PUSB3F99 [NEXPERIA]

ESD protection for ultra high-speed interfacesProduction;
PUSB3F99
型号: PUSB3F99
厂家: Nexperia    Nexperia
描述:

ESD protection for ultra high-speed interfacesProduction

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PUSB3F99  
ESD protection for ultra high-speed interfaces  
Rev. 1 — 15 December 2017  
Product data sheet  
1 Product profile  
1.1 General description  
The device is designed to protect high-speed interfaces such as SuperSpeed USB,  
High-Definition Multimedia Interface (HDMI), DisplayPort, external Serial Advanced  
Technology Attachment (eSATA) and Low Voltage Differential Signaling (LVDS)  
interfaces against ElectroStatic Discharge (ESD).  
The device includes four high-level ESD protection diode structures for ultra high-speed  
signal lines and is encapsulated in a leadless small DFN2510A-10 (SOT1176-1) plastic  
package.  
All signal lines are protected by a special diode configuration offering ultra low line  
capacitance of only 0.5 pF. These diodes utilize a unique snap-back structure in order to  
provide protection to downstream components from ESD voltages up to ±10 kV contact  
exceeding IEC 61000-4-2, level 4.  
1.2 Features and benefits  
System ESD protection for USB 2.0 and SuperSpeed USB 3.1, HDMI 2.0, DisplayPort,  
eSATA and LVDS  
All signal lines with integrated rail-to-rail clamping diodes for downstream ESD  
protection of ±10 kV exceeding IEC 61000-4-2, level 4  
Matched 0.5 mm trace spacing  
Signal lines with ≤ 0.05 pF matching capacitance between signal pairs  
Line capacitance of only 0.5 pF for each channel  
Design-friendly ‘pass-through’ signal routing  
1.3 Applications  
The device is designed for high-speed receiver and transmitter port protection:  
TVs and monitors  
DVD recorders and players  
Notebooks, main board graphic cards and ports  
Set-top boxes and game consoles  
 
 
 
 
Nexperia  
PUSB3F99  
ESD protection for ultra high-speed interfaces  
2 Pinning information  
Table 1.ꢀPinning  
Pin  
1
Symbol  
CH1  
CH2  
GND  
CH3  
CH4  
n.c.  
Description  
Simplified outline  
Graphic symbol  
channel 1 ESD protection  
channel 2 ESD protection  
ground  
10  
9
8
7
6
1
2
4
5
2
3
4
channel 3 ESD protection  
channel 4 ESD protection  
not connected  
1
2
3
4
5
5
Transparent top view  
6
3, 8  
018aaa001  
7
n.c.  
not connected  
8
GND  
n.c.  
ground  
9
not connected  
10  
n.c.  
not connected  
3 Ordering information  
Table 2.ꢀOrdering information  
Type number  
Package  
Name  
Description  
Version  
PUSB3F99  
DFN2510A-10  
plastic extremely thin small outline package; no leads;10  
terminals; body 1 × 2.5 × 0.5 mm  
SOT1176-1  
4 Marking  
Table 3.ꢀMarking codes  
Type number  
Marking code  
PUSB3F99  
96  
5 Limiting values  
Table 4.ꢀLimiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol  
VI  
Parameter  
Conditions  
Min  
Max  
Unit  
input voltage  
-0.5  
+3.3  
V
[1]  
VESD  
electrostatic discharge voltage  
IEC 61000-4-2, level 4  
contact discharge  
air discharge  
-10  
-15  
-40  
-55  
+10  
+15  
+85  
+125  
kV  
kV  
°C  
°C  
Tamb  
Tstg  
ambient temperature  
storage temperature  
[1] All pins to ground.  
PUSB3F99  
All information provided in this document is subject to legal disclaimers.  
© Nexperia B.V. 2017. All rights reserved.  
Product data sheet  
Rev. 1 — 15 December 2017  
2 / 12  
 
 
 
 
 
