LH0101K-MIL [NSC]

LH0101 Power Operational Amplifier; LH0101功耗运算放大器
LH0101K-MIL
型号: LH0101K-MIL
厂家: National Semiconductor    National Semiconductor
描述:

LH0101 Power Operational Amplifier
LH0101功耗运算放大器

运算放大器
文件: 总12页 (文件大小:281K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
February 1995  
LH0101 Power Operational Amplifier  
General Description  
Features  
Y
5 Amp peak, 2 Amp continuous output current  
300 kHz power bandwidth  
The LH0101 is a wideband power operational amplifier fea-  
turing FET inputs, internal compensation, virtually no cross-  
over distortion, and rapid settling time. These features make  
the LH0101 an ideal choice for DC or AC servo amplifiers,  
deflection yoke drives, programmable power supplies, and  
disk head positioner amplifiers. The LH0101 is packaged in  
an 8 pin TO-3 hermetic package, rated at 60 watts with a  
suitable heat sink.  
Y
Y
Y
Y
Y
Y
Y
g
850 mW standby power ( 15V supplies)  
300 pA input bias current  
10 V/ms slew rate  
Virtually no crossover distortion  
2 ms settling time to 0.01%  
5 MHz gain bandwidth  
Schematic and Connection Diagrams  
TL/K/5558–2  
Top View  
Order Numbers LH0101K,  
LH0101K-MIL, LH0101CK,  
LH0101AK,  
LH0101AK-MIL or LH0101ACK  
See NS Package Number K08A  
Note: Electrically connected internally, no  
connection should be made to pin.  
TL/K/5558–1  
C
1995 National Semiconductor Corporation  
TL/K/5558  
RRD-B30M115/Printed in U. S. A.  
Absolute Maximum Ratings  
If Military/Aerospace specified devices are required,  
please contact the National Semiconductor Sales  
Office/Distributors for availability and specifications.  
(Note 5)  
Peak Output Current (50 ms pulse), I  
5A  
O(PK)  
Output Short Circuit Duration  
(within rated power dissipation,  
e
e
25 C)  
R
0.35X, T  
Continuous  
§
Operating Temperature Range, T  
SC  
A
g
Supply Voltage, V  
22V  
5W  
S
A
e
Power Dissipation at T  
Derate linearly at 25 C/W to zero at 150 C,  
b a  
25 C to 85 C  
25 C, P  
LH0101AC, LH0101C  
LH0101A, LH0101  
§
§
55 C to 125 C  
§
A
D
b a  
§
C
§
§
§
§
e
Derate linearly at 2 C/W to zero at 150 C  
b
a
65 C to 150 C  
Power Dissipation at T  
25 C  
§
62W  
Storage Temperature Range, T  
§
STG  
§
Differential Input Voltage, V  
§
Maximum Junction Temperature, T  
150 C  
§
J
k
k
g
g
g
40V but  
20V but  
V
V
k
Lead Temperature (Soldering 10 sec.)  
IN  
S
260 C  
§
g
Input Voltage Range, V  
Thermal ResistanceÐ  
CM  
S
ESD rating to be determined.  
