54F365LM [NSC]
IC F/FAST SERIES, 6-BIT DRIVER, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20, Bus Driver/Transceiver;
| 型号： | 54F365LM |
| 厂家： | 
National Semiconductor |
| 描述： | IC F/FAST SERIES, 6-BIT DRIVER, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20, Bus Driver/Transceiver 驱动 输出元件 逻辑集成电路 |
| 文件： | 总8页 (文件大小：145K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
January 1995
54F/74F365
Hex Buffer/Driver with TRI-STATE Outputs
É
Features
General Description
The ’F365 is a hex buffer and line driver designed to be
employed as a memory and address driver, clock driver and
bus-oriented transmitter/receiver.
Y
TRI-STATE buffer outputs
Y
Outputs sink 64 mA
Y
Bus-oriented
Package
Commercial
74F365PC
Military
Package Description
Number
N16E
16-Lead (0.300 Wide) Molded Dual-In-Line
×
54F365DM (Note 2)
J16A
16-Lead Ceramic Dual-In-Line
74F365SC (Note 1)
M16A
W16A
E20A
16-Lead (0.150 Wide) Molded Small Outline, JEDEC
×
54F365FM (Note 2)
54F365LM (Note 2)
16-Lead Cerpack
20-Lead Ceramic Leadless Chip Carrier, Type C
e
Note 1: Devices also available in 13 reel. Use suffix
SCX.
×
Note 2: Military grade device with environmental and burn-in processing. Use suffix
e
DMQB, FMQB and LMQB.
Logic Symbol
Connection Diagrams
IEEE/IEC
Pin Assignment
for DIP, SOIC and Flatpak
Pin Assignment
for LCC
TL/F/9522–1
TL/F/9522–2
TL/F/9522–4
TRI-STATEÉ is a registered trademark of National Semiconductor Corporation.
C
1995 National Semiconductor Corporation
TL/F/9522
RRD-B30M105/Printed in U. S. A.
Unit Loading/Fan Out
54F/74F
Pin Names
Description
U.L.
Input I /I
IH IL
Output I /I
HIGH/LOW
OH OL
OE , OE
1
Output Enable Input
(Active LOW)
Inputs
1.0/0.033
20 mA/20 mA
2
I
n
1.0/0.033
20 mA/20 mA
b
O
Outputs
600/106.6 (80)
12 mA/64 mA (48 mA)
n
Function Table
Inputs
Output
O
OE
OE
2
I
1
e
e
e
e
L
LOW Voltage Level
HIGH Voltage Level
Immaterial
H
X
Z
L
L
L
L
L
H
X
X
L
H
Z
Z
High Impedance
X
H
H
X
2
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.
Recommended Operating
Conditions
Free Air Ambient Temperature
Military
Commercial
b
a
55 C to 125 C
§
0 C to 70 C
§
§
b
b
a
65 C to 150 C
Storage Temperature
§
§
§
§
§
a
§
a
55 C to 125 C
Ambient Temperature under Bias
§
Supply Voltage
Military
Commercial
b
b
a
a a
4.5V to 5.5V
a a
4.5V to 5.5V
Junction Temperature under Bias
Plastic
55 C to 175 C
§
§
a
55 C to 150 C
V
Pin Potential to
CC
Ground Pin
b
a
0.5V to 7.0V
b
a
0.5V to 7.0V
Input Voltage (Note 2)
Input Current (Note 2)
Voltage Applied to Output
b
a
30 mA to 5.0 mA
e
in HIGH State (with V
Standard Output
TRI-STATE Output
0V)
CC
b
0.5V to 5.5V
0.5V to V
CC
b
a
Current Applied to Output
in LOW State (Max)
twice the rated I (mA)
OL
Note 1: Absolute maximum ratings are values beyond which the device may
be damaged or have its useful life impaired. Functional operation under
these conditions is not implied.
Note 2: Either voltage limit or current limit is sufficient to protect inputs.
