DS90C383B [NSC]

+3.3V Programmable LVDS Transmitter 24-Bit Flat Panel Display (FPD) Link-65 MHz; + 3.3V可编程LVDS发射器24位平板显示器( FPD )链路65兆赫
DS90C383B
型号: DS90C383B
厂家: National Semiconductor    National Semiconductor
描述:

+3.3V Programmable LVDS Transmitter 24-Bit Flat Panel Display (FPD) Link-65 MHz
+ 3.3V可编程LVDS发射器24位平板显示器( FPD )链路65兆赫

显示器 光电二极管
文件: 总11页 (文件大小:639K)
中文:  中文翻译
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October 2006  
DS90C383B  
+3.3V Programmable LVDS Transmitter 24-Bit Flat Panel  
Display (FPD) Link-65 MHz  
General Description  
Features  
n No special start-up sequence required between  
clock/data and /PD pins. Input signal (clock and data)  
can be applied either before or after the device is  
powered.  
The DS90C383B transmitter converts 28 bits of CMOS/TTL  
data into four LVDS (Low Voltage Differential Signaling) data  
streams. A phase-locked transmit clock is transmitted in  
parallel with the data streams over a fifth LVDS link. Every  
cycle of the transmit clock 28 bits of input data are sampled  
and transmitted. At a transmit clock frequency of 65 MHz, 24  
bits of RGB data and 3 bits of LCD timing and control data  
(FPLINE, FPFRAME, DRDY) are transmitted at a rate of 455  
Mbps per LVDS data channel. Using a 65 MHz clock, the  
data throughput is 227 Mbytes/sec. The DS90C383B trans-  
mitter can be programmed for Rising edge strobe or Falling  
edge strobe through a dedicated pin. A Rising edge or  
Falling edge strobe transmitter will interoperate with a Falling  
edge strobe Receiver (DS90CF386) without any translation  
logic.  
n Support Spread Spectrum Clocking up to 100kHz  
frequency modulation & deviations of 2.5% center  
spread or −5% down spread.  
n "Input Clock Detection" feature will pull all LVDS pairs to  
logic low when input clock is missing and when /PD pin  
is logic high.  
n 18 to 68 MHz shift clock support  
n Best–in–Class Set & Hold Times on TxINPUTs  
n Tx power consumption 130 mW (typ) 65MHz  
Grayscale  
n 40% Less Power Dissipation than BiCMOS Alternatives  
<
@
This chipset is an ideal means to solve EMI and cable size  
problems associated with wide, high speed TTL interfaces.  
<
n Tx Power-down mode 60µW (typ)  
n Supports VGA, SVGA, XGA and Dual Pixel SXGA.  
n Narrow bus reduces cable size and cost  
n Up to 1.8 Gbps throughput  
n Up to 227 Megabytes/sec bandwidth  
n 345 mV (typ) swing LVDS devices for low EMI  
n PLL requires no external components  
n Compatible with TIA/EIA-644 LVDS standard  
n Low profile 56-lead TSSOP package  
n Improved replacement for:  
SN75LVDS83, DS90C383A  
Block Diagram  
DS90C383B  
20098401  
Order Number DS90C383BMT  
See NS Package Number MTD56  
TRI-STATE® is a registered trademark of National Semiconductor Corporation.  
© 2006 National Semiconductor Corporation  
DS200984  
www.national.com  
Absolute Maximum Ratings (Note 1)  
If Military/Aerospace specified devices are required,  
please contact the National Semiconductor Sales Office/  
Distributors for availability and specifications.  
ESD Rating  
(HBM, 1.5 k, 100 pF)  
(EIAJ, 0, 200 pF)  
7 kV  
500V  
Supply Voltage (VCC  
)
−0.3V to +4V  
−0.3V to (VCC + 0.3V)  
−0.3V to (VCC + 0.3V)  
Recommended Operating  
Conditions  
CMOS/TTL Input Voltage  
LVDS Driver Output Voltage  
LVDS Output Short Circuit  
Duration  
Min Nom  
Max  
Units  
Supply Voltage  
(VCC  
Operating Free Air  
3.0  
3.3  
3.6  
V
Continuous  
+150˚C  
)
Junction Temperature  
Storage Temperature  
Lead Temperature  
−65˚C to +150˚C  
Temperature (TA) −10  
Supply Noise  
+25  
+70  
200  
˚C  
mVPP  
(Soldering, 4 sec)  
+260˚C  
Voltage (VCC  
)
@
Maximum Package Power Dissipation Capacity 25˚C  
TxCLKIN frequency  
18  
68  
MHz  
MTD56 (TSSOP) Package:  
DS90C383B  
Package Derating:  
DS90C383B  
1.63 W  
12.5 mW/˚C above +25˚C  
Electrical Characteristics  
Over recommended operating supply and temperature ranges unless otherwise specified.  
