NSSL100CT

更新时间:2024-09-18 06:04:26
品牌:NICHIA
描述:SPECIFICATIONS FOR NICHIA CHIP TYPE WARM WHITE LED

NSSL100CT 概述

SPECIFICATIONS FOR NICHIA CHIP TYPE WARM WHITE LED 规格FOR NICHIA片式暖白光LED

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No. STSE-CC6069A  
<Cat.No.060601>  
SPECIFICATIONS FOR NICHIA CHIP TYPE WARM WHITE LED  
MODEL : NSSL100CT  
NICHIA CORPORATION  
Nichia STSE-CC6069A  
<Cat.No.060601>  
1.SPECIFICATIONS  
(1) Absolute Maximum Ratings  
Item  
(Ta=25°C)  
Unit  
Symbol  
IF  
Absolute Maximum Rating  
Forward Current  
35  
110  
mA  
Pulse Forward Current  
Reverse Voltage  
IFP  
mA  
VR  
5
V
Power Dissipation  
Operating Temperature  
Storage Temperature  
Soldering Temperature  
PD  
123  
mW  
Topr  
Tstg  
Tsld  
-30 ~ + 85  
-40 ~ +100  
°C  
°C  
Reflow Soldering : 260°C  
Hand Soldering : 350°C  
for 10sec.  
for 3sec.  
<
<
IFP Conditions  
:
Pulse Width 10msec. and Duty 1/10  
=
=
(2) Initial Electrical/Optical Characteristics  
Item Symbol Condition  
Forward Voltage  
(Ta=25°C)  
Typ.  
(3.2)  
-
Max.  
Unit  
V
VF  
IR  
Iv  
-
IF=20[mA]  
VR= 5[V]  
3.5  
50  
-
Reverse Current  
µA  
mcd  
-
Luminous Intensity  
IF=20[mA]  
IF=20[mA]  
IF=20[mA]  
(880)  
0.41  
0.39  
x
y
-
Chromaticity Coordinate  
-
-
-
Please refer to CIE 1931 chromaticity diagram.  
(3) Ranking  
(Ta=25°C)  
Unit  
Item  
Symbol Condition  
Min.  
880  
620  
Max.  
1240  
880  
Rank V  
Rank U  
Iv  
Iv  
IF=20[mA]  
IF=20[mA]  
mcd  
Luminous Intensity  
mcd  
Luminous Intensity Measurement allowance is ± 10%.  
Color Ranks  
(IF=20mA,Ta=25°C)  
Rank d1  
x
y
0.3575 0.3610 0.3780 0.3988 0.3897 0.3720  
0.3612 0.3850 0.3970 0.4116 0.3823 0.3714  
Rank d2  
x
y
0.3545 0.3575 0.3720 0.3897 0.3822 0.3667  
0.3408 0.3612 0.3714 0.3823 0.3580 0.3484  
Rank e1  
x
y
0.3897 0.3988 0.4162 0.4390 0.4255 0.4053  
0.3823 0.4116 0.4200 0.4310 0.4000 0.3907  
-1-  
Nichia STSE-CC6069A  
<Cat.No.060601>  
Rank e2  
x
y
0.3822 0.3897 0.4053 0.4255 0.4129 0.3954  
0.3580 0.3823 0.3907 0.4000 0.3725 0.3642  
Rank f3  
Rank f4  
x
0.4255 0.4390 0.4680 0.4519  
0.4000 0.4310 0.4385 0.4086  
x
y
0.4519 0.4680 0.4970 0.4770  
0.4086 0.4385 0.4466 0.4137  
y
Rank f5  
Rank f6  
x
y
0.4129 0.4255 0.4519 0.4355  
0.3725 0.4000 0.4086 0.3785  
x
y
0.4355 0.4519 0.4770 0.4588  
0.3785 0.4086 0.4137 0.3838  
Color Coordinates Measurement allowance is ± 0.01.  
2.INITIAL OPTICAL/ELECTRICAL CHARACTERISTICS  
Please refer to figure’s page.  
3.OUTLINE DIMENSIONS AND MATERIALS  
Please refer to figure’s page.  
Material as follows ;  
Package  
Encapsulating Resin  
Electrodes  
:
:
:
Ceramics  
Silicone Resin (with Phosphor)  
Au Plating  
4.PACKAGING  
· The LEDs are packed in cardboard boxes after taping.  
