DS90UR906QSQ [NSC]

5 - 65 MHz 24-bit Color FPD-Link II Serializer and Deserializer; 5 - 65 MHz的24位彩色FPD -Link的II串行器和解串
DS90UR906QSQ
型号: DS90UR906QSQ
厂家: National Semiconductor    National Semiconductor
描述:

5 - 65 MHz 24-bit Color FPD-Link II Serializer and Deserializer
5 - 65 MHz的24位彩色FPD -Link的II串行器和解串

光电二极管
文件: 总44页 (文件大小:1169K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
May 26, 2010  
DS90UR905Q/DS90UR906Q  
5 - 65 MHz 24-bit Color FPD-Link II Serializer and  
Deserializer  
General Description  
Features  
The DS90UR905Q/906Q chipset translates a parallel RGB  
Video Interface into a high-speed serialized interface over a  
single pair. This serial bus scheme greatly eases system de-  
sign by eliminating skew problems between clock and data,  
reduces the number of connector pins, reduces the intercon-  
nect size, weight, and cost, and overall eases PCB layout. In  
addition, internal DC balanced decoding is used to support  
AC-coupled interconnects.  
5 – 65 MHz PCLK support (140 Mbps – 1.82 Gbps)  
AC coupled STP interconnect cable up to 10 meters  
Integrated terminations on Ser and Des  
@ Speed link BIST mode and reporting pin  
Optional I2C compatible Serial Control Bus  
RGB888 + VS, HS, DE support  
Power down mode minimizes power dissipation  
1.8V or 3.3V compatible LVCMOS I/O interface  
Automotive grade product: AEC-Q100 Grade 2 qualified  
>8 kV HBM and ISO 10605 ESD Rating  
The DS90UR905Q Ser (serializer) embeds the clock, bal-  
ances the data payload, and level shifts the signals to high-  
speed low voltage differential signaling. Up to 24 inputs are  
serialized along with the three video control signals. This sup-  
ports full 24-bit color or 18-bit color and 6 general purpose  
signals (e.g. Audio I2S) applications.  
Backward compatible mode for operation with older  
generation devices  
The DS90UR906Q Des (deserializer) recovers the data  
(RGB) and control signals and extracts the clock from the se-  
rial stream. It is able to lock to the incoming data stream  
without the use of a training sequence or special SYNC pat-  
terns, and does not require a reference clock. A link status  
(LOCK) output signal is provided.  
SERIALIZER — DS90UR905Q  
RGB888 + VS/HS/DE serialized to 1 pair FPD-Link II  
Randomizer/Scrambler — DC-balanced data stream  
Selectable output VOD and adjustable de-emphasis  
DESERIALIZER — DS90UR906Q  
FAST random data lock; no reference clock required  
Serial transmission is optimized by a user selectable de-em-  
phasis, differential output level select features, and receiver  
equalization. EMI is minimized by the use of low voltage dif-  
ferential signaling, receiver drive strength control, and spread  
spectrum clocking compatibility. The Des may be configured  
to generate Spread Spectrum Clock and Data on its parallel  
outputs.  
Adjustable input receiver equalization  
LOCK (real time link status) reporting pin  
EMI minimization on output parallel bus (SSCG)  
Output Slew control (OS)  
Applications  
The DS90UR905Q (Ser) is offered in a 48-pin LLP and the  
DS90UR906Q (Des) is offered in a 60-pin LLP package. They  
are specified over the automotive AEC-Q100 grade 2 tem-  
perature range of -40°C to +105°C.  
Automotive Display for Navigation  
Automotive Display for Entertainment  
Applications Diagram  
30102027  
TRI-STATE® is a registered trademark of National Semiconductor Corporation.  
© 2010 National Semiconductor Corporation  
301020  
www.national.com  
Block Diagrams  
30102028  
30102029  
www.national.com  
2
Ordering Information  
NSID  
DS90UR905QSQE  
Package Description  
Quantity  
250  
SPEC  
NOPB  
NOPB  
NOPB  
NOPB  
NOPB  
NOPB  
Package ID  
SQA48A  
SQA48A  
SQA48A  
SQA60B  
SQA60B  
SQA60B  
48–pin LLP, 7.0 X 7.0 X 0.8 mm, 0.5 mm pitch  
48–pin LLP, 7.0 X 7.0 X 0.8 mm, 0.5 mm pitch  
48–pin LLP, 7.0 X 7.0 X 0.8 mm, 0.5 mm pitch  
60–pin LLP, 9.0 X 9.0 X 0.8 mm, 0.5 mm pitch  
60–pin LLP, 9.0 X 9.0 X 0.8 mm, 0.5 mm pitch  
60–pin LLP, 9.0 X 9.0 X 0.8 mm, 0.5 mm pitch  
DS90UR905QSQ  
DS90UR905QSQX  
DS90UR906QSQE  
DS90UR906QSQ  
DS90UR906QSQX  
1000  
2500  
250  
1000  
2000  
Note: Automotive Grade (Q) product incorporates enhanced manufacturing and support processes for the automotive market,  
including defect detection methodologies. Reliability qualification is compliant with the requirements and temperature grades  
defined in the AEC Q100 standard. Automotive Grade products are identified with the letter Q. For more information go to  
http://www.national.com/automotive.  
DS90UR905Q Pin Diagram  
30102019  
Serializer - DS90UR905Q — Top View  
3
www.national.com  
DS90UR905Q Serializer Pin Descriptions  
Pin Name  
Pin #  
I/O, Type Description  
LVCMOS Parallel Interface  
R[7:0]  
G[7:0]  
B[7:0]  
HS  
34, 33, 32, 29, I, LVCMOS RED Parallel Interface Data Input Pins  
28, 27, 26, 25 w/ pull-down (MSB = 7, LSB = 0)  
42, 41, 40, 39, I, LVCMOS GREEN Parallel Interface Data Input Pins  
38, 37, 36, 35 w/ pull-down (MSB = 7, LSB = 0)  
2, 1, 48, 47,  
I, LVCMOS BLUE Parallel Interface Data Input Pins  
46, 45, 44, 43 w/ pull-down (MSB = 7, LSB = 0)  
3
I, LVCMOS Horizontal Sync Input  
w/ pull-down Video control signal pulse width must be 3 PCLKs or longer to be transmitted when the  
Control Signal Filter is enabled (CONFIG[1:0] = 01). There is no restriction on the minimum  
transition pulse when the Control Signal Filter is disabled (CONFIG[1:0] = 00). The signal  
is limited to 2 transitions per 130 PCLKs.  
VS  
DE  
4
5
I, LVCMOS Vertical Sync Input  
w/ pull-down Video control signal is limited to 1 transition per 130 PCLKs. Thus, the minimum pulse width  
is 130 PCLKs.  
I, LVCMOS Data Enable Input  
w/ pull-down Video control signal pulse width must be 3 PCLKs or longer to be transmitted when the  
Control Signal Filter is enabled (CONFIG[1:0] = 01). There is no restriction on the minimum  
transition pulse when the Control Signal Filter is disabled (CONFIG[1:0] = 00). The signal  
is limited to 2 transitions per 130 PCLKs.  
PCLK  
10  
I, LVCMOS Pixel Clock Input  
w/ pull-down Latch edge set by RFB function.  
Control and Configuration  
PDB  
21  
I, LVCMOS Power-down Mode Input  
w/ pull-down PDB = 1, Ser is enabled (normal operation).  
Refer to ”Power Up Requirements and PDB Pin” in the Applications Information Section.  
PDB = 0, Ser is powered down  
When the Ser is in the power-down state, the driver outputs (DOUT+/-) are both logic high,  
the PLL is shutdown, IDD is minimized. Control Registers are RESET.  
VODSEL  
De-Emph  
24  
23  
I, LVCMOS Differential Driver Output Voltage Select — Pin or Register Control  
w/ pull-down VODSEL = 1, LVDS VOD is ±420 mV, 840 mVp-p (typ) — Long Cable / De-E Applications  
VODSEL = 0, LVDS VOD is 280 mV, 560 mVp-p (typ)  
I, Analog  
w/ pull-up De-Emph = open (float) - disabled  
To enable De-emphasis, tie a resistor from this pin to GND or control via register.  
De-Emphasis Control — Pin or Register Control  
See Table 4.  
RFB  
11  
I, LVCMOS Pixel Clock Input Latch Edge Select — Pin or Register Control  
w/ pull-down RFB = 1, parallel interface data and control signals are latched on the rising clock edge.  
RFB = 0, parallel interface data and control signals are latched on the falling clock edge.  
CONFIG  
[1:0]  
13, 12  
I, LVCMOS Operating Modes — Pin or Register Control  
w/ pull-down Determine the DS90UR905’s operating mode and interfacing device.  
CONFIG[1:0] = 00: Interfacing to DS90UR906, Control Signal Filter DISABLED  
CONFIG[1:0] = 01: Interfacing to DS90UR906, Control Signal Filter ENABLED  
CONFIG [1:0] = 10: Interfacing to DS90UR124, DS99R124  
CONFIG [1:0] = 11: Interfacing to DS90C124  
ID[x]  
SCL  
SDA  
6
8
9
I, Analog  
Serial Control Bus Device ID Address Select — Optional  
Resistor to Ground and 10 kpull-up to 1.8V rail. See Table 13.  
I, LVCMOS Serial Control Bus Clock Input - Optional  
SCL requires an external pull-up resistor to VDDIO  
.
I/O, LVCMOS Serial Control Bus Data Input / Output - Optional  
Open Drain SDA requires an external pull-up resistor VDDIO  
.
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4
Pin Name  
Pin #  
I/O, Type Description  
BISTEN  
31  
I, LVCMOS BIST Mode — Optional  
w/ pull-down BISTEN = 1, BIST is enabled  
BISTEN = 0, BIST is disabled  
RES[2:0]  
18, 16, 15  
I, LVCMOS Reserved - tie LOW  
w/ pull-down  
FPD-Link II Serial Interface  
DOUT+  
20  
O, LVDS  
O, LVDS  
True Output.  
The output must be AC Coupled with a 100 nF capacitor.  
DOUT-  
19  
Inverting Output.  
The output must be AC Coupled with a 100 nF capacitor.  
Power and Ground  
VDDL  
7
14  
Power  
Power  
Power  
Power  
Power  
Ground  
Logic Power, 1.8 V ±5%  
VDDP  
VDDHS  
VDDTX  
VDDIO  
GND  
PLL Power, 1.8 V ±5%  
17  
TX High Speed Logic Power, 1.8 V ±5%  
Output Driver Power, 1.8 V ±5%  
LVCMOS I/O Power, 1.8 V ±5% OR 3.3 V ±10%  
22  
30  
DAP  
DAP is the large metal contact at the bottom side, located at the center of the LLP  
package. Connect to the ground plane (GND) with at least 9 vias.  
NOTE: 1= HIGH, 0 L= LOW  
The VDD (VDDn and VDDIO) supply ramp should be faster than 1.5 ms with a monotonic rise. If slower then 1.5 ms then a capacitor  
on the PDB pin is needed to ensure PDB arrives after all the VDD have settled to the recommended operating voltage.  
5
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DS90UR906Q Pin Diagram  
30102020  
Deserializer - DS90UR906Q — Top View  
www.national.com  
6
DS90UR906Q Deserializer Pin Descriptions  
Pin Name  
Pin #  
I/O, Type Description  
LVCMOS Parallel Interface  
R[7:0]  
G[7:0]  
B[7:0]  
HS  
33, 34, 35,  
I, STRAP, RED Parallel Interface Data Output Pins (MSB = 7, LSB = 0)  
36, 37, 39, O, LVCMOS In power-down (PDB = 0), outputs are controlled by the OSS_SEL (See Table 8). These  
40, 41  
pins are inputs during power-up (See STRAP Inputs).  
20, 21, 22,  
I, STRAP, GREEN Parallel Interface Data Output Pins (MSB = 7, LSB = 0)  
23, 25, 26, O, LVCMOS In power-down (PDB = 0), outputs are controlled by the OSS_SEL (See Table 8). These  
27, 28  
pins are inputs during power-up (See STRAP Inputs).  
9, 10, 11,  
I, STRAP, BLUE Parallel Interface Data Output Pins (MSB = 7, LSB = 0)  
12, 14, 17, O, LVCMOS In power-down (PDB = 0), outputs are controlled by the OSS_SEL (See Table 8). These  
18, 19  
8
pins are inputs during power-up (See STRAP Inputs).  
O, LVCMOS Horizontal Sync Output  
In power-down (PDB = 0), output is controlled by the OSS_SEL pin (See Table 8). Video  
control signal pulse width must be 3 PCLKs or longer to be transmitted when the Control  
Signal Filter is enabled (CONFIG[1:0] = 01). There is no restriction on the minimum transition  
pulse when the Control Signal Filter is disabled (CONFIG[1:0] = 00). The signal is limited to  
2 transitions per 130 PCLKs.  