Symbol Parameter Conditions  
CMOS/TTL DC SPECIFICATIONS  
Min  
Typ  
Max  
Units  
VIH  
VIL  
VCL  
IIN  
High Level Input Voltage  
Low Level Input Voltage  
Input Clamp Voltage  
Input Current  
2.0  
VCC  
0.8  
V
V
GND  
ICL = −18 mA  
−0.79  
+1.8  
0
−1.5  
+10  
V
V
V
= 0.4V, 2.5V or VCC  
= GND  
µA  
µA  
IN  
IN  
−10  
250  
LVDS DC SPECIFICATIONS  
VOD  
Differential Output Voltage  
RL = 100Ω  
345  
450  
35  
mV  
mV  
VOD  
Change in VOD between  
complimentary output states  
Offset Voltage (Note 4)  
VOS  
1.13  
1.25  
1.38  
35  
V
VOS  
Change in VOS between  
complimentary output states  
Output Short Circuit Current  
Output TRI-STATE® Current  
mV  
IOS  
IOZ  
VOUT = 0V, RL = 100Ω  
−3.5  
1
−5  
10  
mA  
µA  
Power Down = 0V,  
VOUT = 0V or V  
CC  
TRANSMITTER SUPPLY CURRENT  
ICCTW  
Transmitter Supply Current  
Worst Case  
RL = 100,  
CL = 5 pF,  
f = 25MHz  
f = 40MHz  
f = 65 MHz  
31  
37  
48  
45  
50  
60  
mA  
mA  
mA  
Worst Case Pattern  
(Figures 1, 4 )" Typ "  
values are given for V  
CC = 3.6V and T  
=
A
+25˚C, " Max " values  
are given for V  
=
CC  
3.6V and T = −10˚C  
A
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2
Electrical Characteristics (Continued)  
Over recommended operating supply and temperature ranges unless otherwise specified.  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
TRANSMITTER SUPPLY CURRENT  
ICCTG  
Transmitter Supply Current  
16 Grayscale  
RL = 100,  
CL = 5 pF,  
f = 25MHz  
f = 40MHz  
f = 65 MHz  
29  
40  
mA  
16 Grayscale Pattern  
(Figures 2, 4 )" Typ "  
values are given for V  
33  
39  
17  
45  
50  
mA  
mA  
µA  
CC = 3.6V and T  
=
A
+25˚C, " Max " values  
are given for V  
=
CC  
3.6V and T = −10˚C  
A
ICCTZ  
Transmitter Supply Current  
Power Down  
Power Down = Low  
150  
Driver Outputs in TRI-STATE under  
Power Down Mode  
Note 1: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the device  
should be operated at these limits. The tables of “Electrical Characteristics” specify conditions for device operation.  
Note 2: Typical values are given for V  
= 3.3V and T = +25˚C unless specified otherwise.  
A
CC  
Note 3: Current into device pins is defined as positive. Current out of device pins is defined as negative. Voltages are referenced to ground unless otherwise  
specified (except V and V ).  
OD  
OD  
Note 4:  
V
OS  
previously referred as V  
.
