product data sheet
1. Product profile
1.1 General description
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an
integrated guard ring for stress protection, encapsulated in SOD323 (SC-76) very small
Surface-Mounted Device (SMD) plastic package.
1.2 Features
I Forward current: IF ≤ 2 A
I Reverse voltage: VR ≤ 10 V
I Ultra low forward voltage
I Very small SMD plastic package
1.3 Applications
I Low voltage rectification
I High efficiency DC-to-DC conversion
I Switch Mode Power Supply (SMPS)
I Reverse polarity protection
I Low power consumption applications
1.4 Quick reference data
Table 1.
Symbol
IF
Quick reference data
Parameter
Conditions
sp ≤ 55 °C
Min
Typ
Max
2
Unit
A
forward current
reverse voltage
forward voltage
T
-
-
-
-
VR
-
10
V
[1]
VF
IF = 1 A
280
350
mV
[1] Pulse test: tp ≤ 300 µs; δ ≤ 0.02.
PMEG1020EA
NXP Semiconductors
2 A ultra low VF MEGA Schottky barrier rectifier
2. Pinning information
Table 2.
Pinning
Pin
1
Description
cathode
Simplified outline
Graphic symbol
[1]
1
2
1
2
2
anode
sym001
[1] The marking bar indicates the cathode.
3. Ordering information
Table 3.
Ordering information
Type number
Package
Name
Description
Version
PMEG1020EA
SC-76
plastic surface-mounted package; 2 leads
SOD323
4. Marking
Table 4.
Marking codes
Type number
PMEG1020EA
Marking code
E2
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VR
Parameter
Conditions
Min
Max
10
Unit
V
reverse voltage
forward current
-
-
-
IF
Tsp ≤ 55 °C
2
A
IFRM
repetitive peak forward
current
tp ≤ 1 ms; δ ≤ 0.5
3.2
A
IFSM
non-repetitive peak
forward current
square wave;
tp = 8 ms
-
9
A
Tj
junction temperature
ambient temperature
storage temperature
-
150
°C
°C
°C
Tamb
Tstg
−65
−65
+150
+150
PMEG1020EA_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 30 December 2008
2 of 9
PMEG1020EA
NXP Semiconductors
2 A ultra low VF MEGA Schottky barrier rectifier
6. Thermal characteristics
Table 6.
Symbol
Rth(j-a)
Thermal characteristics
Parameter
Conditions
Min
Typ
Max Unit
[1]
[2]
[3]
thermal resistance from
junction to ambient
in free air
-
-
-
-
-
-
450
210
90
K/W
K/W
K/W
Rth(j-sp)
thermal resistance from
junction to solder point
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] Device mounted on an FR4 PCB with copper clad 10 × 10 mm.
[3] Soldering point of cathode tab.
7. Characteristics
Table 7.
Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
[1]
VF
forward voltage
IF = 0.01 A
IF = 0.1 A
IF = 1 A
-
-
-
-
100
170
280
350
130
200
350
460
mV
mV
mV
mV
IF = 2 A
[2]
IR
reverse current
VR = 5 V
-
-
-
-
0.7
1
2
mA
mA
mA
pF
VR = 8 V
2.5
3
VR = 10 V
1.2
37
Cd
diode capacitance
VR = 5 V; f = 1 MHz
45
[1] Pulse test: tp ≤ 300 µs; δ ≤ 0.02.
[2] For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse
power losses PR are a significant part of the total power losses.
PMEG1020EA_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 30 December 2008
3 of 9
PMEG1020EA
NXP Semiconductors
2 A ultra low VF MEGA Schottky barrier rectifier
mdb194
mdb195
4
5
10
10
I
R
I
F
(µA)
(1)
(2)
(mA)
4
3
2
10
3
10
10
10
(1)
(2)
(3)
2
10
10
1
10
1
(3)
0
100
200
300
400
V
500
(mV)
0
2
4
6
8
10
V
(V)
R
F
(1) Tamb = 85 °C
(2) Tamb = 25 °C
(3) Tamb = −40 °C
(1) Tamb = 85 °C
(2) Tamb = 25 °C
(3) Tamb = −40 °C
Fig 1. Forward current as a function of forward
voltage; typical values
Fig 2. Reverse current as a function of reverse
voltage; typical values
mdb196
120
C
d
(pF)
100
80
60
40
20
0
2
4
6
8
10
V
(V)
R
f = 1 MHz; Tamb = 25 °C
Fig 3. Diode capacitance as a function of reverse voltage; typical values
PMEG1020EA_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 30 December 2008
4 of 9
PMEG1020EA
NXP Semiconductors
2 A ultra low VF MEGA Schottky barrier rectifier
8. Test information
t
t
1
2
P
duty cycle δ =
t
2
t
1
t
006aaa812
Fig 4. Duty cycle definition
9. Package outline
1.35
1.15
1.1
0.8
0.45
0.15
1
2.7 1.8
2.3 1.6
2
0.40
0.25
0.25
0.10
Dimensions in mm
03-12-17
Fig 5. Package outline SOD323 (SC-76)
10. Packing information
Table 8.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number Package Description
Packing quantity
3000
-115
10000
PMEG1020EA SOD323 4 mm pitch, 8 mm tape and reel
-135
[1] For further information and the availability of packing methods, see Section 14.
PMEG1020EA_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 30 December 2008
5 of 9
PMEG1020EA
NXP Semiconductors
2 A ultra low VF MEGA Schottky barrier rectifier
11. Soldering
3.05
2.1
solder lands
solder resist
1.65 0.95
0.5 (2×) 0.6 (2×)
solder paste
occupied area
2.2
Dimensions in mm
0.5
(2×)
0.6
(2×)
sod323_fr
Fig 6. Reflow soldering footprint SOD323 (SC-76)
5
2.9
1.5 (2×)
solder lands
solder resist
occupied area
1.2
2.75
Dimensions in mm
(2×)
preferred transport
direction during soldering
sod323_fw
Fig 7. Wave soldering footprint SOD323 (SC-76)
PMEG1020EA_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 30 December 2008
6 of 9
PMEG1020EA
NXP Semiconductors
2 A ultra low VF MEGA Schottky barrier rectifier
12. Revision history
Table 9.
Revision history
Document ID
PMEG1020EA_4
Modifications:
Release date
Data sheet status
Change notice
Supersedes
20081230
Product data sheet
-
PMEG1020EA_3
• The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
• Legal texts have been adapted to the new company name where appropriate.
• Section 13 “Legal information”: updated
PMEG1020EA_3
PMEG1020EA_2
PMEG1020EA_1
20040206
20030715
20030307
Product specification
Product specification
Preliminary specification
-
-
-
PMEG1020EA_2
PMEG1020EA_1
-
PMEG1020EA_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 30 December 2008
7 of 9
PMEG1020EA
NXP Semiconductors
2 A ultra low VF MEGA Schottky barrier rectifier
13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
13.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
PMEG1020EA_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 30 December 2008
8 of 9
PMEG1020EA
NXP Semiconductors
2 A ultra low VF MEGA Schottky barrier rectifier
15. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
1.4
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics. . . . . . . . . . . . . . . . . . . 3
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Test information. . . . . . . . . . . . . . . . . . . . . . . . . 5
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5
Packing information. . . . . . . . . . . . . . . . . . . . . . 5
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 7
3
4
5
6
7
8
9
10
11
12
13
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 8
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 8
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
13.1
13.2
13.3
13.4
14
15
Contact information. . . . . . . . . . . . . . . . . . . . . . 8
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 30 December 2008
Document identifier: PMEG1020EA_4
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