See Typical Performance Characteristics  
e
e
g
DC Electrical Characteristics (Note 1) V  
15V, T  
25 C unless otherwise noted  
§
S
A
LH0101AC  
LH0101A  
LH0101C  
LH0101  
Symbol  
Parameter  
Conditions  
Units  
Min  
Typ Max Min  
Typ Max  
V
Input Offset Voltage  
1
3
7
5
10  
15  
OS  
mV  
s
s
T
T
T
0
MIN  
A
MAX  
DV /DP Change in  
OS  
(Note 2)  
D
Input Offset Voltage  
150  
10  
300  
10  
mV/W  
with Dissipated Power  
e
DV /DT Change in  
OS  
V
CM  
Input Offset Voltage  
mV/ C  
§
with Temperature  
I
I
Input Bias Current  
300  
60  
1000 pA  
B
LH0101C/AC  
LH0101/A  
60  
nA  
1000  
s
s
T
T
A
MAX  
300  
75  
Input Offset Current  
250 pA  
OS  
LH0101C/AC  
LH0101/A  
15  
15  
nA  
250  
T
A
T
MAX  
75  
e
e
10X  
g
A
V
Large Signal  
Voltage Gain  
V
10V R  
L
VOL  
O
50  
200  
50  
200  
V/mV  
e
e
e
e
g
g
g
g
12.5  
Output Voltage Swing R  
SC  
0
R
L
R
L
R
L
100X  
10X  
5X  
12  
12.5  
12  
O
e a  
g
g
11.25 11.6  
g
g
11.25 11.6  
A
1
V
V
g
g
g
g
11  
Note 3  
10.5  
11  
10.5  
CMRR  
PSRR  
Common Mode  
Rejection Ratio  
e
g
DV  
DV  
10V  
85  
100  
100  
28  
85  
100  
100  
28  
IN  
S
dB  
Power Supply  
e
g
g
5V to 15V  
85  
85  
Rejection Ratio  
I
Quiescent Supply  
Current  
S
35  
35  
mA  
2
e
e
25 C  
g
AC Electrical Characteristics (Note 1), V  
15V, T  
§
S
A
LH0101  
LH0101C  
Symbol  
Parameter  
Conditions  
LH0101A  
LH0101AC  
Units  
Min  
Typ  
Max  
Min  
Typ  
Max  
e
e
e
Equivalent Input  
Noise Voltage  
f
f
1 kHz  
n
25  
25  
nV Hz  
0
C
Input Capacitance  
1 MHz  
3.0  
300  
10  
3.0  
300  
10  
pF  
IN  
b
Power Bandwidth, 3 dB  
kHz  
SR  
Slew Rate  
7.5  
V/ms  
(Note 4)  
e
R
L
10X  
t , t  
r f  
Small Signal Rise or  
Fall Time  
200  
200  
ns  
e a  
A
V
1
Small Signal Overshoot  
Gain-Bandwidth Product  
10  
10  
%
GBW  
4.0  
5.0  
5.0  
MHz  
(Note 4)  
e %  
R
L
o
t
s
Large Signal Settling  
Time to 0.01%  
2.0  
2.0  
ms  
e
e
e
1 kHz  
THD  
Total Harmonic Distortion  
P
10W, f  
0.008  
0.008  
%
R
10X  
L
e
operating junction temperature will rise approximately 20 C without heat sinking. Accordingly, V  
e
g
25 C value. When supply voltages are 15V, quiescent  
§
Note 1: Specification is at T  
25 C. Actual values at operating temperature may differ from the T  
§
A
A
may change 0.5 mV and I and I  
will change significantly  
OS  
§
OS  
B
g
during warm-ups. Refer to the I vs. temperature and power dissipation graphs for expected values. Power supply voltage is 15V. Temperature tests are made  
B
only at extremes.  
Note 2: Change in offset voltage with dissipated power is due entirely to average device temperature rise and not to differential thermal feedback effects. Test is  
performed without any heat sink.  
Note 3: At light loads, the output swing may be limited by the second stage rather than the output stage. See the application section under ‘‘Output swing  
enhancement’’ for hints on how to obtain extended operation.  
Note 4: These parameters are sample tested to 10% LTPD.  
Note 5: Refer to RETS0101AK for the LH0101AK military specifications and RETS0101K for the LH0101K military specifications.  
3
Typical Performance Characteristics  
Quiescent Power Supply  
Current  
Maximum Power Dissipation  
Safe Operating Area  
TL/K/5558–3  
4
Typical Performance Characteristics (Continued)  
Total Harmonic  
Distortion vs. Gain  
Output Voltage Swing  
with Swing Enhancement  
Equivalent Input Noise Voltage  
TL/K/5558–4  
e
10X)  
Small Signal Pulse Response (No Load)  
Large Signal Pulse Response (R  
L
TL/K/5558–5  
TL/K/5558–6  
5
Application Hints  
Input Voltages  
Electrostatic shielding of high impedance circuitry is advisa-  
ble.  
The LH0101 operational amplifier contains JFET input de-  
vices which exhibit high reverse breakdown voltages from  
gate to source or drain. This eliminates the need for input  
clamp diodes, so that high differential input voltages may be  
applied without a large increase in input current. However,  
neither input voltage should be allowed to exceed the nega-  
tive supply as the resultant high current flow may destroy  
the unit.  
