NS6B083T [NICHIA]

TYPE BLUE LED; 键入蓝色LED
NS6B083T
型号: NS6B083T
厂家: NICHIA CORPORATION    NICHIA CORPORATION
描述:

TYPE BLUE LED
键入蓝色LED

文件: 总14页 (文件大小:384K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
No. STSE-CC7099A  
<Cat.No.070615>  
SPECIFICATIONS FOR NICHIA CHIP TYPE BLUE LED  
MODEL : NS6B083T  
NICHIA CORPORATION  
Nichia STSE-CC7099A  
<Cat.No.070615>  
1.SPECIFICATIONS  
(1) Absolute Maximum Ratings  
Item  
(Ta=25°C)  
Unit  
mA  
mA  
mA  
W
Symbol  
IF  
Absolute Maximum Rating  
Forward Current  
350  
600  
Pulse Forward Current  
Allowable Reverse Current  
Power Dissipation  
IFP  
IR  
85  
PD  
1.54  
Operating Temperature  
Storage Temperature  
Dice Temperature  
Topr  
Tstg  
Tj  
-30 ~ + 85  
-40 ~ +100  
120  
°C  
°C  
°C  
<
<
=
IFP Conditions  
:
Pulse Width 10msec. and Duty  
1/10  
=
(2) Initial Electrical/Optical Characteristics  
Item Symbol Condition  
Forward Voltage  
Luminous Flux  
(Ta=25°C)  
Typ.  
Max.  
Unit  
V
VF  
φv  
-
IF=300[mA]  
IF=300[mA]  
(3.5)  
(16)  
4.4  
-
-
-
lm  
-
½
x
y
IF=300[mA] 0.133  
IF=300[mA] 0.075  
Chromaticity Coordinate  
-
-
½ Please refer to CIE 1931 chromaticity diagram.  
(3) Ranking  
(Ta=25°C)  
Unit  
Item  
Symbol  
Condition  
Min.  
4.0  
Max.  
4.4  
Rank H  
Rank M  
Rank L  
3.6  
4.0  
Forward Voltage  
VF  
IF=300[mA]  
V
3.2  
3.6  
Rank K  
Rank P9  
Rank P8  
Rank P7  
Rank P6  
Rank P5  
Rank P4  
2.8  
3.2  
21.4  
18.0  
15.1  
12.7  
10.7  
9.0  
25.5  
21.4  
18.0  
15.1  
12.7  
10.7  
Luminous Flux  
φv  
IF=300[mA]  
lm  
½ Forward Voltage Measurement allowance is ± 3%.  
½ Luminous Flux Measurement allowance is ± 10%.  
Color Rank  
(IF=300mA,Ta=25°C)  
Rank W  
x
y
0.11  
0.04  
0.11  
0.10  
0.15  
0.10  
0.15  
0.04  
½ Color Coordinates Measurement allowance is ± 0.01.  
2.INITIAL OPTICAL/ELECTRICAL CHARACTERISTICS  
Please refer to figure’s page.  
-1-  
Nichia STSE-CC7099A  
<Cat.No.070615>  
3.OUTLINE DIMENSIONS AND MATERIALS  
Please refer to figure’s page.  
Material as follows ; Package  
Encapsulating Resin  
Electrodes  
:
:
:
Heat-Resistant Polymer  
Silicone Resin (with Diffused)  
Ag Plating Copper Alloy  
4.PACKAGING  
· The LEDs are packed in cardboard boxes after taping.  
Please refer to figure’s page.  
The label on the minimum packing unit shows ; Part Number, Lot Number, Ranking, Quantity  
· In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation.  
· The LEDs may be damaged if the boxes are dropped or receive a strong impact against them,  
so precautions must be taken to prevent any damage.  
· The boxes are not water resistant and therefore must be kept away from water and moisture.  
· When the LEDs are transported, we recommend that you use the same packing method as Nichia.  
5.LOT NUMBER  
The first six digits number shows lot number.  
The lot number is composed of the following characters;  
{ꢀ¯¯¯¯ - U„z  
{ - Year  
( 6 for 2006, 7 for 2007 )  
- Month ( 1 for Jan., 9 for Sep., A for Oct., B for Nov. )  
¯¯¯¯ - Nichia's Product Number  
U - Ranking by Color Coordinates  
„ - Ranking by Luminous Flux  
z - Ranking by Forward Voltage  
-2-  
Nichia STSE-CC7099A  
<Cat.No.070615>  
6.RELIABILITY  
(1) TEST ITEMS AND RESULTS  
Standard  
Test Method  
JEITA ED-4701 Tsld=260°C, 10sec.  
