PUMB30 [NEXPERIA]

PNP/PNP double resistor-equipped transistors; R1 = 2.2 kOhm, R2 = openProduction;


型号：	PUMB30
厂家：	Nexperia
描述：	PNP/PNP double resistor-equipped transistors; R1 = 2.2 kOhm, R2 = openProduction 放大器光电二极管晶体管
文件：	总11页 (文件大小：186K)
中文：	中文翻译
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Important notice

Dear Customer,

On 7 February 2017 the former NXP Standard Product business became a new company with the

tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS

semiconductors with its focus on the automotive, industrial, computing, consumer and wearable

application markets

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use

the references to Nexperia, as shown below.

Instead of http://www.nxp.com, http://www.philips.com/ or http://www.semiconductors.philips.com/,

use http://www.nexperia.com

Instead of sales.addresses@www.nxp.com or sales.addresses@www.semiconductors.philips.com, use

salesaddresses@nexperia.com (email)

Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on

the version, as shown below:

reserved

Should be replaced with:

If you have any questions related to the data sheet, please contact our nearest sales office via e-mail

or telephone (details via salesaddresses@nexperia.com). Thank you for your cooperation and

understanding,

Kind regards,

Team Nexperia

PEMB30; PUMB30

PNP/PNP double resistor-equipped transistors;

R1 = 2.2 kΩ, R2 = open

Rev. 02 — 2 September 2009

Product data sheet

1. Product proﬁle

1.1 General description

PNP/PNP double Resistor-Equipped Transistors (RET) in Surface-Mounted Device (SMD)

plastic packages

Table 1.

Product overview

Type number

Package

NXP

NPN/PNP

complement

NPN/NPN

complement

JEITA

PEMB30

PUMB30

SOT666

SOT363

PEMD30

PUMD30

PEMH30

PUMH30

SC-88

1.2 Features

I 100 mA output current capability

I Built-in bias resistors

I Reduces component count

I Reduces pick and place costs

I Simpliﬁes circuit design

1.3 Applications

I Low current peripheral driver

I Cost-saving alternative for BC857BS

and BC857BV

I Control of IC inputs

1.4 Quick reference data

Table 2.

Symbol

Quick reference data

Parameter

Conditions

Min

Typ

Max

Unit

Per transistor

V_CEOcollector-emitter voltage

I_O

open base

−50

output current

−100

2.86

kΩ

bias resistor 1 (input)

1.54

2.2

PEMB30; PUMB30

NXP Semiconductors

PNP/PNP double resistor-equipped transistors; R1 = 2.2 kΩ, R2 = open

2. Pinning information

Table 3.

Pinning

Description

Simpliﬁed outline

Symbol

GND (emitter) TR1

input (base) TR1

output (collector) TR2

GND (emitter) TR2

input (base) TR2

output (collector) TR1

TR2

TR1

001aab555

006aaa268

3. Ordering information

Table 4.

Ordering information

Type number

Package

Name

Description

Version

SOT666

SOT363

PEMB30

PUMB30

plastic surface-mounted package; 6 leads

SC-88

4. Marking

Table 5.

Marking codes

Type number

PEMB30

Marking code^[1]

PUMB30

*B2

[1] * = -: made in Hong Kong

* = p: made in Hong Kong

* = t: made in Malaysia

* = W: made in China

PEMB30_PUMB30_2

Product data sheet

Rev. 02 — 2 September 2009

2 of 10

PEMB30; PUMB30

NXP Semiconductors

PNP/PNP double resistor-equipped transistors; R1 = 2.2 kΩ, R2 = open

5. Limiting values

Table 6.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Parameter

Conditions

Min

Max

Unit

Per transistor

V_CBO

V_CEO

V_EBO

I_O

collector-base voltage

open emitter

open base

−50

−5

collector-emitter voltage

emitter-base voltage

output current

open collector

−100

I_CM

peak collector current

single pulse;

t_p≤ 1 ms

P_tot

total power dissipation

SOT363

T_amb≤ 25 °C

[1]

200

[1][2]

SOT666

Per device

P_tot

total power dissipation

SOT363

T_amb≤ 25 °C

[1]

300

°C

[1][2]

SOT666

300

T_stg

T_j

storage temperature

junction temperature

ambient temperature

−65

+150

150

°C

T_amb

−65

+150

°C

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard

footprint.

[2] Reﬂow soldering is the only recommended soldering method.

6. Thermal characteristics

Table 7.

Thermal characteristics

Symbol Parameter

Per transistor

Conditions

Min

Typ

Max Unit

R_th(j-a)

thermal resistance from

in free air

junction to ambient

[1]

SOT363

625

K/W

[1][2]

SOT666

Per device

R_th(j-a)

thermal resistance from

junction to ambient

in free air

[1]

SOT363

SOT666

416

K/W

[1][2]

[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[2] Reﬂow soldering is the only recommended soldering method.