DC Electrical Characteristics
54F/74F
Typ
Symbol
Parameter
Units
V
CC
Conditions
Min
Max
V
V
V
V
Input HIGH Voltage
2.0
V
V
V
Recognized as a HIGH Signal
Recognized as a LOW Signal
IH
Input LOW Voltage
0.8
IL
b
e b
18 mA
Input Clamp Diode Voltage
1.2
Min
Min
I
CD
OH
IN
e b
e b
e b
e b
e b
Output HIGH
Voltage
54F 10% V
2.4
2.0
2.4
2.0
2.7
I
I
I
I
I
3 mA
12 mA
3 mA
15 mA
3 mA
CC
CC
CC
CC
OH
OH
OH
OH
OH
54F 10% V
74F 10% V
74F 10% V
V
74F 5% V
CC
e
e
V
Output LOW
Voltage
54F 10% V
74F 10% V
0.55
0.55
I
I
48 mA
OL
CC
OL
OL
V
Min
Max
0.0
64 mA
CC
e
e
I
I
Input HIGH Current
20
mA
mA
V
2.7V
IH
IN
IN
Input HIGH Current
Breakdown Test
V
7.0V
BVI
100
b
e
I
I
I
I
I
I
I
I
I
Input LOW Current
20
50
mA
mA
mA
mA
mA
mA
mA
mA
mA
Max
Max
Max
Max
Max
0.0V
Max
Max
Max
V
V
V
V
V
V
V
V
V
0.5V
IL
IN
e
e
e
e
e
Output Leakage Current
Output Leakage Current
Output Short-Circuit Current
Output HIGH Leakage Current
Bus Drainage Test
50
2.7V
0.5V
0V
OZH
OZL
OS
OUT
OUT
OUT
OUT
OUT
b
b
b
225
250
100
V
CC
CEX
ZZ
500
35
5.25V
e
Power Supply Current
Power Supply Current
Power Supply Current
25
44
35
HIGH
LOW
CCH
CCL
CCZ
O
e
62
O
e
48
HIGH Z
O
3
AC Electrical Characteristics
74F
54F
74F
e a
T
A
25 C
§
5.0V
e
50 pF
e
T
, V
CC
e
Mil
T
, V
Com
e
50 pF
A
A CC
e a
Symbol
Parameter
V
Units
CC
C
C
L
L
e
C
50 pF
L
Min
Typ
Max
Min
Max
Min
Max
t
t
Propagation Delay
2.5
2.5
4.6
4.9
6.5
7.0
2.0
2.0
7.0
7.0
2.0
2.0
7.0
7.5
PLH
ns
ns
ns
I
to O
n
PHL
n
t
t
Enable Time
2.5
2.5
5.1
5.7
9.5
9.0
2.0
2.0
8.5
8.5
2.5
2.5
10.0
9.5
PZH
PZL
t
t
Disable Time
2.0
2.0
3.6
4.4
6.5
6.5
1.5
1.5
6.5
9.0
2.0
2.0
7.0
7.0
PHZ
PLZ
Ordering Information
The device number is used to form part of a simplified purchasing code where the package type and temperature range are
defined as follows:
74F 365
S
C
X
Temperature Range Family
e
e
54F Military
Special Variations
e
74F Commercial
QB
Military grade device with
environmental and burn-in
processing
Device Type
e
X
Devices shipped in 13 reels
×
Package Code
Temperature Range
e
e
e
e
e
e
P
D
F
L
Plastic DIP
Ceramic DIP
Flatpak
Leadless Chip Carrier (LCC)
Small Outline (SOIC)
a
C
Commercial (0 C to 70 C)
§
§
e
b a
Military ( 55 C to 125 C)
M
§
§
S
4
5
Physical Dimensions inches (millimeters)
20-Lead Ceramic Leadless Chip Carrier (L)
NS Package Number E20A
16-Lead Ceramic Dual-In-Line Package (D)
NS Package Number J16A
6
Physical Dimensions inches (millimeters) (Continued)
16-Lead (0.150 Wide) Molded Small Outline Package, JEDEC (S)
×
NS Package Number M16A
16-Lead (0.300 Wide) Molded Dual-In-Line Package (P)
×
NS Package Number N16E
7
Physical Dimensions inches (millimeters) (Continued)
16-Lead Ceramic Flatpak (F)
NS Package Number W16A
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant
into the body, or (b) support or sustain life, and whose
failure to perform, when properly used in accordance
with instructions for use provided in the labeling, can
be reasonably expected to result in a significant injury
to the user.
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
National Semiconductor
Corporation
National Semiconductor
Europe
National Semiconductor
Hong Kong Ltd.
National Semiconductor
Japan Ltd.
a
1111 West Bardin Road
Arlington, TX 76017
Tel: 1(800) 272-9959
Fax: 1(800) 737-7018
Fax:
(
49) 0-180-530 85 86
@
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49) 0-180-530 85 85
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National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
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