DS55493J [NSC]
Quad LED Segment Driver; 四通道LED驱动器段型号: | DS55493J |
厂家: | National Semiconductor |
描述: | Quad LED Segment Driver |
文件: | 总4页 (文件大小:109K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
April 1990
DS55493/DS75493 Quad LED Segment Driver
General Description
The DS55493/DS75493 is a quad LED segment driver. It is
designed to interface between MOS IC’s and LED’s. An ex-
ternal resistor is required for each segment to drive the out-
Features
Y
Low voltage operation
Y
Low input current for MOS compatibility
Y
Low standby power
put current which is approximately equal to 0.7V/R and is
L
Y
Display blanking capability
relatively constant, independent of supply variations. Blank-
ing can be achieved by taking the chip enable (CE) to a
logical ‘‘1’’ level.
Y
Output current regulation
Y
Quad high gain circuits
Schematic and Connection Diagrams
TL/F/7561–1
Dual-In-Line Package
Truth Table
CE
V
I
OUT
IN
0
0
1
1
ON
0
OFF
OFF
X
e
X
Don’t care
TL/F/7561–2
Order Number DS55493J, DS75493J
or DS75493N
See NS Package Number J16A or N16A
C
1995 National Semiconductor Corporation
TL/F/7561
RRD-B30M105/Printed in U. S. A.
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.
Operating Conditions
Min
Supply Voltage
Max
Units
V
CC
V
SS
3.2
6.5
8.8
8.8
V
V
Supply Voltage
10V
10V
Temperature T
DS75493
DS55493
A
Input Voltage
a
0
70
125
C
C
§
§
Output Voltage
V
CC
b
a
55
b
a
65 C to 150 C
Storage Temperature Range
§
§
25 mA
b
Output Current (I
)
OUT
Maximum Power Dissipation* at 25 C
Cavity Package
Molded Package
§
1371 mW
1280 mW
Lead Temperature (Soldering, 4 seconds)
260 C
§
*Derate cavity package 9.14 mW/ C above 25 C; derate molded package
§
§
10.24 mW/ C above 25 C.
§
§
t
Electrical Characteristics (V
V ) (Notes 2 and 3)
CC
SS
Symbol
Parameter
Input Current
Conditions
Min
Typ
Max
3.2
Units
e
e
e
e
Open, V 0V
CE
I
V
Max, V
IN
8.8V, V
CC
mA
mA
IN
SS
@
e
e
8.8V
I
R
SET
0V, V
CE
3.6
OUT
e
to GND
e
e
I
I
Chip Enable Input Current
Output Current
V
Max, V
Max, V
8.8V, All Other Pins
CE
CC
SS
CE
2.1
mA
@
e
e
V
CC
e
6.5V,
I
2.15V, R
50X
Min, V
SS
OUT
OUT
L
e
e
b
b
b
I
80 mA, V
IN
6.5V
8
13
16
mA
mA
mA
CE
Through 1.0 kX
e
e
e
b
20
V
0V, V
IN
8.8V
CE
@
e
Measure Current to Gnd,
e
I
Output Leakage Current
I
R
SET
0V,
V
V
Min, V
0V
OL
OUT
CC
CE
e
b
b
8.8V Through
200
100
IN
e
V
SS
8.8V
100 kX
e
V
6.5V Though
CE
1.0 kX, V
mA
e
8.8V
IN
e
Max, All Other Pins to Gnd
e
e
e
I
I
Supply Current, V
Supply Current
V
CC
V
CC
V
CC
Max, V
SS
40
40
mA
mA
CC
SS
CC
0V, All Other Pins to Gnd
@
e
e
8.8V
Min, V
8.8V
I
2.15V, V
CE
SS
OUT
Through 100 kX,
0.5
1.5
1.4
mA
mA
e
R
50X
L
e
e
Open,
I
Open, R
SET
OUT
e
V
0V
CE
e
Switching Characteristics T
25 C, nominal power supplies unless otherwise noted
§
A
Symbol
Parameter
Conditions
Min
Typ
Max
Units
t
t
Propagation Delay to a Logical ‘‘0’’
From Input to Output
(See AC Test Circuit
pd(OFF)
170
300
100
ns
ns
Propagation Delay to a Logical ‘‘1’’
From Input to Output
(See AC Test Circuit)
pd(ON)
11
Note 1: ‘‘Absolute Maximum Ratings’’ are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the devices
should be operated at these limits. The table of ‘‘Electrical Characteristics’’ provides conditions for actual device operation.
a
b
a
Note 2: Unless otherwise specified min/max limits apply across the 0 C to 70 C range for the DS75493 and across the 55 C to 125 C range for the
DS55493.
§
§
§
§
Note 3: All currents into device pins shown as positive, out of device pins as negative, all voltages referenced to ground unless otherwise noted. All values shown
as max or min on absolute value basis.
2
Typical Applications
TL/F/7561–3
AC Test Circuit
Switching Time Waveforms
TL/F/7561–5
TL/F/7561–4
Physical Dimensions inches (millimeters)
Order Number DS55493J, DS75493J
NS Package Number J16A
3
Physical Dimensions inches (millimeters) (Continued)
Order Number DS75493N
See NS Package Number N16A
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant
into the body, or (b) support or sustain life, and whose
failure to perform, when properly used in accordance
with instructions for use provided in the labeling, can
be reasonably expected to result in a significant injury
to the user.
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
National Semiconductor
Corporation
National Semiconductor
Europe
National Semiconductor
Hong Kong Ltd.
National Semiconductor
Japan Ltd.
a
1111 West Bardin Road
Arlington, TX 76017
Tel: 1(800) 272-9959
Fax: 1(800) 737-7018
Fax:
(
49) 0-180-530 85 86
@
13th Floor, Straight Block,
Ocean Centre, 5 Canton Rd.
Tsimshatsui, Kowloon
Hong Kong
Tel: (852) 2737-1600
Fax: (852) 2736-9960
Tel: 81-043-299-2309
Fax: 81-043-299-2408
Email: cnjwge tevm2.nsc.com
a
a
a
a
Deutsch Tel:
English Tel:
Fran3ais Tel:
Italiano Tel:
(
(
(
(
49) 0-180-530 85 85
49) 0-180-532 78 32
49) 0-180-532 93 58
49) 0-180-534 16 80
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
相关型号:
©2020 ICPDF网 联系我们和版权申明