Please refer to figure’s page.  
The label on the minimum packing unit shows ; Part Number, Lot Number, Ranking, Quantity  
· In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation.  
· The LEDs may be damaged if the boxes are dropped or receive a strong impact against them,  
so precautions must be taken to prevent any damage.  
· The boxes are not water resistant and therefore must be kept away from water and moisture.  
· When the LEDs are transported, we recommend that you use the same packing method as Nichia.  
5.LOT NUMBER  
The first six digits number shows lot number.  
The lot number is composed of the following characters;  
ꢁꢂꢃꢃꢃ- Uꢄ  
- Year  
( 5 for 2005, 6 for 2006 )  
- Month ( 1 for Jan., 9 for Sep., A for Oct., B for Nov. )  
ꢃꢃꢃꢃ - Nichia's Product Number  
U - Ranking by Color Coordinates  
- Ranking by Luminous Intensity  
-2-  
Nichia STSE-CC6069A  
<Cat.No.060601>  
6.RELIABILITY  
(1) TEST ITEMS AND RESULTS  
Standard  
Number of  
Test Item  
Resistance to  
Soldering Heat  
(Reflow Soldering)  
Solderability  
Test Method  
JEITA ED-4701  
300 301  
Test Conditions  
Tsld=260°C, 10sec.  
(Pre treatment 30°C,70%,168hrs.)  
Note  
2 times  
Damaged  
0/50  
JEITA ED-4701  
300 303  
JEITA ED-4701  
300 307  
JEITA ED-4701  
100 105  
JEITA ED-4701  
200 203  
JEITA ED-4701  
200 201  
JEITA ED-4701  
100 103  
JEITA ED-4701  
200 202  
Tsld=215 ± 5°C, 3sec.  
(Lead Solder)  
0°C ~ 100°C  
1 time  
over 95%  
20 cycles  
0/50  
0/50  
0/50  
0/50  
0/50  
0/50  
0/50  
0/50  
0/50  
0/50  
0/50  
0/50  
0/50  
(Reflow Soldering)  
Thermal Shock  
15sec. 15sec.  
Temperature Cycle  
-40°C ~ 25°C ~ 100°C ~ 25°C  
30min. 5min. 30min. 5min.  
25°C ~ 65°C ~ -10°C  
90%RH 24hrs./1cycle  
Ta=100°C  
100 cycles  
10 cycles  
1000 hrs.  
1000 hrs.  
1000 hrs.  
1000 hrs.  
1000 hrs.  
1000 hrs.  
500 hrs.  
Moisture Resistance Cyclic  
High Temperature Storage  
Temperature Humidity  
Storage  
Low Temperature Storage  
Ta=60°C, RH=90%  
Ta=-40°C  
Steady State Operating Life  
Condition 1  
Steady State Operating Life  
Condition 2  
Steady State Operating Life  
of High Temperature  
Steady State Operating Life  
of High Humidity Heat  
Steady State Operating Life  
of Low Temperature  
Vibration  
Ta=25°C, IF=20mA  
Ta=25°C, IF=35mA  
Ta=85°C, IF=10mA  
60°C, RH=90%, IF=20mA  
Ta=-30°C, IF=20mA  
1000 hrs.  
48min.  
JEITA ED-4701  
400 403  
100 ~ 2000 ~ 100Hz Sweep 4min.  
200m/s2  
3direction, 4cycles  
3mm, 5 ± 1 sec.  
Substrate Bending  
Adhesion Strength  
JEITA ED-4702  
JEITA ED-4702  
1 time  
1 time  
0/50  
0/50  
5N, 10 ± 1 sec.  
(2) CRITERIA FOR JUDGING DAMAGE  
Criteria for Judgement  
Min.  
Max.  
Item  
Symbol Test Conditions  
Forward Voltage  
Reverse Current  
Luminous Intensity  
VF  
IR  
IF=20mA  
VR=5V  
-
U.S.L.*)1.1  
U.S.L.*)2.0  
-
-
IV  
IF=20mA  
L.S.L.**)0.7  
*) U.S.L. : Upper Standard Level  
**) L.S.L. : Lower Standard Level  
-3-  
Nichia STSE-CC6069A  
<Cat.No.060601>  
7.CAUTIONS  
The LEDs are devices which are materialized by combining Blue LEDs and special phosphors.  