VS  
DE  
7
6
O, LVCMOS Vertical Sync Output  
In power-down (PDB = 0), output is controlled by the OSS_SEL pin (See Table 8). Video  
control signal is limited to 1 transition per 130 PCLKs. Thus, the minimum pulse width is 130  
PCLKs.  
O, LVCMOS Data Enable Output  
In power-down (PDB = 0), output is controlled by the OSS_SEL pin (See Table 8). Video  
control signal pulse width must be 3 PCLKs or longer to be transmitted when the Control  
Signal Filter is enabled (CONFIG[1:0] = 01). There is no restriction on the minimum transition  
pulse when the Control Signal Filter is disabled (CONFIG[1:0] = 00). The signal is limited to  
2 transitions per 130 PCLKs.  
PCLK  
LOCK  
5
O, LVCMOS Pixel Clock Output  
In power-down (PDB = 0), output is controlled by the OSS_SEL pin (See Table 8). Strobe  
edge set by RFB function.  
32  
O, LVCMOS LOCK Status Output  
LOCK = 1, PLL is Locked, outputs are active LOCK = 0, PLL is unlocked, RGB[7:0], HS,  
VS, DE and PCLK output states are controlled by OSS_SEL (See Table 8). May be used  
as Link Status or to flag when Video Data is active (ON/OFF).  
PASS  
42  
O, LVCMOS PASS Output (BIST Mode)  
PASS = 1, error free transmission  
PASS = 0, one or more errors were detected in the received payload  
Route to test point for monitoring, or leave open if unused.  
Control and Configuration — STRAP PINS  
For a High State, use a 10 kpull up to VDDIO; for a Low State, the IO includes an internal pull down. The STRAP pins are read upon  
power-up and set device configuration. Pin Number listed along with shared RGB Output name in square brackets.  
CONFIG[1:0]  
10 [B6],  
9 [B7]  
STRAP  
Operating Modes — Pin or Register Control  
I, LVCMOS These pins determine the DS90UR906’s operating mode and interfacing device.  
w/ pull-down CONFIG[1:0] = 00: Interfacing to DS90UR905, Control Signal Filter DISABLED  
CONFIG[1:0] = 01: Interfacing to DS90UR905, Control Signal Filter ENABLED  
CONFIG[1:0] = 10: Interfacing to DS90UR241  
CONFIG[1:0] = 11: Interfacing to DS90C241  
LF_MODE  
12 [B4]  
STRAP  
SSCG Low Frequency Mode — Pin or Register Control  
I, LVCMOS Only required when SSCG is enabled, otherwise LF_MODE condition is a DON’T CARE  
w/ pull-down (X).  
LF_MODE = 1, SSCG in low frequency mode (PCLK = 5-20 MHz)  
LF_MODE = 0, SSCG in high frequency mode (PCLK = 20-65 MHz)  
7
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Pin Name  
Pin #  
I/O, Type Description  
OS_PCLK  
11 [B5]  
STRAP  
PCLK Output Slew Select — Pin or Register Control  
I, LVCMOS OS_PCLK = 1, increased PCLK slew  
w/ pull-down OS_PCLK = 0, normal (default)  
OS_DATA  
OP_LOW  
14 [B3]  
STRAP  
Data Output Slew Select — Pin or Register Control  
I, LVCMOS OS_DATA = 1, increased DATA slew  
w/ pull-down OS_DATA = 0, normal (default)  
42 PASS  
STRAP  
Outputs held Low when LOCK = 1 — Pin or Register Control  
I, LVCMOS NOTE: IT IS NOT RECOMMENDED TO USE ANY OTHER STRAP OPTIONS WITH THIS  
w/ pull-down STRAP FUNCTION  
OP_LOW = 1: all outputs are held LOW during power up until released by programming  
OP_LOW release/set register HIGH  
NOTE: Before the device is powered up, the outputs are in tri-state.  
See Figure 26 and Figure 27.  
OP_LOW = 0: all outputs toggle normally as soon as LOCK goes HIGH (default).  
OSS_SEL  
17 [B2]  
18 [B1]  
STRAP  
Output Sleep State Select — Pin or Register Control  
I, LVCMOS NOTE: OSS_SEL STRAP CANNOT BE USED IF OP_LOW =1  
w/ pull-down OSS_SEL is used in conjunction with PDB to determine the state of the outputs in Power  
Down (Sleep). (See Table 8).  
RFB  
STRAP  
Pixel Clock Output Strobe Edge Select — Pin or Register Control  
I, LVCMOS RFB = 1, parallel interface data and control signals are strobed on the rising clock edge.  
w/ pull-down RFB = 0, parallel interface data and control signals are strobed on the falling clock edge.  
EQ[3:0]  
20 [G7],  
21 [G6],  
22 [G5],  
23 [G4]  
STRAP  
I, LVCMOS (See Table 5).  
w/ pull-down  
Receiver Input Equalization — Pin or Register Control  
OSC_SEL[2:0]  
SSC[3:0]  
26 [G2],  
27 [G1],  
28 [G0]  
STRAP  
Oscillator Select — Pin or Register Control  
I, LVCMOS (See Table 9 and Table 10).  
w/ pull-down  
34 [R6],  
35 [R5],  
36 [R4],  
37 R[3]  
STRAP  
Spread Spectrum Clock Generation (SSCG) Range Select — Pin or Register Control  
I, LVCMOS (See Table 6 and Table 7).  
w/ pull-down  
MAP_SEL[1:0]  
40 [R1],  
41 [R0]  
STRAP  
Bit Mapping Backward Compatibility / DS90UR241 Options — Pin or Register Control  
I, LVCMOS Normal setting to b'00. See (Table 11).  
w/ pull-down  
Control and Configuration  
PDB  
59  
I, LVCMOS Power Down Mode Input  
w/ pull-down PDB = 1, Des is enabled (normal operation).  
Refer to “Power Up Requirements and PDB Pin” in the Applications Information Section.  
PDB = 0, Des is in power-down.  
When the Des is in the power-down state, the LVCMOS output state is determined by Table  
8. Control Registers are RESET.  
ID[x]  
SCL  
SDA  
56  
3
I, Analog  
Serial Control Bus Device ID Address Select — Optional  
Resistor to Ground and 10 kpull-up to 1.8V rail. (See Table 12).  
I, LVCMOS Serial Control Bus Clock Input - Optional  
SCL requires an external pull-up resistor to VDDIO  
.
2
I/O,  
Serial Control Bus Data Input / Output - Optional  
LVCMOS SDA requires an external pull-up resistor to VDDIO  
Open Drain  
.
BISTEN  
RES  
44  
47  
I, LVCMOS BIST Enable Input — Optional  
w/ pull-down BISTEN = 1, BIST is enabled  
BISTEN = 0, BIST is disabled  
I, LVCMOS Reserved - tie LOW  
w/ pull-down  
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8
Pin Name  
Pin #  
I/O, Type Description  
NC  
1, 15, 16,  
30, 31, 45,  
46, 60  
Not Connected  
Leave pin open (float)  
FPD-Link II Serial Interface  
RIN+  
RIN-  
CMF  
49  
50  
51  
I, LVDS  
I, LVDS  
I, Analog  
True Input. The input must be AC Coupled with a 100 nF capacitor.  
Inverting Input. The input must be AC Coupled with a 100 nF capacitor.  
Common-Mode Filter  
VCM center-tap is a virtual ground which may be ac-coupled to ground to increase receiver  
common mode noise immunity. Recommended value is 4.7 μF or higher.  
CMLOUTP  
CMLOUTN  
52  
53  
O, LVDS  
O, LVDS  
Test Monitor Pin — EQ Waveform  
NC or connect to test point. Requires Serial Bus Control to enable.  
Test Monitor Pin — EQ Waveform  
NC or connect to test point. Requires Serial Bus Control to enable.  
Power and Ground  
VDDL  
29  
48  
Power  
Power  
Power  
Power  
Power  
Power  
Power  
Ground  
Logic Power, 1.8 V ±5%  
VDDIR  
Input Power, 1.8 V ±5%  
VDDR  
43, 55  
4, 58  
57  
RX High Speed Logic Power, 1.8 V ±5%  
SSCG Power, 1.8 V ±5%  
VDDSC  
VDDPR  
VDDCMLO  
VDDIO  
GND  
PLL Power, 1.8 V ±5%  
54  
RX High Speed Logic Power, 1.8 V ±5%  
13, 24, 38  
DAP  
LVCMOS I/O Power, 1.8 V ±5% OR 3.3 V ±10% (VDDIO)  
DAP is the large metal contact at the bottom side, located at the center of the LLP package.  
Connected to the ground plane (GND) with at least 9 vias.  
NOTE: 1 = HIGH, 0 = LOW  
The VDD (VDDn and VDDIO) supply ramp should be faster than 1.5 ms with a monotonic rise. If slower then 1.5 ms then a capacitor  
on the PDB pin is needed to ensure PDB arrives after all the VDD have settled to the recommended operating voltage.  
9
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ESD Rating (ISO10605), RD = 330Ω, CS = 330pF  
Air Discharge (DOUT+, DOUT−  
Contact Discharge (DOUT+  
DOUT−  
Air Discharge (RIN+, RIN−  
Contact Discharge (RIN+, RIN−  
ESD Rating (ISO10605), RD = 330Ω, CS = 150pF  
Air Discharge (DOUT+, DOUT−  
Contact Discharge (DOUT+  
DOUT−  
Air Discharge (RIN+, RIN−  
Absolute Maximum Ratings (Note 1)  
)
±15 kV  
If Military/Aerospace specified devices are required,  
please contact the National Semiconductor Sales Office/  
Distributors for availability and specifications.  
,
)
±10 kV  
±15 kV  
±10 kV  
)
Supply Voltage – VDDn (1.8V)  
Supply Voltage – VDDIO  
LVCMOS I/O Voltage  
Receiver Input Voltage  
Driver Output Voltage  
Junction Temperature  
Storage Temperature  
48L LLP Package  
−0.3V to +2.5V  
−0.3V to +4.0V  
−0.3V to +(VDDIO + 0.3V)  
−0.3V to (VDD + 0.3V)  
−0.3V to (VDD + 0.3V)  
+150°C  
)
)
±25 kV  
,
)
±10 kV  
±25 kV  
±10 kV  
−65°C to +150°C  
)
Contact Discharge (RIN+, RIN−  
)
Maximum Power Dissipation  
Capacity at 25°C  
Derate above 25°C  
215mW  
1/θJA mW / °C  
27.1 °C/W  
For soldering specifications:  
see product folder at www.national.com and  
www.national.com/ms/MS/MS-SOLDERING.pdf  
ꢀθJA (based on 9 thermal vias)  
ꢀθJC (based on 9 thermal vias)  
60L LLP Package  
4.5 °C/W  
Recommended Operating  
Conditions  
Maximum Power Dissipation  
Capacity at 25°C  
470mW  
Min  
1.71  
1.71  
Nom  
Max  
1.89  
1.89  
Units  
V
V
Derate above 25C  
1/θJA mW / °C  
Supply Voltage (VDDn  
LVCMOS Supply  
)
1.8  
ꢀθJA  
24.6 °C/W  
2.8 °C/W  
±8 kV  
±1 kV  
±250 V  
1.8  
Voltage (VDDIO  
)
ꢀθJC  
OR  
ESD Rating (HBM)  
ESD Rating (CDM)  
ESD Rating (MM)  
LVCMOS Supply  
Voltage (VDDIO  
Operating Free Air  
3.0  
3.3  
3.6  
V
)
ESD Rating (ISO10605), RD = 2kΩ, CS = 150pF or RD =  
2kΩ, CS = 330pF or RD = 330Ω, CS = 150pF  
Temperature (TA)  
PCLK Clock Frequency  
Supply Noise (Note 10)  
−40  
5
+25  
+105  
65  
50  
°C  
MHz  
mVP-P  
Air Discharge (DOUT+, DOUT−  
Contact Discharge (DOUT+  
DOUT−  
Air Discharge (RIN+, RIN−  
Contact Discharge (RIN+, RIN−  
)
±30 kV  
,
)
±10 kV  
±30 kV  
±10 kV  
)
)
Serializer DC Electrical Characteristics  
Over recommended operating supply and temperature ranges unless otherwise specified. (Note 2, Note 3, Note 4)  
Symbol  
Parameter  
Conditions  
Pin/Freq.  
