PZT2222A [NEXPERIA]

NPN switching transistorProduction;


型号：	PZT2222A
厂家：	Nexperia
描述：	NPN switching transistorProduction
文件：	总8页 (文件大小：335K)
中文：	中文翻译
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Important notice

Dear Customer,

On 7 February 2017 the former NXP Standard Product business became a new company with the

tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS

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DISCRETE SEMICONDUCTORS

DATA SHEET

handbook, halfpage

M3D087

PZT2222A

NPN switching transistor

Product data sheet

1999 Apr 14

Supersedes data of 1997 Jun 02

NXP Semiconductors

Product data sheet

NPN switching transistor

PZT2222A

FEATURES

PINNING

• High current (max. 600 mA)

• Low voltage (max. 40 V).

DESCRIPTION

base

2, 4

collector

emitter

APPLICATIONS

• Switching and linear amplification.

DESCRIPTION

handbook, halfpage

2, 4

NPN switching transistor in a SOT223 plastic package.

PNP complement: PZT2907A.

Top view

MAM287

Fig.1 Simplified outline (SOT223) and symbol.

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL

PARAMETER

collector-base voltage

CONDITIONS

open emitter

MIN.

MAX.

UNIT

V_CBO

V_CEO

V_EBO

I_C

−

collector-emitter voltage

emitter-base voltage

collector current (DC)

peak collector current

peak base current

open base

open collector

600

800

200

1.15

+150

150

+150

I_CM

I_BM

P_tot

T_stg

T_j

total power dissipation

storage temperature

junction temperature

operating ambient temperature

T_amb≤ 25 °C; note 1

−65

−

°C

T_amb

−65

Note

1. Device mounted on a printed-circuit board, single-sided copper, tinplated, mounting pad for collector 1 cm².

For other mounting conditions, see “Thermal considerations for SOT223 in the General Part of associated

Handbook”.

1999 Apr 14

NXP Semiconductors

Product data sheet

NPN switching transistor

PZT2222A

THERMAL CHARACTERISTICS

SYMBOL

R_{th j-a}

PARAMETER

CONDITIONS

note 1

VALUE

UNIT

K/W

thermal resistance from junction to ambient

109

R_{th j-s}

thermal resistance from junction to soldering point

Note

1. Device mounted on a printed-circuit board, single-sided copper, tinplated, mounting pad for collector 1 cm².

For other mounting conditions, see “Thermal considerations for SOT223 in the General Part of associated

Handbook”.

CHARACTERISTICS

T_j= 25 °C unless otherwise specified.

SYMBOL

I_CBO

PARAMETER

CONDITIONS

I_E= 0; V_CB= 60 V

MIN.

MAX.

UNIT

collector cut-off current

−

I_E= 0; V_CB= 60 V; T_amb= 125 °C

I_C= 0; V_EB= 5 V

−

µA

I_EBO

h_FE

emitter cut-off current

DC current gain

I_C= 0.1 mA; V_CE= 10 V

I_C= 1 mA; V_CE= 10 V

I_C= 10 mA; V_CE= 10 V

−

I_C= 10 mA; V_CE= 10 V;

−

T_amb= −55 °C

I_C= 150 mA; V_CE= 1 V; note 1

I_C= 150 mA; V_CE= 10 V; note 1

I_C= 500 mA; V_CE= 10 V; note 1

100

−

300

−

V_CEsat

collector-emitter saturation voltage I_C= 150 mA; I_B= 15 mA

I_C= 500 mA; I_B= 50 mA

300

−

V_BEsat

base-emitter saturation voltage

I_C= 150 mA; I_B= 15 mA

0.6

−

1.2

I_C= 500 mA; I_B= 50 mA

C_c

C_e

f_T

collector capacitance

emitter capacitance

transition frequency

I_E= i_e= 0; V_CB= 10 V; f = 1 MHz

I_C= i_c= 0; V_EB= 500 mV; f = 1 MHz

−

MHz

−

I_C= 20 mA; V_CE= 20 V; f = 100 MHz 300

Switching times (between 10% and 90% levels); (see Fig.2)

t_on

t_d

t_r

turn-on time

delay time

rise time

I_Con= 150 mA; I_Bon= 15 mA;

I_Boff= −15 mA; T_amb= 25 °C

−

t_off

t_s

turn-off time

storage time

fall time

250

200

t_f

Note

1. Pulse test: t_p≤ 300 µs; δ ≤ 0.02.

1999 Apr 14

NXP Semiconductors

Product data sheet

NPN switching transistor

PZT2222A

handbook, full pagewidth

(probe)

oscilloscope

450 Ω

DUT

MLB826

V_i= 9.5 V; T = 500 µs; t_p= 10 µs; t_r= t_f≤ 3 ns.

