LM2758TLX [NSC]
Switched Capacitor Flash LED Driver in micro SMD; 开关电容闪光灯的micro SMD LED驱动器
| 型号： | LM2758TLX |
| 厂家： | 
National Semiconductor |
| 描述： | Switched Capacitor Flash LED Driver in micro SMD |
| 文件： | 总14页 (文件大小：1001K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
October 9, 2009
LM2758
Switched Capacitor Flash LED Driver in micro SMD
General Description
Features
LM2758 is an integrated low-noise, high-current switched ca-
pacitor DC/DC converter with a regulated current sink. The
device is capable of driving loads up to 700 mA from a single-
cell Li-Ion battery. Maximum efficiency is achieved over the
input voltage range by actively selecting the proper gain
based on the LED forward voltage and current requirements.
Up to 700 mA Output Current
■
■
Ultra-Small Solution Size
—No Inductor, Only 4 Capacitors and a resistor Required
—1.514 mm x 1.996 mm x 0.6 mm thin micro SMD
package
90% Peak Efficiency
■
■
■
One external low-power resistor sets the desired current for
Indicator, Torch and Flash modes. To protect the devices and
the flash LED, internal Time-out circuitry turns off the LM2758
in case of a faulty prolonged Flash mode. Internal soft-start
circuitry limits the amount of inrush current during start-up.
Indicator, Torch and Flash Modes
Time-Out Circuitry Limits Flash Duration to 814 msec.
(typ.)
Adaptive 1x and 1.5x Gains for Maximum Efficiency
■
■
■
True Shutdown
LM2758 is offered in National’s tiny 12-bump thin micro SMD
package.
Internal Soft-Start Eliminates Inrush Current
Applications
Camera Flash in Mobile Phones
■
■
Flash for Digital Cameras
Typical Application Circuit
30045301
© 2009 National Semiconductor Corporation
300453
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Connection Diagram
12-Bump Thin Micro SMD
1.514mm x 1.996mm x 0.6mm
NS Package Number TLA12
30045302
Pin Descriptions
Pin
C1
B2
Name
VIN
Description
Supply voltage connection.
CPOUT
Charge pump regulated output. A 2.2 µF ceramic capacitor is required from CPOUT to
GND. Connect flash LED anode to this pin.
B1
D2
C2
D1
A2
C1+
C1−
Flying capacitor pins. A 1 µF ceramic capacitor should be connected from C1+ to C1−
and from C2+ to C2−.
C2+
C2−
SGND
Analog and control ground for charge pump. This pin should be connected directly to a
low impedance ground plane.
C3
A1
B3
A3
LED−
EN1
EN2
ISET
Regulated current source output. Connect flash LED cathode to this pin.
The EN1 and EN2 pins are used to select the modes (Torch, Indictor, Flash), as well as
to put the part into Shutdown mode.
LED current programming resistor pin. A resistor connected between this pin and GND
are used to set Torch, Flash and Indicator currents.
D3
PGND
Power ground for the charge pump and the current source. This pin should be connected
directly to a low impedance ground plane.
Ordering Information
Order Number
LM2758TL
Supplied as Tape and Reel (Units)
250 units, tape and reel
LM2758TLX
3000 units, tape and reel
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2
Absolute Maximum Ratings (Note 1, Note
2)
Operating Ratings (Note 1, Note 2)
Input Voltage Range
2.7V to 5.5V
Junction Temperature Range (TJ)
-40°C to +125°C
-40°C to +85 °C
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Ambient Temperature Range (TA)
(Note 6)
VIN, CPOUT pins: Voltage to GND
EN1, EN2 pins: Voltage to GND
-0.3V to 6.0V
-0.3V to (VIN + 0.3V)
w/ 6.0V max
Thermal Information
Junction-to-Ambient Thermal Resistance
56°C/W
Continuous Power Dissipation
(Note 3)
Resistance (θJA), micro SMD package
(Note 7)
Internally Limited
150°C
Junction Temperature (TJ-MAX
)
Storage Temperature Range
-65°C to 150°C
(Note 5)
Maximum Lead Temp. (Soldering)
ESD Ratings (Note 4)
Human Body Model
2kV
Machine Model
200V
ESD Caution Notice
National Semiconductor recommends that all integrated circuits be handled with appropriate ESD precautions. Failure to observe
proper ESD handling techniques can result in damage to the device.