Nexperia  
PUSB3F99  
ESD protection for ultra high-speed interfaces  
6 Characteristics  
Table 5.ꢀCharacteristics  
Tamb = 25 °C unless otherwise specified.  
Symbol  
VBR  
Parameter  
Conditions  
Min  
Typ  
-
Max  
Unit  
V
breakdown voltage  
reverse leakage current  
forward voltage  
II = 1 mA  
6
-
-
ILR  
per channel; VI = 3 V  
II = 1 mA  
-
1
μA  
V
VF  
-
0.7  
0.5  
0.05  
-
[1]  
[1]  
[2]  
Cline  
ΔCline  
rdyn  
line capacitance  
f = 1 MHz; VI = 3.3 V  
f = 1 MHz; VI = 3.3 V  
surge  
-
0.6  
-
pF  
pF  
line capacitance difference  
dynamic resistance  
-
-
-
0.41  
0.26  
-
-
Ω
Ω
positive transient  
negative transient  
TLP  
[3]  
-
-
0.43  
0.28  
-
-
Ω
Ω
positive transient  
negative transient  
IPP = 5.2 A  
[2]  
[2]  
VCL  
clamping voltage  
-
-
4.6  
-
-
V
V
positive transient  
IPP = -4.4 A  
-2.2  
negative transient  
[1] This parameter is guaranteed by design.  
[2] According to IEC 61000-4-5 (8/20 μs current waveform).  
[3] 100 ns Transmission Line Pulse (TLP); 50 Ω; pulser at 80 ns.  
PUSB3F99  
All information provided in this document is subject to legal disclaimers.  
© Nexperia B.V. 2017. All rights reserved.  
Product data sheet  
Rev. 1 — 15 December 2017  
3 / 12  
 
 
 
 
Nexperia  
PUSB3F99  
ESD protection for ultra high-speed interfaces  
6.1  
aaa-009367  
aaa-009368  
2
1.2  
S
(dB)  
dd21  
a
-2  
0.8  
0.4  
0
-6  
-10  
-14  
6
7
8
9
10  
10  
10  
10  
10  
10  
0
1
2
3
4
5
f (MHz)  
V (V)  
I
differential mode  
Figure 1.ꢀInsertion loss; typical values  
Figure 2.ꢀRelative capacitance as a function of input  
voltage; typical values  
aaa-009369  
aaa-009370  
0
120  
Z
(Ω)  
dif  
S
(dB)  
dd21  
110  
-20  
(2)  
100  
90  
-40  
(1)  
-60  
10  
80  
40.0  
6
7
8
9
10  
10  
10  
10  
10  
40.5  
41.0  
41.5  
42.0  
f (MHz)  
t (ns)  
Sdd21 normalized to 100 Ω;differential pairs CH1/CH2  
versus CH3/CH4  
tr = 200 ps; differential pair CH1 + CH2  
(1) PUSB3F99 on reference board  
(2) Reference board without device under test (DUT)  
Figure 3.ꢀCrosstalk; typical values  
Figure 4.ꢀDifferential Time Domain Reflectometer (TDR)  
plot; typical values  
PUSB3F99  
All information provided in this document is subject to legal disclaimers.  
© Nexperia B.V. 2017. All rights reserved.  
Product data sheet  
Rev. 1 — 15 December 2017  
4 / 12  
 