PEMB30_PUMB30_2

Product data sheet

Rev. 02 — 2 September 2009

3 of 10

PEMB30; PUMB30

NXP Semiconductors

PNP/PNP double resistor-equipped transistors; R1 = 2.2 kΩ, R2 = open

7. Characteristics

Table 8.

Characteristics

T_amb= 25 °C unless otherwise speciﬁed.

Symbol Parameter

Per transistor

Conditions

Min

Typ

Max Unit

I_CBO

collector-base cut-off

current

V_CB= −50 V; I_E= 0 A

−100 nA

I_CEO

collector-emitter cut-off V_CE= −30 V; I_B= 0 A

−1

µA

current

V_CE= −30 V; I_B= 0 A;

−50

T_j= 150 °C

I_EBO

emitter-base cut-off

current

V_EB= −5 V; I_C= 0 A

−100 nA

h_FE

DC current gain

V_CE= −5 V; I_C= −20 mA

I_C= −10 mA; I_B= −0.5 mA

V_CEsat

collector-emitter

−150 mV

saturation voltage

C_c

bias resistor 1 (input)

collector capacitance

1.54 2.2

2.86 kΩ

V_CB= −10 V; I_E= i_e= 0 A;

f = 1 MHz

006aaa691

006aaa692

500

−1

(1)

400

300

200

100

CEsat

(V)

(2)

(3)

−1

−10

(1)

(2)

(3)

−2

−10

−1

−10

−1

−10

−1

−10

(mA)

I (mA)

V_CE= −5 V

I_C/I_B= 20

(1) T_amb= 100 °C

(2) T_amb= 25 °C

(3) T_amb= −40 °C

(1) T_amb= 100 °C

(2) T_amb= 25 °C

(3) T_amb= −40 °C

Fig 1. DC current gain as a function of collector

current; typical values

Fig 2. Collector-emitter saturation voltage as a

function of collector current; typical values

PEMB30_PUMB30_2

Product data sheet

Rev. 02 — 2 September 2009

4 of 10

PEMB30; PUMB30

NXP Semiconductors

PNP/PNP double resistor-equipped transistors; R1 = 2.2 kΩ, R2 = open

8. Package outline

2.2

1.8

1.1

0.8

1.7

1.5

0.6

0.5

0.45

0.15

0.3

0.1

2.2 1.35

2.0 1.15

1.7 1.3

1.5 1.1

pin 1

index

pin 1 index

0.25

0.10

0.3

0.2

0.18

0.08

0.27

0.17

0.65

0.5

1.3

Dimensions in mm

06-03-16

Dimensions in mm

04-11-08

Fig 3. Package outline SOT363 (SC-88)

Fig 4. Package outline SOT666

9. Packing information

Table 9.

Packing methods

The indicated -xxx are the last three digits of the 12NC ordering code.^[1]

Type number Package Description Packing quantity

3000 4000 8000 10000

PEMB30

SOT666 2 mm pitch, 8 mm tape and reel

-315

4 mm pitch, 8 mm tape and reel

SOT363 4 mm pitch, 8 mm tape and reel; T1

4 mm pitch, 8 mm tape and reel; T2

-115

[2]

[3]

PUMB30

-115

-125

-135

-165

[1] For further information and the availability of packing methods, see Section 13.

[2] T1: normal taping

[3] T2: reverse taping

PEMB30_PUMB30_2

Product data sheet

Rev. 02 — 2 September 2009

5 of 10

PEMB30; PUMB30

NXP Semiconductors

PNP/PNP double resistor-equipped transistors; R1 = 2.2 kΩ, R2 = open

10. Soldering

2.65

solder lands

0.4 (2×)

1.5

2.35

0.6

(4×)

0.5

(4×)

solder resist

solder paste

0.5

(4×)

0.6

(2×)

occupied area

0.6

(4×)

Dimensions in mm

1.8

sot363_fr

Dimensions in mm

Fig 5. Reﬂow soldering footprint SOT363 (SC-88)

1.5

solder lands

solder resist

occupied area

2.5

0.3

4.5

1.5

Dimensions in mm

preferred transport

direction during soldering

1.3

2.45

5.3

sot363_fw

Fig 6. Wave soldering footprint SOT363 (SC-88)

PEMB30_PUMB30_2

Product data sheet

Rev. 02 — 2 September 2009

6 of 10

PEMB30; PUMB30

NXP Semiconductors

PNP/PNP double resistor-equipped transistors; R1 = 2.2 kΩ, R2 = open

2.75

2.45

2.1

1.6

solder lands

0.4

(6×)

0.3

(2×)

0.25

(2×)

placement area

0.538

0.55

(2×)

1.075

1.7

solder paste

occupied area

0.325 0.375

(4×) (4×)

Dimensions in mm

1.7

0.45

0.6

(4×)

(2×)

0.5

0.65

(4×)

(2×)

sot666_fr

Reﬂow soldering is the only recommended soldering method.

