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NSPC222G50TRA1 [NICHICON]

Film Capacitor, Polyphenylene Sulphide, 50V, 2% +Tol, 2% -Tol, 3% TC, 0.0022uF, Surface Mount, 0805, CHIP;
NSPC222G50TRA1
型号： NSPC222G50TRA1
厂家： NICHICON CORPORATION    NICHICON CORPORATION
描述：

Film Capacitor, Polyphenylene Sulphide, 50V, 2% +Tol, 2% -Tol, 3% TC, 0.0022uF, Surface Mount, 0805, CHIP

PC 电容器
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NSPC Series  
Stacked Film Capacitor Chips  
FEATURES  
• STACKED METALLIZED POLYPHENYLENE SULFIDE (PPS) FILM  
• STANDARD EIA 0805, 1206, 1210, 1913 AND 2416 SIZES  
• WIDE TEMPERATURE RANGE (-55O +125OC)  
• HIGH HEAT AND MOISTURE RESISTANT  
• VERY STABLE TEMPERATURE, FREQUENCY, VOLTAGE, BIAS AND  
nDIELECTRIC ABSORPTION CHARACTERISTICS  
• REFLOW SOLDERING APPLICABLE  
• TAPE AND REEL PACKAGING  
Case Sizes  
1210  
SPECIFICATIONS  
0805  
1206  
1913  
2416  
Capacitance Range  
Voltage Ratings*  
100pF ~ .01µF  
3300pF ~ .047µF  
.015µF ~ .1µF  
.047µF ~ .1µF  
0.12µF ~ 0.22µF  
16Vdc (12Vrms), 50Vdc (40Vrms)  
Capacitance Tolerance  
±5% Std, ±2% Opt  
Temperature Range  
-55oC ~ +125oC  
Dissipation Factor (20oC)  
Insulation Resistance (20oC)  
0.6% max @ 1 KHz  
3 Gigohms Minimum  
175% of Rated Voltage (5 Seconds)  
150% of Rated Voltage (60 Seconds)  
Dielectric Withstanding Voltage  
Temperature Characteristic  
Dielectric Absorption  
±3% ∆C Maximum Over Temperature Range  
0.05 ~ 0.10% Typical  
* -AC Voltage Ratings (Vrms) From 60 hz to 30Khz. Contact NIC For Derating At Higher Frequencies.  
ENVIRONMENTAL CHARACTERISTICS  
Life Test At +125oC*:  
1000 Hours at 125% of  
Rated Voltage  
Capacitance Change  
Dissipation Factor  
Within ±2% of Initial Value  
0.66% Maximum  
Insulation Resistance  
1 Gigohm Minimum  
Resistance to Soldering Heat:  
+260oC Peak for 5 Seconds  
Flow and Reflow  
Capacitance Change  
Dissipation Factor  
Within ±3% of Initial Value  
0.66% Maximum  
Insulation Resistance  
1 Gigohm Minimum  
Humidity Load Life (Note 1):  
(1) 1000 Hours, +40oC  
(2) 500 Hours, +60oC  
Capacitance Change  
Dissipation Factor  
Within ±2% of Initial Value  
0.90% Maximum  
Insulation Resistance  
(1) 1 Gigohm Minimum  
(2) 0.5 Gigohm Minimum  
Solderability with  
10% Wt Rosin-Methanol Flux  
90% Minimum Coverage After 5 Second Dip into 235°C Solder Pot  
NOTE 1: At 90 ~ 95% Relative Humidity and Rated Voltage  
* +105°C for 2416 Case Size  
PART NUMBERING SYSTEM  
NSPC 103 J 16 TR A2 F  
Lead Free (Optional)  
Size Code  
Tape & Reel  
Voltage  
Tolerance Code: J=±5%, G=±2%  
Capacitance in pF, 1st two digits are  
significant, 3rd digit is no. of zeros  
Series  
®
NIC COMPONENTS  
www.niccomp.com  
www.lowESR.com  
www.RFpassives.com  
179  
NSPC Series  
Stacked Film Capacitor Chips  
STANDARD PRODUCTS AND SIZE CODE  
Working Voltage  
H
(Vdc)  
Cap.  
Code  
16  
50  
100 pF  
120  
150  
180  
220  
270  
330  
390  
470  