Min  
Typ  
Max  
Units  
LVCMOS INPUT DC SPECIFICATIONS  
VDDIO = 3.0 to 3.6V  
VDDIO  
VDDIO  
0.8  
2.2  
V
V
V
V
R[7:0],  
G[7:0],  
B[7:0],  
HS, VS, DE,  
PCLK, PDB,  
VODSEL,  
RFB,  
VIH  
High Level Input Voltage  
Low Level Input Voltage  
0.65*  
VDDIO  
VDDIO = 1.71 to 1.89V  
VDDIO = 3.0 to 3.6V  
VDDIO = 1.71 to 1.89V  
GND  
VIL  
0.35*  
VDDIO  
GND  
VDDIO = 3.0  
to 3.6V  
−15  
−15  
±1  
±1  
+15  
+15  
μA  
μA  
CONFIG[1:0],  
IIN  
VIN = 0V or VDDIO  
Input Current  
VDDIO = 1.7 BISTEN  
to 1.89V  
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10  
Symbol  
Parameter  
Conditions  
VODSEL = 0  
Pin/Freq.  
Min  
Typ  
Max  
Units  
LVDS DRIVER DC SPECIFICATIONS  
±205  
±320  
±280  
±420  
560  
±355  
±520  
VOD  
Differential Output Voltage  
mV  
RL = 100Ω,  
VODSEL = 1  
VODSEL = 0  
VODSEL = 1  
De-emph = disabled,  
Figure 2  
mVp-p  
mVp-p  
Differential Output Voltage  
(DOUT+) – (DOUT-)  
VODp-p  
ΔVOD  
VOS  
840  
RL = 100Ω, De-emph = disabled,  
VODSEL = L  
Output Voltage Unbalance  
1
50  
mV  
DOUT+,  
DOUT-  
VODSEL = 0  
VODSEL = 1  
1.65  
V
V
Offset Voltage – Single-ended RL = 100Ω,  
At TP A & B, Figure 1  
De-emph = disabled  
1.575  
Offset Voltage Unbalance  
Single-ended  
ΔVOS  
RL = 100Ω, De-emph = disabled  
1
mV  
At TP A & B, Figure 1  
DOUT+/- = 0V,  
De-emph = disabled  
IOS  
RT  
Output Short Circuit Current  
Internal Termination Resistor  
VODSEL = 0  
−36  
mA  
DOUT+,  
DOUT-  
80  
120  
SUPPLY CURRENT  
IDDT1  
Checker Board  
Pattern,  
VDD= 1.89V All VDD pins  
VDDIO= 1.89V  
75  
3
85  
5
mA  
mA  
Serializer  
Supply Current  
(includes load current)  
RL = 100Ω, f = 65MHz  
De-emph = 3KΩ  
VODSEL = H, Figure 9  
IDDIOT1  
IDDT2  
VDDIO  
VDDIO = 3.6V  
11  
15  
mA  
Checker Board  
Pattern,  
VDD= 1.89V All VDD pins  
VDDIO= 1.89V  
65  
3
75  
5
mA  
mA  
De-emph = 6KΩ,  
VODSEL = L, Figure 9  
IDDIOT2  
VDDIO  
VDDIO = 3.6V  
11  
15  
mA  
IDDZ  
VDD= 1.89V All VDD pins  
40  
5
1000  
10  
µA  
µA  
µA  
Serializer  
Supply Current Power-down  
PDB = 0V , (All other  
LVCMOS Inputs = 0V)  
VDDIO= 1.89V  
VDDIO  
IDDIOZ  
VDDIO = 3.6V  
10  
20  
Deserializer DC Electrical Characteristics  
Over recommended operating supply and temperature ranges unless otherwise specified.  
Symbol  
Parameter  
Conditions  
Pin/Freq.  
Min  
Typ  
Max  
Units  
3.3 V I/O LVCMOS DC SPECIFICATIONS – VDDIO = 3.0 to 3.6V  
VIH  
VIL  
IIN  
VDDIO  
0.8  
High Level Input Voltage  
Low Level Input Voltage  
Input Current  
2.2  
GND  
−15  
2.8  
V
V
PDB,  
BISTEN  
VIN = 0V or VDDIO  
IOH = −0.5 mA, OS_PCLK/DATA = L R[7:0], G  
[7:0], B[7:0],  
±1  
+15  
μA  
V
VOH  
VDDIO  
High Level Output Voltage  
HS, VS, DE,  
PCLK, LOCK,  
PASS  
VOL  
IOL = +0.5 mA, OS_PCLK/DATA = L  
Low Level Output Voltage  
GND  
0.2  
V
VDDIO = 3.3V  
Output Short Circuit Current  
Output Short Circuit Current  
TRI-STATE® Output Current  
PCLK  
36  
37  
mA  
mA  
uA  
VOUT = 0V, OS_PCLK/DATA = L/H  
IOS  
VDDIO = 3.3V  
Des Outputs  
Outputs  
VOUT = 0V, OS_PCLK/DATA = L/H  
PDB = 0V, OSS_SEL = 0V,  
VOUT = H  
IOZ  
−15  
+15  
1.8 V I/O LVCMOS DC SPECIFICATIONS – VDDIO = 1.71 to 1.89V  
VIH  
VIL  
IIN  
VDDIO  
0.595  
+15  
High Level Input Voltage  
Low Level Input Voltage  
Input Current  
1.235  
GND  
−15  
V
V
PDB,  
BISTEN  
VIN = 0V or VDDIO  
±1  
μA  
11  
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Symbol  
Parameter  
Conditions  
Pin/Freq.  
Min  
Typ  
Max  
Units  
IOH = −0.5 mA, OS_PCLK/DATA = L/ R[7:0], G  
VOH  
VDDIO  
High Level Output Voltage  
1.5  
V
[7:0], B[7:0],  
H
HS, VS, DE,  
PCLK, LOCK,  
PASS  
VOL  
IOL = +0.5 mA, OS_PCLK/DATA = L/H  
Low Level Output Voltage  
GND  
0.2  
V
VDDIO = 1.8V  
VOUT = H, OS_PCLK/DATA = L/H  
18  
18  
mA  
mA  
µA  
IOS  
Output Short Circuit Current  
TRI-STATE Output Current  
PCLK  
VDDIO = 1.8V  
VOUT = H, OS_PCLK/DATA = L/H  
PDB = 0V, OSS_SEL = 0V,  
VOUT = 0V or VDDIO  
IOZ  
Outputs  
-15  
+15  
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12  
Symbol  
Parameter  
Conditions  
Pin/Freq.  
Min  
Typ  
Max  
Units  
LVDS RECEIVER DC SPECIFICATIONS  
Differential Input Threshold  
High Voltage  
VTH  
+50  
−50  
mV  
mV  
V
VCM = +1.2V (Internal VBIAS  
)
Differential Input Threshold  
Low Voltage  
VTL  
RIN+, RIN-  
RIN+, RIN-  
Common Mode Voltage,  
Internal VBIAS  
VCM  
1.2  
IIN  
VIN = 0V or VDDIO  
Input Current  
-15  
80  
+15  
120  
µA  
RT  
Internal Termination Resistor  
CMLOUTP/N DRIVER OUTPUT DC SPECIFICATIONS – EQ TEST PORT  
VOD  
Differential Output Voltage  
RL = 100Ω,  
542  
1.4  
mV  
V
CMLOUTP,  
CMLOUTN  
Offset Voltage  
Single-ended  
VOS  
RL = 100Ω  
CMLOUTP,  
CMLOUTN  
RT  
Internal Termination Resistor  
80  
120  
SUPPLY CURRENT  
IDD1  
Checker Board  
Pattern, OS_PCLK/  
DATA = H,  
EQ = 001,  
SSCG=ON  
VDD= 1.89V All VDD pins  
VDDIO=1.89V  
93  
33  
105  
45  
mA  
mA  
Deserializer  
Supply Current  
IDDIO1  
VDDIO  
(includes load current)  
VDDIO = 3.6V  
62  
75  
mA  
CMLOUTP/N =  
enabled  
CL = 4pF, Figure 9  
IDDZ  
VDD= 1.89V All VDD pins  
40  
5
2000  
100  
µA  
µA  
µA  
Deserializer Supply Current  
Power Down  
PDB = 0V, All other  
LVCMOS Inputs = 0V  
VDDIO=1.89V  
VDDIO  
IDDIOZ  
VDDIO = 3.6V  
300  
2500  
Recommended Serializer Timing for PCLK  
Over recommended operating supply and temperature ranges unless otherwise specified.  
Symbol  
tTCP  
Parameter  
Conditions  
Min  
15.38  
0.4T  
0.4T  
0.5  
Typ  
T
Max  
200  
0.6T  
0.6T  
2.4  
Units  
ns  
Transmit Input PCLK Period  
Transmit Input PCLK High Time  
Transmit Input PCLK Low Time  
PCLK Input Transition Time  
5 MHz to 65 MHz, Figure 4  
tTCIH  
0.5T  
0.5T  
ns  
tTCIL  
ns  
tCLKT  
ns  
SSCIN PCLK Input – Spread Spectrum fmod  
at PCLK = 65 MHz  
35  
kHz  
%
fdev  
±2  
13  
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Serializer Switching Characteristics  
Over recommended operating supply and temperature ranges unless otherwise specified.  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
tLHT  
Ser Output Low-to-High  
Transition Time, Figure 3  
RL = 100Ω, De-emphasis = disabled,  
VODSEL = 0  
200  
ps  
RL = 100Ω, De-emphasis = disabled,  
VODSEL = 1  
200  
200  
200  
ps  
ps  
tHLT  
Ser Output High-to-Low  
RL = 100Ω, De-emphasis = disabled,  
VODSEL = 0  
Transition Time, Figure 3  
RL = 100Ω, De-emphasis = disabled,  
VODSEL = 1  
ps  
ns  
ns  
tDIS  
tDIH  
tXZD  
Input Data - Setup Time,  
Figure 4  
RGB[7:0], HS, VS, DE to PCLK  
2
2
Input Data - Hold Time,  
Figure 4  
PCLK to RGB[7:0], HS, VS, DE  
Ser Ouput Active to OFF Delay,  
Figure 6  
8
15  
10  
ns  
ms  
ns  
UI  
(Note 11)  
tPLD  
Serializer PLL Lock Time,  
Figure 5  
(Note 11)  
RL = 100Ω  
RL = 100Ω  
1.4  
tSD  
Serializer Delay - Latency,  
Figure 7  
144*T  
0.28  
145  
(Note 11)  
tDJIT  
Ser Output Total Jitter,  
Figure 8  
RL = 100Ω, De-Emph = disabled,  
RANDOM pattern  
PCLK = 65 MHz  
RL = 100Ω, De-Emph = disabled,  
RANDOM pattern  
PCLK = 43 MHz  
0.27  
0.35  
UI  
UI  
RL = 100Ω, De-Emph = disabled,  
RANDOM pattern  
PCLK = 5 MHz  
Serializer Jitter Transfer  
Function -3 dB Bandwidth  
PCLK = 65 MHz  
PCLK = 43 MHz  
PCLK = 20 MHz  
PCLK = 5 MHz  
PCLK = 65 MHz  
PCLK = 43 MHz  
PCLK = 20 MHz  
PCLK = 5 MHz  
3
MHz  
MHz  
MHz  
kHz  
dB  
λSTXBW  
2.3  
1.3  
650  
Serializer Jitter Transfer  
Function Peaking  
0.838  
0.825  
0.826  
0.278  
δSTX  
dB  
dB  
dB  
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14  
Deserializer Switching Characteristics  
Over recommended operating supply and temperature ranges unless otherwise specified.  
Symbol  
tRCP  
Parameter  
PCLK Output Period  
PCLK Output Duty Cycle  
Conditions  
tRCP = tTCP  
Pin/Freq.  
