DS36C280MX/NOPB [NSC]

IC LINE TRANSCEIVER, PDSO8, 0.150 INCH, PLASTIC, SOIC-8, Line Driver or Receiver;
DS36C280MX/NOPB
型号: DS36C280MX/NOPB
厂家: National Semiconductor    National Semiconductor
描述:

IC LINE TRANSCEIVER, PDSO8, 0.150 INCH, PLASTIC, SOIC-8, Line Driver or Receiver

驱动 光电二极管 接口集成电路 驱动器
文件: 总9页 (文件大小:555K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
July 2000  
DS36C280  
Slew Rate Controlled CMOS EIA-RS-485 Transceiver  
General Description  
Features  
n 100% RS-485 compliant  
The DS36C280 is a low power differential bus/line trans-  
ceiver designed to meet the requirements of RS-485 Stan-  
dard for multipoint data transmission. In addition, it is com-  
patible with TIA/EIA-422-B.  
— Guaranteed RS-485 device interoperation  
n Low power CMOS design: ICC 500 µA max  
n Adjustable slew rate control  
— Minimizes EMI affects  
n Built-in power up/down glitch-free circuitry  
— Permits live transceiver insertion/displacement  
The slew rate control feature allows the user to set the driver  
rise and fall times by using an external resistor. Controlled  
edge rates can reduce switching EMI.  
n SOIC packages  
The CMOS design offers significant power savings over its  
bipolar and ALS counterparts without sacrificing ruggedness  
against ESD damage. The device is ideal for use in battery  
powered or power conscious applications. ICC is specified at  
500 µA maximum.  
n Industrial temperature range: −40˚C to +85˚C  
n On-board thermal shutdown circuitry  
— Prevents damage to the device in the event of  
excessive power dissipation  
The driver and receiver outputs feature TRI-STATE® capa-  
bility. The driver outputs operate over the entire common  
mode range of −7V to +12V. Bus contention or fault situa-  
tions are handled by a thermal shutdown circuit, which  
forces the driver outputs into the high impedance state.  
n Wide common mode range: −7V to +12V  
n Receiver open input fail-safe (Note 1)  
1
n
n
4
unit load (DS36C280): 128 nodes  
unit load (DS36C280T): 64 nodes  
1
2
n ESD (human body model): 2 kV  
The receiver incorporates a fail safe circuit which guarantees  
a high output state when the inputs are left open (Note 1) .  
Connection and Logic Diagram  
Truth Table  
DRIVER SECTION  
DE/RE*  
DI  
H
L
DO/RI  
DO*/RI*  
H
H
L
H
L
L
H
Z
X
Z
RECEIVER SECTION  
DE/RE*  
RI-RI*  
RO  
H
L
L
+0.2V  
−0.2V  
X
L
H
Z
01205201  
Order Number DS36C280M, DS36C280TM  
See NS Package Number M08A  
L
OPEN (Note 1)  
H
Note 1: Non-terminated, Open Inputs only  
TRI-STATE® is a registered trademark of National Semiconductor Corporation.  
© 2004 National Semiconductor Corporation  
DS012052  
www.national.com  
Absolute Maximum Ratings (Note 2)  
If Military/Aerospace specified devices are required,  
please contact the National Semiconductor Sales Office/  
Distributors for availability and specifications.  
Storage Temperature Range  
Lead Temperature  
−65˚C to +150˚C  
+260˚C  
(Soldering 4 sec.)  
