PMSS3906 [NEXPERIA]
PNP switching transistorProduction;
| 型号： | PMSS3906 |
| 厂家： | 
Nexperia |
| 描述： | PNP switching transistorProduction |
| 文件： | 总9页 (文件大小：346K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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DISCRETE SEMICONDUCTORS
DATA SHEET
book, halfpage
PMSS3906
PNP switching transistor
Product data sheet
2004 Jan 09
Supersedes data of 1999 Apr 22
NXP Semiconductors
Product data sheet
PNP switching transistor
PMSS3906
FEATURES
QUICK REFERENCE DATA
SYMBOL PARAMETER
• Low current (max. 100 mA)
• Low voltage (max. 40 V).
TYP.
MAX.
UNIT
VCEO
collector-emitter
voltage
−
−40
V
APPLICATIONS
IC
collector current
−
−100
mA
hFE
DC current gain 100
300
• Switching, e.g. telephony and professional
communication equipment.
DESCRIPTION
PNP switching transistor in an SOT323 (SC-70) plastic
package. NPN complement: PMSS3904.
PRODUCT OVERVIEW
PACKAGE
TYPE NUMBER
MARKING CODE(1)
NPN COMPLEMENT
PMSS3904
PHILIPS
EIAJ
PMSS3906
SOT323
SC-70
06*
Note
1. * = p: Made in Hong Kong.
* = t: Made in Malaysia.
* = W: Made in China.
SIMPLIFIED OUTLINE, SYMBOL AND PINNING
PINNING
TYPE NUMBER
SIMPLIFIED OUTLINE AND SYMBOL
PIN
1
DESCRIPTION
base
PMSS3906
3
handbook, halfpage
2
emitter
3
2
3
collector
1
1
2
Top view
MAM048
2004 Jan 09
2
NXP Semiconductors
Product data sheet
PNP switching transistor
PMSS3906
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
DESCRIPTION
VERSION
PMSS3906
−
plastic surface mounted package; 3 leads
SOT323
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
PARAMETER
collector-base voltage
CONDITIONS
open emitter
MIN.
MAX.
−40
UNIT
VCBO
VCEO
VEBO
IC
−
−
−
−
−
−
−
V
collector-emitter voltage
emitter-base voltage
collector current (DC)
peak collector current
peak base current
open base
−40
V
open collector
−5
V
−100
−200
−100
200
mA
mA
mA
mW
°C
°C
°C
ICM
IBM
Ptot
Tstg
Tj
total power dissipation
storage temperature
junction temperature
operating ambient temperature
Tamb ≤ 25 °C; notes 1 and 2
−65
−
+150
150
Tamb
−65
+150
Notes
1. Refer to standard mounting conditions.
2. Transistor mounted on an FR4 printed-circuit board, single-sided copper, tinplated, standard footprint.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
notes 1 and 2
VALUE
UNIT
Rth(j-a)
thermal resistance from junction to ambient
625
K/W
Notes
1. Refer to standard mounting conditions.
2. Transistor mounted on an FR4 printed-circuit board, single-sided copper, tinplated, standard footprint.
2004 Jan 09
3
NXP Semiconductors
Product data sheet
PNP switching transistor
PMSS3906
CHARACTERISTICS
Tamb = 25 °C unless otherwise specified.
SYMBOL
ICBO
PARAMETER
CONDITIONS
IE = 0; VCB = −30 V
MIN.
MAX.
−50
UNIT
nA
collector-base cut-off current
−
−
−
IE = 0; VCB = −30 V; Tj = 150 °C
IC = 0; VEB = −5 V
VCE = −1 V
−10
−50
µA
IEBO
hFE
emitter-base cut-off current
DC current gain
nA
IC = −0.1 mA
60
80
100
60
30
−
−
IC = −1 mA
−
IC = −10 mA
300
−
IC = −50 mA; note 1
IC = −100 mA; note 1
IC = −10 mA; IB = −1 mA
IC = −50 mA; IB = −5 mA; note 1
−
VCEsat
collector-emitter saturation
voltage
−250
−400
−850
−950
4.5
14
mV
mV
mV
mV
pF
−
VBEsat
base-emitter saturation voltage IC = −10 mA; IB = −1 mA
IC = −50 mA; IB = −5 mA; note 1
−
−
Cc
Ce
fT
collector capacitance
emitter capacitance
transition frequency
noise figure
IE = ie = 0; VCB = −5 V; f = 1 MHz
IC = ic = 0; VEB = −0.5 V; f = 1 MHz
−
−
pF
IE = −10 mA; VCB = −20 V; f = 100 MHz 150
−
MHz
dB
F
IC = −100 µA; VCE = −5 V; RS = 1 kΩ;