Fig 7. Reﬂow soldering footprint SOT666

PEMB30_PUMB30_2

Product data sheet

Rev. 02 — 2 September 2009

7 of 10

PEMB30; PUMB30

NXP Semiconductors

PNP/PNP double resistor-equipped transistors; R1 = 2.2 kΩ, R2 = open

11. Revision history

Table 10. Revision history

Document ID

Release date

20090902

Data sheet status

Change notice

Supersedes

PEMB30_PUMB30_2

Modiﬁcations:

Product data sheet

PEMB30_PUMB30_1

• This data sheet was changed to reﬂect the new company name NXP Semiconductors,

including new legal deﬁnitions and disclaimers. No changes were made to the technical

content.

• Figure 3 “Package outline SOT363 (SC-88)”: updated

• Figure 5 “Reﬂow soldering footprint SOT363 (SC-88)”: updated

• Figure 6 “Wave soldering footprint SOT363 (SC-88)”: updated

• Figure 7 “Reﬂow soldering footprint SOT666”: updated

PEMB30_PUMB30_1

20060331

Product data sheet

PEMB30_PUMB30_2

Product data sheet

Rev. 02 — 2 September 2009

8 of 10

PEMB30; PUMB30

NXP Semiconductors

PNP/PNP double resistor-equipped transistors; R1 = 2.2 kΩ, R2 = open

12. Legal information

12.1 Data sheet status

Document status^[1][2]

Product status^[3]

Development

Deﬁnition

Objective [short] data sheet

This document contains data from the objective speciﬁcation for product development.

This document contains data from the preliminary speciﬁcation.

This document contains the product speciﬁcation.

Preliminary [short] data sheet Qualiﬁcation

Product [short] data sheet Production

[1]

[2]

[3]

Please consult the most recently issued document before initiating or completing a design.

The term ‘short data sheet’ is explained in section “Deﬁnitions”.

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

damage. NXP Semiconductors accepts no liability for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

12.2 Deﬁnitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modiﬁcations or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

speciﬁed use without further testing or modiﬁcation.

Limiting values — Stress above one or more limiting values (as deﬁned in

the Absolute Maximum Ratings System of IEC 60134) may cause permanent

damage to the device. Limiting values are stress ratings only and operation of

the device at these or any other conditions above those given in the

Characteristics sections of this document is not implied. Exposure to limiting

values for extended periods may affect device reliability.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

ofﬁce. In case of any inconsistency or conﬂict with the short data sheet, the

full data sheet shall prevail.

Terms and conditions of sale — NXP Semiconductors products are sold

subject to the general terms and conditions of commercial sale, as published

at http://www.nxp.com/proﬁle/terms, including those pertaining to warranty,

intellectual property rights infringement and limitation of liability, unless

explicitly otherwise agreed to in writing by NXP Semiconductors. In case of

any inconsistency or conﬂict between information in this document and such

terms and conditions, the latter will prevail.

12.3 Disclaimers

General — Information in this document is believed to be accurate and

reliable. However, NXP Semiconductors does not give any representations or

warranties, expressed or implied, as to the accuracy or completeness of such

information and shall have no liability for the consequences of use of such

information.

No offer to sell or license — Nothing in this document may be interpreted

or construed as an offer to sell products that is open for acceptance or the

grant, conveyance or implication of any license under any copyrights, patents

or other industrial or intellectual property rights.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation speciﬁcations and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from national authorities.

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in medical, military, aircraft,

space or life support equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

12.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

13. Contact information

For more information, please visit: http://www.nxp.com

For sales ofﬁce addresses, please send an email to: salesaddresses@nxp.com

PEMB30_PUMB30_2

Product data sheet

Rev. 02 — 2 September 2009

9 of 10

PEMB30; PUMB30

NXP Semiconductors

PNP/PNP double resistor-equipped transistors; R1 = 2.2 kΩ, R2 = open

14. Contents

Product proﬁle . . . . . . . . . . . . . . . . . . . . . . . . . . 1

General description. . . . . . . . . . . . . . . . . . . . . . 1

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Quick reference data. . . . . . . . . . . . . . . . . . . . . 1

1.1

1.2

1.3

1.4

Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

Ordering information. . . . . . . . . . . . . . . . . . . . . 2

Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3

Thermal characteristics. . . . . . . . . . . . . . . . . . . 3

Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4

Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5

Packing information. . . . . . . . . . . . . . . . . . . . . . 5

Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 8

Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9

Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9

Deﬁnitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

12.1

12.2

12.3

12.4

Contact information. . . . . . . . . . . . . . . . . . . . . . 9

Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 2 September 2009

Document identifier: PEMB30_PUMB30_2

PUMB30 [NEXPERIA]

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