Number of  
Damaged  
0/22  
Test Item  
Resistance to  
Test Conditions  
Note  
2 times  
Soldering Heat  
(Reflow Soldering)  
Solderability  
300 301  
(Pre treatment 30°C,70%,168hrs.)  
JEITA ED-4701 Tsld=215 ± 5°C, 3sec.  
1 time  
over 95%  
20 cycles  
0/22  
0/50  
0/50  
0/22  
0/22  
0/22  
0/22  
0/22  
0/22  
0/22  
0/22  
0/22  
(Reflow Soldering)  
300 303  
JEITA ED-4701 0°C ~ 100°C  
300 307 15sec. 15sec.  
JEITA ED-4701 -40°C ~ 25°C ~ 100°C ~ 25°C  
100 105 30min. 5min. 30min. 5min.  
Moisture Resistance Cyclic JEITA ED-4701 25°C ~ 65°C ~ -10°C  
200 203 90%RH 24hrs./1cycle  
(Lead Solder)  
Thermal Shock  
Temperature Cycle  
100 cycles  
10 cycles  
1000 hrs.  
1000 hrs.  
1000 hrs.  
1000 hrs.  
1000 hrs.  
500 hrs.  
High Temperature Storage  
JEITA ED-4701 Ta=100°C  
200 201  
JEITA ED-4701 Ta=60°C, RH=90%  
100 103  
JEITA ED-4701 Ta=-40°C  
200 202  
Temperature Humidity  
Storage  
Low Temperature Storage  
Steady State Operating Life  
Ta=25°C, IF=350mA  
Tested with Nichia standard circuit board.  
Ta=85°C, IF=160mA  
Tested with Nichia standard circuit board.  
60°C, RH=90%, IF=250mA  
Tested with Nichia standard circuit board.  
Ta=-30°C, IF=300mA  
½
½
Steady State Operating Life  
of High Temperature  
Steady State Operating Life  
of High Humidity Heat  
Steady State Operating Life  
of Low Temperature  
Vibration  
½
1000 hrs.  
48min.  
½
Tested with Nichia standard circuit board.  
JEITA ED-4701 100 ~ 2000 ~ 100Hz Sweep 4min.  
400 403  
200m/s2  
3directions, 4cycles  
Substrate Bending  
JEITA ED-4702 3mm, 5 ± 1 sec.  
JEITA ED-4702 5N, 10 ± 1 sec.  
JEITA ED-4701 R=1.5k, C=100pF  
1 time  
1 time  
0/22  
0/22  
0/22  
Adhesion Strength  
Electrostatic Discharges  
3 times  
300 304  
Test Voltage=2kV  
Negative/Positive  
½ Thermal resistance of LED with Nichia standard circuit board : Rja 65°C/W  
Nichia standard circuit board : FR4, t=1.6mm, Copper foil, t=0.07mm  
(2) CRITERIA FOR JUDGING DAMAGE  
Criteria for Judgement  
Min.  
Max.  
Item  
Forward Voltage  
Luminous Flux  
Symbol Test Conditions  
VF  
IF=300mA  
IF=300mA  
-
Initial Level ¯ 1.1  
φv  
Initial Level ¯ 0.7  
-
½ The test is performed after the board is cooled down to the room temperature.  
-3-  
Nichia STSE-CC7099A-1  
<Cat.No.071212>  
7.CAUTIONS  
(1) Moisture Proof Package  
· When moisture is absorbed into the SMT package it may vaporize and expand during soldering.  
There is a possibility that this can cause exfoliation of the contacts and damage the optical  
characteristics of the LEDs.  
to a minimum in the package.  
For this reason, the moisture proof package is used to keep moisture  
· The moisture proof package is made of an aluminum moisture proof bag. A package of  
a moisture absorbent material (silica gel) is inserted into the aluminium moisture proof bag.  
The silica gel changes its color from blue to pink as it absorbs moisture.  
(2) Storage  
· Storage Conditions  
Before opening the package :  
The LEDs should be kept at 30°C or less and 90%RH or less. The LEDs should be used within  
a year.  
When storing the LEDs, moisture proof packaging with absorbent material (silica gel)  
is recommended.  
After opening the package :  
The LEDs should be kept at 30°C or less and 70%RH or less. The LEDs should be soldered  
within 168 hours (7days) after opening the package.  
stored in the moisture proof packages, such as sealed containers with packages of moisture  
absorbent material (silica gel). It is also recommended to return the LEDs to the original  
If unused LEDs remain, they should be  
moisture proof bag and to reseal the moisture proof bag again.  
· If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage  
time, baking treatment should be performed using the following condition.  