Min  
15.38  
45  
Typ  
T
Max  
200  
55  
Units  
ns  
PCLK  
PCLK  
tRDC  
SSCG=OFF, 5–65MHz  
SSCG=ON, 5–20MHz  
SSCG=ON, 20–65MHz  
VDDIO = 1.8V,  
50  
59  
53  
%
35  
65  
%
40  
60  
%
tCLH  
LVCMOS  
Low-to-High  
Transition Time, Figure 10  
PCLK/RGB[7:0], HS,  
VS, DE  
2.1  
2.0  
ns  
ns  
CL = 4 pF  
VDDIO = 3.3V  
CL = 4 pF  
tCHL  
LVCMOS  
High-to-Low  
VDDIO = 1.8V  
PCLK/RGB[7:0], HS,  
VS, DE  
CL = 4 pF, OS_PCLK/DATA  
1.6  
1.5  
ns  
ns  
T
Transition Time, Figure 10  
= L  
VDDIO = 3.3V  
CL = 4 pF, OS_PCLK/DATA  
= H  
tROS  
tROH  
tDDLT  
Data Valid before PCLK – Set VDDIO = 1.71 to 1.89V or 3.0 RGB[7:0], HS, VS, DE  
Up Time, Figure 14  
to 3.6V  
CL = 4pF (lumped load)  
0.30  
0.40  
0.45  
0.55  
Data Valid after PCLK – Hold VDDIO = 1.71 to 1.89V or 3.0 RGB[7:0], HS, VS, DE  
Time, Figure 14  
to 3.6V  
T
CL = 4pF (lumped load)  
Deserializer Lock Time,  
Figure 13  
SSC[3:0] = 0000 (OFF),  
(Note 6)  
PCLK = 5MHz  
PCLK = 65 MHz  
PCLK = 5MHz  
PCLK = 65 MHz  
3
4
ms  
ms  
ms  
ms  
T
SSC[3:0] = 0000 (OFF),  
(Note 6)  
SSC[3:0] = ON,  
(Note 6)  
30  
SSC[3:0] = ON,  
(Note 6)  
6
tDD  
Des Delay - Latency,  
Figure 11  
SSC[3:0] = 0000 (OFF),  
(Note 6)  
139*T  
140*T  
tDPJ  
Des Period Jitter  
SSC[3:0] = OFF,  
(Note 8), (Note 11)  
PCLK = 5MHz  
975  
500  
550  
675  
375  
500  
0.9  
1700  
1000  
1250  
1150  
900  
ps  
ps  
ps  
ps  
ps  
ps  
UI  
PCLK = 10MHz  
PCLK = 65 MHz  
PCLK = 5MHz  
tDCCJ  
Des Cycle-to-Cycle Jitter  
SSC[3:0] = OFF,  
(Note 9), (Note 11)  
PCLK = 10MHz  
PCLK = 65 MHz  
for jitter freq < 2MHz  
for jitter freq > 6MHz  
1150  
tIJT  
Des Input Jitter Tolerance,  
Figure 16  
EQ = OFF,  
SSCG = OFF,  
PCLK = 65MHz  
0.5  
UI  
15  
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Symbol  
Parameter  
Conditions  
Pin/Freq.  
Min  
Typ  
Max  
Units  
BIST Mode  
tPASS  
BIST PASS Valid Time,  
BISTEN = 1, Figure 17  
1
10  
us  
SSCG Mode  
fDEV  
Spread Spectrum  
Clocking Deviation  
Frequency  
Under typical conditions  
Under typical conditions  
PCLK = 5 to 65 MHz,  
SSC[3:0] = ON  
±0.5  
8
±2  
%
fMOD  
Spread Spectrum  
Clocking Modulation  
Frequency  
PCLK = 5 to 65 MHz,  
SSC[3:0] = ON  
100  
kHz  
Recommended Timing for the Serial Control Bus  
Over 3.3V supply and temperature ranges unless otherwise specified.  
Symbol  
Parameter  
Conditions  
Min  
>0  
Typ  
Max  
100  
400  
Units  
kHz  
kHz  
us  
fSCL  
SCL Clock Frequency  
Standard Mode  
Fast Mode  
>0  
tLOW  
tHIGH  
SCL Low Period  
SCL High Period  
Standard Mode  
Fast Mode  
4.7  
1.3  
4.0  
0.6  
4.0  
us  
Standard Mode  
Fast Mode  
us  
us  
tHD;STA Hold time for a start or a  
repeated start condition,  
Figure 18  
Standard Mode  
Fast Mode  
us  
0.6  
4.7  
0.6  
us  
us  
us  
tSU:STA Set Up time for a start or a  
repeated start condition,  
Figure 18  
Standard Mode  
Fast Mode  
tHD;DAT Data Hold Time,  
Standard Mode  
Fast Mode  
0
3.45  
0.9  
us  
us  
ns  
ns  
us  
us  
us  
Figure 18  
0
tSU;DAT Data Set Up Time,  
Standard Mode  
Fast Mode  
250  
100  
4.0  
0.6  
4.7  
Figure 18  
tSU;STO Set Up Time for STOP  
Standard Mode  
Fast Mode  
Condition, Figure 18  
tBUF  
Bus Free Time  
Standard Mode  
Fast Mode  
Between STOP and START,  
Figure 18  
1.3  
us  
tr  
tf  
SCL & SDA Rise Time,  
Figure 18  
Standard Mode  
Fast Mode  
1000  
300  
300  
300  
ns  
ns  
ns  
ns  
SCL & SDA Fall Time,  
Figure 18  
Standard Mode  
Fast mode  
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16  
DC and AC Serial Control Bus Characteristics  
Over 3.3V supply and temperature ranges unless otherwise specified.  
Symbol  
VIH  
Parameter  
Input High Level  
Conditions  
Min  
2.2  
Typ  
Max  
VDDIO  
0.8  
Units  
V
SDA and SCL  
SDA and SCL  
VIL  
Input Low Level Voltage  
Input Hysteresis  
GND  
V
VHY  
>50  
mV  
VOL  
Output Low Level Voltage,  
(Note 11)  
SDA, IOL = 1.25mA  
0
0.4  
V
Iin  
tR  
tF  
SDA or SCL, Vin = VDDIO or GND  
-15  
+15  
µA  
ns  
ns  
ns  
ns  
ns  
pF  
SDA RiseTime – READ  
SDA Fall Time – READ  
40  
25  
SDA, RPU = X, Cb 400pF  
tSU;DAT Set Up Time — READ  
tHD;DAT Hold Up Time — READ  
520  
55  
tSP  
Cin  
Input Filter  
50  
Input Capacitance  
SDA or SCL  
<5  
Note 1: “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of device reliability  
and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or other conditions beyond those indicated in  
the Recommended Operating Conditions is not implied. The Recommended Operating Conditions indicate conditions at which the device is functional and the  
device should not be operated beyond such conditions.  
Note 2: The Electrical Characteristics tables list guaranteed specifications under the listed Recommended Operating Conditions except as otherwise modified  
or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and are not guaranteed.  
Note 3: Typical values represent most likely parametric norms at VDD = 3.3V, Ta = +25 degC, and at the Recommended Operation Conditions at the time of  
product characterization and are not guaranteed.  
Note 4: Current into device pins is defined as positive. Current out of a device pin is defined as negative. Voltages are referenced to ground except VOD, ΔVOD,  
VTH and VTL which are differential voltages.  
Note 5: When the Serializer output is at TRI-STATE the Deserializer will lose PLL lock. Resynchronization / Relock must occur before data transfer require tPLD  
Note 6: tPLD and tDDLT is the time required by the serializer and deserializer to obtain lock when exiting power-down state with an active PCLK.  
Note 7: UI – Unit Interval is equivalent to one serialized data bit width (1UI = 1 / 28*PCLK). The UI scales with PCLK frequency.  
Note 8: tDPJ is the maximum amount the period is allowed to deviate over many samples.  
Note 9: tDCCJ is the maximum amount of jitter between adjacent clock cycles.  
Note 10: Supply noise testing was done with minimum capacitors on the PCB. A sinusoidal signal is AC coupled to the VDDn (1.8V) supply with amplitude = 100  
mVp-p measured at the device VDDn pins. Bit error rate testing of input to the Ser and output of the Des with 10 meter cable shows no error when the noise  
frequency on the Ser is less than 750 kHz. The Des on the other hand shows no error when the noise frequency is less than 400 kHz.  
Note 11: Specification is guaranteed by characterization and is not tested in production.  
Note 12: Specification is guaranteed by design and is not tested in production.  
17  
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AC Timing Diagrams and Test Circuits  
30102046  
FIGURE 1. Serializer Test Circuit  
30102030  
FIGURE 2. Serializer Output Waveforms  
30102047  
FIGURE 3. Serializer Output Transition Times  
30102031  
FIGURE 4. Serializer Input PCLK Waveform and Set and Hold Times  
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18  
30102048  
FIGURE 5. Serializer Lock Time  
30102049  
FIGURE 6. Serializer Disable Time  
30102010  
FIGURE 7. Serializer Latency Delay  
19  
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30102050  
FIGURE 8. Serializer Output Jitter  
30102032  
FIGURE 9. Checkerboard Data Pattern  
30102005  
FIGURE 10. Deserializer LVCMOS Transition Times  
30102011  
FIGURE 11. Deserializer Delay – Latency  
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20  
30102013  
FIGURE 12. Deserializer Disable Time (OSS_SEL = 0)  
30102014  
FIGURE 13. Deserializer PLL Lock Times and PDB TRI-STATE Delay  
30102035  
FIGURE 14. Deserializer Output Data Valid (Setup and Hold) Times with SSCG = Off  
21  
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30102034  
FIGURE 15. Deserializer Output Data Valid (Setup and Hold) Times with SSCG = On  
30102016  
FIGURE 16. Receiver Input Jitter Tolerance  
30102052  
FIGURE 17. BIST PASS Waveform  
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22  
30102036  
FIGURE 18. Serial Control Bus Timing Diagram  
23  
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Signal filter feature is enabled or disabled in Normal mode.  
This feature may be controlled by pin or by Register.  
Functional Description  
The DS90UR905Q / DS90UR906Q chipset transmits and re-  
ceives 27-bits of data (24-high speed color bits and 3 low  
speed video control signals) over a single serial FPD-Link II  
pair operating at 140Mbps to 1.82Gbps. The serial stream al-  
so contains an embedded clock, video control signals and the  
DC-balance information which enhances signal quality and  
supports AC coupling. The pair is intended for use with each  
other but is backward compatible with previous generations  
of FPD-Link II as well.  
TABLE 1. DS90UR905Q Ser Modes  
CON CON Mode  
FIG1 FIG0  
Des Device  
L
L
H
L
Normal Mode, Control  
Signal Filter disabled  
DS90UR906Q  
DS90UR906Q  
L
Normal Mode, Control  
Signal Filter enabled  
The Des can attain lock to a data stream without the use of a  
separate reference clock source, which greatly simplifies sys-  
tem complexity and overall cost. The Des also synchronizes  
to the Ser regardless of the data pattern, delivering true au-  
tomatic “plug and lock” performance. It can lock to the incom-  
ing serial stream without the need of special training patterns  
or sync characters. The Des recovers the clock and data by  
extracting the embedded clock information, validating and  
then deserializing the incoming data stream providing a par-  
allel LVCMOS video bus to the display.  
H
H
Backwards Compatible DS90UR124,  
GEN2 DS99R124  
H
Backwards Compatible DS90C124  
GEN1  
TABLE 2. DS90UR906Q Des Modes  
CON CON Mode  
FIG1 FIG0  
Ser Device  
L
L
H
L
Normal Mode, Control  
Signal Filter disabled  
DS90UR905Q  
DS90UR905Q  
The DS90UR905Q / DS90UR906Q chipset can operate in 24-  
bit color depth (with VS,HS,DE encoded in the DCA bit) or in  
18-bit color depth (with VS, HS, DE encoded in DCA or  
mapped into the high-speed data bits). In 18–bit color appli-  
cations, the three video signals maybe sent encoded via the  
DCA bit (restrictions apply) or sent as “data bits” along with  
three additional general purpose signals.  
L
Normal Mode, Control  
Signal Filter enabled  
H
H
Backwards Compatible DS90UR241  
GEN2  
H
Backwards Compatible DS90C241  
GEN1  
Block Diagrams for the chipset are shown at the beginning of  
this datasheet.  
VIDEO CONTROL SIGNAL FILTER — Ser and Des  
Data Transfer  
When operating the devices in Normal Mode, the Video Con-  
trol Signals (DE, HS, VS) have the following restrictions:  
The DS90UR905Q / DS90UR906Q chipset will transmit and  
receive a pixel of data in the following format: C1 and C0 rep-  
resent the embedded clock in the serial stream. C1 is always  
HIGH and C0 is always LOW. b[23:0] contain the scrambled  
RGB data. DCB is the DC-Balanced control bit. DCB is used  
to minimize the short and long-term DC bias on the signal  
lines. This bit determines if the data is unmodified or inverted.  
DCA is used to validate data integrity in the embedded data  
stream and can also contain encoded control (VS,HS,DE).  
Both DCA and DCB coding schemes are generated by the  
Ser and decoded by the Des automatically. Figure 19 illus-  
trates* the serial stream per PCLK cycle. *Note: The figure  
only illustrates the bits but does not actually represent the bit  
location as the bits are scrambled and balanced continuously.  
Normal Mode with Control Signal Filter Enabled:  
DE and HS — Only 2 transitions per 130 clock cycles are  
transmitted, the transition pulse must be 3 PCLK or longer.  
Normal Mode with Control Signal Filter Disabled:  
DE and HS — Only 2 transitions per 130 clock cycles are  
transmitted, no restriction on minimum transition pulse.  
VS — Only 1 transition per 130 clock cycles are  
transmitted, minimum pulse width is 130 clock cycles.  