Consequently, the color of the LEDs is changed a little by an operating current.  
Care should be taken after due consideration when using LEDs.  
(1) Moisture Proof Package  
· When moisture is absorbed into the SMT package it may vaporize and expand during soldering.  
There is a possibility that this can cause exfoliation of the contacts and damage to the optical  
characteristics of the LEDs.  
to a minimum in the package.  
For this reason, the moisture proof package is used to keep moisture  
· The moisture proof package is made of an aluminum moisture proof bag with a zipper.  
a moisture absorbent material (silica gel) is inserted into the aluminum moisture proof bag.  
The silica gel changes its color from blue to pink as it absorbs moisture.  
A package of  
(2) Storage  
· Storage Conditions  
Before opening the package :  
The LEDs should be kept at 30°C or less and 90%RH or less. The LEDs should be used within a  
year. When storing the LEDs, moisture proof packaging with absorbent material (silica gel)  
is recommended.  
After opening the package :  
The LEDs should be kept at 30°C or less and 70%RH or less.  
The LEDs should be soldered  
within 168 hours (7days) after opening the package.  
If unused LEDs remain, they should be  
stored in moisture proof packages, such as sealed containers with packages of moisture absorbent  
material (silica gel). It is also recommended to return the LEDs to the original moisture proof bag  
and to reseal the moisture proof bag again.  
· If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage  
time, baking treatment should be performed using the following conditions.  
Baking treatment : more than 24 hours at 65 ± 5°C  
· Nichia LED electrodes are gold plated. The gold surface may be affected by environments which  
contain corrosive substances. Please avoid conditions which may cause the LED to corrode, tarnish  
or discolor. This corrosion or discoloration may cause difficulty during soldering operations.  
It is recommended that the User use the LEDs as soon as possible.  
· Please avoid rapid transitions in ambient temperature, especially in high humidity environments where  
condensation can occur.  
(3) Heat Generation  
· Thermal design of the end product is of paramount importance.  
Please consider the heat generation  
of the LED when making the system design. The coefficient of temperature increase per input  
electric power is affected by the thermal resistance of the circuit board and density of LED placement  
on the board, as well as other components. It is necessary to avoid intense heat generation and operate  
within the maximum ratings given in this specification.  
· The operating current should be decided after considering the ambient maximum temperature of LEDs.  
-4-  
Nichia STSE-CC6069A  
<Cat.No.060601>  
(4) Soldering Conditions  
· The LEDs can be soldered in place using the reflow soldering method.  
Nichia cannot make a  
guarantee on the LEDs after they have been assembled using the dip soldering method.  
· Recommended soldering conditions  
Reflow Soldering  
Lead Solder  
120 ~ 150°C  
120 sec. Max.  
240°C Max.  
Hand Soldering  
Lead-free Solder  
180 ~ 200°C  
120 sec. Max.  
Pre-heat  
Pre-heat time  
Peak  
Temperature 350°C Max.  
Soldering time 3 sec. Max.  
(one time only)  
260°C Max.  
temperature  
Soldering time  
Condition  
10 sec. Max.  
refer to  
10 sec. Max.  
refer to  
Temperature - profile 1. Temperature - profile 2.  
(N2 reflow is recommended.)  
After reflow soldering rapid cooling should be avoided.  
[Temperature-profile (Surface of circuit board)]  
Use the conditions shown to the under figure.  
<1: Lead Solder>  
<2: Lead-free Solder>  
2.5 ~ 5°C / sec.  
1 ~ 5°C / sec.  
240°C Max.  
260°C Max.  
10sec. Max.  
Pre-heating  
10sec. Max.  
Pre-heating  
1 ~ 5°C / sec.  
180 ~ 200°C  
2.5 ~ 5°C / sec.  
120 ~ 150°C  
60sec.Max.  
60sec.Max.  
Above 220°C  
Above 200°C  
120sec.Max.  
120sec.Max.  
[Recommended soldering pad design]  
Use the following conditions shown in the figure.  
2.2  
1.5  
(Unit : mm)  
4.4  
· Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere  
during air reflow. It is recommended that the User use the nitrogen reflow method.  
· The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the  
top of package. The pressure to the top surface will be influence to the reliability of the LEDs.  
Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using  
the chip mounter, the picking up nozzle that does not affect the silicone resin should be used.  
· Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,  
a double-head soldering iron should be used. It should be confirmed beforehand whether the  
characteristics of the LEDs will or will not be damaged by repairing.  
· Reflow soldering should not be done more than two times.  
· When soldering, do not put stress on the LEDs during heating.  
· After soldering, do not warp the circuit board.  
(5) Cleaning  
· It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs.  
When using  
other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the  
resin or not. Freon solvents should not be used to clean the LEDs because of worldwide regulations.  
· Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic  
cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition.  
Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur.  
-5-  
Nichia STSE-CC6069A  
<Cat.No.060601>  
(6) Static Electricity  
· Static electricity or surge voltage damages the LEDs.  
It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs.  
· All devices, equipment and machinery must be properly grounded. It is recommended that precautions  
be taken against surge voltage to the equipment that mounts the LEDs.  
· When inspecting the final products in which LEDs were assembled, it is recommended to check  
whether the assembled LEDs are damaged by static electricity or not.  
It is easy to find  
static-damaged LEDs by a light-on test or a VF test at a lower current (below 1mA is recommended).  
· Damaged LEDs will show some unusual characteristics such as the leak current remarkably  
increases, the forward voltage becomes lower, or the LEDs do not light at the low current.  
Criteria : (VF > 2.0V at IF=0.5mA)  
(7) Others  
· Care must be taken to ensure that the reverse voltage will not exceed the absolute maximum rating  
when using the LEDs with matrix drive.  
· The LED light output is strong enough to injure human eyes. Precautions must be taken to prevent  
looking directly at the LEDs with unaided eyes for more than a few seconds.  
· Flashing lights have been known to cause discomfort in people; you can prevent this by taking  
precautions during use. Also, people should be cautious when using equipment that has had LEDs  
incorporated into it.  
· The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such  
as office equipment, communications equipment, measurement instruments and household appliances).  
Consult Nichia’s sales staff in advance for information on the applications in which exceptional quality  
and reliability are required, particularly when the failure or malfunction of the LEDs may directly  
jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor  
control systems, automobiles, traffic control equipment, life support systems and safety devices).  
· User shall not reverse engineer by disassembling or analysis of the LEDs without having prior written  
consent from Nichia.  
When defective LEDs are found, the User shall inform Nichia directly before  
disassembling or analysis.  
· The formal specifications must be exchanged and signed by both parties before large volume purchase begins.  
· The appearance and specifications of the product may be modified for improvement without notice.  
-6-  
Nichia STSE-CC6069A  
<Cat.No.060601>  
ICI Chromaticity Diagram  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
520  
530  
540  
510  
550  
560  
570  
580  
500  
f4  
f3  
590  
e1  
d1  
600  
f6  
f5  
610  
620  
e2  
d2  
490  
630  
480  
470  
460  
0.1  
0.2  
0.3  
0.4  
x
0.5  
0.6  
0.7  
0.8  
0
½ Color Coordinates Measurement allowance is ± 0.01.  
-7-  
Forward Voltage vs.  
Forward Current vs.  
Duty Ratio vs.  
Allowable Forward Current  
Forward Current  
Relative Luminosity  
4.0  
200  
200  
Ta=25°C  
100  
Ta=25°C  
Ta=25°C  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
110  
50  
20  
10  
5
50  
35  
20  
10  
1
2.0 2.5 3.0 3.5 4.0 4.5 5.0  
0
20 40 60 80 100 120  
Forward Current IFP (mA)  
1
5
10 20  
50 100  
Forward Voltage VF (V)  
Duty Ratio (%)  
Ambient Temperature vs.  
Ambient Temperature vs.  
Ambient Temperature vs.  
Forward Voltage  
Relative Luminosity  
Allowable Forward Current  
5.0  
2.0  
50  
40  
30  
20  
10  
0
I
I
=60mA  
=20mA  
FP  
IFP=20mA  
4.6  
4.2  
3.8  
3.4  
3.0  
2.6  
2.2  
FP  
IFP=5mA  
1.0  
0.5  
0.2  
-40 -20  
0
20 40 60 80 100  
-40 -20  
0
20 40 60 80 100  
0
20  
40  
60  
80 100  
Ambient Temperature Ta (°C)  
Ambient Temperature Ta (°C)  
Ambient Temperature Ta (°C)  
Model  
NSSL100C  
Title  
No.  
