LM2409 [NSC]

Monolithic Triple 9.5 ns CRT Driver; 单片三重9.5纳秒的CRT驱动器
LM2409
型号: LM2409
厂家: National Semiconductor    National Semiconductor
描述:

Monolithic Triple 9.5 ns CRT Driver
单片三重9.5纳秒的CRT驱动器

驱动器
文件: 总9页 (文件大小:1063K)
中文:  中文翻译
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August 1999  
LM2409  
Monolithic Triple 9.5 ns CRT Driver  
n Well matched with LM1279 video preamp  
n 0V to 5V input range  
n Stable with 0 pF–20 pF capacitive loads and inductive  
peaking networks  
n Convenient TO-220 staggered lead package style  
n Standard LM240X Family Pinout which is designed for  
easy PCB layout  
General Description  
The LM2409 is an integrated high voltage CRT driver circuit  
designed for use in color monitor applications. The IC con-  
tains three high input impedance, wide band amplifiers  
which directly drive the RGB cathodes of a CRT. Each chan-  
nel has its gain internally set to −14 and can drive CRT ca-  
pacitive loads as well as resistive loads present in other ap-  
plications, limited only by the package’s power dissipation.  
Applications  
n 1024 x 768 Displays up to 70 Hz Refresh  
n Pixel clock frequencies up to 75 MHz  
n Monitors using video blanking  
The IC is packaged in an industry standard 11-lead TO-220  
molded plastic power package. See Thermal Considerations  
section.  
Features  
n Dissipates approximately 50% less power than the  
LM2406  
Schematic and Connection Diagrams  
DS100838-2  
Note: Tab is at GND  
Top View  
Order Number LM2409T  
DS100838-1  
FIGURE 1. Simplified Schematic Diagram  
(One Channel)  
© 1999 National Semiconductor Corporation  
DS100838  
www.national.com  
Absolute Maximum Ratings (Notes 1, 3)  
Machine Model  
250V  
If Military/Aerospace specified devices are required,  
please contact the National Semiconductor Sales Office/  
Distributors for availability and specifications.  
Operating Range (Note 2)  
VCC  
+60V to +85V  
+8V to +15V  
Supply Voltage, (VCC  
Bias Voltage, (VBB  
Input Voltage, (VIN  
)
+90V  
+16V  
VBB  
)
VIN  
+0V to +5V  
)
0V to 6V  
VOUT  
+15V to +75V  
−20˚C to +115˚C  
Storage Temperature Range, (TSTG  
Lead Temperature  
)
−65˚C to +150˚C  
Case Temperature  
Do not operate the part without a heat sink.  
<
(Soldering, 10 sec.)  
300˚C  
2 kV  
ESD Tolerance, Human Body Model  
Electrical Characteristics  
(See Figure 2 for Test Circuit)  
Unless otherwise noted: VCC = +80V, VBB = +12V, VIN = +2.7 VDC, CL = 8 pF, Output = 40 VPP at 1 MHz, TC = 50˚C.  
LM2409  
Symbol  
Parameter  
Supply Current  
Condition  
Units  
Min  
Typ  
Max  
ICC  
Per Channel, No Input Signal, No  
Output Load  
8
mA  
IBB  
VOUT  
AV  
Bias Current  
DC Output Voltage  
DC Voltage Gain  
Gain Matching  
Linearity Error  
Rise Time  
All Three Channels  
12  
65  
−14  
1.0  
8
mA  
No AC Input Signal, VIN = 1.2V  
No AC Input Signal  
62  
68  
VDC  
−12  
−16  
AV  
LE  
(Note 4), No AC Input Signal  
(Notes 4, 5), No AC Input Signal  
(Note 6), 10% to 90%  
(Note 6), 90% to 10%  
(Note 6)  
dB  
%
tR  
9
ns  
ns  
%
tF  
Fall Time  
11  
1
OS  
Overshoot  
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur.  
Note 2: Operating ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and  
test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may  
change when the device is not operated under the listed test conditions.  
Note 3: All voltages are measured with respect to GND, unless otherwise specified.  
Note 4: Calculated value from Voltage Gain test on each channel.  
Note 5: Linearity Error is the variation in dc gain from V = 1.0V to V = 4.5V.  
IN IN  
<
f
Note 6: Input from signal generator: t , t  
1 ns.  
r
AC Test Circuit  
DS100838-3  
Note: 8 pF load includes parasitic capacitance.  