Video Control Signals are defined as low frequency signals  
with limited transitions. Glitches of a control signal can cause  
a visual display error. This feature allows for the chipset to  
validate and filter out any high frequency noise on the control  
signals. See Figure 20.  
30102037  
FIGURE 19. FPD-Link II Serial Stream (905/906)  
Ser & Des OPERATING MODES AND BACKWARD  
COMPATIBILITY (CONFIG[1:0])  
The DS90UR905Q / DS90UR906Q chipset is also backward  
compatible with previous generations of FPD-Link II. Config-  
uration modes are provided for backwards compatibility with  
the DS90C241 / DS90C124 FPD-Link II Generation 1, and  
also the DS90UR241 / DS90UR124 FPD-Link II Generation  
2 chipset by setting the respective mode with the CONFIG  
[1:0] pins on the Ser or Des as shown in Table 1 and Table  
2. The selection also determine whether the Video Control  
30102042  
FIGURE 20. Video Control Signal Filter Waveform  
www.national.com  
24  
SERIALIZER FUNCTIONAL DESCRIPTION  
TABLE 4. De-Emphasis Resistor Value  
The Ser converts a wide parallel input bus to a single serial  
output data stream, and also acts as a signal generator for  
the chipset Built In Self Test (BIST) mode. The device can be  
configured via external pins or through the optional serial  
control bus. The Ser features enhance signal quality on the  
link by supporting: a selectable VOD level, a selectable de-  
emphasis signal conditioning and also the FPD-Link II data  
coding that provides randomization, scrambling, and DC Bal-  
anacing of the video data. The Ser includes multiple features  
to reduce EMI associated with display data transmission. This  
includes the randomization and scrambling of the data and  
also the system spread spectrum PCLK support. The Ser  
features power saving features with a sleep mode, auto stop  
clock feature, and optional LVCMOS (1.8 V) parallel bus com-  
patibility.  
De-Emphasis Setting  
Disabled  
- 12 dB  
Resistor Value (kΩ)  
Open  
0.6  
1.0  
- 9 dB  
2.0  
- 6 dB  
5.0  
- 3 dB  
See also the Functional Description of the chipset's serial  
control bus and BIST modes.  
EMI Reduction Features  
Data Randomization & Scrambling  
Text to come.  
Ser — Spread Spectrum Compatibility  
The Ser PCLK is capable of tracking spread spectrum clock-  
ing (SSC) from a host source. The PCLK will accept spread  
spectrum tracking up to 35kHz modulation and ±0.5, ±1 or  
±2% deviations (center spread). The maximum conditions for  
the PCLK input are: a modulation frequency of 35kHz and  
amplitude deviations of ±2% (4% total).  
30102060  
FIGURE 21. De-Emph vs. R value  
Power Saving Features  
Ser — Power Down Feature (PDB)  
Signal Quality Enhancers  
The Ser has a PDB input pin to ENABLE or POWER DOWN  
the device. This pin is controlled by the host and is used to  
save power, disabling the link when the display is not needed.  
In the POWER DOWN mode, the high-speed driver outputs  
are both pulled to VDD and present a 0V VOD state. Note –  
in POWER DOWN, the optional Serial Bus Control Registers  
are RESET.  
Ser — VOD Select (VODSEL)  
The Ser differential output voltage may be increased by set-  
ting the VODSEL pin High. When VODSEL is Low, the VOD  
is at the standard (default) level. When VODSEL is High, the  
DC VOD is increased in level. The increased VOD is useful  
in extremely high noise environments and also on extra long  
cable length applications. When using de-emphasis it is rec-  
ommended to set VODSEL = H to avoid excessive signal  
attenuation especially with the larger de-emphasis settings.  
This feature may be controlled by the external pin or by reg-  
ister.  
Ser — Stop Clock Feature  
The Ser will enter a low power SLEEP state when the PCLK  
is stopped. A STOP condition is detected when the input clock  
frequency is less than 3 MHz. The clock should be held at a  
static Low or high state. When the PCLK starts again, the Ser  
will then lock to the valid input PCLK and then transmits the  
RGB data to the Des. Note – in STOP CLOCK SLEEP, the  
optional Serial Bus Control Registers values are RE-  
TAINED.  
TABLE 3. Differential Output Voltage  
Input  
Effect  
VOD  
mV  
VOD  
mVp-p  
VODSEL  
1.8V or 3.3V VDDIO Operation  
H
L
±420  
±280  
840  
560  
The Ser parallel bus and Serial Bus Interface can operate with  
1.8 V or 3.3 V levels (VDDIO) for host compatibility. The 1.8 V  
levels will offer lower noise (EMI) and also a system power  
savings.  
Ser — De-Emphasis (De-Emph)  
The De-Emph pin controls the amount of de-emphasis be-  
ginning one full bit time after a logic transition that the Ser  
drives. This is useful to counteract loading effects of long or  
lossy cables. This pin should be left open for standard switch-  
ing currents (no de-emphasis) or if controlled by register. De-  
emphasis is selected by connecting a resistor on this pin to  
ground, with R value between 0.5 kto 1 M, or by register  
setting. When using De-Emphasis it is recommended to set  
VODSEL = H.  
Ser — Pixel Clock Edge Select (RFB)  
The RFB pin determines the edge that the data is latched on.  
If RFB is High, input data is latched on the Rising edge of the  
PCLK. If RFB is Low, input data is latched on the Falling edge  
of the PCLK. Ser and Des maybe set differently. This feature  
may be controlled by the external pin or by register.  
Optional Serial Bus Control  
Please see the following section on the optional Serial Bus  
Control Interface.  
25  
www.national.com  
Optional BIST Mode  
INPUTS  
EQ2  
Effect  
Please see the following section on the chipset BIST mode  
for details.  
EQ3  
H
EQ1  
H
EQ0  
H
L
H
H
X
~9 dB  
~10.5 dB  
~12 dB  
OFF*  
DESERIALIZER FUNCTIONAL DESCRIPTION  
H
L
H
The Des converts a single input serial data stream to a wide  
parallel output bus, and also provides a signal check for the  
chipset Built In Self Test (BIST) mode. The device can be  
configured via external pins and strap pins or through the op-  
tional serial control bus. The Des features enhance signal  
quality on the link by supporting: an equalizer input and also  
the FPD-Link II data coding that provides randomization,  
scrambling, and DC balanacing of the data. The Des includes  
multiple features to reduce EMI associated with display data  
transmission. This includes the randomization and scram-  
bling of the data and also the output spread spectrum clock  
generation (SSCG) support. The Des features power saving  
features with a power down mode, and optional LVCMOS (1.8  
V) interface compatibility.  
H
H
H
X
X
L
* Default Setting is EQ = Off  
EMI Reduction Features  
Des — Output Slew (OS_PCLK/DATA)  
The parallel bus outputs (RGB[7:0], VS, HS, DE and PCLK)  
of the Des feature a selectable output slew. The DATA ((RGB  
[7:0], VS, HS, DE) are controlled by strap pin or register bit  
OS_DATA. The PCLK is controlled by strap pin or register bit  
OS_PCLK. When the OS_PCLK/DATA = HIGH, the maxi-  
mum slew rate is selected. When the OS_PCLK/DATA =  
LOW, the minimum slew rate is selected. Use the higher slew  
rate setting when driving longer traces or a heavier capacitive  
load.  
Signal Quality Enhancers  
Des — Input Equalizer Gain (EQ)  
Des — Common Mode Filter Pin (CMF) — Optional  
The Des can enable receiver input equalization of the serial  
stream to increase the eye opening to the Des input. Note this  
function cannot be seen at the RxIN+/- input but can be ob-  
served at the serial test port (CMLOUTP/N) enabled via the  
Serial Bus control registers. The equalization feature may be  
controlled by the external pin or by register.  
The Des provides access to the center tap of the internal ter-  
mination. A capacitor may be placed on this pin for additional  
common-mode filtering of the differential pair. This can be  
useful in high noise environments for additional noise rejec-  
tion capability. A 0.1µF capacitor may be connected to this  
pin to Ground.  
TABLE 5. Receiver Equalization Configuration Table  
Des — SSCG Generation — Optional  
INPUTS  
Effect  
The Des provides an internally generated spread spectrum  
clock (SSCG) to modulate its outputs. Both clock and data  
outputs are modulated. This will aid to lower system EMI.  
Output SSCG deviations to ±2.0% (4% total) at up to 35kHz  
modulations nominally are available. See Table 6. This fea-  
ture may be controlled by external STRAP pins or by register.  
EQ3  
L
EQ2  
L
EQ1  
L
EQ0  
H
~1.5 dB  
~3 dB  
L
L
H
H
L
H
L
H
~4.5 dB  
~6 dB  
L
H
H
H
H
L
L
H
~7.5 dB  
TABLE 6. SSCG Configuration (LF_MODE = L) — Des Output  
SSC[3:0] Inputs  
Result  
LF_MODE = L (20 - 65 MHz)  
SSC3  
SSC2  
L
SSC1  
L
SSC0  
L
fdev (%)  
Off  
fmod (kHz)  
L
L
Off  
L
L
H
L
±0.5  
±1.0  
±1.5  
±2.0  
±0.5  
±1.0  
±1.5  
±2.0  
±0.5  
±1.0  
±1.5  
±2.0  
±0.5  
±1.0  
±1.5  
L
L
H
H
L
PCLK/2168  
PCLK/1300  
L
L
H
L
L
H
H
H
H
L
L
L
H
L
L
H
H
L
L
H
L
H
H
H
H
H
H
H
H
L
L
H
L
PCLK/868  
PCLK/650  
L
H
H
L
L
H
L
H
H
H
H
L
H
L
H
H
H
www.national.com  
26  
TABLE 7. SSCG Configuration (LF_MODE = H) — Des Output  
SSC[3:0] Inputs  
Result  
LH_MODE = H (5 - 20 MHz)  
SSC3  
L
SSC2  
L
SSC1  
L
SSC0  
L
fdev (%)  
Off  
fmod (kHz)  
Off  
L
L
L
H
L
±0.5  
±1.0  
±1.5  
±2.0  
±0.5  
±1.0  
±1.5  
±2.0  
±0.5  
±1.0  
±1.5  
±2.0  
±0.5  
±1.0  
±1.5  
L
L
H
H
L
PCLK/620  
PCLK/370  
L
L
H
L
L
H
H
H
H
L
L
L
H
L
L
H
H
L
L
H
L
H
H
H
H
H
H
H
H
L
L
H
L
PCLK/258  
PCLK/192  
L
H
H
L
L
H
L
H
H
H
H
L
H
L
H
H
H
Note – in POWER DOWN, the optional Serial Bus Control  
Registers are RESET.  
Des — Stop Stream SLEEP Feature  
The Des will enter a low power SLEEP state when the input  
serial stream is stopped. A STOP condition is detected when  
the embedded clock bits are not present. When the serial  
stream starts again, the Des will then lock to the incoming  
signal and recover the data. Note – in STOP STREAM  
SLEEP, the optional Serial Bus Control Registers values are  
RETAINED.  
Des — CLOCK-DATA RECOVERY STATUS FLAG (LOCK)  
and OUTPUT STATE SELECT (OSS_SEL)  
30102033  
When PDB is driven HIGH, the CDR PLL begins locking to  
the serial input and LOCK goes from TRI-STATE to LOW  
(depending on the value of the OSS_SEL setting). After the  
DS90UR906Q completes its lock sequence to the input serial  
data, the LOCK output is driven HIGH, indicating valid data  
and clock recovered from the serial input is available on the  
parallel bus and PCLK outputs. The PCLK output is held at  
its current state at the change from OSC_CLK (if this is en-  
abled via OSC_SEL) to the recovered clock (or vice versa).  
FIGURE 22. SSCG Waveform  
1.8V or 3.3V VDDIO Operation  
The Des parallel bus and Serial Bus Interface can operate  
with 1.8 V or 3.3 V levels (VDDIO) for target (Display) compat-  
ibility. The 1.8 V levels will offer a lower noise (EMI) and also  
a system power savings.  
Power Saving Features  
If there is a loss of clock from the input serial stream, LOCK  
is driven Low and the state of the RGB/VS/HS/DE outputs are  
based on the OSS_SEL setting (STRAP PIN configuration or  
register).  
Des — PowerDown Feature (PDB)  
The Des has a PDB input pin to ENABLE or POWER DOWN  
the device. This pin can be controlled by the system to save  
power, disabling the Des when the display is not needed. An  
auto detect mode is also available. In this mode, the PDB pin  
is tied High and the Des will enter POWER DOWN when the  
serial stream stops. When the serial stream starts up again,  
the Des will lock to the input stream and assert the LOCK pin  
and output valid data. In POWER DOWN mode, the Data and  
PCLK output states are determined by the OSS_SEL status.  