Baking treatment : more than 24 hours at 65 ± 5°C  
· This product has silver plated metal parts that are inside and/or outside the package body. The silver  
plating becomes tarnished when being exposed to an environment which contains corrosive gases.  
Any LED with tarnished leads may lead to poor solderability and deterioration of optical characteristics.  
Please do not expose the LEDs to corrosive atmosphere during storage.  
· After assembly and during use, silver plating can be affected by the corrosive gases emitted by  
components and materials in close proximity of the LEDs within an end product, and the gases entering  
into the product from the external atmosphere. The above should be taken into consideration when  
designing.  
· Please avoid rapid transitions in ambient temperature, especially in high humidity environments where  
condensation can occur.  
(3) Recommended circuit  
· In designing a circuit, the current through each LED must not exceed its absolute maximum rating.  
It is recommended to use Circuit B which regulates the current flowing through each LED.  
In the meanwhile, when driving LEDs with a constant voltage in Circuit A, the current through  
the LEDs may vary due to the variation in forward voltage (VF) of the LEDs. In the worst case,  
some LED may be subjected to stresses in excess of the absolute maximum rating.  
(B)  
(A)  
-4-  
Nichia STSE-CC7099A  
<Cat.No.070615>  
(4) Soldering Conditions  
· The LEDs can be soldered in place using the reflow soldering method.  
Nichia cannot make a  
guarantee on the LEDs after they have been assembled using the dip soldering method.  
· Recommended soldering conditions  
Reflow Soldering  
Lead Solder  
120 ~ 150°C  
Hand Soldering  
Temperature 350°C Max.  
Soldering time 3 sec. Max.  
(one time only)  
Lead-free Solder  
180 ~ 200°C  
120 sec. Max.  
Pre-heat  
Pre-heat time  
Peak  
120 sec. Max.  
240°C Max.  
260°C Max.  
temperature  
Soldering time  
Condition  
10 sec. Max.  
refer to  
10 sec. Max.  
refer to  
Temperature - profile 1. Temperature - profile 2.  
(N2 reflow is recommended.)  
Although the recommended soldering conditions are specified in the above table, reflow or hand  
soldering at the lowest possible temperature is desirable for the LEDs.  
A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.  
[Temperature-profile (Surface of circuit board)]  
Use the conditions shown to the under figure.  
<1 : Lead Solder>  
<2 : Lead-free Solder>  
2.5 ~ 5°C / sec.  
1 ~ 5°C / sec.  
240°C Max.  
260°C Max.  
10sec. Max.  
Pre-heating  
10sec. Max.  
Pre-heating  
1 ~ 5°C / sec.  
180 ~ 200°C  
2.5 ~ 5°C / sec.  
120 ~ 150°C  
60sec.Max.  
60sec.Max.  
Above 220°C  
Above 200°C  
120sec.Max.  
120sec.Max.  
[Recommended soldering pad design]  
Use the following conditions shown in the figure.  
(9.5)  
2.05  
Thin line boxesSolder resist opening  
Thick line boxesLand pattern  
Die Heat Sink  
1.05  
Make sure the die heat sink is electrically  
connected to the cathode(K).  
1.1  
K
A
4.5  
8
(Unit : mm)  
· Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere  
during air reflow. It is recommended that the User use the nitrogen reflow method.  
· The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the  
top of package. The pressure to the top surface will be influence to the reliability of the LEDs.  
Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using  
the chip mounter, the picking up nozzle that does not affect the silicone resin should be used.  
· Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,  
a hot plate should be used. It should be confirmed beforehand whether the characteristics of the LEDs  
will or will not be damaged by repairing.  
· Reflow soldering should not be done more than two times.  
· Die Heat sink is to be soldered.  
If not, please use the heat conductive adhesive.  
· When soldering, do not put stress on the LEDs during heating.  
· After soldering, do not warp the circuit board.  
-5-  
Nichia STSE-CC7099A  
<Cat.No.070615>  
(5) Cleaning  
· It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs.  
other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the  
resin or not. Freon solvents should not be used to clean the LEDs because of worldwide regulations.  
· Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic  
When using  
cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition.  
Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur.  
(6) Static Electricity  
· Static electricity or surge voltage damages the LEDs.  
It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs.  
· All devices, equipment and machinery must be properly grounded. It is recommended that precautions  
be taken against surge voltage to the equipment that mounts the LEDs.  
· When inspecting the final products in which LEDs were assembled, it is recommended to check  
whether the assembled LEDs are damaged by static electricity or not.  
It is easy to find  
static-damaged LEDs by a light-on test or a VF test at a lower current (below 6mA is recommended).  