CM  
Recommended Transmitter Input Characteristics  
Over recommended operating supply and temperature ranges unless otherwise specified  
Symbol  
TCIT  
Parameter  
Min  
Typ  
Max Units  
TxCLK IN Transition Time (Figure 5 )  
TxCLK IN Period (Figure 6 )  
5
ns  
ns  
ns  
ns  
ns  
us  
TCIP  
14.7  
T
50  
TCIH  
TCIL  
TxCLK IN High Time (Figure 6 )  
TxCLK IN Low Time (Figure 6)  
0.35T 0.5T 0.65T  
0.35T 0.5T 0.65T  
TXIT  
TxIN, and Power Down pins Transition Time  
Minimum pulse width for Power Down pin signal  
1.5  
1
6.0  
TXPD  
Transmitter Switching Characteristics  
Over recommended operating supply and temperature ranges unless otherwise specified  
Symbol  
LLHT  
Parameter  
LVDS Low-to-High Transition Time (Figure 4 )  
LVDS High-to-Low Transition Time (Figure 4 )  
Transmitter Output Pulse Position for Bit 0 (Figure 11 ) (Note  
5)  
Min  
Typ  
Max  
Units  
ns  
0.75  
0.75  
0
1.4  
1.4  
LHLT  
ns  
TPPos0  
f = 65  
MHz  
−0.20  
+0.20  
ns  
TPPos1  
TPPos2  
TPPos3  
TPPos4  
TPPos5  
TPPos6  
Transmitter Output Pulse Position for Bit 1  
Transmitter Output Pulse Position for Bit 2  
Transmitter Output Pulse Position for Bit 3  
Transmitter Output Pulse Position for Bit 4  
Transmitter Output Pulse Position for Bit 5  
Transmitter Output Pulse Position for Bit 6  
2.00  
4.20  
2.20  
4.40  
2.40  
4.60  
ns  
ns  
ns  
ns  
ns  
ns  
6.39  
6.59  
6.79  
8.59  
8.79  
8.99  
10.79  
12.99  
10.99  
13.19  
11.19  
13.39  
3
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Transmitter Switching Characteristics (Continued)  
Over recommended operating supply and temperature ranges unless otherwise specified  
Symbol  
Parameter  
Transmitter Output Pulse Position for Bit 0 (Figure 11 ) (Note  
5)  
Min  
Typ  
Max  
Units  
TPPos0  
f = 40  
MHz  
−0.25  
0
+0.25  
ns  
TPPos1  
TPPos2  
TPPos3  
TPPos4  
TPPos5  
TPPos6  
TPPos0  
Transmitter Output Pulse Position for Bit 1  
Transmitter Output Pulse Position for Bit 2  
Transmitter Output Pulse Position for Bit 3  
Transmitter Output Pulse Position for Bit 4  
Transmitter Output Pulse Position for Bit 5  
Transmitter Output Pulse Position for Bit 6  
Transmitter Output Pulse Position for Bit 0 (Figure 11 ) (Note  
5)  
3.32  
6.89  
3.57  
7.14  
10.71  
14.29  
17.86  
21.43  
0
3.82  
7.39  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
10.46  
14.04  
17.61  
21.18  
−0.45  
10.96  
14.54  
18.11  
21.68  
+0.45  
f =  
25MHz  
TPPos1  
TPPos2  
TPPos3  
TPPos4  
TPPos5  
TPPos6  
TSTC  
Transmitter Output Pulse Position for Bit 1  
Transmitter Output Pulse Position for Bit 2  
Transmitter Output Pulse Position for Bit 3  
Transmitter Output Pulse Position for Bit 4  
Transmitter Output Pulse Position for Bit 5  
Transmitter Output Pulse Position for Bit 6  
TxIN Setup to TxCLK IN (Figure 6 )  
5.26  
10.98  
16.69  
22.41  
25.12  
33.84  
2.5  
5.71  
6.16  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
11.43  
17.14  
22.86  
28.57  
34.29  
11.88  
17.59  
23.31  
29.02  
34.74  
THTC  
TxIN Hold to TxCLK IN (Figure 6 )  
0.5  
TCCD  
TxCLK IN to TxCLK OUT Delay (Figure 7 ) 50% duty cycle  
input clock is assumed, TA= −10˚C, and 65MHz for ” Min ”,  
TA= 70˚C,and 25MHz for ” Max ”, VCC= 3.6V, R_FB = VCC  
TxCLK IN to TxCLK OUT Delay (Figure 7 ) 50% duty cycle  
input clock is assumed, TA= −10˚C, and 65MHz for ” Min ”,  
TA= 70˚C, and 25MHz for ” Max ”, VCC= 3.6V, R_FB = GND  
3.340  
7.211  
6.062  
3.011  
ns  
SSCG  
f =  
100kHz  
25MHz  
f =  
2.5%/−5%  
100kHz  
Spread Spectrum Clock support; Modulation frequency with a  
linear profile(Note 6).  