Electrical Characteristics
(Note 2, Note 8)
Limits in standard typeface are for TJ = 25°C. Limits in boldface type apply over the full operating junction temperature range (-40°
C ≤ TJ ≤ +125 °C). Unless otherwise noted, specifications apply to the LM2758 Typical Application Circuit (pg.1) with VIN = 3.6V,
VEN1 = VIN, VEN2 = 0V, C1 = C2 = 1 µF, CIN = COUT = 2.2 µF, RSET = 20 kΩ (Note 9).
Symbol
ILED
Parameter
LED Current Accuracy
ISET Pin Voltage
Conditions
Min
450
Typ
500
Max
550
Units
mA
V
ILED = 500 mA, Flash Mode
VSET
1.3
ID/ISET
LED Current to Set Current Flash Mode
7650
1639
Ratio
Torch Mode
ILED-IND
1/32 x
ILED-
Indicator Mode
32 kHZ PWM Mode
Indicator Current Level
mA
TORCH
VGDX
1x to 1.5x Gain Transition
Voltage Threshold on
IOUT = 500 mA
300
mV
V
VLED
-
VOUT
Output Voltage
1x Mode, IOUT = 0 mA
VIN
4.8
1.5x Mode, IOUT = 0 mA (Note 10)
IOUT = 200 mA, VIN = 3.3V
5.3
ROUT
1x Mode Output
Impedance
0.33
0.53
Ω
1.5x Mode Output
Impedance
IOUT = 500 mA, VIN = 3.3V (Note 11)
1.5
2.0
FSW
IQ
Switching Frequency
Quiescent Current
1.25
0.7
4
1.5
0.8
5
MHz
mA
0.8
IOUT = 0 mA 1x Mode
IOUT = 0 mA 1.5x Mode
Device Disabled (Note 12)
(Note 13)
ISD
Shutdown Current
Time-out Duration
Input Logic High
Input Logic Low
0.01
814
1
µA
msec
V
TOUT
VIH
VIL
640
1.2
1000
Pins: EN1, EN2
Pins: EN1, EN2
0.4
V
3
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Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation
of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions,
see the Electrical Characteristics tables.
Note 2: All voltages are with respect to the potential to the GND pin.
Note 3: Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ=150°C (typ.) and disengages at TJ =
140°C (typ.).
Note 4: The Human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. The machine model is a 200pF capacitor discharged
directly into each pin. MIL-STD-883 3015.7
Note 5: For detailed soldering specifications and information, please refer to National Semiconductor Application Note AN-1112.
Note 6: In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be
derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operation junction temperature (TJ-MAX-OP = 125ºC), the maximum power
dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application (θJA), as given by the
following equation: TA-MAX = TJ-MAX-OP - (θJA × PD-MAX).
Note 7: Junction-to-ambient thermal resistance (θJA) is taken from a thermal modeling result, performed under the conditions and guidelines set forth in the
JEDEC standard JESD51-7. The test board is a 4–layer FR-4 board measuring 102 mm x 76 mm x 1.6 mm with a 2x1 array of thermal vias. The ground plane
on the board is 50 mm x 50 mm. Thickness of copper layers are 53µm/35µm/35µm/53µm (1.5oz/1oz/1oz/1.5oz). Ambient temperature in simulation is 22°C, still
air. Power dissipation is 1W.
The value of θJA of this product in this micro SMD could fall in a range as wide as 50ºC/W to 150ºC/W (if not wider), depending on PWB material, layout, and
environmental conditions. In applications where high maximum power dissipation exists (high VIN, high IOUT), special care must be paid to thermal dissipation
issues.
Note 8: Min and Max limits are guaranteed by design, test, or statistical analysis. Typical (Typ) numbers are not guaranteed, but do represent the most likely
norm. Unless otherwise specified, conditions for Typ specifications are: VIN = 3.6V and TA = 25°C.
Note 9: CIN, COUT, C1, C2: Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) used in setting electrical characteristics.
Note 10: Output voltage is internally limited not to exceed maximum specified value.
Note 11: These specification table entries are guaranteed by design. These parameters are not guaranteed by production testing. The temperature limits for test
are (-40°C ≤ TA ≤ +85°C).
Note 12: The temperature limits for ISD (shutdown current) test are -40°C ≤ TA ≤ +85°C, as in Shutdown mode ambient temperature is equal to junction
temperature.
Note 13: The time-out specifications are calculated values based on the switching frequency spread.
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4
Block Diagram
30045319
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Typical Performance Characteristics
Unless otherwise specified: TA = 25°C, VIN = 3.6V, CIN = COUT = 2.2 µF, C1 = C2 = 1 µF. Capacitors are low-ESR multi-layer
ceramic capacitors (MLCC's). Luxeon PWF1 Flash LED.