· Damaged LEDs will show some unusual characteristics such as the forward voltage becomes lower,  
or the LEDs do not light at the low current.  
Criteria : (VF > 2.0V at IF=3mA)  
(7) Heat Generation  
· Thermal design of the end product is of paramount importance.  
Please consider the heat generation  
of the LED when making the system design. The coefficient of temperature increase per input  
electric power is affected by the thermal resistance of the circuit board and density of LED placement  
on the board, as well as other components. It is necessary to avoid intense heat generation and operate  
within the maximum ratings given in this specification.  
· Please determine the operating current with consideration of the ambient temperature local to the LED  
and refer to the plot of Ambient temperature vs. Allowable Forward Current on CHARACTERISTICS  
in this specifications. Please also take measures to remove heat from the area near the LED (heat sink)  
to improve the operational characteristics of the LED.  
· The equation 1 indicates correlation between Tj and Ta, and the equation 2 indicates correlation  
between Tj and Ts.  
Tj=Ta + RjaW  
1
Tj=Ts + RjsW  
2
Tj = Dice Temperature : °C, Ta = Ambient Temperature : °C,  
Ts = Solder Temperature (Cathode Side) : °C,  
Rja = Heat resistance from Dice to Ambient temperature : °C /W,  
Rjs = Heat resistance from Dice to Ts measuring point 10°C /W,  
W = Inputting Power (IF VF) : W  
-6-  
Nichia STSE-CC7099A  
<Cat.No.070615>  
(8) Others  
· NS6B083 complies with RoHS Directive.  
· The LED light output is strong enough to injure human eyes. Precautions must be taken to prevent  
looking directly at the LEDs with unaided eyes for more than a few seconds.  
· Flashing lights have been known to cause discomfort in people; you can prevent this by taking  
precautions during use. Also, people should be cautious when using equipment that has had LEDs  
incorporated into it.  
· The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such  
as office equipment, communications equipment, measurement instruments and household appliances).  
Consult Nichia’s sales staff in advance for information on the applications in which exceptional quality  
and reliability are required, particularly when the failure or malfunction of the LEDs may directly  
jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor  
control systems, automobiles, traffic control equipment, life support systems and safety devices).  
· User shall not reverse engineer by disassembling or analysis of the LEDs without having prior written  
consent from Nichia.  
When defective LEDs are found, the User shall inform Nichia directly before  
disassembling or analysis.  
· The formal specifications must be exchanged and signed by both parties before large volume purchase begins.  
· The appearance and specifications of the product may be modified for improvement without notice.  
-7-  
Nichia STSE-CC7099A  
<Cat.No.070615>  
ICI Chromaticity Diagram  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
520  
530  
540  
510  
550  
560  
570  
500  
580  
590  
600  
610  
620  
630  
490  
480  
W
470  
460  
0
0.1  
0.2  
0.3  
0.4  
0.5  
0.6  
0.7  
0.8  
x
½ Color Coordinates Measurement allowance is ± 0.01.  
-8-  
Forward Voltage vs.  
Forward Current vs.  
Duty Ratio vs.  
Allowable Forward Current  
Forward Current  
Relative Luminous Flux  
1000  
2.5  
1000  
Ta=25°C  
Ta=25°C  
2.0  
Ta=25°C  
600  
300  
1.5  
1.0  
0.5  
0
350  
200  
100  
50  
100  
10  
0
100 200 300 400 500 600 700  
Forward Current IFP (mA)  
1
5
10 20  
50 100  
2.0 2.5 3.0 3.5 4.0 4.5  
Forward Voltage VF (V)  
Duty Ratio (%)  
Ambient Temperature vs.  
Ambient Temperature vs.  
Ambient Temperature vs.  
Forward Voltage  
Relative Luminous Flux  
Allowable Forward Current  
5.0  
2.0  
500  
Thermal resistance  
Rja=35°C/W  
IFP=300mA  
4.5  
IFP=300mA  
400  
1.0  
0.5  
350  
270  
4.0  
3.5  
3.0  
2.5  
Thermal resistance  
160  
Rja=65°C/W  
Typical measuring PWB  
100  
0.2  
0
-40 -20  
0
20 40 60 80 100  
-40 -20  
0
20 40 60 80 100  
0
20  
40  
60  
80 100  
Ambient Temperature Ta (°C)  
Ambient Temperature Ta (°C)  
Ambient Temperature Ta (°C)  
Model  
NS6B083  
Title CHARACTERISTICS  
NICHIA CORPORATION  
No.  
070608766371  
Forward Current vs.  