Error voltages can also be generated in the external circuit-  
ry. Thermocouples formed between dissimilar metals can  
cause hundreds of microvolts of error in the presence of  
temperature gradients.  
Since the LH0101 can deliver large output currents, careful  
attention should be paid to power supply, power supply by-  
passing and load currents. Incorrect grounding of signal in-  
puts and load can cause significant errors.  
Exceeding the negative common-mode limit on either input  
will cause a reversal of the phase to the output and force  
the amplifier output to the corresponding high or low state.  
Exceeding the negative common-mode limit on both inputs  
will force the amplifier output to a high state. In neither case  
does a latch occur since raising the input back within the  
common-mode range again puts the input stage and thus  
the amplifier in a normal operating mode.  
Every attempt should be made to achieve a single point  
ground system as shown in the figure below.  
Exceeding the positive common-mode limit on a single input  
will not change the phase of the output however, if both  
inputs exceed the limit, the output of the amplifier will be  
forced to a high state.  
These amplifiers will operate with the common-mode input  
voltage equal to the positive supply. In fact, the common-  
mode voltage may exceed the positive supply by approxi-  
mately 100 mV, independent of supply voltage and over the  
full operating temperature range. The positive supply may  
therefore be used as a reference on an input as, for exam-  
ple, in a supply current monitor and/or limiter.  
With the LH0101 there is a temptation to remove the bias  
current compensation resistor normally used on the non-in-  
verting input of a summing amplifier. Direct connection of  
the inputs to ground or a low-impedance voltage source is  
not recommended with supply voltages greater than 3V.  
The potential problem involves loss of one supply which can  
cause excessive current in the second supply. Destruction  
of the IC could result if the current to the inputs of the de-  
vice is not limited to less than 100 mA or if there is much  
more than 1 mF bypass on the supply buss.  
TL/K/5558–7  
FIGURE 1. Single-Point Grounding  
Bypass capacitor C should be used if the lead lengths of  
BX  
bypass capacitors C are long. If a single point ground sys-  
B
tem is not possible, keep signal, load, and power supply  
from intermingling as much as possible. For further informa-  
tion on proper grounding techniques refer to ‘‘Grounding  
and Shielding Techniques in Instrumentation’’ by Morrison,  
and ‘‘Noise Reduction Techniques in Electronic Systems’’  
by Ott (both published by John Wiley and Sons).  
Although difficulties can be largely avoided by installing  
clamp diodes across the supply lines on every PC board, a  
conservative design would include enough resistance in the  
input lead to limit current to 10 mA if the input lead is pulled  
to either supply by internal currents. This precaution is by no  
means limited to the LH0101.  
Leads or PC board traces to the supply pins, short-circuit  
current limit pins, and the output pin must be substantial  
enough to handle the high currents that the LH0101 is capa-  
ble of producing.  
Layout Considerations  
Short Circuit Current Limiting  
When working with circuitry capable of resolving pico-am-  
pere level signals, leakage currents in circuitry external to  
the op amp can significantly degrade performance. High  
quality insulation is a must (Kel-F and Teflon rate high).  
Proper cleaning of all insulating surfaces to remove fluxes  
and other residues is also required. This includes the IC  
package as well as sockets and printed circuit boards.  
a
should be shorted to V and SC should be shorted to  
Should current limiting of the output not be necessary, SC  
a
b
. Remember that the short circuit current limit is depen-  
b
V
dent upon the total resistance seen between the supply and  
current limit pins. This total resistance includes the desired  
resistor plus leads, PC Board traces, and solder joints.* As-  
suming a zero TCR current limit resistor, typical temperature  
coefficient of the short circuit current will be approximately  
When operating in high humidity environments or near 0 C,  
§
some form of surface coating may be necessary to provide  
a moisture barrier.  
.3%/ C.  
§
0.6  
*Short circuit current will be limited to approximately  
.
The effects of board leakage can be minimized by encircling  
the input circuitry with a conductive guard ring operated at a  
potential close to that of the inputs.  
