NEXCW473Z55V107X55TRF [NIC]
V-Chip Memory Back-Up Capacitors;
| 型号： | NEXCW473Z55V107X55TRF |
| 厂家： | 
NIC-COMPONENTS CORP. |
| 描述： | V-Chip Memory Back-Up Capacitors |
| 文件： | 总2页 (文件大小：116K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
V-Chip Memory Back-Up Capacitors
NEXCW Series
FEATURES
• DOUBLE LAYER CONSTRUCTION
• POWER BACK-UP FOR CMOS DEVICES
• SURFACE MOUNTABLE V-CHIP STYLE
• LEAD-FREE FINISH
RoHS Compliant
High Temperature Reflow
+260°C
CHARACTERISTICS
Rated Voltage Range
Rated Capacitance Range
Operating Temp. Range
Capacitance Tolerance
3.5 & 5.5VDC
Suppeerr CCaappaacciittoorr
Appplliiccaattiioonn GGuuiiddee
0.047F ~ 0.47F (47,000μF ~ 470,000μF)
-40°C ~ +85°C
+80%/-20% (Z)
Δ Capacitance Change
Maximum ESR
Within ±30% of initial measured value
Less than 200% of the specified maximum value
Less than 200% of the specified maximum value
Within +80%/-20% of specified value
Load Life Test
+85°C 240 hours
Current at 30 minutes
Δ Capacitance Change
Maximum ESR
Temperature Cycling
(5 cycles, -25 ~ +70°C
Less than specified maximum value
Current at 30 minutes
Δ Capacitance Change
Maximum ESR
Less than specified maximum value
Within ±20% of initial measured value
Humidity Resistance
(240 hours @ 40°C/90% RH)
Less than 120% of the specified maximum value
Current at 30 minutes
Less than 120% of the specified maximum value
STANDARD VALUES AND SPECIFICATIONS
Capacitance Working
Max. Current
@ 30 minutes
(mA)
Max. ESR
@ 1KHz
(Ω)
NIC P/N
Value (F)
Discharge
Voltage
(VDC)
NEXCW104Z3.5V10.7X5.5TRF
NEXCW224Z3.5V10.7X5.5TRF
NEXCW474Z3.5V10.7X8.5TRF
NEXCW473Z5.5V10.7X5.5TRF
NEXCW104Z5.5V10.7X5.5TRF
NEXCW224Z5.5V10.7X8.5TRF
0.10
0.22
0.47
0.047
0.10
0.22
3.5
3.5
3.5
5.5
5.5
5.5
0.090
0.200
0.420
0.071
0.150
0.330
100
50
50
100
50
50
HIGH TEMPERATURE REFLOW PROFILE
Peak Temperature
(260°C)
Peak Temperature
Time above +255°C
Time above +230°C
Time above +220°C
Time above +217°C
+260°C
250
200
150
10 sec. max.
45 sec. max.
60 sec. max.
70 sec. max.
Time above
217°C
70 sec. max.
100
50
Cool Down
Time above 170°C
50 sec. max.
150°C ~ +200°C
(with time above +170°C
50 sec. max.)
Pre-heat
150°C ~ 200°C 150 sec. max.
25
150 sec. max.
0
Time
1. The temperatures shown are the surface temperature values on the top of the can and on the capacitor terminals.
2. 2x reflow process maximum. Capacitor should be allowed to return to room temperature before second reflow process.
WASHING is NOT RECOMMENDED. Additional precautions can be found at
www.niccomp.com/precautions
If in doubt or uncertainty, please review your specific application - process details
with NIC’s technical support personnel: tpmg@niccomp.com
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com
1
SPECIFICATIONS ARE SUBJECT TO CHANGE
V-Chip Memory Back-Up Capacitors
NEXCW Series
CASE DIMENSIONS (mm)
I
+
-
I
I
Dφ ±
10.7
10.7
W
Case Size
10.7 x 5.5
10.7 x 8.5
L max. A/B ±0.2
I
P
5.5
8.5
10.8
10.8
3.9 ±0.5 1.2 ± 0.1 5.0
3.9 ±0.5 1.2 ± 0.1 5.0
w
Dφ
A
0.3mm max.
L
P
B
LAND PATTERN DIMENSIONS (mm)
COMPONENT OUTLINE
Case
R
S
T
Diameter
T
10.7
5.0
4.9
2.5
S
S
R
CARRIER TAPE DIMENSIONS (mm)
Case Size
10.7 x 5.5
10.7 x 8.5
A
11.4
11.4
B
13.0
13.0
D
1.55
1.55
E
1.75
1.75
F
11.5
11.5
P
4.0
4.0
P1
16.0
16.0
T1
0.4
0.4
T2
6.0
8.4
W
24.0
24.0
Quantity/Reel
1,000
500
P
T1
D
E
-
F
W
B
+
P1
A
T2
Feeding
REEL DIMENSIONS (mm)
Case Size
10.7 x 5.5
10.7 x 8.5
A ± 2.0
380
380
B ± 1.0
80.0
100.0
C ± 0.5
13.0
13.0
D ± 0.8
21.0
21.0
E ± 0.5
2.0
2.0
W
t
25.5 ± 0.5
25.5 ± 1.0
2.0
2.0
t
C
E
B
A
W
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com
2
SPECIFICATIONS ARE SUBJECT TO CHANGE
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