Supply Voltage (VCC  
Input Voltage (DE/RE*, & DI)  
Common Mode (VCM  
Driver Output/Receiver  
Input  
)
+12V  
Recommended Operating  
Conditions  
−0.5V to (VCC +0.5V)  
)
Min  
Typ  
Max  
Units  
Supply Voltage (VCC  
Bus Voltage  
)
+4.75 +5.0 +5.25  
V
V
15V  
−7  
+12  
Input Voltage (DO/RI,  
DO*/RI*)  
14V  
Operating Free Air Temperature (TA)  
Receiver Output Voltage  
−0.5V to (VCC +0.5V)  
DS36C280T  
DS36C280  
−40  
0
+25  
+25  
+85  
+70  
˚C  
˚C  
@
Maximum Package Power Dissipation +25˚C  
M Package 1190 mV,  
derate  
9.5 mW/˚C above +25˚C  
Electrical Characteristics (Notes 3, 4)  
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified  
Symbol  
Parameter  
Conditions  
Reference  
Min  
Typ  
Max Units  
DIFFERENTIAL DRIVER CHARACTERISTICS  
VOD1  
VOD0  
VOD0*  
VOD2  
Differential Output Voltage  
Output Voltage  
IO = 0 mA (No Load)  
1.5  
0
5.0  
5.0  
5.0  
V
V
V
V
V
V
(422)  
(485)  
IO = 0 mA  
Output Voltage  
(Output to GND)  
RL = 50Ω  
0
Differential Output Voltage  
(Termination Load)  
(422)  
(485)  
(Note 5)  
Figure 1  
2.0  
1.5  
2.8  
2.3  
0.1  
RL = 27Ω  
5.0  
VOD2  
VOD3  
VOC  
Balance of VOD2  
RL = 27or 50Ω  
−0.2  
+0.2  
|VOD2 − VOD2*  
|
(422, 485)  
Differential Output Voltage  
(Full Load)  
R1 = 54, R2 = 375Ω  
VTEST = −7V to +12V  
RL = 27Ω  
Figure 2  
1.5  
2.0  
5.0  
V
Driver Common Mode  
Output Voltage  
(485)  
(422)  
(Note 5)  
Figure 1  
0
0
3.0  
3.0  
V
V
V
RL = 50Ω  
VOC  
IOSD  
Balance of VOC  
RL = 27or  
RL = 50Ω  
−0.2  
+0.2  
|VOC − VOC*  
|
(422, 485)  
(485) Figure 4  
(485)  
Driver Output Short-Circuit  
Current  
VO = +12V  
200  
+250  
−250  
mA  
mA  
VO = −7V  
−190  
RECEIVER CHARACTERISTICS  
VTH  
Differential Input High  
Threshold Voltage  
VO = VOH, IO = −0.4 mA  
−7V VCM +12V  
VO = VOL, IO = 0.4 mA  
−7V VCM +12V  
VCM = 0V  
+0.035 +0.2  
V
V
(Note 6)  
(422, 485)  
VTL  
Differential Input Low  
Threshold Voltage  
−0.2 −0.035  
VHST  
RIN  
RIN  
IIN  
Hysteresis  
70  
mV  
kΩ  
Input Resistance  
Input Resistance  
Line Input Current  
(Note 8)  
−7V VCM +12V  
−7V VCM +12V  
DS36C280T  
DS36C280  
VIN = +12V  
VIN = −7V  
24  
48  
0
68  
68  
kΩ  
Other Input = 0V  
DE = VIL, RE* = VIL  
VCC = 4.75 to 5.25  
or 0V  
DS36C280  
0.19  
−0.1  
0.19  
−0.1  
0.19  
−0.1  
0.19  
−0.1  
0.25  
−0.2  
0.5  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mV  
0
DS36C280T VIN = +12V  
0
VIN = −7V  
VIN = +12V  
VIN = −7V  
0
−0.4  
0.25  
−0.2  
0.5  
IING  
Line Input Current  
Glitch (Note 8)  
Other Input = 0V  
DE = VIL, RE* = VIL  
VCC = +3.0V  
DS36C280  
0
0
DS36C280T VIN = +12V  
VIN = −7V  
0
or 0V TA = 25˚C  
RS = 500Ω  
0
−0.4  
400  
IB  
Input Balance Test  
(422) (Note 10)  
www.national.com  
2
Electrical Characteristics (Notes 3, 4) (Continued)  
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified  
Symbol  
Parameter  
Conditions  
Reference  
Min  
3.5  
7
Typ  
Max Units  
RECEIVER CHARACTERISTICS  
VOH  
VOL  
IOSR  
IOZR  
High Level Output Voltage  
Low Level Output Voltage  