−
4
f = 10 Hz to 15.7 kHz
Switching times (between 10% and 90% levels); see Fig.1
ton
td
tr
turn-on time
delay time
rise time
ICon = −10 mA; IBon = −1 mA; IBoff = 1 mA −
100
50
ns
ns
ns
ns
ns
ns
−
−
−
−
−
50
toff
ts
turn-off time
storage time
fall time
700
600
100
tf
Note
1. Pulse test: tp ≤ 300 µs; δ ≤ 0.02.
2004 Jan 09
4
NXP Semiconductors
Product data sheet
PNP switching transistor
PMSS3906
V
B
V
C
BB
CC
R
R
V
(probe)
(probe)
o
oscilloscope
oscilloscope
450 Ω
450 Ω
R2
V
DUT
i
R1
MGD624
Vi = −5 V; T = 500 µs; tp = 10 µs; tr = tf ≤ 3 ns.
R1 = 56 Ω; R2 = 2.5 kΩ; RB = 3.9 kΩ; RC = 270 Ω.
VBB = 1.9 V; VCC = 3 V.
Oscilloscope input impedance Zi = 50 Ω.
Fig.1 Test circuit for switching times.
2004 Jan 09
5
NXP Semiconductors
Product data sheet
PNP switching transistor
PMSS3906
PACKAGE OUTLINE
Plastic surface-mounted package; 3 leads
SOT323
D
B
E
A
X
H
y
v M
A
E
3
Q
A
A
1
c
1
2
L
p
e
b
w
M B
1
p
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
A
1
max
A
UNIT
b
c
D
E
e
e
H
E
L
Q
v
w
p
p
1
1.1
0.8
0.4
0.3
0.25
0.10
2.2
1.8
1.35
1.15
2.2
2.0
0.45
0.15
0.23
0.13
mm
0.1
1.3
0.65
0.2
0.2
REFERENCES
JEDEC JEITA
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
04-11-04
06-03-16
SOT323
SC-70
2004 Jan 09
6
NXP Semiconductors
Product data sheet
PNP switching transistor
PMSS3906
DATA SHEET STATUS
DOCUMENT
STATUS(1)
PRODUCT
STATUS(2)
DEFINITION
Objective data sheet
Development
This document contains data from the objective specification for product
development.
Preliminary data sheet
Product data sheet
Qualification
Production
This document contains data from the preliminary specification.
This document contains the product specification.
Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
DISCLAIMERS
above those given in the Characteristics sections of this
document is not implied. Exposure to limiting values for
extended periods may affect device reliability.
General ⎯ Information in this document is believed to be
accurate and reliable. However, NXP Semiconductors
does not give any representations or warranties,
expressed or implied, as to the accuracy or completeness
of such information and shall have no liability for the
consequences of use of such information.
Terms and conditions of sale ⎯ NXP Semiconductors
products are sold subject to the general terms and
conditions of commercial sale, as published at
http://www.nxp.com/profile/terms, including those
pertaining to warranty, intellectual property rights
infringement and limitation of liability, unless explicitly
otherwise agreed to in writing by NXP Semiconductors. In
case of any inconsistency or conflict between information
in this document and such terms and conditions, the latter
will prevail.
Right to make changes ⎯ NXP Semiconductors
reserves the right to make changes to information
published in this document, including without limitation
specifications and product descriptions, at any time and
without notice. This document supersedes and replaces all
information supplied prior to the publication hereof.
No offer to sell or license ⎯ Nothing in this document
may be interpreted or construed as an offer to sell products
that is open for acceptance or the grant, conveyance or
implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use ⎯ NXP Semiconductors products are
not designed, authorized or warranted to be suitable for
use in medical, military, aircraft, space or life support
equipment, nor in applications where failure or malfunction
of an NXP Semiconductors product can reasonably be
expected to result in personal injury, death or severe
property or environmental damage. NXP Semiconductors
accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at
the customer’s own risk.
Export control ⎯ This document as well as the item(s)
described herein may be subject to export control
regulations. Export might require a prior authorization from
national authorities.
Quick reference data ⎯ The Quick reference data is an
extract of the product data given in the Limiting values and
Characteristics sections of this document, and as such is
not complete, exhaustive or legally binding.
Applications ⎯ Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values ⎯ Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC 60134) may cause permanent damage to
the device. Limiting values are stress ratings only and
operation of the device at these or any other conditions
2004 Jan 09
7
NXP Semiconductors
Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal
definitions and disclaimers. No changes were made to the technical content, except for package outline
drawings which were updated to the latest version.
Contact information
For additional information please visit: http://www.nxp.com
For sales offices addresses send e-mail to: salesaddresses@nxp.com
© NXP B.V. 2009
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R75/04/pp8
Date of release: 2004 Jan 09
Document order number: 9397 750 12329
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