Efficiency vs VIN
Oscillator Frequency vs VIN
30045304
30045305
Quiescent Current vs VIN
Shutdown Current vs VIN
30045307
30045306
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ILED vs VLED-
LED Current vs RSET
30045308
30045309
Shutdown to Flash Mode
VIN = 3.6V, ILED = 500 mA
Shutdown to Torch Mode
VIN = 3.6V, ILED = 108 mA, Gain = 1x, EN1 = 0V
30045310
30045311
Shutdown to Indicator Mode
VIN = 3.6V, ILED(Torch) = 108 mA, EN2 = 0V
Indicator Mode
EN1 = VIN = 3.6V, ILED(Torch) = 108 mA, Gain = 1x, EN2 = 0V
30045312
30045313
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Torch to Flash Mode Transition
EN2 = VIN = 3.6V, ILED(Flash) = 500 mA, Gain = 1.5x
Indicator to Flash Mode Transition
EN1 = VIN = 3.6V, ILED(Flash) = 500 mA, Gain = 1.5x
30045315
30045314
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8
where excessive current is drawn. Output current is limited to
1.2A typically.
Application Information
CIRCUIT DESCRIPTION
LOGIC CONTROL PINS
The LM2758 is an adaptive 1x and 1.5x CMOS charge pump,
optimized for driving Flash LEDs in camera phone and other
portable applications. It provides a constant current of 500 mA
(typ.) for Flash mode and 107 mA (typ.) for Torch mode with
RSET = 20 kΩ. These current can change, see SETTING LED
CURRENTS.
LM2758 has two logic pins, EN1 and EN2. The operating
modes of the part function according to the tables below:
EN1
EN2
Mode
Shutdown
Indicator
Torch
0
1
0
1
0
0
1
1
There are four modes of operation for LM2758: the Flash
Mode, Torch Mode, Indicator Mode and Shutdown Mode (see
EN1 and EN2 truth table). Torch and Flash modes sink a
constant DC current while Indicator mode operates in pulsat-
ing DC at 1/32 positive duty cycle with same current magni-
tude as Torch mode. The LED is driven from CPOUT and
connected to the current sink. LED drive current mode is pro-
grammed by connecting a resistor, RSET, to the current set
pin, ISET. LM2758 also controls CPOUT with variable gain (1x
or 1.5x) and adjustable impedance (ROUT) to provide an out-
put voltage that would account for LED forward voltage drop
and headroom for the current sink to drive desired current
through LED.
Flash
FLASH TIME-OUT FEATURE
Flash Time-out Protection Circuitry disables the current sinks
when the signal on EN1 and EN2 is held high for more than
814 msec (typ.). This prevents the device from self-heating
due to the high power dissipation during Flash conditions.
During the time-out condition, voltage will still be present on
CPOUT but the current sinks will be shut off, resulting in no
current through the Flash LED. When the device goes into a
time-out condition, placing a logic Low signal on EN1 and EN2
will reset the time-out; a subsequent logic High signal on EN1
or EN2 will return the device to normal operation.
CHARGE PUMP AND GAIN TRANSITIONS
The input to the 1x/1.5x charge pump is connected to the
VIN pin, and the loosely regulated output of the charge pump
is connected to the CPOUT pin. In 1x mode, as long as the
input voltage is less than 4.7V, the output voltage is approxi-
mately equal to the input voltage. When input voltage is over
4.7V the output voltage gets regulated to 4.7V. In 1.5x mode,
the output voltage is always less than or equal to 4.7V over
entire input voltage range.
SETTING LED CURRENTS
The current through the LED can be set by connecting an
appropriately sized resistor RSET between the ISET pin of the
LM2758 and GND.
The LED current in Torch mode is approximately 1639 times
greater than the current of ISET, while the LED current in Flash
mode is approximately 7650 times of the same ISET current.
The feedback loop of an internal amplifier sets the voltage of
the ISET pin to 1.3V (typ.). The statements above are simplified
in the equations below:
The charge pump’s gain is selected depending on the head-
room voltage across the current sink of LM2758. When head-
room voltage VLED- (at LED pin) drops below 300 mV (typ.)
the charge pump gain transition happens from 1x to 1.5x to
maintain current regulation across the LED. Once the charge
pump transition to a higher gain, it will remain at that gain for
as long as the device remains enabled. Shutting down and
then re-enabling the device will resets the gain mode to the
minimum gain required to maintain the load.