R1 = 68 Ω; R2 = 325 Ω; R_B= 325 Ω; R_C= 160 Ω.

_BB= −3.5 V; V_CC= 29.5 V.

Oscilloscope input impedance Z_i= 50 Ω.

Fig.2 Test circuit for switching times.

1999 Apr 14

NXP Semiconductors

Product data sheet

NPN switching transistor

PZT2222A

PACKAGE OUTLINE

Plastic surface mounted package; collector pad for good heat transfer; 4 leads

SOT223

detail X

4 mm

scale

DIMENSIONS (mm are the original dimensions)

UNIT

1.8

1.5

0.10 0.80

0.01 0.60

3.1

2.9

0.32

0.22

6.7

6.3

3.7

3.3

7.3

6.7

1.1

0.7

0.95

0.85

4.6

2.3

0.2

0.1

REFERENCES

JEDEC

EUROPEAN

PROJECTION

OUTLINE

VERSION

ISSUE DATE

IEC

EIAJ

97-02-28

99-09-13

SOT223

SC-73

1999 Apr 14

NXP Semiconductors

Product data sheet

NPN switching transistor

PZT2222A

DATA SHEET STATUS

DOCUMENT

STATUS⁽¹⁾

PRODUCT

STATUS⁽²⁾

DEFINITION

Objective data sheet

Development

This document contains data from the objective specification for product

development.

Preliminary data sheet

Product data sheet

Qualification

Production

This document contains data from the preliminary specification.

This document contains the product specification.

Notes

1. Please consult the most recently issued document before initiating or completing a design.

2. The product status of device(s) described in this document may have changed since this document was published

and may differ in case of multiple devices. The latest product status information is available on the Internet at

URL http://www.nxp.com.

DISCLAIMERS

above those given in the Characteristics sections of this

document is not implied. Exposure to limiting values for

extended periods may affect device reliability.

General ⎯ Information in this document is believed to be

accurate and reliable. However, NXP Semiconductors

does not give any representations or warranties,

expressed or implied, as to the accuracy or completeness

of such information and shall have no liability for the

consequences of use of such information.

Terms and conditions of sale ⎯ NXP Semiconductors

products are sold subject to the general terms and

conditions of commercial sale, as published at

http://www.nxp.com/profile/terms, including those

pertaining to warranty, intellectual property rights

infringement and limitation of liability, unless explicitly

otherwise agreed to in writing by NXP Semiconductors. In

case of any inconsistency or conflict between information

in this document and such terms and conditions, the latter

will prevail.

Right to make changes ⎯ NXP Semiconductors

reserves the right to make changes to information

published in this document, including without limitation

specifications and product descriptions, at any time and

without notice. This document supersedes and replaces all

information supplied prior to the publication hereof.

No offer to sell or license ⎯ Nothing in this document

may be interpreted or construed as an offer to sell products

that is open for acceptance or the grant, conveyance or

implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Suitability for use ⎯ NXP Semiconductors products are

not designed, authorized or warranted to be suitable for

use in medical, military, aircraft, space or life support

equipment, nor in applications where failure or malfunction

of an NXP Semiconductors product can reasonably be

expected to result in personal injury, death or severe

property or environmental damage. NXP Semiconductors

accepts no liability for inclusion and/or use of NXP

Semiconductors products in such equipment or

applications and therefore such inclusion and/or use is at

the customer’s own risk.

Export control ⎯ This document as well as the item(s)

described herein may be subject to export control

regulations. Export might require a prior authorization from

national authorities.

Quick reference data ⎯ The Quick reference data is an

extract of the product data given in the Limiting values and

Characteristics sections of this document, and as such is

not complete, exhaustive or legally binding.

Applications ⎯ Applications that are described herein for

any of these products are for illustrative purposes only.

NXP Semiconductors makes no representation or

warranty that such applications will be suitable for the

specified use without further testing or modification.

Limiting values ⎯ Stress above one or more limiting

values (as defined in the Absolute Maximum Ratings

System of IEC 60134) may cause permanent damage to

the device. Limiting values are stress ratings only and

operation of the device at these or any other conditions

1999 Apr 14

NXP Semiconductors

Customer notification

This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal

definitions and disclaimers. No changes were made to the technical content, except for package outline

drawings which were updated to the latest version.

Contact information

For additional information please visit: http://www.nxp.com

For sales offices addresses send e-mail to: salesaddresses@nxp.com

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed

without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license

under patent- or other industrial or intellectual property rights.

Printed in The Netherlands

115002/00/03/pp7

Date of release: 1999 Apr 14

Document order number: 9397 750 05636

PZT2222A [NEXPERIA]

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