40MHz  
f =  
2.5%/−5%  
100kHz  
65MHz  
2.5%/−5%  
TPLLS  
TPDD  
Transmitter Phase Lock Loop Set (Figure 8 )  
Transmitter Power Down Delay (Figure 10 )  
10  
ms  
ns  
100  
Note 5: The Minimum and Maximum Limits are based on statistical analysis of the device performance over process, voltage, and temperature ranges. This  
parameter is functionality tested only on Automatic Test Equipment (ATE).  
Note 6: Care must be taken to ensure TSTC and THTC are met so input data are sampling correctly. This SSCG parameter only shows the performance of tracking  
Spread Spectrum Clock applied to TxCLK IN pin, and reflects the result on TxCLKOUT+ and TxCLK− pins.  
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4
AC Timing Diagrams  
20098404  
FIGURE 1. “Worst Case” Test Pattern  
20098405  
FIGURE 2. “16 Grayscale” Test Pattern (Notes 7, 8, 9, 10)  
Note 7: The worst case test pattern produces a maximum toggling of digital circuits, LVDS I/O and CMOS/TTL I/O.  
Note 8: The 16 grayscale test pattern tests device power consumption for a “typical” LCD display pattern. The test pattern approximates signal switching needed  
to produce groups of 16 vertical stripes across the display.  
Note 9: Figures 1, 2 show a falling edge data strobe (TxCLK IN/RxCLK OUT).  
Note 10: Recommended pin to signal mapping. Customer may choose to define differently.  
5
www.national.com  
AC Timing Diagrams (Continued)  
20098430  
FIGURE 3. DS90C383B (Transmitter) LVDS Output Load  
20098406  
FIGURE 4. DS90C383B (Transmitter) LVDS Transition Times  
20098408  
FIGURE 5. DS90C383B (Transmitter) Input Clock Transition Time  
20098410  
FIGURE 6. DS90C383B (Transmitter) Setup/Hold and High/Low Times (Falling Edge Strobe)  
20098412  
FIGURE 7. DS90C383B (Transmitter) Clock In to Clock Out Delay (Falling Edge Strobe)  
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6
AC Timing Diagrams (Continued)  
20098414  
FIGURE 8. DS90C383B (Transmitter) Phase Lock Loop Set Time  
20098417  
FIGURE 9. 28 Parallel TTL Data Inputs Mapped to LVDS Outputs  
20098418  
FIGURE 10. Transmitter Power Down Delay  
7
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AC Timing Diagrams (Continued)  
20098426  
FIGURE 11. Transmitter LVDS Output Pulse Position Measurement  
DS90C383B Pin Description—FPD Link Transmitter  
Pin Name  
I/O  
No.  
Description  
TxIN  
I
28  
TTL level input. This includes: 8 Red, 8 Green, 8 Blue, and 4 control linesFPLINE,  
FPFRAME and DRDY (also referred to as HSYNC, VSYNC, Data Enable).  
Positive LVDS differentiaI data output.  
TxOUT+  
O
O
I
4
4
1
1
1
1
1
TxOUT−  
Negative LVDS differential data output.  
FPSHIFT IN  
R_FB  
TTL Ievel clock input. The falling edge acts as data strobe. Pin name TxCLK IN.  
Programmable strobe select (See Table 1).  
Positive LVDS differential clock output.  
I
TxCLK OUT+  
TxCLK OUT−  
PWR DOWN  
O
O
I
Negative LVDS differential clock output.  
TTL level input. Assertion (low input) TRI-STATES the outputs, ensuring low current at power  
down. See Applications Information section.  
Power supply pins for TTL inputs.  
VCC  
I
I
I
I
I
I
3
5
1
2
1
3
GND  
Ground pins for TTL inputs.  
PLL VCC  
PLL GND  
LVDS VCC  
LVDS GND  
Power supply pin for PLL.  
Ground pins for PLL.  
Power supply pin for LVDS outputs.  