ILED = GAINFLASH/TORCH x (1.3/RSET
)
The maximum recommended current through LED is 500 mA
in Torch mode / 700 mA in Flash mode. Note: If the ISET for
Torch Mode setting at 500 mA, the Flash mode would be over
700 mA (max). See the graph LED Current vs RSET. Using the
part in conditions where the junction temperature might rise
above the rated maximum requires that the operating ranges
and/or conditions be de-rated. The printed circuit board also
must be carefully laid out to account for high thermal dissipa-
tion in the part.
SOFT START
The LM2758 contains internal soft-start circuitry to limit inrush
currents when the part is enabled. Soft start is implemented
internally with a controlled turn-on of the internal voltage ref-
erence.
CURRENT LIMIT PROTECTION
The LM2758 charge pump contains current limit protection
circuitry that protects the device during VOUT fault conditions
9
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ANALOG BRIGHTNESS CONTROL
30045318
The current though the LED could be varied dynamically by
changing the ISET current. The above figure shows the circuit.
The current though the LED can be calculated as follows.
tance tolerance (as good as ±10%) and hold their value over
temperature (X7R: ±15% over -55°C to 125°C; X5R: ±15%
over -55°C to 85°C). Capacitors with Y5V or Z5U temperature
characteristic are generally not recommended for use with the
LM2758. Capacitors with these temperature characteristics
typically have wide capacitance tolerance (+80%, -20%) and
vary significantly over temperature (Y5V: +22%, -82% over
-30°C to +85°C range; Z5U: +22%, -56% over +10°C to +85°
C range). Under some conditions, a nominal 1 μF Y5V or Z5U
capacitor could have a capacitance of only 0.1 μF. Such detri-
mental deviation is likely to cause Y5V and Z5U capacitors to
fail to meet the minimum capacitance requirements of the
LM2758. The voltage rating of the output capacitor should be
6.3V or more. For example, a 6.3V 0603 2.2 μF output ca-
pacitor (TDK C1608X5R0J225) is acceptable for use with the
LM2758, as long as the capacitance on the output does not
fall below a minimum of 1 μF in the intended application. All
other capacitors should have a voltage rating at or above the
maximum input voltage of the application and should have a
minimum capacitance of 1 μF.
30045317
CAPACITOR SELECTION
The LM2758 requires 4 external capacitors for proper opera-
tion. Surface-mount multi-layer ceramic capacitors are rec-
ommended. These capacitors are small, inexpensive and
have very low equivalent series resistance (ESR <20 mΩ
typ.). Tantalum capacitors, OS-CON capacitors, and alu-
minum electrolytic capacitors are not recommended for use
with the LM2758 due to their high ESR, as compared to ce-
ramic capacitors. For most applications, ceramic capacitors
with X7R or X5R temperature characteristic are preferred for
use with the LM2758. These capacitors have tight capaci-
Suggested Capacitors and Suppliers
Type MFG
MFG Part No.
Voltage Rating
Case Size
Inch (mm)
2.2 µF for CIN and COUT
C1608X5R0J225
JMK107BJ225
Ceramic X5R
Ceramic X5R
TDK
6.3V
6.3V
0603 (1608)
0603 (1608)
Taiyo-Yuden
1 µF for C1 and C2
C1608X5R0J105
JMK107BJ105M
Ceramic X5R
Ceramic X5R
TDK
6.3V
6.3V
0603 (1608)
0603 (1608)
Taiyo-Yuden
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10
POWER EFFICIENCY
tion temperature of the device does not exceed the maximum
operating rating of 125°C. The maximum ambient tempera-
ture rating must be derated in applications where high power
dissipation and/or poor thermal resistance causes the junc-
tion temperature to exceed 125°C.
Efficiency of LED drivers is commonly taken to be the ratio of
power consumed by the LEDs (PLED) to the power drawn at
the input of the part (PIN). With a 1x/1.5x charge pump, the
input current is equal to the charge pump gain times the output
current (total LED current). The efficiency of the LM2758 can
be predicted as follows:
MICRO SMD PACKAGE ASSEMBLY AND USE
Use of the micro SMD package requires specialized board
layout, precision mounting and careful re-flow techniques as
detailed in National Semiconductor Application Note 1112.
Refer to the section "Surface Mount Technology (SMD) As-
sembly Considerations". For best results in assembly, align-
ment ordinals on the PC board should be used to facilitate
placement of the device. The pad style used with the micro
SMD package must be the NSMD (non-solder mask defined)
typ. This means that the solder-mask opening is larger than
the pad size. This prevents a lip that otherwise forms if the
solder mask and pad overlap, from holding the device off the
surface of the board and interfering with mounting. See Ap-
plication Note 1112 for specific instructions how to do this.