101  
121  
151  
181  
221  
271  
331  
391  
471  
561  
681  
821  
102  
122  
152  
182  
222  
272  
332  
392  
472  
562  
682  
822  
103  
123  
153  
183  
223  
273  
333  
393  
473  
563  
683  
823  
104  
124  
154  
184  
224  
A1  
A1  
A1  
A1  
A1  
A1  
A1  
A1  
A1  
A1  
A1  
A1  
A1  
A1  
A1  
A1  
A1  
A1  
B1  
B1  
B1  
B1  
B1  
B2  
B2  
C1  
C1  
C2  
C2  
C2  
C3  
C3  
D1  
D1  
D1  
D2  
D2  
E1  
E3  
E4  
E5  
W
Standard: Sn/Pb  
Optional: 95.5% Sn,  
4% Ag and 0.5% Cu over  
phosphorus copper barrier  
over copper base  
0.35 ±0.2  
L
DIMENSION (mm) AND CASE CODE  
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ꢓꢒꢑ  
ꢑꢔ  
ꢑꢋ  
ꢗꢔ  
ꢇꢄ  
ꢇꢀ  
ꢉꢂ  
ꢉꢄ  
ꢉꢀ  
ꢋꢂ  
ꢋꢄ  
ꢍꢂ  
ꢍꢀ  
ꢍꢈ  
ꢍꢊ  
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ꢔꢌꢍ  
ꢅ�ꢆ  
ꢂ�ꢅ  
ꢂ�ꢈ  
ꢂ�ꢅ  
ꢂ�ꢈ  
ꢄ�ꢅ  
ꢂ�ꢈ  
ꢄ�ꢅ  
ꢂ�ꢆ  
ꢄ�ꢈ  
ꢄ�ꢆ  
ꢀ�ꢄ  
ꢋꢌꢍ  
ꢔꢌꢋꢕꢊꢍꢌꢋ  
ꢍꢖꢍꢕ  
560  
680  
820  
ꢀ�ꢋ  
ꢂ�ꢁꢃꢅ�ꢄ  
ꢂꢄꢅꢁ  
0.001 µF  
0.0012  
0.0015  
0.0018  
0.0022  
0.0027  
0.0033  
0.0039  
0.0047  
0.0056  
0.0068  
0.0082  
0.01  
0.012  
0.015  
0.018  
0.022  
0.027  
0.033  
0.039  
0.047  
0.056  
0.068  
0.082  
0.1  
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ꢈ�ꢆ  
ꢄ�ꢊꢃꢅ�ꢄ  
ꢀ�ꢀꢃꢅ�ꢀ  
ꢂꢄꢂꢅ  
ꢂꢌꢂꢀ  
A1  
A1  
A1  
A1  
A1  
A2  
A2  
B1  
B1  
B1  
B1  
B2  
B2  
B3  
B3  
C2  
C2  
C3  
C3  
ꢁ�ꢅ  
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RECOMMENDED LAND PATTERN (mm)  
EIA Size  
A
B
C
0805  
1206  
1210  
1913  
2416  
1.0  
2.2  
2.2  
2.6  
3.8  
2.7  
3.8  
3.8  
6.6  
7.8  
1.1  
1.4  
2.3  
3.0  
3.8  
A
B
REFLOW SOLDERING  
0.12  
0.15  
0.18  
0.22  
300  
250  
200  
T
E
M
P
E
Soldering  
230°C Max.  
Cool  
Down  
Pre-Heat  
150°C Max.  
NSPC 103 J 50 TR B2 F  
R °C 150  
A
T
U
R
Lead Free  
100  
Size Code  
Tape & Reel  
Voltage  
50  
Tolerance Code: J=±5%, G=±2%  
Capacitance in pF, 1st two digits are  
significant, 3rd digit is no. of zeros  
E
0
5 Seconds Max.  
2 Minutes Min.  
Series  
2 1/2 Minutes Max.  
Less than  
15 Seconds  
®
180  
NIC COMPONENTS  
www.niccomp.com  
www.lowESR.com  
www.RFpassives.com  
Taping Specificaitons  
Stacked Film Capacitor Chips  
REEL DIMENSIONS (mm) AND QUANTITY  
D3 ±  
1.0  
Q'ty/  
Reel  
Case Code  
D ± 2.0 D2 ± 0.6  
W ± 1.0 t ± 1.0  
J1  
A3  
A4  
B4  
B5  
B6  
C4  
C5  
C6  
C7  
3,000  
2,000  
178  
21.0  
60.0  
9.0  
2.0  
t
REEL  
1
3
.
0
+/−  
2.0 +/− 0.5  
0.5  
D2  
W
EMBOSSED PLASTIC TAPE DIMENSIONS (mm)  
Case Code  
A ±0.1 B ±0.1 C ±0.2 t ±0.5 W ±0.3 F ±0.5 P ±0.1 Dφ + 0.2  
J1  
A3  
A4  
B4  
B5  
B6  
C4  
C5  
C6  
C7  
1.00  
1.85  
1.1  
1.3  
1.5  
1.5  
1.5  
1.9  
1.9  
1.9  
2.5  
2.5  
0.20  
1.55  
2.3  
0.25  
1.9  
2.8  
3.5  
3.5  
0.25  
0.25  
8.0  
3.5  
4.0  
1.0  
4.0 ±0.1  
P1  
1.75 ±0.1  
t
1.5 +0.1  
-0  
F
W
B
Do  
A
P
C
®
NIC COMPONENTS  
www.niccomp.com  
www.lowESR.com  
www.RFpassives.com  
185  

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