Short Circuit Current  
TRI-STATE Leakage  
Current  
IOH = −4 mA, VID = +0.2V  
IOL = +4 mA, VID = −0.2V  
VO = GND  
RO  
4.6  
0.3  
35  
V
Figure 11  
0.5  
85  
1
V
RO  
mA  
µA  
VO = 0.4V to 2.4V  
DEVICE CHARACTERISTICS  
VIH  
VIL  
IIH  
High Level Input Voltage  
Low Level Input Voltage  
High Level Input Current  
Low Level Input Current  
2.0  
VCC  
0.8  
2
V
V
GND  
DE/RE*,  
DI  
VIH = VCC  
µA  
µA  
µA  
mA  
µA  
µA  
IIL  
VCC = 5.0V  
−2  
VIL = 0V  
VCC = +3.0V  
−2  
SR = 0V  
SR  
−1  
ICCR  
ICCD  
Power Supply Current  
(No Load)  
Driver OFF, Receiver ON  
Driver ON, Receiver OFF  
200  
200  
500  
500  
VCC  
Switching Characteristics (Notes 4, 9, 11)  
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified  
Symbol  
Parameter  
Conditions  
Reference  
Min  
10  
10  
0
Typ  
Max  
Units  
ns  
DRIVER CHARACTERISTICS  
tPHLD  
tPLHD  
tSKD  
Differential Propagation  
Delay High to Low  
RL = 54, CL = 100 pF  
Figures 5, 6  
399  
400  
1
1000  
1000  
10  
Differential Propagation  
Delay Low to High  
ns  
Differential Skew  
ns  
|tPHLD − tPLHD  
Rise Time  
Fall Time  
|
tr  
SR = Open  
SR = 100 kΩ  
SR = Short  
CL = 15 pF  
CL = 100 pF  
2870  
3070  
1590  
1640  
337  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tf  
tr  
Rise Time  
Fall Time  
tf  
tr  
Rise Time  
Fall Time  
100  
100  
1000  
1000  
2000  
800  
tf  
348  
tPHZ  
tPLZ  
tPZH  
tPZL  
Disable Time High to Z  
Disable Time Low to Z  
Enable Time Z to High  
Enable Time Z to Low  
Figures 7, 8  
Figures 9, 10  
Figures 7, 8  
Figures 9, 10  
1100  
500  
300  
500  
300  
500  
RECEIVER CHARACTERISTICS  
tPHL  
tPLH  
Propagation Delay  
High to Low  
CL = 15 pF  
30  
30  
0
210  
190  
400  
400  
ns  
ns  
Propagation Delay  
Low to High  
Figures 12, 13  
tSK  
Skew, |tPHL − tPLH  
|
20  
50  
55  
40  
45  
50  
ns  
ns  
ns  
ns  
ns  
tPLZ  
tPHZ  
tPZL  
tPZH  
Output Disable Time  
CL = 15 pF  
150  
150  
150  
150  
Figures 14, 15, 16  
Output Enable Time  
Note 2: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the devices  
should be operated at these limits. The table of “Electrical Characteristics” specifies conditions of device operation.  
3
www.national.com  
Switching Characteristics (Notes 4, 9, 11) (Continued)  
Note 3: Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground except V  
and  
OD1  
V
.
OD2  
Note 4: All typicals are given for: V  
= +5.0V, T = + 25˚C.  
A
CC  
Note 5: Delta |V  
| and Delta |V | are changes in magnitude of V  
and V , respectively, that occur when input changes state.  
OD2 OC  
OD2  
OC  
Note 6: Threshold parameter limits specified as an algebraic value rather than by magnitude.  
Note 7: Hysteresis defined as V = V − V  
.
TL  
HST  
TH  
Note 8: I includes the receiver input current and driver TRI-STATE leakage current.  
IN  
Note 9: C includes probe and jig capacitance.  
L
Note 10: For complete details of test, see RS-485.  
Note 11: SR = GND for all Switching Characteristics unless otherwise specified.  