Des — Oscillator Output — Optional  
The Des provides an optional PCLK output when the input  
clock (serial stream) has been lost. This is based on an inter-  
nal oscillator. The frequency of the oscillator may be selected.  
This feature may be controlled by the external pin or by reg-  
ister. See Table 9 and Table 10.  
27  
www.national.com  
TABLE 8. OSS_SEL and PDB Configuration — Des Outputs  
OUTPUTS  
INPUTS  
PDB  
Serial  
Input  
OSS_SEL  
PCLK  
RGB/HS/VS/DE  
LOCK  
PASS  
X
L
H
H
H
X
L
Z
L
Z
L
Z
L
Z
H
H
H
Static  
Static  
Active  
H
X
Z
Z*  
L
Active  
Active  
H
*NOTE — If pin is strapped HIGH, output will be pulled up  
TABLE 9. OSC (Oscillator) Mode — Des Output  
OUTPUTS  
INPUTS  
Embedded PCLK  
NOTE *  
PCLK  
RGB/HS/VS/DE  
LOCK  
PASS  
OSC  
L
L
H
Output  
Present  
Toggling  
Active  
H
H
* NOTE — Absent and OSC_SEL 000  
30102040  
FIGURE 23. Des Outputs with Output State Select Low (OSS_SEL = L)  
www.national.com  
28  
30102053  
FIGURE 24. Des Outputs with Output State Select High (OSS_SEL = H)  
TABLE 10. OSC_SEL (Oscillator) Configuration  
OSC_SEL[2:0] INPUTS  
PCLK Oscillator Output  
OSC_SEL2  
OSC_SEL1  
OSC_SEL0  
L
L
L
L
L
H
L
Off – Feature Disabled – Default  
50 MHz ±40%  
L
H
H
L
25 MHz ±40%  
L
H
L
16.7 MHz ±40%  
12.5 MHz ±40%  
10 MHz ±40%  
H
H
H
H
L
H
L
H
H
8.3 MHz ±40%  
H
6.3 MHz ±40%  
30102054  
FIGURE 25. Des Outputs with Output State High and PCLK Output Oscillator Option Enabled  
29  
www.national.com  
Des — OP_LOW — Optional  
2) OSS_SEL function is not available when O/P_LOW is tied  
H.  
The OP_ LOW feature is used to hold the LVCMOS outputs  
(except the LOCK output) at a LOW state. The user must tog-  
gle the OP_LOW Set/Reset register bit to release the outputs  
to the normal toggling state. Note that the release of the out-  
puts can only occur when LOCK is HIGH. When the OP_LOW  
feature is enabled, anytime LOCK = LOW, the LVCMOS out-  
puts will toggle to a LOW state again. The OP_ LOW strap  
pin feature is assigned to output PASS pin 42.  
Outputs RGB[7:0], HSYNC, VSYNC, DE, and PCLK are in  
TRI-STATE before PDB toggles HIGH because the OP_LOW  
strap value has not been recognized until the DS90UR906  
powers up. Figure 26 shows the user controlled release of  
OP_LOW and automatic reset of OP_LOW set on the falling  
edge of LOCK. Figure 27 shows the user controlled release  
of OP_LOW and manual reset of OP_LOW set. Note manual  
reset of OP_LOW can only occur when LOCK is H.  
Restrictions on other straps:  
1) Other straps should not be used in order to keep RGB[7:0],  
HS, VS, DE, and PCLK at a true LOW state. Other features  
should be selected thru I2C.  
30102065  
FIGURE 26. OP_LOW Auto Set  
www.national.com  
30  
30102066  
FIGURE 27. OP_LOW Manual Set/Reset  
Des — Pixel Clock Edge Select (RFB)  
Des — Strap Input Pins  
The RFB pin determines the edge that the data is strobed on.  
If RFB is High, output data is strobed on the Rising edge of  
the PCLK. If RFB is Low, data is strobed on the Falling edge  
of the PCLK. This allows for inter-operability with downstream  
devices. The Des output does not need to use the same edge  
as the Ser input. This feature may be controlled by the exter-  
nal pin or by register.  
Configuration of the device maybe done via configuration in-  
put pins and the STRAP input pins, or via the Serial Control  
Bus. The STRAP input pins share select parallel bus output  
pins. They are used to load in configuration values during the  
initial power up sequence of the device. Only a pull-up on the  
pin is required when a HIGH is desired. By default the pad  
has an internal pull down, and will bias Low by itself. The rec-  
ommended value of the pull up is 10 kΩ to VDDIO; open (NC)  
for Low, no pull-down is required (internal pull-down). If using  
the Serial Control Bus, no pull ups are required.  
Des — Control Signal Filter — Optional  
The Des provides an optional Control Signal (VS, HS, DE)  
filter that monitors the three video control signals and elimi-  
nates any pulses that are 1 or 2 PCLKs wide. Control signals  
must be 3 pixel clocks wide (in its HIGH or LOW state, re-  
gardless of which state is active). This is set by the CONFIG  
[1:0] or by the Control Register. This feature may be controlled  
by the external pin or by Register.  
Optional Serial Bus Control  
Please see the following section on the optional Serial Bus  
Control Interface.  
Optional BIST Mode  
Please see the following section on the chipset BIST mode  
for details.  
Des — Low Frequency Optimization (LF_Mode)  
Text to come. This feature may be controlled by the external  
pin or by Register.  
Des — Map Select  
Text to come. This feature may be controlled by the external  
pin or by Register.  
TABLE 11. Map Select Configuration  
INPUTS  
Effect  
MAPSEL1  
MAPSEL0  
L
L
Bit 4, Bit 5 on LSB  
DEFAULT  
L
H
LSB 0 or 1  
LSB 0  
H
H or L  
31  
www.national.com  
Figure 29 shows the waveform diagram of a typical BIST test  
for two cases. Case 1 is error free, and Case 2 shows one  
with multiple errors. In most cases it is difficult to generate  
errors due to the robustness of the link (differential data trans-  
mission etc.), thus they may be introduced by greatly extend-  
ing the cable length, faulting the interconnect, reducing signal  
condition enhancements (De-Emphasis, VODSEL, or Rx  
Equalization).  
Built In Self Test (BIST)  
An optional At-Speed Built In Self Test (BIST) feature sup-  
ports the testing of the high-speed serial link. This is useful in  
the prototype stage, equipment production, in-system test  
and also for system diagnostics. In the BIST mode only a input  
clock is required along with control to the Ser and Des BIS-  
TEN input pins. The Ser outputs a test pattern (PRBS7) and  
drives the link at speed. The Des detects the PRBS7 pattern  
and monitors it for errors. A PASS output pin toggles to flag  
any payloads that are received with 1 to 24 errors. Upon com-  
pletion of the test, the result of the test is held on the PASS  
output until reset (new BIST test or Power Down). A high on  
PASS indicates NO ERRORS were detected. A Low on PASS  
indicates one or more errors were detected. The duration of  
the test is controlled by the pulse width applied to the Des  
BISTEN pin. During the BIST duration the deserializer data  
outputs toggle with a checkerboard pattern.  
Inter-operability is supported between this FPD-Link II device  
and all FPD-Link II generations (Gen 1/2/3) — see respective  
datasheets for details on entering BIST mode and control.  
Sample BIST Sequence  
See Figure 28 for the BIST mode flow diagram.  
Step 1: Place the DS90UR905Q Ser in BIST Mode by setting  
Ser BISTEN = H. For the DS90UR905Q Ser or DS99R421  
FPD-Link II Ser BIST Mode is enabled via the BISTEN pin.  
For the DS90C241 Ser or DS90UR241 Ser, BIST mode is  
enetered by setting all the input data of the device to Low  
state. A PCLK is required for all the Ser options. When the  
Des detects the BIST mode pattern and command (DCA and  
DCB code) the RGB and control signal outputs are shut off.  
30102043  
FIGURE 28. BIST Mode Flow Diagram  
BER Calculations  
It is possible to calculate the approximate Bit Error Rate  
(BER). The following is required:  
Step 2: Place the DS90UR906Q Des in BIST mode by setting  
the BISTEN = H. The Des is now in the BIST mode and checks  
the incoming serial payloads for errors. If an error in the pay-  
load (1 to 24) is detected, the PASS pin will switch low for one  
half of the clock period. During the BIST test, the PASS output  
can be monitored and counted to determine the payload error  
rate.  
Pixel Clock Frequency (MHz)  
BIST Duration (seconds)  
BIST test Result (PASS)  
The BER is less than or equal to one over the product of 24  
times the PCLK rate times the test duration. If we assume a  
65MHz PCLK, a 10 minute (600 second) test, and a PASS,  
the BERT is 1.07 X 10E-12  
The BIST mode runs a check on the data payload bits. The  
LOCK pin also provides a link status. It the recovery of the C0  
and C1 bits does not reconstruct the expected clock signal,  
the LOCK pin will switch Low. The combination of the LOCK  
and At-Speed BIST PASS pin provides a powerful tool for  
system evaluation and performance monitoring.  
Step 3: To Stop the BIST mode, the Des BISTEN pin is set  
Low. The Des stops checking the data and the final test result  
is held on the PASS pin. If the test ran error free, the PASS  
output will be High. If there was one or more errors detected,  
the PASS output will be Low. The PASS output state is held  
until a new BIST is run, the device is RESET, or Powered  
Down. The BIST duration is user controlled by the duration of  
the BISTEN signal.  
Step 4: To return the link to normal operation, the Ser BISTEN  
input is set Low. The Link returns to normal operation.  
www.national.com  
32  
30102064  
FIGURE 29. BIST Waveforms  
33  
www.national.com  
To communicate with a remote device, the host controller  
(master) sends the slave address and listens for a response  
from the slave. This response is referred to as an acknowl-  
edge bit (ACK). If a slave on the bus is addressed correctly,  
it Acknowledges (ACKs) the master by driving the SDA bus  
low. If the address doesn't match a device's slave address, it  
Not-acknowledges (NACKs) the master by letting SDA be  
pulled High. ACKs also occur on the bus when data is being  
transmitted. When the master is writing data, the slave ACKs  
after every data byte is successfully received. When the mas-  
ter is reading data, the master ACKs after every data byte is  
received to let the slave know it wants to receive another data  
byte. When the master wants to stop reading, it NACKs after  
the last data byte and creates a stop condition on the bus. All  
communication on the bus begins with either a Start condition  
or a Repeated Start condition. All communication on the bus  
ends with a Stop condition. A READ is shown in Figure 32  
and a WRITE is shown in Figure 33.  
Optional Serial Bus Control  
The Ser and Des may also be configured by the use of a serial  
control bus that is I2C protocol compatible. By default, the I2C  
reg_0x00'h is set to 00'h and all configuration is set by control/  
strap pins. A write of 01'h to reg_0x00'h will enable/allow con-  
figuration by registers; this will override the control/strap pins.  
Multiple devices may share the serial control bus since mul-  
tiple addresses are supported. See Figure 30.  
The serial bus is comprised of three pins. The SCL is a Serial  
Bus Clock Input. The SDA is the Serial Bus Data Input / Out-  
put signal. Both SCL and SDA signals require an external pull  
up resistor to VDDIO. For most applications a 4.7 k pull up re-  
sistor to VDDIO may be used. The resistor value may be  
adjusted for capacitive loading and data rate requirements.  
The signals are either pulled High, or driven Low.  
Note: During initial power-up, a delay of 10ms will be required  
before the I2C will respond.  
If the Serial Bus is not required, the three pins may be left  
open (NC).  
TABLE 12. ID[x] Resistor Value – DS90UR905Q Ser  
Resistor  
RID* kΩ  
(5% tol)  
Address  
7'b  
Address  
8'b  
0 appended  
(WRITE)  
0.47  
2.7  
7b' 110 1001 (h'69)  
7b' 110 1010 (h'6A)  
7b' 110 1011 (h'6B)  
7b' 110 1110 (h'6E)  
8b' 1101 0010 (h'D2)  
8b' 1101 0100 (h'D4)  
8b' 1101 0110 (h'D6)  
8b' 1101 1100 (h'DC)  
30102041  
FIGURE 30. Serial Control Bus Connection  
8.2  
Open  
The third pin is the ID[X] pin. This pin sets one of four possible  
device addresses. Two different connections are possible.  
The pin may be pulled to VDD (1.8V, NOT VDDIO)) with a 10  
kresistor; or a 10 kpull up resistor (to VDD 1.8V, NOT  
TABLE 13. ID[x] Resistor Value – DS90UR906Q Des  
Resistor  
RID* kΩ  
(5% tol)  
Address  
7'b  
Address  
8'b  
0 appended  
(WRITE)  
V
DDIO)) and a pull down resistor of the recommended value  
to set other three possible addresses may be used. See Table  
12 for the Ser and Table 13 for the Des. Do not tie ID[x] directly  
to VSS.  
