NSHC222G50TRA1F [NICHICON]
Film Capacitor, Polyphenylene Sulphide, 50V, 2% +Tol, 2% -Tol, 0.0022uF, Surface Mount, 0805, CHIP, ROHS COMPLIANT;
| 型号： | NSHC222G50TRA1F |
| 厂家： | 
NICHICON CORPORATION |
| 描述： | Film Capacitor, Polyphenylene Sulphide, 50V, 2% +Tol, 2% -Tol, 0.0022uF, Surface Mount, 0805, CHIP, ROHS COMPLIANT 电容器 |
| 文件： | 总2页 (文件大小：137K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Stacked Film Capacitor Chips
NSHC Series
FEATURES
• STACKED METALLIZED POLYPHENYLENE SULFIDE (PPS) FILM
• STANDARD EIA 0603, 0805, 1206, 1210, 1913 AND 2416 SIZES
• WIDE TEMPERATURE RANGE UP TO +125OC (100pF ~ 0.1µF)
• HIGH HEAT AND MOISTURE RESISTANT
NEW
• VERY STABLE TEMPERATURE, FREQUENCY, VOLTAGE, BIAS AND
nDIELECTRIC ABSORPTION CHARACTERISTICS
• SUITABLE FOR REFLOW (100pF ~ 0.1µF) & FLOW (0.12µF ~ 0.22µF)
SOLDERING
• TAPE AND REEL PACKAGING
Case Sizes
1206
SPECIFICATIONS
0603
0805
1210
1913
2416
Capacitance Range
Voltage Ratings
100pF ~ 0.0027µF 100pF ~ .01µF 3300pF ~ .047µF .012µF ~ .1µF .047µF ~ .1µF 0.12µF ~ 0.22µF
16Vdc (12Vrms), 50Vdc (40Vrms)
±5% Std, ±2% Opt
-55oC ~ +125°C (0.12µF ~ 0.22µF voltage derated above 105°C)
Capacitance Tolerance
Temperature Range
Dissipation Factor (20°C)
Insulation Resistance (20°C)
0.6% max @ 1 KHz
3 Gigohms Minimum
150% of Rated Voltage 60 Seconds
175% of Rated Voltage for 5 Seconds (except 1913 and 2416 case sizes)
Dielectric Withstanding Voltage
Temperature Characteristic
Dielectric Absorption
±3% ∆C Maximum Over Temperature Range
0.05 ~ 0.10% Typical
ENVIRONMENTAL CHARACTERISTICS
Life Test At +125°C
1000 Hours at 125% of
Rated Voltage
Capacitance Change
Dissipation Factor
Within ±2% of Initial Value
0.66% Maximum
NSHC IS
RECOMMENDED
FOR NEW DESIGNS
Insulation Resistance
1 Gigohm Minimum
Resistance to Soldering Heat:
+260°C Peak for 5 Seconds
(0.047µF ~ 0.22µF)
Capacitance Change
Dissipation Factor
Within ±3% of Initial Value
0.66% Maximum
Insulation Resistance
1 Gigohm Minimum
Humidity Load Life (Note 1):
(1) 1000 Hours, +40°C
(2) 500 Hours, +60°C
Capacitance Change
Dissipation Factor
Within ±2% of Initial Value
0.90% Maximum
Insulation Resistance
(1) 1 Gigohm Minimum
(2) 0.5 Gigohm Minimum
Solderability with
10% Wt Rosin-Methanol Flux
90% Minimum Coverage After 5 Second Dip into 235°C Solder Pot
RECOMMENDED SOLDERING PROFILES
RECOMMENDED LAND
PATTERN (mm)
FLOW SOLDERING
0.12µF ~ 0.22µF only
REFLOW SOLDERING
EIA Size
A
B
C
Soldering
250°C Max.
Cool
300
250
300
250
200
0603
0805
1206
1210
1913
2416
0.6
0.8
1.8
1.8
2.6
3.8
2.0
2.4
3.6
3.6
6.6
7.8
0.7
1.1
1.4
2.3
3.0
3.8
Soldering
230°C Max.
T
E
M
P
E
R
A
T
T
E
M
P
Down
Cool
Down
200
°C 150
100
Pre-Heat
150°C Max.
Pre-Heat
150°C Max.
RE °C 150
A
T
U
R
100
U
R
E
50
50
E
0
0
5 Seconds Max.
2 Minutes Min.
5 Seconds Max.
2 Minutes Min.
A
B
2 1/2 Minutes Max.
3 Minutes Max.
Less than
15 Seconds
®
181
www.RFpassives.com
NIC COMPONENTS
www.niccomp.com
www.lowESR.com
Stacked Film Capacitor Chips
NSHC Series
STANDARD PRODUCTS AND SIZE CODE
DIMENSION (mm) AND CASE CODE
Working Voltage
(Vdc)
Length
L ±0.2
Width
W
Height
H ±0.2
EIA
Code
Case Code
p
Cap.
Code
J1
A1
A2
B1
B2
B3
C1
C2
C3
D1
D2
D3
D4
E1
E3
E4
E5
1.6
0.8 ±0.15 0.7±0.15 0.35±0.20 0603
0.9
16
50
100 pF
120
101
121
151
181
221
271
331
391
471
561
681
821
102
122
152
182
222
272
332
392
472
562
682
822
103
123
153
183
223
273
333
393
473
563
683
823
104
124
154
184
224
J1
J1
J1
J1
J1
J1
J1
J1
J1
J1
J1
J1
J1
J1
J1
J1
J1
J1
A1
A1
A1
A1
A1
A2
A2
B1
B1
B1
B1
B2
B2
B3
B3
C2
C2
C3
C3
A1
A1
A1
A1
A1
A1
A1
A1
A1
A1
A1
A1
A1
A1
A1
A1
A1
A1
B1
B1
B1
B1
B1
B2
B2
C1
C1
C2
C2
C2
C3
C3
D1
D2
D2
D3
D4
E1
E3
E4
E5
2.0
1.25±0.2
1.6±0.2
0.45±0.25 0805
1.1
0.9
1.1
1.5
1.1
1.5
2.1
1.4
2.0
2.4
2.8
1.8
2.4
2.8
3.2
150
3.2
3.2
1206
0.65±0.30
1210
180
220
270
2.5±0.2
3.3±0.3
330
390
470
560
4.8
6.0
1913
0.35±0.20
2416
680
820
0.001 µF
0.0012
0.0015
0.0018
0.0022
0.0027
0.0033
0.0039
0.0047
0.0056
0.0068
0.0082
0.01
4.1±0.3
OUTLINE DRAWING (J1 ~ C3 CASE SIZES)
Stacked Element Terminations
H
0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.056
0.068
0.082
0.1
L2
L1
W
p
p
OUTLINE DRAWING (D1 ~ E5 CASE SIZES)
Stacked Element Terminations: Plating of 95.5% Sn,
4% Ag and 0.5% Cu over
phosphorus copper
barrier over copper base
H
0.12
0.15
L2
L1
W
0.18
p
p
0.22
PART NUMBERING SYSTEM
NSHC 103 J 16 TR A2 F
Lead Free (Optional)
Size Code
Tape & Reel
Voltage
Tolerance Code: J=±5%, G=±2%
Capacitance in pF, 1st two digits are
significant, 3rd digit is no. of zeros
Series
®
182
NIC COMPONENTS
www.niccomp.com
www.lowESR.com
www.RFpassives.com
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