Parameter Measurement Information  
01205202  
FIGURE 1. Driver VOD2 and VOC  
01205205  
FIGURE 5. Driver Differential  
Propagation Delay Test Circuit  
01205218  
FIGURE 2. Driver VOD3  
01205203  
FIGURE 3. Driver VOH and VOL  
01205206  
FIGURE 6. Driver Differential Propagation Delays  
and Differential Rise and Fall Times  
01205204  
Vtest = −7V to +12V  
FIGURE 4. Driver IOSD  
www.national.com  
4
Parameter Measurement  
Information (Continued)  
01205210  
FIGURE 10. TRI-STATE Waveforms (tPZL, tPLZ  
)
01205207  
FIGURE 7. TRI-STATE Test Circuit (tPZH , tPHZ  
)
01205211  
FIGURE 11. Receiver VOH and VOL  
01205208  
FIGURE 8. TRI-STATE Waveforms (tPZH, tPHZ  
)
01205212  
FIGURE 12. Receiver Differential  
Propagation Delay Test Circuit  
01205209  
FIGURE 9. TRI-STATE Test Circuit (tPZL, tPLZ  
)
01205213  
FIGURE 13. Receiver Differential Propagation Delay Waveforms  
5
www.national.com  
Parameter Measurement Information (Continued)  
01205214  
FIGURE 14. Receiver TRI-STATE Test Circuit  
01205215  
FIGURE 15. Receiver Enable and Disable Waveforms (tPLZ, tPZL  
)
01205216  
FIGURE 16. Receiver Enable and Disable Waveforms (tPHZ, tPZH  
)
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6
Typical Application Information  
01205217  
FIGURE 17. Typical Pin Connection  
TABLE 1. Device Pin Descriptions  
Description  
Pin  
#
Name  
1
RO  
Receiver Output: When DE/RE* (Receiver Enable) is LOW, the receiver is enabled (ON), if DO/RI ≥  
DO*/RI* by 200 mV, RO will be HIGH. If DO/RI DO*/RI* by 200 mV, RO will be LOW. Additionally RO will  
be HIGH for OPEN (Non-terminated) inputs.  
2
3
SR  
Slew Rate Control: A resistor connected to Ground controls the Driver Output rising and falling edge rates.  
Combined Driver and Receiver Output Enable: When signal is LOW the receiver output is enabled and the  
driver outputs are in TRI-STATE (OFF). When signaI is HlGH, the receiver output is in TRI-STATE (OFF)  
and the driver outputs are enabled.  
DE/RE*  
4
DI  
Driver Input: When DE/RE* is HlGH, the driver is enabled, if DI is LOW, then DO/RI will be LOW and  
DO*/RI* will be HIGH. If DI is HIGH, then DO/RI is HIGH and DO*/RI* is LOW.  
Ground Connection  
5
6
7
8
GND  
DO/RI  
DO*/RI*  
VCC  
Driver Output/Receiver Input, 485 Bus Pin.  
Driver Output/Receiver Input, 485 Bus Pin.  
Positive Power Supply Connection: Recommended operating range for VCC is +4.75V to +5.25V.  
−3V stay the same. The other reference points are +12V at  
+0.5 mA for the top border and −7V at −0.4 mA for the  
Unit Load  
A unit load for a RS-485 receiver is defined by the input  
current versus the input voltage curve. The gray shaded  
region is the defined operating range from −7V to +12V. The  
top border extending from −3V at 0 mA to +12V at +1 mA is  
defined as one unit load. Likewise, the bottom border ex-  
tending from +5V at 0 mA to −7V at −0.8 mA is also defined  
as one unit load (see Figure 18 ). A RS-485 driver is capable  
of driving up to 32 unit loads. This allows upto 32 nodes on  
a single bus. Although sufficient for many applications, it is  
sometime desirable to have even more nodes. For example  
an aircraft that has 32 rows with 4 seats per row could  
benefit from having 128 nodes on one bus. This would allow  
signals to be transferred to and from each individual seat to  
1 main station. Usually there is one or two less seats in the  
last row of the aircraft near the restrooms and food storage  
area. This frees the node for the main station.  