CHARACTERISTICS  
060524652981  
NICHIA CORPORATION  
Spectrum  
Forward Current vs.  
Chromaticity Coordinate  
0.400  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0
Ta=25°C  
Ta=25°C  
IF=20mA  
0.395  
0.390  
0.385  
0.380  
20mA  
50mA  
1mA  
5mA  
100mA  
0.395 0.400 0.405 0.410 0.415  
400  
500  
600  
700  
800  
0°  
Wavelength λ (nm)  
x
Ambient Temperature vs.  
Directivity  
Chromaticity Coordinate  
Y
Y
10°  
1.0  
20°  
0.400  
30°  
X
X
IFP=20mA  
40°  
0.395  
-30°C  
50°  
0°C  
60°  
70°  
25°C  
0.5  
0.390  
50°C  
Ta=25°C  
IFP=20mA  
0.385  
85°C  
X-X  
Y-Y  
80°  
90°  
0
0.380  
90°  
60°  
30°  
0°  
0.5  
1.0  
0.395 0.400 0.405 0.410 0.415  
Radiation Angle  
x
Model  
Title  
No.  
NSSL100C  
CHARACTERISTICS  
060524652991  
NICHIA CORPORATION  
+0.3  
2
1.2 ± 0.15  
1.7  
-0.2  
1.3  
Anode  
A
K
LED chip  
Cathode  
0.5  
Cathode mark  
ITEM  
PACKAGE  
MATERIALS  
Ceramics  
ENCAPSULATING RESIN Silicone Resin (with Phosphor)  
ELECTRODES  
Au Plating  
Unit  
mm  
Model  
Title  
NSSL100x  
10/1  
Scale  
OUTLINE DIMENSIONS  
NICHIA CORPORATION  
Allow  
±0.2  
No.  
050602317653  
11.4±1  
9±0.3  
+0  
φ 180  
-3  
Taping part  
Reel part  
+0.1  
0.2±0.05  
φ 1.5  
4±0.1  
-0  
2±0.05  
Cathode mark  
Label  
4±0.1  
2 MAX.  
XXXX LED  
+0.25  
φ 1  
-0  
TYPE NSSx100xT  
2.5±0.2  
LOT XXXXXX-U„  
QTY  
pcs  
Reel End of tape  
No LEDs  
LEDs mounting part  
No LEDs  
Top cover tape  
Embossed carrier tape  
Pull direction  
Reel Lead Min.160mm (No LEDs is more than 40)  
Reel Lead Min.400mm  
Reel Lead Min.40mm (No LEDs)  
2,500pcs/Reel  
Unit  
mm  
NSSx100xT  
Model  
Title  
Taping is based on the JIS C 0806 : Packaging of Electronic  
Components on Continuous Tapes.  
TAPING DIMENSIONS  
060127537872  
NICHIA CORPORATION  
Scale  
Allow  
No.  
Nichia STSE-CC6069A  
<Cat.No.060601>  
The reel and moisture absorbent material are put in the moisture proof foil bag  
and then heat sealed.  
Reel  
Label  
NICHIA  
Seal  
XXXX LED  
TYPE  
LOT  
QTY  
NSSx100xT  
xxxxxx-U„  
PCS  
NICHIA CORPORATION  
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN  
Moisture proof foil bag  
Moisture  
absorbent material  
The box is partitioned with the  
cardboard.  
Label  
NICHIA  
XXXX LED  
Nichia LED  
TYPE  
RANK  
QTY  
NSSx100xT  
U„  
PCS  
NICHIA CORPORATION  
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN  
Packing unit  
Reel/bag  
1reel  
Quantity/bag (pcs)  
Moisture proof foil bag  
2,500 MAX.  
Cardboard box  
Cardboard box S  
Cardboard box M  
Cardboard box L  
Dimensions (mm)  
291¯237¯120¯8t  
259¯247¯243¯5t  
444¯262¯259¯8t  
Reel/box  
Quantity/box (pcs)  
17,500 MAX.  
37,500 MAX.  
75,000 MAX.  
7reel MAX.  
15reel MAX.  
30reel MAX.  
Model  
Title  
NSSx100xT  
PACKING  
NICHIA CORPORATION  
No.  
050602541181  
-12-  

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