0.47  
2.7  
7b' 111 0001 (h'71)  
7b' 111 0010 (h'72)  
7b' 111 0011 (h'73)  
7b' 111 0110 (h'76)  
8b' 1110 0010 (h'E2)  
8b' 1110 0100 (h'E4)  
8b' 1110 0110 (h'E6)  
8b' 1110 1100 (h'EC)  
The Serial Bus protocol is controlled by START, START-Re-  
peated, and STOP phases. A START occurs when SCL  
transitions Low while SDA is High. A STOP occurs when SDA  
transition High while SCL is also HIGH. See Figure 31  
8.2  
Open  
*Note: RID 0 ohm, do not connect directly to VSS (GND),  
this is not a valid address.  
30102051  
FIGURE 31. START and STOP Conditions  
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34  
30102038  
FIGURE 32. Serial Control Bus — READ  
30102039  
FIGURE 33. Serial Control Bus — WRITE  
TABLE 14. SERIALIZER — Serial Bus Control Registers  
ADD ADD Register Name Bit(s) R/W Defa Function  
Description  
(dec) (hex)  
ult  
(bin)  
0
0
Ser Config 1  
7
6
5
R/W  
R/W  
R/W  
0
0
0
Reserved  
Reserved  
VODSEL  
Reserved  
Reserved  
0: Low  
1: High  
4
R/W  
R/W  
0
RFB  
0: Data latched on Falling edge of PCLK  
1: Data latched on Rising edge of PCLK  
3:2  
00 CONFIG  
00: Control Signal Filter Disabled  
01: Control Signal Filter Enabled  
10: DS90UR124, DS99R124 Mode  
11: DS90C124 Mode  
1
R/W  
0
SLEEP  
Note – not the same function as PowerDown (PDB)  
0: normal mode  
1: Sleep Mode – Register settings retained.  
0
7
R/W  
R/W  
0
0
REG  
0: Configurations set from control pins  
1: Configuration set from registers (except I2C_ID)  
1
1
Device ID  
REG ID  
0: Address from ID[x] Pin  
1: Address from Register  
6:0  
R/W 1101 ID[X]  
000  
Serial Bus Device ID, Four IDs are:  
7b '1101 001 (h'69)  
7b '1101 010 (h'6A)  
7b '1101 011 (h'6B)  
7b '1101 110 (h'6E)  
All other addresses are Reserved.  
2
2
De-Emphasis  
Control  
7:5  
R/W 000 De-E Setting  
000: set by external Resistor  
001: -1 dB  
010: -2 dB  
011: -3.3 dB  
100: -5 dB  
101: -6.7 dB  
110: -9 dB  
111: -12 dB  
4
R/W  
0
De-E EN  
0: De-Emphasis Enabled  
1: De-Emphasis Disabled  
3:0  
R/W 000 Reserved  
Reserved  
35  
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TABLE 15. DESERIALIZER — Serial Bus Control Registers  
ADD ADD Register Name Bit(s) R/W Defa Function  
Description  
(dec) (hex)  
ult  
(bin)  
0
0
Des Config 1  
7
6
R/W  
R/W  
R/W  
R/W  
R/W  
0
0
0
0
LFMODE  
OS_PCLK  
OS_DATA  
RFB  
0: 20 to 65 MHz Operation  
1: 5 to 20 MHz Operation  
0: Normal PCLK Output Slew  
1: Increased PCLK Slew  
5
0: Normal DATA OUTPUT Slew  
1: Increased Data Slew  
4
0: Data strobed on Falling edge of PCLK  
1: Data strobed on Rising edge of PCLK  
3:2  
00 CONFIG  
00: Normal Mode, Control Signal Filter Disabled  
01: Normal Mode, Control Signal Filter Enabled  
10: Backwards Compatible (DS90UR241)  
11: Backwards Compatible (DS90C241)  
1
R/W  
0
SLEEP  
Note – not the same function as PowerDown (PDB)  
0: normal mode  
1: Sleep Mode – Register settings retained.  
0
7
R/W  
R/W  
0
0
REG Control  
0: Configurations set from control pins / STRAP pins  
1: Configurations set from registers (except I2C_ID)  
1
1
Slave ID  
0: Address from ID[X] Pin  
1: Address from Register  
6:0  
R/W 1110 ID[X]  
000  
Serial Bus Device ID, Four IDs are:  
7b '1110 001 (h'71)  
7b '1110 010 (h'72)  
7b '1110 011 (h'73)  
7b '1110 110 (h'76)  
All other addresses are Reserved.  
2
2
Des Features 1  
7
6
R/W  
R/W  
0
0
OP_LOW  
Release/Set  
0: set outputs state LOW (except LOCK)  
1: release output LOW state, outputs toggling normally  
Note: This register only works during LOCK = 1.  
OSS_SEL  
Output Sleep State Select  
0: PCLK/RGB[7:0]/HS/VS/DE = Tri-State, LOCK =  
Normal, PASS = H  
1: PCLK/RGB[7:0]/HS/VS/DE = L, LOCK = Normal,  
PASS = H  
5:4  
R/W  
00 MAP_SEL  
Special for Backwards Compatible Mode with  
DS90UR241)  
00: bit 4, 5 on LSB  
01: LSB zero or one  
10: LSB zero  
11: LSB zero  
3
R/W  
R/W  
0
OP_LOW strap 0: strap will determine whether OP_LOW feature is ON  
bypass  
or OFF  
1: Turns OFF OP_LOW feature  
2:0  
00 OSC_SEL  
000: OFF  
001: 50 MHz ±40%  
010: 25 MHz ±40%  
011: 16.7 MHz ±40%  
100: 12.5 MHz ±40%  
101: 10 MHz ±40%  
110: 8.3 MHz ±40%  
111: 6.3 MHz ±40%  
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36  
ADD ADD Register Name Bit(s) R/W Defa Function  
Description  
(dec) (hex)  
ult  
(bin)  
3 3  
Des Features 2  
7:5  
R/W 000 EQ Gain  
000: ~1.625 dB  
001: ~3.25 dB  
010: ~4.87 dB  
011: ~6.5 dB  
100: ~8.125 dB  
101: ~9.75 dB  
110: ~11.375 dB  
111: ~13 dB  
4
R/W  
0
EQ Enable  
0: EQ = disabled  
1: EQ = enabled  
3:0  
R/W 0000 SSC  
IF LF_MODE = 0, then:  
000: SSCG OFF  
0001: fdev = ±0.5%, fmod = PCLK/2168  
0010: fdev = ±1.0%, fmod = PCLK/2168  
0011: fdev = ±1.5%, fmod = PCLK/2168  
0100: fdev = ±2.0%, fmod = PCLK/2168  
0101: fdev = ±0.5%, fmod = PCLK/1300  
0110: fdev = ±1.0%, fmod = PCLK/1300  
0111: fdev = ±1.5%, fmod = PCLK/1300  
1000: fdev = ±2.0%, fmod = PCLK/1300  
1001: fdev = ±0.5%, fmod = PCLK/868  
1010: fdev = ±1.0%, fmod = PCLK/868  
1011: fdev = ±1.5%, fmod = PCLK/868  
1100: fdev = ±2.0%, fmod = PCLK/868  
1101: fdev = ±0.5%, fmod = PCLK/650  
1110: fdev = ±1.0%, fmod = PCLK/650  
1111: fdev = ±1.5%, fmod = PCLK/650  
IF LF_MODE = 1, then:  
000: SSCG OFF  
0001: fdev = ±0.5%, fmod = PCLK/620  
0010: fdev = ±1.0%, fmod = PCLK/620  
0011: fdev = ±1.5%, fmod = PCLK/620  
0100: fdev = ±2.0%, fmod = PCLK/620  
0101: fdev = ±0.5%, fmod = PCLK/370  
0110: fdev = ±1.0%, fmod = PCLK/370  
0111: fdev = ±1.5%, fmod = PCLK/370  
1000: fdev = ±2.0%, fmod = PCLK/370  
1001: fdev = ±0.5%, fmod = PCLK/258  
1010: fdev = ±1.0%, fmod = PCLK/258  
1011: fdev = ±1.5%, fmod = PCLK/258  
1100: fdev = ±2.0%, fmod = PCLK/258  
1101: fdev = ±0.5%, fmod = PCLK/192  
1110: fdev = ±1.0%, fmod = PCLK/192  
1111: fdev = ±1.5%, fmod = PCLK/192  
4
4
CMLOUT  
Config  
7
R/W  
0
Repeater Enable 0: Output CMLOUTP/N = disabled  
1: Output CMLOUTP/N = enabled  
6:0  
R/W 0000 Reserved  
Reserved  
000  
37  
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TYPICAL APPLICATION CONNECTION  
Applications Information  
Figure 34 shows a typical application of the DS90UR905Q  
Ser in Pin control mode for a 65 MHz 24-bit Color Display  
Application. The LVDS outputs require 100 nF AC coupling  
capacitors to the line. The line driver includes internal termi-  
nation. Bypass capacitors are placed near the power supply  
pins. At a minimum, four 0.1 µF capacitors and a 4.7 µF ca-  
pacitor should be used for local device bypassing. System  
GPO (General Purpose Output) signals control the PDB and  
BISTEN pins. In this application the RFB pin is tied Low to  
latch data on the falling edge of the PCLK. The application  
assumes the companion Des (DS90UR906Q) therefore the  
configuration pins are also both tied Low. In this example the  
cable is long, therefore the VODSEL pin is tied High and a  
De-Emphasis value is selected by the resistor R1. The inter-  
face to the host is with 1.8 V LVCMOS levels, thus the VDDIO  
pin is connected also to the 1.8V rail. The Optional Serial Bus  
Control is not used in this example, thus the SCL, SDA and  
ID[x] pins are left open. A delay cap is placed on the PDB  
signal to delay the enabling of the device until power is stable.  
DISPLAY APPLICATION  
The DS90UR905Q/906Q chipset is intended for interface be-  
tween a host (graphics processor) and a Display. It supports  
an 24-bit color depth (RGB888) and up to 1024 X 768 display  
formats. In a RGB888 application, 24 color bits (R[7:0], G[7:0],  
B[7:0]), Pixel Clock (PCLK) and three control bits (VS, HS and  
DE) are supported across the serial link with PCLK rates from  
5 to 65 MHz. The chipset may also be used in 18-bit color  
applications. In this application three to six general purpose  
signals may also be sent from host to display.  
The Des is expected to be located close to its target device.  
The interconnect between the Des and the target device is  
typically in the 1 to 3 inch separation range. The input capac-  
itance of the target device is expected to be in the 5 to 10 pF  
range. Care should be taken on the PCLK output trace as this  
signal is edge sensitive and strobes the data. It is also as-  
sumed that the fanout of the Des is one. If additional loads  
need to be driven, a logic buffer or mux device is recom-  
mended.  
30102044  
FIGURE 34. DS90UR905Q Typical Connection Diagram — Pin Control  
www.national.com  
38  
Figure 35 shows a typical application of the DS90UR906Q  
Des in Pin/STRAP control mode for a 65 MHz 24-bit Color  
Display Application. The LVDS inputs utilize 100 nF coupling  
capacitors to the line and the Receiver provides internal ter-  
mination. Bypass capacitors are placed near the power sup-  
ply pins. At a minimum, seven 0.1 µF capacitors and two 4.7  
µF capacitors should be used for local device bypassing. Sys-  
tem GPO (General Purpose Output) signals control the PDB  
and the BISTEN pins. In this application the RRFB pin is tied  
Low to strobe the data on the falling edge of the PCLK.  
the STRAP pull-up on B7. The receiver input equalizer is also  
enabled and set to provide 7.5 dB of gain, this is accomplished  
with EQ[3:0] set to 1001'b with STRAP pull ups on G4 and  
G7. To reduce parallel bus EMI, the SSCG feature is enabled  
and set to 30 kHz and ±1% with SSC[3:0] set to 0010'b and  
a STRAP pull-up on R4. The desired features are set with the  
use of the four pull up resistors.  
The interface to the target display is with 3.3V LVCMOS lev-  
els, thus the VDDIO pin is connected to the 3.3 V rail. The  
optional Serial Bus Control is not used in this example, thus  
the SCL, SDA and ID[x] pins are left open. A delay cap is  
placed on the PDB signal to delay the enabling of the device  
until power is stable.  
