54F20DM [NSC]

Dual 4-Input NAND Gate; 两个4输入与非门
54F20DM
型号: 54F20DM
厂家: National Semiconductor    National Semiconductor
描述:

Dual 4-Input NAND Gate
两个4输入与非门

触发器 逻辑集成电路 栅
文件: 总6页 (文件大小:142K)
中文:  中文翻译
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November 1994  
54F/74F20  
Dual 4-Input NAND Gate  
General Description  
This device contains two independent gates, each of which  
performs the logic NAND function.  
Package  
Commercial  
74F20PC  
Military  
Package Description  
Number  
N14A  
J14A  
14-Lead (0.300 Wide) Molded Dual-In-Line  
×
54F20DM (Note 2)  
14-Lead Ceramic Dual-In-Line  
74F20SC (Note 1)  
74F20SJ (Note 1)  
M14A  
M14D  
W14B  
E20A  
14-Lead (0.150 Wide) Molded Small Outline, JEDEC  
×
14-Lead (0.300 Wide) Molded Small Outline, EIAJ  
×
54F20FM (Note 2)  
54F20LM (Note 2)  
14-Lead Cerpack  
20-Lead Ceramic Leadless Chip Carrier, Type C  
e
Note 1: Devices also available in 13 reel. Use suffix  
SCX and SJX.  
×
Note 2: Military grade device with environmental and burn-in processing. Use suffix  
e
DMQB, FMQB and LMQB.  
Logic Symbol  
Connection Diagrams  
IEEE/IEC  
Pin Assignment  
for DIP, SOIC and Flatpak  
Pin Assignment  
for LCC  
TL/F/9462–2  
TL/F/9462–1  
TL/F/9462–3  
Unit Loading/Fan Out  
54F/74F  
Pin Names  
Description  
U.L.  
Input I /I  
IH IL  
Output I /I  
HIGH/LOW  
OH OL  
b
20 mA/ 0.6 mA  
b
1 mA/20 mA  
A , B , C , D  
n
Inputs  
1.0/1.0  
50/33.3  
n
n
n
O
Outputs  
n
TRI-STATEÉ is a registered trademark of National Semiconductor Corporation.  
C
1995 National Semiconductor Corporation  
TL/F/9462  
RRD-B30M75/Printed in U. S. A.  
Absolute Maximum Ratings (Note 1)  
If Military/Aerospace specified devices are required,  
please contact the National Semiconductor Sales  
Office/Distributors for availability and specifications.  
Recommended Operating  
Conditions  
Free Air Ambient Temperature  
Military  
Commercial  
b
a
55 C to 125 C  
§
0 C to 70 C  
§
§
b
b
a
65 C to 150 C  
Storage Temperature  
§
§
§
§
§
a
§
a
55 C to 125 C  
Ambient Temperature under Bias  
§
Supply Voltage  
Military  
Commercial  
b
b
a
a a  
4.5V to 5.5V  
a a  
4.5V to 5.5V  
Junction Temperature under Bias  
Plastic  
55 C to 175 C  
§
§
a
55 C to 150 C  
V
Pin Potential to  
CC  
Ground Pin  
b
a
0.5V to 7.0V  
b
a
0.5V to 7.0V  
Input Voltage (Note 2)  
Input Current (Note 2)  
Voltage Applied to Output  
b
a
30 mA to 5.0 mA  
e
in HIGH State (with V  
Standard Output  
0V)  
CC  
b
0.5V to 5.5V  
0.5V to V  
CC  
b
a
TRI-STATE Output  
É
Current Applied to Output  
in LOW State (Max)  
twice the rated I (mA)  
OL  
Note 1: Absolute maximum ratings are values beyond which the device may  
be damaged or have its useful life impaired. Functional operation under  
these conditions is not implied.  
Note 2: Either voltage limit or current limit is sufficient to protect inputs.  
DC Electrical Characteristics  
54F/74F  
Symbol  
Parameter  
Units  
V
CC  
Conditions  
Min  
Typ  
Max  
V
V
V
V
Input HIGH Voltage  
2.0  
V
V
V
Recognized as a HIGH Signal  
Recognized as a LOW Signal  
IH  
Input LOW Voltage  
0.8  
IL  
b
e b  
18 mA  
Input Clamp Diode Voltage  
1.2  
Min  
Min  
I
IN  
CD  
OH  
e b  
e b  
e b  
Output HIGH  
Voltage  
54F 10% V  
2.5  
2.5  
2.7  
I
I
I
1 mA  
1 mA  
1 mA  
CC  
OH  
OH  
OH  
74F 10% V  
74F 5% V  
V
CC  
CC  
e
e
V
Output LOW  
Voltage  
54F 10% V  
74F 10% V  
0.5  
I
I
20 mA  
20 mA  
OL  
CC  
OL  
V
Min  
Max  
Max  
Max  
0.0  
0.5  
CC  
OL  
I
I
I
Input HIGH  
Current  
54F  
74F  
20.0  
5.0  
IH  
e
e
mA  
mA  
mA  
V
V
V
V
2.7V  
7.0V  
IN  
Input HIGH Current  