Spectrum  
Chromaticity Coordinate (λD)  
0.11  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0
Ta=25°C  
0.10  
Ta=25°C  
=300mA  
I
FP  
20mA(473.6nm)  
0.09  
100mA(472.0nm)  
0.08  
300mA(470.7nm)  
400mA(470.4nm)  
0.07  
600mA(469.9nm)  
0.06  
0.10 0.11 0.12 0.13 0.14 0.15  
350  
450  
550  
650  
750  
Wavelength λ (nm)  
x
Forward Current vs.  
Ambient Temperature vs.  
Directivity  
Dominant Wavelength  
Dominant Wavelength  
0°  
10°  
477  
1.0  
20°  
477  
30°  
Ta=25°C  
475  
Ta=25°C  
IFP=300mA  
IFP=300mA  
475  
40°  
50°  
473  
471  
469  
467  
465  
473  
471  
469  
467  
465  
60°  
70°  
80°  
0.5  
0
90°  
1.0  
90°  
60°  
30°  
0°  
0.5  
10  
100  
1000  
-40 -20  
0
20 40 60 80 100  
Radiation Angle  
Ambient Temperature Ta (°C)  
Forward Current IFP (mA)  
Model  
NS6B083  
Title CHARACTERISTICS  
NICHIA CORPORATION  
No.  
070608766381  
4.3  
3.2  
Die Heatsink  
Cathode  
Internal Circuit  
A
K
Protection device  
Cathode mark  
C 1.5  
0.6  
6.5  
5
Anode  
Die Heatsink  
4.85  
3.4  
ITEM  
MATERIALS  
PACKAGE  
Heat-Resistant Polymer  
Silicone Resin (with Diffused)  
Ag Plating Copper Alloy  
ENCAPSULATING RESIN  
ELECTRODES  
Unit  
mm  
Model  
Title  
NS6B083  
7/1  
Scale  
Allow  
±0.2  
OUTLINE DIMENSIONS  
070608766391  
NICHIA CORPORATION  
½ NS6B083 has a protection device built in as a protection  
circuit against static electricity.  
No.  
+0  
15.4±1  
φ 180  
-3  
Reel part  
Taping part  
+1  
13  
-0  
4±0.1  
+0.1  
φ 1.5  
0.2±0.05  
-0  
2±0.05  
Cathode mark  
8±0.1  
1.55±0.1  
Label  
+0.2  
φ1.5  
-0  
XXXX LED  
TYPE NS6x083T  
LOT xxxxxx-U„z  
5.2±0.1  
QTY  
pcs  
RoHS  
Reel end of tape  
No LEDs  
LEDs mounting part  
No LEDs  
Pull direction  
Top cover  
tape  
Embossed carrier tape  
Reel Lead Min.160mm (No LEDs)  
Reel Lead Min.100mm (No LEDs)  
Reel Lead Min.400mm  
1,400pcs/Reel  
Unit  
mm  
NS6x083T  
Model  
Title  
Taping is based on the JIS C 0806 : Packaging of Electronic  
TAPING DIMENSIONS  
070524652622  
NICHIA CORPORATION  
Components on Continuous Tapes.  
Scale  
Allow  
No.  
Nichia STSE-CC7099A  
<Cat.No.070615>  
The reel and moisture absorbent material are put in the moisture proof foil bag  
and then heat sealed.  
Reel  
Label  
NICHIA  
Seal  
XXXX LED  
TYPE  
LOT  
QTY  
NS6x083T  
xxxxxx-U„z  
PCS  
RoHS  
NICHIA CORPORATION  
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN  
Moisture proof foil bag  
Moisture  
absorbent material  
The box is partitioned with the  
cardboard.  
Label  
NICHIA  
XXXX LED  
NS6x083T  
U„z  
PCS  
Nichia LED  
TYPE  
RANK  
QTY  
RoHS  
NICHIA CORPORATION  
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN  
Packing unit  
Reel/bag  
1reel  
Quantity/bag (pcs)  
1,400 MAX.  
Moisture proof foil bag  
Cardboard box  
Cardboard box S  
Cardboard box M  
Cardboard box L  
Dimensions (mm)  
291¯237¯120¯8t  
259¯247¯243¯5t  
444¯262¯259¯8t  
Reel/box  
Quantity/box (pcs)  
7,000 MAX.  
5reel MAX.  
10reel MAX.  
20reel MAX.  
14,000 MAX.  
28,000 MAX.  
Model  
Title  
NS6x083T  
PACKING  
NICHIA CORPORATION  
No.  
070524652632  
-13-  

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Operator Interfaces/HMIs NS
OMRON

NS8-TV01B-V2

Operator Interfaces/HMIs NS
OMRON