RSC  
6
Application Hints (Continued)  
ground set the frequency of the pole. In many instances the  
frequency of this pole is much greater than the expected 3  
dB frequency of the closed loop gain and consequently  
there is negligible effect on stability margin. However, if the  
feedback pole is less than approximately six times the ex-  
pected 3 dB frequency a lead capacitor should be placed  
from the output to the input of the op amp. The value of the  
added capacitor should be such that the RC time consistant  
of this capacitor and the resistance it parallels is greater  
than or equal to the original feedback pole time constant.  
Thermal Resistance  
The thermal resistance between two points of a conductive  
system is expressed as:  
b
T
T
2
1
e
i
C/W  
§
12  
P
D
where subscript order indicates the direction of heat flow. A  
simplified heat transfer circuit for a cased semiconductor  
and heat sink system is shown in the figure below.  
The circuit is valid only if the system is in thermal equilibrium  
(constant heat flow) and there are, indeed, single specific  
temperatures T , T and T (no temperature distribution in  
Some inductive loads may cause output stage oscillation. A  
.01 mF ceramic capacitor in series with a 10X resistor from  
the output to ground will usually remedy this situation.  
J
C
S
junction, case, or heat sink). Nevertheless, this is a reason-  
able approximation of actual performance.  
TL/K/5558–8  
TL/K/5558–9  
FIGURE 2. Semiconductor-Heat Sink Thermal Circuit  
FIGURE 3. Driving Inductive Loads  
The junction-to-case thermal resistance i specified in the  
JC  
Capacitive loads may be compensated for by traditional  
techniques. (See ‘‘Operational Amplifiers: Theory and Prac-  
tice’’ by Roberge, published by Wiley):  
data sheet depends upon the material and size of the pack-  
age, die size and thickness, and quality of the die bond to  
the case or lead frame. The case-to-heat sink thermal re-  
sistance i depends on the mounting of the device to the  
CS  
heat sink and upon the area and quality of the contact sur-  
face. Typical i for a TO-3 package is 0.5 to 0.7 C/W, and  
§
CS  
0.3 to 0.5 C/W using silicone grease.  
§
The heat sink to ambient thermal resistance i  
depends  
on the quality of the heat sink and the ambient conditions.  
SA  
Cooling is normally required to maintain the worst case op-  
erating junction temperature T of the device below the  
J
specified maximum value T  
. T can be calculated  
J(MAX)  
J
from known operating conditions. Rewriting the above equa-  
tion, we find:  
b
TL/K/555810  
T
T
A
J
e
i
C/W  
§
JA  
FIGURE 4. R and C Selected to  
C
C
Compensate for Capacitive Load  
P
D
e
a
P
T
T
i
C
§
J
A
D
JA  
A similar but alternative technique may be used for the  
LH0101:  
b
for a DC Signal  
a
a b b  
(V ) I  
Q
Where: P (V  
D
V
)I  
OUT OUT  
V
S
l
l
e
a
a
e
and V Supply Voltage  
S
i
i
i
i
JA  
JC  
CS  
SA  
i
for the LH0101 is about 2 C/W.  
§
JC  
Stability and Compensation  
As with most amplifiers, care should be taken with lead  
dress, component placement and supply decoupling in or-  
der to ensure stability. For example, resistors from the out-  
put to an input should be placed with the body close to the  
input to minimize ‘‘pickup’’ and maximize the frequency of  
the feedback pole by minimizing the capacitance from the  
input to ground.  
A feedback pole is created when the feedback around any  
amplifier is resistive. The parallel resistance and capaci-  
tance from the input device (usually the inverting input) to ac  
TL/K/555811  
FIGURE 5. Alternate Compensation for Capacitive Load  
7
Application Hints (Continued)  
Output Swing Enhancement  
Output Resistance  
When the feedback pin is connected directly to the output,  
the output voltage swing is limited by the driver stage and  
not by output saturation. Output swing can be increased as  
shown by taking gain in the output stage as shown in High  
Power Voltage Follower with Swing Enhancement below.  
Whenever gain is taken in the output stage, as in swing  
enhancement, either the output stage, or the entire op amp  
must be appropriately compensated to account for the addi-  
tional loop gain.  