Since the device in the Pin/STRAP mode, four 10 kpull up  
resistors are used on the parallel output bus to select the de-  
sired device features. CONFIG[1:0] is set to 01'b for Normal  
Mode and Control Signal Filter ON, this is accomplished with  
30102045  
FIGURE 35. DS90UR906Q Typical Connection Diagram — Pin Control  
39  
www.national.com  
POWER UP REQUIREMENTS AND PDB PIN  
and ground pins directly to the power and ground planes with  
bypass capacitors connected to the plane with via on both  
ends of the capacitor. Connecting power or ground pins to an  
external bypass capacitor will increase the inductance of the  
path.  
The VDD (VDDn and VDDIO) supply ramp should be faster than  
1.5 ms with a monotonic rise. If slower then 1.5 ms then a  
capacitor on the PDB pin is needed to ensure PDB arrives  
after all the VDD have settled to the recommended operating  
voltage. When PDB pin is pulled to VDDIO, it is recommended  
to use a 10 kΩ pull-up and a 22 uF cap to GND to delay the  
PDB input signal.  
A small body size X7R chip capacitor, such as 0603, is rec-  
ommended for external bypass. Its small body size reduces  
the parasitic inductance of the capacitor. The user must pay  
attention to the resonance frequency of these external bypass  
capacitors, usually in the range of 20-30 MHz. To provide ef-  
fective bypassing, multiple capacitors are often used to  
achieve low impedance between the supply rails over the fre-  
quency of interest. At high frequency, it is also a common  
practice to use two vias from power and ground pins to the  
planes, reducing the impedance at high frequency.  
NOISE MARGIN  
TBD  
TRANSMISSION MEDIA  
The Ser/Des chipset is intended to be used in a point-to-point  
configuration, through a PCB trace, or through twisted pair  
cable. The Ser and Des provide internal terminations provid-  
ing a clean signaling environment. The interconnect for LVDS  
should present a differential impedance of 100 Ohms. Use  
cables and connectors that have matched differential  
impedance to minimize impedance discontinuities. Shielded  
or un-shielded cables may be used depending upon the noise  
environment and application requirements.  
Some devices provide separate power and ground pins for  
different portions of the circuit. This is done to isolate switch-  
ing noise effects between different sections of the circuit.  
Separate planes on the PCB are typically not required. Pin  
Description tables typically provide guidance on which circuit  
blocks are connected to which power pin pairs. In some cas-  
es, an external filter many be used to provide clean power to  
sensitive circuits such as PLLs.  
LIVE LINK INSERTION  
Use at least a four layer board with a power and ground plane.  
Locate LVCMOS signals away from the LVDS lines to prevent  
coupling from the LVCMOS lines to the LVDS lines. Closely-  
coupled differential lines of 100 Ohms are typically recom-  
mended for LVDS interconnect. The closely coupled lines  
help to ensure that coupled noise will appear as common-  
mode and thus is rejected by the receivers. The tightly cou-  
pled lines will also radiate less.  
The Ser and Des devices support live pluggable applications.  
The automatic receiver lock to random data “plug & go” hot  
insertion capability allows the DS90UR906Q to attain lock to  
the active data stream during a live insertion event.  
PCB LAYOUT AND POWER SYSTEM CONSIDERATIONS  
Circuit board layout and stack-up for the LVDS Ser/Des de-  
vices should be designed to provide low-noise power feed to  
the device. Good layout practice will also separate high fre-  
quency or high-level inputs and outputs to minimize unwanted  
stray noise pickup, feedback and interference. Power system  
performance may be greatly improved by using thin di-  
electrics (2 to 4 mils) for power / ground sandwiches. This  
arrangement provides plane capacitance for the PCB power  
system with low-inductance parasitics, which has proven es-  
pecially effective at high frequencies, and makes the value  
and placement of external bypass capacitors less critical. Ex-  
ternal bypass capacitors should include both RF ceramic and  
tantalum electrolytic types. RF capacitors may use values in  
the range of 0.01 uF to 0.1 uF. Tantalum capacitors may be  
in the 2.2 uF to 10 uF range. Voltage rating of the tantalum  
capacitors should be at least 5X the power supply voltage  
being used.  
Information on the LLP style package is provided in National  
Application Note: AN-1187.  
LVDS INTERCONNECT GUIDELINES  
See AN-1108 and AN-905 for full details.  
Use 100Ω coupled differential pairs  
Use the S/2S/3S rule in spacings  
– S = space between the pair  
– 2S = space between pairs  
– 3S = space to LVCMOS signal  
Minimize the number of Vias  
Use differential connectors when operating above  
500Mbps line speed  
Maintain balance of the traces  
Minimize skew within the pair  
Terminate as close to the TX outputs and RX inputs as  
possible  
Surface mount capacitors are recommended due to their  
smaller parasitics. When using multiple capacitors per supply  
pin, locate the smaller value closer to the pin. A large bulk  
capacitor is recommend at the point of power entry. This is  
typically in the 50uF to 100uF range and will smooth low fre-  
quency switching noise. It is recommended to connect power  
Additional general guidance can be found in the LVDS  
Owner’s Manual - available in PDF format from the National  
web site at: www.national.com/lvds  
www.national.com  
40  
ALTERNATE COLOR / DATA MAPPING  
devices, a color mapping review is recommended to ensure  
the correct connectivity is obtained. Table 16 provides exam-  
ples for interfacing to 18-bit applications with or without the  
video control signals embedded. The DS90UR906Q Des also  
provides additional flexibility with the MAP_SEL feature as  
well.  
Color Mapped data Pin names are provided to specify a rec-  
ommended mapping for 24-bit Color Applications. Seven [7]  
is assumed to be the MSB, and Zero [0] is assumed to be the  
LSB. While this is recommended it is not required. When con-  
necting to earlier generations of FPD-Link II Ser and Des  
TABLE 16. Alternate Color / Data Mapping — See Text Below  
18-bit RGB 18-bit RGB 24-bit RGB 905 Pin Name 906 Pin Name 24-bit RGB 18-bit RGB 18-bit RGB  
RO R0  
LSB R0  
R1  
GP0  
GP1  
R0  
RO  
R1  
R0  
R1  
GP0  
GP1  
R0  
LSB R0  
R1  
R1  
R1  
R2  
R2  
R2  
R2  
R2  
R2  
R3  
R1  
R3  
R3  
R3  
R3  
R1  
R3  
R4  
R2  
R4  
R4  
R4  
R4  
R2  
R4  
MSB R5  
LSB G0  
G1  
R3  
R5  
R5  
R5  
R5  
R3  
MSB R5  
LSB G0  
G1  
R4  
R6  
R6  
R6  
R6  
R4  
R5  
R7  
R7  
R7  
R7  
R5  
G2  
GP2  
GP3  
GO  
G1  
G0  
G0  
G0  
G0  
GP2  
GP3  
G0  
G2  
G3  
G1  
G1  
G1  
G1  
G3  
G4  
G2  
G2  
G2  
G2  
G4  
MSB G5  
LSB B0  
B1  
G3  
G3  
G3  
G3  
G1  
MSB G5  
LSB0  
B1  
G2  
G4  
G4  
G4  
G4  
G2  
G3  
G5  
G5  
G5  
G5  
G3  
B2  
G4  
G6  
G6  
G6  
G6  
G4  
B2  
B3  
G5  
G7  
G7  
G7  
G7  
G5  
B3  
B4  
GP4  
GP5  
B0  
B0  
B0  
B0  
B0  
GP4  
GP5  
B0  
B4  
MSB B5  
HS  
B1  
B1  
B1  
B1  
MSB B5  
HS  
B2  
B2  
B2  
B2  
VS  
B1  
B3  
B3  
B3  
B3  
B1  
VS  
DE  
B2  
B4  
B4  
B4  
B4  
B2  
DE  
GP0  
GP1  
GP2  
GND  
GND  
GND  
Scenario 3  
B3  
B5  
B5  
B5  
B5  
B3  
GP0  
GP1  
GP2  
GND  
GND  
GND  
Scenario 3  
B4  
B6  
B6  
B6  
B6  
B4  
B5  
B7  
B7  
B7  
B7  
B5  
HS  
HS  
VS  
HS  
VS  
HS  
VS  
HS  
VS  
HS  
VS  
VS  
DE  
DE  
Scenario 1  
DE  
DE  
DE  
Scenario 1  
DE  
Scenario 2  
905 Pin Name  
906 Pin Name  
Scenario 2  
Scenario 3  
Scenario 1  
Scenario 3 supports an 18-bit RGB color mapping, 3 un-em-  
bedded video control signals, and up to three general purpose  
signals.  
Scenario 1 supports the 24-bit RGB color mapping, along with  
the 3 embedded video control signals. This is the native mode  
for the chipset.  
Scenario 2  
Scenario 2 supports an 18-bit RGB color mapping, 3 embed-  
ded video control signals, and up to six general purpose  
signals.  
41  
www.national.com  
Changed Table 15: ADD \ 1\ bit \ 6:0 \ ID[x]: deleted Device  
ID 7b'1110 00 (h'70). Only four (4) IDs will be available.  
Changed Table 15: ADD \ 2 \ bit \ 7 \ Reserved: changed  
“Reserved” to “OP_LOW”  
Changed Table 15: ADD \ 2 \ bit \ 6 \ Reserved: changed  
“Reserved” to “OSS_SEL”  
Updated DS90UR905Q Typical Connection Diagram —  
Pin Control. Ref 30102044  
Updated DS90UR906Q Typical Connection Diagram —  
Pin Control. Ref 30102045  
Created OP_LOW timing figure 26. Ref 30102065.  
Created OP_LOW timing figure27. Ref 30102066.  
Removed IDDT3 and IDDIOT3 (RANDOM pattern)  
because the limits are the same as checker board pattern.  
Typical Performance Curves  
LVCMOS VOL/IOL (VDDIO, OS_PCLK/DATA, PCLK/  
outputs)  
LVCMOS VOH/IOH (VDDIO, OS_PCLK/DATA, PCLK/  
outputs)  
Ser ICC  
Des ICC  
SigCon Ser  
SigCon Des  
Cable Length  
Revision History  
2/01/2010  
2/08/2010  
DS90UR905Q DATASHEET LIMITS HAVE BEEN  
UPDATED PER CHARACTERIZATION RESULT AND  
ARE THE FINAL LIMITS  
Minor corrections: Changed Iin from +/-10uA to +/-15uA in  
Serial Control bus section; added note 11 to: tXZR, tPLD  
,
tSD, tDJIT and VOL (in Serial Control Bus Characteristics).  
2/09/2010  
Added “Note: During initial power-up, a delay of 10ms will  
be required before the I2C will respond.” in Optional Serial  
Bus Control description section.  
Updated TABLE 12: deleted ID[x] Address 7'b 110 1000  
(h'68) (8'b 1101 0000 (h'D0))  
Updated TABLE 13: deleted ID[x] Address 7'b 111 0000  
(h'70) (8'b 1110 0000 (h'E0))  
Updated DS90UR906Q Pin Diagram: strap changes on  
pin11, pin14, and pin42  
Updated DS90UR906Q Deserializer Pin Descriptions:  
RDS feature changed to OS_PCLK and OS_DATA.  
Added OP_LOW feature.  
2/11/2010  
Removed Note 11 on tDJIT and max values.  
3/5/2010  
Added reference to soldering profile.  
Added ESD CDM and ESD MM values.  
Updated θJA value.  
Changed strap pin 14 feature from “RDS” to  
“OS_DATA” (Output Slew_DATA)  
Added strap to pin 11 “OS_PCLK” (Output Slew_PCLK)  
Added strap to pin 42 “OP_LOW” (Output LOW)  
Changed Table 14: ADD \ 1 \ bit \ 6:0 \ ID[x]: deleted Device  
ID 7b'1101 00 (h'68). Only four (4) IDs will be available.  
5/25/2010  
DS90UR906 DATASHEET LIMITS HAVE BEEN  
UPDATED PER CHARACTERIZATION RESULTS  
Corrected TABLE 14. SERIALIZER — Serial Bus Control  
Regeisters: register 5 from RFB to VODSEL and register  
4 from VODSEL to RFB  
Changed Table 15: ADD \ 0 \ bit \ 6 \ OSS_SEL:  
“OSS_SEL” changed feature to “OS_PCLK” (Output  
Slew_PCLK). OSS_SEL moved to ADD \ 2 \ bit \ 6 \.  
Changed Table 15: ADD \ 0 \ bit \ 5 \ RDS: changed “RDS”  
feature to OS_DATA (Output Slew_DATA)  
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42  
Physical Dimensions inches (millimeters) unless otherwise noted  
48–pin LLP Package (7.0 mm x 7.0 mm x 0.8 mm, 0.5 mm pitch)  
NS Package Number SQA48A  
60–pin LLP Package (9.0 mm x 9.0 mm x 0.8 mm, 0.5 mm pitch)  
NS Package Number SQA60B  
43  
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