Nexperia  
PUSB3F99  
ESD protection for ultra high-speed interfaces  
Data rate: 10 Gbit/s; Vertical scale: 200 mV/div; Horizontal scale: 20 ps/div  
3.1 dB de-emphasis  
2.2 dB pre-shoot  
Figure 5.ꢀUSB 3.1 eye diagram, Printed-Circuit Board (PCB) with PUSB3F99  
Data rate: 10 Gbit/s; Vertical scale: 200 mV/div; Horizontal scale: 20 ps/div  
3.1 dB de-emphasis  
2.2 dB pre-shoot  
Figure 6.ꢀUSB 3.1 eye diagram, PCB without PUSB3F99 (reference)  
PUSB3F99  
All information provided in this document is subject to legal disclaimers.  
© Nexperia B.V. 2017. All rights reserved.  
Product data sheet  
Rev. 1 — 15 December 2017  
5 / 12  
Nexperia  
PUSB3F99  
ESD protection for ultra high-speed interfaces  
aaa-014159  
Test frequency: 148.5 MHz  
Differential swing voltage: 810 mV  
Horizontal scale: 34 ps/div  
Figure 7.ꢀHDMI 2.0 TP1 eye diagram, PCB with PUSB3F99 (2160p, 60 Hz  
aaa-014160  
Test frequency: 148.5 MHz  
Differential swing voltage: 800 mV  
Horizontal scale: 34 ps/div  
Figure 8.ꢀHDMI 2.0 TP1 eye diagram, PCB without PUSB3F99 (2160p, 60 Hz, reference)  
PUSB3F99  
All information provided in this document is subject to legal disclaimers.  
© Nexperia B.V. 2017. All rights reserved.  
Product data sheet  
Rev. 1 — 15 December 2017  
6 / 12  
Nexperia  
PUSB3F99  
ESD protection for ultra high-speed interfaces  
aaa-014161  
Test frequency: 148.5 MHz  
Differential swing voltage: 809 mV  
Horizontal scale: 34 ps/div  
Remark: Measured at Test Point 2 (TP2) worst cable emulator, reference cable equalizer and worst case positive skew.  
Figure 9.ꢀHDMI 2.0 TP2 eye diagram, PCB with PUSB3F99 (2160p, 60 Hz)  
aaa-014162  
Test frequency: 148.5 MHz  
Differential swing voltage: 820 mV  
Horizontal scale: 34 ps/div  
Remark: Measured at Test Point 2 (TP2) worst cable emulator, reference cable equalizer and worst case positive skew.  
Figure 10.ꢀHDMI 2.0 TP2 eye diagram, PCB without PUSB3F99 (2160p, 60 Hz, reference)  
PUSB3F99  
All information provided in this document is subject to legal disclaimers.  
© Nexperia B.V. 2017. All rights reserved.  
Product data sheet  
Rev. 1 — 15 December 2017  
7 / 12  
Nexperia  
PUSB3F99  
ESD protection for ultra high-speed interfaces  
aaa-009371  
aaa-009372  
6
0
I
I
PP  
(A)  
PP  
(A)  
4
2
0
-2  
-4  
-6  
0
2
4
6
-2.5  
-2.0  
-1.5  
-1.0  
-0.5  
0
V
(V)  
V
(V)  
CL  
CL  
IEC 61000-4-5; tp = 8/20 μs; positive pulse  
IEC 61000-4-5; tp = 8/20 μs; negative pulse  
Figure 11.ꢀDynamic resistance with positive clamping;  
typical values  
Figure 12.ꢀDynamic resistance with negative clamping;  
typical values  
aaa-009373  
aaa-009374  
14  
0
I
I
(A)  
12  
(A)  
-2  
10  
8
-4  
-6  
6
-8  
4
-10  
-12  
-14  
2
0
0
4
8
12  
-6  
-4  
-2  
0
V
(V)  
V
(V)  
CL  
CL  
tp = 100 ns; Transmission Line Pulse (TLP)  
tp = 100 ns; Transmission Line Pulse (TLP)  
Figure 13.ꢀDynamic resistance with positive clamping;  
typical values  
Figure 14.ꢀDynamic resistance with negative clamping;  
typical values  
The device uses an advanced clamping structure showing a negative dynamic  
resistance. This snap-back behavior strongly reduces the clamping voltage to the system  
behind the ESD protection during an ESD event. Do not connect unlimited DC current  
sources to the data lines to avoid keeping the ESD protection device in snap-back state  
after exceeding breakdown voltage (due to an ESD pulse for instance).  
PUSB3F99  
All information provided in this document is subject to legal disclaimers.  
© Nexperia B.V. 2017. All rights reserved.  
Product data sheet  
Rev. 1 — 15 December 2017  
8 / 12  
Nexperia  
PUSB3F99  
ESD protection for ultra high-speed interfaces  
7 Application information  
The device is designed to provide high-level ESD protection for high-speed serial data  
buses such as HDMI, DisplayPort, eSATA and LVDS data lines.  
When designing the Printed-Circuit Board (PCB), give careful consideration to  
impedance matching and signal coupling. Do not connect the signal lines to unlimited  
current sources like, for example, a battery.  
8 Package outline  
Table 6.ꢀPackage outline  
1.1  
0.9  
0.127  
0.2 min  
5
6
2.6  
2.4  
0.25  
0.15  
2
0.5  
1
10  
0.4  
0.3  
0.05 max  
0.5 max  
0.45  
0.35  
Dimensions in mm  
12-05-23  
Figure 15.ꢀPackage outline DFN2510A-10 (SOT1176-1)  
PUSB3F99  
All information provided in this document is subject to legal disclaimers.  
© Nexperia B.V. 2017. All rights reserved.  
Product data sheet  
Rev. 1 — 15 December 2017  
9 / 12  
 