FIGURE 2. Test Circuit (One Channel)  
Figure 2 shows a typical test circuit for evaluation of the LM2409. This circuit is designed to allow testing of the LM2409 in a 50Ω  
environment without the use of an expensive FET probe. The 4950resistor at the output forms a 100:1 voltage divider when  
connected to a 50load.  
www.national.com  
2
=
=
=
=
Typical Performance Characteristics (VCC 80V, VBB 12V, CL 8pF, VOUT 40VPP (25V-65V),  
Test Circuit - Figure 2 unless otherwise specified)  
DS100838-4  
DS100838-7  
FIGURE 3. VOUT vs VIN  
FIGURE 6. Power Dissipation vs Frequency  
DS100838-5  
DS100838-8  
FIGURE 4. Speed vs Temperature  
FIGURE 7. Speed vs Offset  
DS100838-6  
FIGURE 5. LM2409 Pulse Response  
DS100838-9  
FIGURE 8. Speed vs Load Capacitance  
3
www.national.com  
over are designed specifically for the LM2409. If another  
member of the LM240X family is used, please refer to its  
datasheet.  
Theory of Operation  
The LM2409 is a high voltage monolithic three channel CRT  
driver suitable for high resolution display applications. The  
LM2409 operates with 80V and 12V power supplies. The  
part is housed in the industry standard 11-lead TO-220  
molded plastic power package.  
POWER SUPPLY BYPASS  
Since the LM2409 is a wide bandwidth amplifier, proper  
power supply bypassing is critical for optimum performance.  
Improper power supply bypassing can result in large over-  
shoot, ringing or oscillation. A 0.01 µF capacitor should be  
connected from the supply pin, VCC, to ground, as close to  
the supply and ground pins as is practical. Additionally, a  
10 µF to 100 µF electrolytic capacitor should be connected  
from the supply pin to ground. The electrolytic capacitor  
should also be placed reasonably close to the LM2409’s  
supply and ground pins. A 0.1 µF capacitor should be con-  
nected from the bias pin, VBB, to ground, as close as is prac-  
tical to the part.  
The circuit diagram of the LM2409 is shown in Figure 1. The  
PNP emitter follower, Q5, provides input buffering. Q1 and  
Q2 form a fixed gain cascode amplifier with resistors R1 and  
R2 setting the gain at −14. Emitter followers Q3 and Q4 iso-  
late the high output impedance of the cascode stage from  
the capacitance of the CRT cathode which decreases the  
sensitivity of the device to load capacitance. Q6 provides bi-  
asing to the output emitter follower stage to reduce cross-  
over distortion at low signal levels.  
Figure 2 shows a typical test circuit for evaluation of the  
LM2409. This circuit is designed to allow testing of the  
LM2409 in a 50environment without the use of an expen-  
sive FET probe. In this test circuit, two low inductance resis-  
tors in series totaling 4.95 kform a 100:1 wideband, low  
capacitance probe when connected to a 50coaxial cable  
and a 50load (such as a 50oscilloscope input). The in-  
put signal from the generator is ac coupled to the base of  
Q5.  
ARC PROTECTION  
During normal CRT operation, internal arcing may occasion-  
ally occur. Spark gaps, in the range of 200V, connected from  
the CRT cathodes to CRT ground will limit the maximum volt-  
age, but to a value that is much higher than allowable on the  
LM2409. This fast, high voltage, high energy pulse can dam-  
age the LM2409 output stage. The application circuit shown  
in Figure 9 is designed to help clamp the voltage at the out-  
put of the LM2409 to a safe level. The clamp diodes, D1 and  
D2, should have a fast transient response, high peak current  
rating, low series impedance and low shunt capacitance.  
FDH400 or equivalent diodes are recommended. Do not use  
1N4148 or equivalent diodes for the clamp diodes. D1 and  
D2 should have short, low impedance connections to VCC  
and ground respectively. The cathode of D1 should be lo-  
cated very close to a separately decoupled bypass capacitor  
(C3 in Figure 9). The ground connection of D2 and the de-  
coupling capacitor should be very close to the LM2409  
ground. This will significantly reduce the high frequency volt-  
age transients that the LM2409 would be subjected to during  
an arcover condition. Resistor R2 limits the arcover current  
that is seen by the diodes while R1 limits the current into the  
LM2409 as well as the voltage stress at the outputs of the  
device. R2 should be a 1/2W solid carbon type resistor. R1  
can be a 1/4W metal or carbon film type resistor. Having  
large value resistors for R1 and R2 would be desirable, but  
this has the effect of increasing rise and fall times. Inductor  
L1 is critical to reduce the initial high frequency voltage lev-  
els that the LM2409 would be subjected to. The inductor will  
not only help protect the device but it will also help maximize  
rise and fall times as well as minimize EMI. For proper arc  
protection, it is important to not omit any of the arc protection  
components shown in Figure 9.  