1
bottom border (see Figure 18 ). Second, for a ⁄ UL device  
4
the top and bottom borders shown in Figure 18 are scaled  
also. Again, both 0 mA reference points at +5V and −3V stay  
the same. The other reference points are +12V at +0.25 mA  
for the top border and −7V at −0.2 mA for the bottom border  
(see Figure 18 ).  
1
1
The advantage of the  
⁄ UL and ⁄ UL devices is the  
2
4
increased number of nodes on one bus. In a single master  
multi-slave type of application were the number of slaves  
exceeds 32, the DS36C278/279/280 may save in the cost of  
extra devices like repeaters, extra media like cable, and/or  
extra components like resistors.  
The DS36C279 and DS36C280 have addition feature which  
offer more advantages. The DS36C279 has an automatic  
sleep mode function for power conscious applications. The  
DS36C280 has a slew rate control for EMI conscious appli-  
cations. Refer to the sleep mode and slew rate control  
portion of the application information section in the corre-  
sponding datasheet for more information on these features.  
The DS36C278, the DS36C279, and the DS36C280 all have  
1
1
4
2 unit load and ⁄ unit load (UL) options available. These  
devices will allow upto 64 nodes or 128 nodes guaranteed  
over temperature depending upon which option is selected.  
1
The  
2
UL option is available in industrial temperature and  
UL is available in commercial temperature.  
UL device the top and bottom borders shown in  
Figure 18 are scaled. Both 0 mA reference points at +5V and  
1
the ⁄  
4
First, for a 1⁄  
2
7
www.national.com  
tion fixed edge rate devices. The slew rate control may be  
adjusted with or without any external components. The  
DS36C280 offers both low power (ICC 500 µA max) and low  
EMI for an RS-485 interface.  
Unit Load (Continued)  
The slew rate control is located at pin two of the device and  
only controls the driver output edges. The slew rate control  
pin (SR) may be left open or shorted to ground, with or  
without a resistor. When the SR pin is shorted to ground  
without a resistor, the driver output edges will transition  
typically 350 ns. When the SR pin is left open, the driver  
output edges will transition typically 3 µs. When the SR pin is  
shorted to ground with a resistor, the driver output edges will  
transition between 350 ns and 3 µs depending on the resis-  
tor value. Refer to the slew rate versus resistor value curve  
in this datasheet for determining resistor values and ex-  
pected typical slew rate value. Please note, when slowing  
the edge rates of the device (see Figure 19 ) will decrease  
the maximum data rate also.  
01205219  
FIGURE 18. Input Current vs Input Voltage  
Operating Range  
Slew Rate Control  
The DS36C280 features an adjustable slew rate control.  
This feature allows more control over EMl levels than tradi-  
Differential Rise/Fall Time  
vs Slew Rate Resistor  
01205220  
FIGURE 19. Slew Rate Resistor  
vs Rise/Fall Time  
www.national.com  
8
Physical Dimensions inches (millimeters) unless otherwise noted  
8-Lead (0.150" Wide) Molded Small Outline Package, JEDEC  
Order Number DS36C280M or DS36C280TM  
NS Package Number M08A  
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves  
the right at any time without notice to change said circuitry and specifications.  
For the most current product information visit us at www.national.com.  
LIFE SUPPORT POLICY  
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS  
WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR  
CORPORATION. As used herein:  
1. Life support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the body, or  
(b) support or sustain life, and whose failure to perform when  
properly used in accordance with instructions for use  
provided in the labeling, can be reasonably expected to result  
in a significant injury to the user.  
2. A critical component is any component of a life support  
device or system whose failure to perform can be reasonably  
expected to cause the failure of the life support device or  
system, or to affect its safety or effectiveness.  
BANNED SUBSTANCE COMPLIANCE  
National Semiconductor certifies that the products and packing materials meet the provisions of the Customer Products Stewardship  
Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification (CSP-9-111S2) and contain no ‘‘Banned  
Substances’’ as defined in CSP-9-111S2.  
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