The open loop output resistance of the LH0101 is a function  
of the load current. No load output resistance is approxi-  
mately 10X. This decreases to under 1X for load currents  
exceeding 100 mA.  
Typical Applications  
See AN261 for more information.  
TL/K/555812  
TL/K/555813  
FIGURE 6. High Power Voltage Follower  
FIGURE 7. High Power Voltage Follower  
with Swing Enhancement  
TL/K/555814  
FIGURE 8. Restricting Outputs to Positive Voltages Only  
Following is a partial list of sockets and heat dissipators for use with the LH0101. National assumes no responsibility for their  
quality or availability.  
8-Lead TO-3 Hardware  
SOCKETS  
Keystone 4626 or 4627  
Robinson Nugent 0002011  
Azimuth 6028 (test socket)  
AAVID Engineering  
30 Cook Court  
Laconla, New Hampshire 03246  
Keystone Electronics Corp.  
49 Bleecker St.  
New York, NY 10012  
HEAT SINKS  
Thermalloy 2266B (35 C/W)  
Azimuth Electronics  
2377 S. El Camino Real  
San Clemente, CA 92572  
Robinson Nugent Inc.  
800 E. 8th St.  
New Albany, IN 47150  
§
IERC LAIC3B4CB  
IERC HP1-TO3-33CB (7 C/W)  
AAVID 5791B  
§
IERC  
135 W. Magnolia Blvd.  
Burbank, CA 91502  
Thermalloy  
P.O. Box 34829  
Dallas, TX 75234  
MICA WASHERS  
Keystone 4658  
8
Typical Applications (Continued)  
TL/K/555815  
FIGURE 9. Generating a Split Supply from a Single Voltage Supply  
TL/K/555816  
FIGURE 10. Power DAC  
TL/K/555817  
FIGURE 11. Bridge Audio Amplifier  
9
Typical Applications (Continued)  
TL/K/555818  
g
g
FIGURE 12. 5 to 35 Power Source or Sink  
TL/K/555819  
FIGURE 13. Remote Loudspeaker via Infrared Link  
TL/K/555820  
FIGURE 14. CRT Deflection Yoke Driver  
10  
Typical Applications (Continued)  
TL/K/555821  
FIGURE 15. DC Servo Amplifier  
TL/K/555822  
FIGURE 16. High Current Source/Sink  
11  
Ý
Lit. 106400  
Physical Dimensions inches (millimeters)  
8 Lead TO-3 Metal Can (K)  
Order Number LH0101K, LH0101K-MIL, LH0101CK, LH0101AK, LH0101AK-MIL or LH0101ACK  
NS Package Number K08A  
LIFE SUPPORT POLICY  
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT  
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL  
SEMICONDUCTOR CORPORATION. As used herein:  
1. Life support devices or systems are devices or  
systems which, (a) are intended for surgical implant  
into the body, or (b) support or sustain life, and whose  
failure to perform, when properly used in accordance  
with instructions for use provided in the labeling, can  
be reasonably expected to result in a significant injury  
to the user.  
2. A critical component is any component of a life  
support device or system whose failure to perform can  
be reasonably expected to cause the failure of the life  
support device or system, or to affect its safety or  
effectiveness.  
National Semiconductor  
Corporation  
National Semiconductor  
Europe  
National Semiconductor  
Hong Kong Ltd.  
National Semiconductor  
Japan Ltd.  
a
1111 West Bardin Road  
Arlington, TX 76017  
Tel: 1(800) 272-9959  
Fax: 1(800) 737-7018  
Fax:  
(
49) 0-180-530 85 86  
@
13th Floor, Straight Block,  
Ocean Centre, 5 Canton Rd.  
Tsimshatsui, Kowloon  
Hong Kong  
Tel: (852) 2737-1600  
Fax: (852) 2736-9960  
Tel: 81-043-299-2309  
Fax: 81-043-299-2408  
Email: cnjwge tevm2.nsc.com  
a
a
a
a
Deutsch Tel:  
English Tel:  
Fran3ais Tel:  
Italiano Tel:  
(
(
(
(
49) 0-180-530 85 85  
49) 0-180-532 78 32  
49) 0-180-532 93 58  
49) 0-180-534 16 80  
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.  

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