Application Hints  
INTRODUCTION  
National Semiconductor (NSC) is committed to provide ap-  
plication information that assists our customers in obtaining  
the best performance possible from our products. The follow-  
ing information is provided in order to support this commit-  
ment. The reader should be aware that the optimization of  
performance was done using a specific printed circuit board  
designed at NSC. Variations in performance can be realized  
due to physical changes in the printed circuit board and the  
application. Therefore, the designer should know that com-  
ponent value changes may be required in order to optimize  
performance in a given application. The values shown in this  
document can be used as a starting point for evaluation pur-  
poses. When working with high bandwidth circuits, good lay-  
out practices are also critical to achieving maximum perfor-  
mance.  
IMPORTANT INFORMATION  
The LM2409 performance is targeted for the VGA (640 x  
480) to XGA (1024 x 768, 70 Hz refresh) resolution market.  
It is designed to be a replacement for discrete CRT drivers.  
The application circuits shown in this document to optimize  
performance and to protect against damage from CRT arc-  
DS100838-10  
FIGURE 9. One Channel of the LM2409 with the Recommended Arc Protection Circuit  
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4
This example assumes a capacitive load of 8 pF and no re-  
sistive load.  
Application Hints (Continued)  
OPTIMIZING TRANSIENT RESPONSE  
TYPICAL APPLICATION  
Referring to Figure 9, there are three components (R1, R2  
and L1) that can be adjusted to optimize the transient re-  
sponse of the application circuit. Increasing the values of R1  
and R2 will slow the circuit down while decreasing over-  
shoot. Increasing the value of L1 will speed up the circuit as  
well as increase overshoot. It is very important to use induc-  
tors with very high self-resonant frequencies, preferably  
above 300 MHz. Ferrite core inductors from J.W. Miller Mag-  
netics (part # 78FR82K) were used for optimizing the perfor-  
mance of the device in the NSC application board. The val-  
ues shown in Figure 9 can be used as a good starting point  
for the evaluation of the LM2409. The NSC demo board also  
has a position open to add a resistor in parallel with L1. This  
resistor can be used to help control overshoot. Using vari-  
able resistors for R1 and the parallel resistor will simplify  
finding the values needed for optimum performance in a  
given application. Once the optimum values are determined  
the variable resistors can be replaced with fixed values.  
A typical application of the LM2409 is shown in Figure 10.  
Used in conjunction with an LM1279, a complete video chan-  
nel from monitor input to CRT cathode can be achieved. Per-  
formance is ideal for 1024 x 768 resolution displays with  
pixel clock frequencies up to 75 MHz. Figure 10 is the sche-  
matic for the NSC demonstration board that can be used to  
evaluate the LM1279/2409 combination in a monitor.  
PC BOARD LAYOUT CONSIDERATIONS  
For optimum performance, an adequate ground plane, isola-  
tion between channels, good supply bypassing and minimiz-  
ing unwanted feedback are necessary. Also, the length of the  
signal traces from the preamplifier to the LM2409 and from  
the LM2409 to the CRT cathode should be as short as pos-  
sible. The following references are recommended:  
Ott, Henry W., “Noise Reduction Techniques in Electronic  
Systems”, John Wiley & Sons, New York, 1976.  
“Guide to CRT Video Design”, National Semiconductor Appli-  
cation Note 861.  
EFFECT OF LOAD CAPACITANCE  
Figure 8 shows the effect of increased load capacitance on  
the speed of the device. This demonstrates the importance  
of knowing the load capacitance in the application.  
“Video Amplifier Design for Computer Monitors”, National  
Semiconductor Application Note 1013.  
Pease, Robert A., “Troubleshooting Analog Circuits”,  
Butterworth-Heinemann, 1991.  