 
Nexperia  
PUSB3F99  
ESD protection for ultra high-speed interfaces  
9 Soldering  
Table 7.ꢀSoldering  
Footprint information for reflow soldering of DFN2510A-10 package  
SOT1176-1  
Hx  
C
Hy Ay By  
0.05  
D
P
0.05  
Generic footprint pattern  
Refer to the package outline drawing for actual layout  
solder land  
solder paste deposit  
solder land plus solder paste  
occupied area  
solder resist  
Dimensions in mm  
Remark:  
Stencil of 75 m is recommended.  
P
Ay  
By  
C
D
Hx  
Hy  
A stencil of 75 m gives an aspect ratio of 0.77  
With a stencil of 100 m one will obtain an aspect ratio of 0.58  
0.5  
1.25  
0.3  
0.475  
0.2  
2.45  
1.5  
sot1176-1_fr  
Figure 16.ꢀReflow soldering footprint DFN2510A-10 (SOT1176-1)  
PUSB3F99  
All information provided in this document is subject to legal disclaimers.  
© Nexperia B.V. 2017. All rights reserved.  
Product data sheet  
Rev. 1 — 15 December 2017  
10 / 12  
 
Nexperia  
PUSB3F99  
ESD protection for ultra high-speed interfaces  
10 Revision history  
Table 8.ꢀRevision history  
Document ID  
Release date Data sheet status  
Change notice Supersedes  
PUSB3F99 v.1  
20171215  
Product data sheet  
-
-
PUSB3F99  
All information provided in this document is subject to legal disclaimers.  
© Nexperia B.V. 2017. All rights reserved.  
Product data sheet  
Rev. 1 — 15 December 2017  
11 / 12  
 
Nexperia  
PUSB3F99  
ESD protection for ultra high-speed interfaces  
Contents  
1
Product profile .................................................... 1  
1.1  
1.2  
1.3  
2
3
4
5
6
6.1  
7
8
General description ............................................1  
Features and benefits ........................................1  
Applications ........................................................1  
Pinning information ............................................ 2  
Ordering information .......................................... 2  
Marking .................................................................2  
Limiting values ....................................................2  
Characteristics .................................................... 3  
............................................................................ 4  
Application information ......................................9  
Package outline ...................................................9  
Soldering ............................................................10  
Revision history ................................................ 11  
9
10  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section 'Legal information'.  
© Nexperia B.V. 2017.  
All rights reserved.  
For more information, please visit: http://www.nexperia.com  
For sales office addresses, please send an email to: salesaddresses@nexperia.com  
Date of release: 15 December 2017  
Document identifier: PUSB3F99  

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