Ground pins for LVDS outputs.  
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8
data is stopped and reapplied, such as changing video mode  
within Graphics Controller, it is not necessary to cycle the PD  
signal. However, there are in certain cases where the PD  
may need to be asserted during these mode changes. In  
cases where the source (Graphics Source) may be supply-  
ing an unstable clock or spurious noisy clock output to the  
LVDS transmitter, the LVDS Transmitter may attempt to lock  
onto this unstable clock signal but is unable to do so due the  
instability or quality of the clock source. The PD signal in  
these cases should then be asserted once a stable clock is  
applied to the LVDS transmitter. Asserting the PWR DOWN  
pin will effectively place the device in reset and disable the  
PLL, enabling the LVDS Transmitter into a power saving  
standby mode. However, it is still generally a good practice  
to assert the PWR DOWN pin or reset the LVDS transmitter  
whenever the clock/data is stopped and reapplied but it is  
not mandatory for the DS90C383B.  
Applications Information  
The DS90C383B are backward compatible with the  
DS90C383/DS90CF383, DS90C383A/DS90CF383A and  
are a pin-for-pin replacement.  
This device may also be used as a replacement for the  
DS90CF583 (5V, 65MHz) and DS90CF581 (5V, 40MHz)  
FPD-Link Transmitters with certain considerations/  
modifications:  
1. Change 5V power supply to 3.3V. Provide this supply to  
the VCC, LVDS VCC and PLL VCC of the transmitter.  
2. The DS90C383B transmitter input and control inputs  
accept 3.3V LVTTL/LVCMOS levels. They are not 5V  
tolerant.  
3. To implement a falling edge device for the DS90C383B,  
the R_FB pin (pin 17) may be tied to ground OR left  
unconnected (an internal pull-down resistor biases this  
pin low). Biasing this pin to Vcc implements a rising edge  
device.  
SPREAD SPECTRUM CLOCK SUPPORT  
The DS90C383B can support Spread Spectrum Clocking  
signal type inputs. The DS90C383B outputs will accurately  
track Spread Spectrum Clock/Data inputs with modulation  
frequencies of up to 100kHz (max.)with either center spread  
of 2.5% or down spread -5% deviations.  
TRANSMITTER INPUT PINS  
The TxIN and control input pins are compatible with LVC-  
MOS and LVTTL levels. These pins are not 5V tolerant.  
TRANSMITTER INPUT CLOCK/DATA SEQUENCING  
POWER SOURCES SEQUENCE  
The DS90C383B does not require any special requirement  
for sequencing of the input clock/data and PD (PowerDown)  
signal. The DS90C383B offers a more robust input sequenc-  
ing feature where the input clock/data can be inserted after  
the release of the PD signal. In the case where the clock/  
In typical applications, it is recommended to have VCC, LVDS  
VCC and PLL VCC from the same power source with three  
separate de-coupling bypass capacitor groups. There is no  
requirement on which VCC entering the device first.  
9
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Pin Diagram  
DS90C383B  
20098423  
Typical Application  
20098403  
TABLE 1. Programmable Transmitter (DS90C383B)  
Pin  
Condition  
R_FB = VCC  
R_FB = GND or NC  
Strobe Status  
Rising edge strobe  
Falling edge strobe  
R_FB  
R_FB  
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10  
Physical Dimensions inches (millimeters) unless otherwise noted  
56-Lead Molded Thin Shrink Small Outline Package, JEDEC  
Order Number DS90C383BMT  
NS Package Number MTD56  
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves  
the right at any time without notice to change said circuitry and specifications.  
For the most current product information visit us at www.national.com.  
LIFE SUPPORT POLICY  
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS  
WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR  
CORPORATION. As used herein:  
1. Life support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the body, or  
(b) support or sustain life, and whose failure to perform when  
properly used in accordance with instructions for use  
provided in the labeling, can be reasonably expected to result  
in a significant injury to the user.  
2. A critical component is any component of a life support  
device or system whose failure to perform can be reasonably  
expected to cause the failure of the life support device or  
system, or to affect its safety or effectiveness.  
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and Materials of Interest Specification (CSP-9-111S2) for regulatory environmental compliance. Details may be found at:  
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