EFFECT OF OFFSET  
Because of its high small signal bandwidth, the part may os-  
cillate in a monitor if feedback occurs around the video chan-  
nel through the chassis wiring. To prevent this, leads to the  
video amplifier input circuit should be shielded, and input cir-  
cuit wiring should be spaced as far as possible from output  
circuit wiring.  
Figure 7 shows the variation in rise and fall times when the  
output offset of the device is varied from 40 VDC to 50 VDC  
.
The rise time shows a maximum variation relative to the cen-  
ter data point (45 VDC) of about 21%. The fall time shows a  
variation of about 3% relative to the center data point.  
THERMAL CONSIDERATIONS  
NSC DEMONSTRATION BOARD  
Figure 4 shows the performance of the LM2409 in the test  
circuit shown in Figure 2 as a function of case temperature.  
The figure shows that the rise time of the LM2409 increases  
by approximately 3% as the case temperature increases  
from 50˚C to 100˚C. This corresponds to a speed degrada-  
tion of 0.6% for every 10˚C rise in case temperature. The fall  
time increases by approximately 3% which corresponds to a  
speed degradation of 0.6% for every 10˚C rise in case tem-  
perature.  
Figure 11 shows routing and component placement on the  
NSC LM1279/2409 demonstration board. The schematic of  
the board is shown in Figure 10. This board provides a good  
example of a layout that can be used as a guide for future  
layouts. Note the location of the following components:  
C55 — VCC bypass capacitor, located very close to pin 6  
and ground pins  
C43, C44 — VBB bypass capacitors, located close to pin  
10 and ground  
Figure  
6 shows the maximum power dissipation of the  
LM2409 vs Frequency when all three channels of the device  
are driving an 8 pF load with a 40 Vp-p alternating one pixel  
on, one pixel off signal. The graph assumes a 72% active  
time (device operating at the specified frequency) which is  
typical in a monitor application. The other 28% of the time  
the device is assumed to be sitting at the black level (65V in  
this case). This graph gives the designer the information  
needed to determine the heat sink requirement for the appli-  
cation. The designer should note that if the load capacitance  
is increased the AC component of the total power dissipation  
will also increase.  
C53–C55 — VCC bypass capacitors, near LM2409 and  
VCC clamp diodes. Very important for arc protection.  
The routing of the LM2409 outputs to the CRT is very critical  
to achieving optimum performance. Figure 12 shows the  
routing and component placement from pin 1 of the LM2409  
to the blue cathode. Note that the components are placed so  
that they almost line up from the output pin of the LM2409 to  
the blue cathode pin of the CRT connector. This is done to  
minimize the length of the video path between these two  
components. Note also that D14, D15, R29 and D13 are  
placed to minimize the size of the video nodes that they are  
attached to. This minimizes parasitic capacitance in the  
video path and also enhances the effectiveness of the pro-  
tection diodes. The anode of protection diode D14 is con-  
nected directly to a section of the the ground plane that has  
a short and direct path to the LM2409 ground pins. The cath-  
ode of D15 is connected to VCC very close to decoupling ca-  
pacitor C55 (see Figure 12) which is connected to the same  
section of the ground plane as D14. The diode placement  
and routing is very important for minimizing the voltage  
The LM2409 case temperature must be maintained below  
115˚C.  
If the maximum expected ambient temperature is 70˚C and  
the maximum power dissipation is 3.4W (from Figure 6, 40  
MHz bandwidth) then a maximum heat sink thermal resis-  
tance can be calculated:  
5
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Application Hints (Continued)  
stress on the LM2409 during an arc over event. Lastly, notice  
that S3 is placed very close to the blue cathode and is tied  
directly to CRT ground.  
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6
Application Hints (Continued)  
DS100838-14  
FIGURE 11. LM1279/240X Demo Board Layout  
7
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Application Hints (Continued)  
DS100838-15  
FIGURE 12. Trace Routing and Component Placement for Blue Channel Output  
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8
Physical Dimensions inches (millimeters) unless otherwise noted  
NS Package Number TA11B  
Order Number LM2409T  
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NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT  
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL  
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:  
1. Life support devices or systems are devices or  
systems which, (a) are intended for surgical implant  
into the body, or (b) support or sustain life, and  
whose failure to perform when properly used in  
accordance with instructions for use provided in the  
labeling, can be reasonably expected to result in a  
significant injury to the user.  
2. A critical component is any component of a life  
support device or system whose failure to perform  
can be reasonably expected to cause the failure of  
the life support device or system, or to affect its  
safety or effectiveness.  
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