The 12-bump package used for LM2758 has 300 micron sol-
der balls and requires 10.82 mils pads for mounting on the
circuit board. The trace to each pad should enter the pad with
a 90° entry angle to prevent debris from being caught in deep
corners. Initially, the trace to each pad should be 7 mil. wide,
for a section approximately 7 mil. long or longer, as a thermal
relief. Then each trace should neck up or down to its optimal
width. The important criteria is symmetry. This ensures the
solder bumps on the LM2758 re-flow evenly and that the de-
vice solders level to the board. In particular, special attention
must be paid to the pads for bumps C1 and D3, because
VIN and GND are typically connected to large copper planes,
thus inadequate thermal relief can result in late or inadequate
re-flow of these bumps.
PLED = VLED × ILED
PIN = VIN × IIN
PIN = VIN × (Gain × ILED + IQ)
E = (PLED ÷ PIN)
For a simple approximation, the current consumed by internal
circuitry (IQ) can be neglected, and the resulting efficiency will
become:
E = VLED ÷ (VIN × Gain)
Neglecting IQ will result in a slightly higher efficiency predic-
tion, but this impact will be negligible due to the value of IQ
being very low compared to the typical Torch and Flash cur-
rent levels (100-500 mA). It is also worth noting that efficiency
as defined here is in part dependent on LED voltage. Variation
in LED voltage does not affect power consumed by the circuit
and typically does not relate to the brightness of the LED. For
an advanced analysis, it is recommended that power con-
sumed by the circuit (VIN x IIN) be evaluated rather than power
efficiency.
THERMAL PROTECTION
Internal thermal protection circuitry disables the LM2758
when the junction temperature exceeds 150°C (typ.). This
feature protects the device from being damaged by high die
temperatures that might otherwise result from excessive pow-
er dissipation. The device will recover and operate normally
when the junction temperature falls below 140°C (typ.). It is
important that the board layout provide good thermal conduc-
tion to keep the junction temperature within the specified
operating ratings.
The micro SMD package is optimized for the smallest possi-
ble size in applications with red or infrared opaque cases.
Because the micro SMD package lacks the plastic encapsu-
lation characteristic of larger devices, it is vulnerable to light.
Backside metallization and/or epoxy coating, along with front
side shading by the printed circuit board, reduce this sensi-
tivity. However, the package has exposed die edges. In par-
ticular, micro SMD devices are sensitive to light, in the red
and infrared range, shining on the package’s exposed die
edges.
POWER DISSIPATION
The power dissipation (PDISSIPATION) and junction temperature
(TJ) can be approximated with the equations below. PIN is the
power generated by the 1x/1.5x charge pump, PLED is the
power consumed by the LEDs, TA is the ambient temperature,
and θJA is the junction-to-ambient thermal resistance for the
12–bump micro SMD package. VIN is the input voltage to the
LM2758, VLED is the nominal LED forward voltage, and ILED
is the programmed LED current.
BOARD LAYOUT CONSIDERATIONS
PC board layout is an important part of DC-DC converter de-
sign. Poor board layout can disrupt the performance of a DC-
DC converter and surrounding circuitry by contributing to EMI,
ground bounce, and resistive voltage loss in the traces. These
can send erroneous signals to the DC-DC converter IC, re-
sulting in poor regulation or instability. Poor layout can also
result in re-flow problems leading to poor solder joints be-
tween the micro SMD package and board pads. Poor solder
joints can result in erratic or degraded performance.
PDISSIPATION = PIN - PLED
= (Gain × VIN × ILED) − (VLED × ILED
TJ = TA + (PDISSIPATION × θJA
)
)
The junction temperature rating takes precedence over the
ambient temperature rating. The LM2758 may be operated
outside the ambient temperature rating, so long as the junc-
11
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Physical Dimensions inches (millimeters) unless otherwise noted
12–bump micro SMD
NS Package Number TLA12
X1 = 1.514 mm ± 30 µm
X2 = 1.996 mm ± 30 µm
X3 = 0.600 mm ± 75 µm
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12
Notes
13
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Technical Support Center
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Email: support@nsc.com
Tel: 1-800-272-9959
www.national.com
相关型号：
LM2760M5/NOPB
SWITCHED CAPACITOR REGULATOR, 750kHz SWITCHING FREQ-MAX, PDSO5, SOT-23, 5 PIN
ROCHESTER
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