Breakdown Test  
54F  
74F  
100  
7.0  
BVI  
IN  
Output HIGH  
54F  
74F  
250  
50  
CEX  
e
V
CC  
OUT  
Leakage Current  
e
All other pins grounded  
V
ID  
Input Leakage  
Test  
I
ID  
1.9 mA  
74F  
74F  
4.75  
e
IOD  
I
Output Leakage  
Circuit Current  
V
150 mV  
OD  
3.75  
mA  
0.0  
All other pins grounded  
b
e
0.5V  
I
I
I
I
Input LOW Current  
0.6  
mA  
mA  
mA  
mA  
Max  
Max  
Max  
Max  
V
V
V
V
IL  
IN  
b
b
e
Output Short-Circuit Current  
Power Supply Current  
Power Supply Current  
60  
150  
0V  
HIGH  
LOW  
OS  
OUT  
e
0.9  
3.4  
1.4  
5.1  
CCH  
CCL  
O
e
O
2
AC Electrical Characteristics  
74F  
54F  
74F  
e a  
T
25 C  
§
5.0V  
A
e
50 pF  
e
T
, V  
CC  
e
Mil  
T
, V  
Com  
e
50 pF  
A
A CC  
e a  
Symbol  
Parameter  
V
Units  
CC  
C
C
L
L
e
C
50 pF  
L
Min  
Typ  
Max  
Min  
Max  
Min  
Max  
t
t
Propagation Delay  
2.4  
1.5  
3.7  
3.2  
5.0  
4.3  
2.0  
1.5  
7.0  
6.5  
2.4  
1.5  
6.0  
5.3  
PLH  
PHL  
ns  
A , B , C , D to O  
n
n
n
n
n
Ordering Information  
The device number is used to form part of a simplified purchasing code where the package type and temperature range are  
defined as follows:  
74F 20  
S
C
X
Temperature Range Family  
Special Variations  
e
e
e
74F  
54F  
Commercial  
Military  
QB  
Military grade device with  
environmental and burn-in  
processing  
Device Type  
e
X
Devices shipped in 13 reels  
×
Package Code  
Temperature Range  
e
e
e
e
e
e
P
D
F
L
S
SJ  
Plastic DIP  
Ceramic DIP  
Flatpak  
Leadless Chip Carrier (LCC)  
Small Outline SOIC JEDEC  
Small Outline SOIC EIAJ  
e
e
a
C
M
Commercial (0 C to 70 C)  
§
§
b a  
Military ( 55 C to 125 C)  
§
§
Physical Dimensions inches (millimeters)  
20-Lead Ceramic Leadless Chip Carrier (L)  
NS Package Number E20A  
3
Physical Dimensions inches (millimeters) (Continued)  
14-Lead Ceramic Dual-In-Line Package (D)  
NS Package Number J14A  
14-Lead (0.150 Wide) Molded Small Outline Package, JEDEC (S)  
×
NS Package Number M14A  
4
Physical Dimensions inches (millimeters) (Continued)  
14-Lead (0.300 Wide) Molded Small Outline Package, EIAJ (SJ)  
×
NS Package Number M14D  
14-Lead (0.300 Wide) Molded Dual-In-Line Package (P)  
×
NS Package Number N14A  
5
Physical Dimensions inches (millimeters) (Continued)  
14-Lead Ceramic Flatpak (F)  
NS Package Number W14B  
LIFE SUPPORT POLICY  
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT  
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL  
SEMICONDUCTOR CORPORATION. As used herein:  
1. Life support devices or systems are devices or  
systems which, (a) are intended for surgical implant  
into the body, or (b) support or sustain life, and whose  
failure to perform, when properly used in accordance  
with instructions for use provided in the labeling, can  
be reasonably expected to result in a significant injury  
to the user.  
2. A critical component is any component of a life  
support device or system whose failure to perform can  
be reasonably expected to cause the failure of the life  
support device or system, or to affect its safety or  
effectiveness.  
National Semiconductor  
Corporation  
2900 Semiconductor Drive  
P.O. Box 58090  
Santa Clara, CA 95052-8090  
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Hong Kong Ltd.  
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Engineering Center  
Bldg. 7F  
13th Floor, Straight Block,  
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Tel: (043) 299-2300  
Fax: (043) 299-2500  
Fax: (3) 558-9998  
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.  

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