LM3355 [NSC]

Regulated 50mA Buck-Boost Switched Capacitor DC/DC Converter; 稳压50mA的降压 - 升压型开关电容DC / DC转换器
LM3355
型号: LM3355
厂家: National Semiconductor    National Semiconductor
描述:

Regulated 50mA Buck-Boost Switched Capacitor DC/DC Converter
稳压50mA的降压 - 升压型开关电容DC / DC转换器

转换器 开关
文件: 总9页 (文件大小:182K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
December 2001  
LM3355  
Regulated 50mA Buck-Boost Switched Capacitor DC/DC  
Converter  
General Description  
Features  
±
n Regulated VOUT with 3% accuracy  
n Standard output voltage of 4.1V  
n Custom output voltages available from 1.8V to 4.1V in  
100 mV increments  
The LM3355 is a CMOS switched capacitor DC/DC con-  
verter that produces a regulated output voltage by automati-  
cally stepping up (boost) or stepping down (buck) the input  
voltage. It accepts an input voltage between 2.5V and 5.5V.  
The LM3355 is available with a standard output voltage of  
4.1V (ideal for white LED applications). If other output volt-  
age options between 1.8V and 4.1V are desired for other  
applications, please contact your National Semiconductor  
representative.  
n 2.5V to 5.5V input voltage  
n Up to 50 mA output current  
>
n
75% average efficiency  
n Uses few, low-cost external components  
n Very small solution size  
The LM3355’s proprietary buck-boost architecture enables  
up to 50 mA of load current at an average efficiency greater  
than 75%. Typical operating current is only 375 µA and the  
typical shutdown current is only 2.3 µA.  
n 375 µA typical operating current  
n 2.3 µA typical shutdown current  
n 1 MHz switching frequency (typical)  
n Architecture and control methods provide high load  
current and good efficiency  
The LM3355 is available in a 10-pin MSOP package. This  
package has a maximum height of only 1.1 mm.  
n MSOP-10 package  
n Over-temperature protection  
The high efficiency of the LM3355, low operating and shut-  
down currents, small package size, and the small size of the  
overall solution make this device ideal for battery powered,  
portable, and hand-held applications.  
Applications  
n White LED display backlights  
See the LM3352 for up to 200mA of output current.  
n 1-cell Lilon battery-operated equipment including PDAs,  
hand-held PCs, cellular phones  
n Flat panel displays  
n Hand-held instruments  
n NiCd, NiMH, or alkaline battery powered systems  
Typical Operating Circuit  
DS200219-1  
© 2001 National Semiconductor Corporation  
DS200219  
www.national.com  
Connection Diagram  
DS200219-2  
Top View  
MSOP-10 Pin Package  
See NS Package Number MUB10A  
Ordering Information  
Order Number  
LM3355MMX-4.1  
LM3355MM-4.1  
Package Type  
NSC Package Drawing  
MUB10A  
Supplied As  
MSOP-10  
MSOP-10  
3.5k Units, Tape and Reel  
1k Units, Tape and Reel  
MUB10A  
Pin Description  
Pin Number  
Name  
Function  
Input Supply Voltage  
Negative Terminal for C1  
Positive Terminal for C1  
Ground  
1
2
VIN  
C1−  
C1+  
GND  
GND  
CFIL  
SD  
3
4
5
Ground  
6
Filter Capacitor, a 1µF capacitor is recommended.  
Shutdown, active low  
7
8
VOUT  
C2−  
C2+  
Regulated Output Voltage  
9
Negative Terminal for C2  
10  
Positive Terminal for C2  
www.national.com  
2
Absolute Maximum Ratings (Note 1)  
If Military/Aerospace specified devices are required,  
please contact the National Semiconductor Sales Office/  
Distributors for availability and specifications.  
ESD Rating (Note 3)  
Human Body Model  
Machine Model  
1.5 kV  
100V  
Operating Ratings  
All Pins  
−0.5V to 5.6V  
Input Voltage (VIN  
Output Voltage (VOUT  
Ambient Temperature (TA) (Note 2)  
Junction Temperature (T ) (Note 2)  
)
2.5V to 5.5V  
1.8V to 4.1V  
Power Dissipation (TA = 25˚C)  
(Note 2)  
)
Internally Limited  
150˚C  
−40˚C to +85˚C  
−40˚C to +125˚C  
TJMAX (Note 2)  
θJA (Note 2)  
250˚C/W  
J
Storage Temperature  
Lead Temperature (Soldering, 5 sec.)  
−65˚C to +150˚C  
260˚C  
Electrical Characteristics  
Limits in standard typeface are for TA = 25˚C, and limits in boldface type apply over the full operating temperature range of  
−40˚C TA 85˚C. Unless otherwise specified: C1 = C2 = 0.33 µF; CIN = 10 µF; COUT = 10 µF; CFIL = 1 µF; VIN = 3.5V.  
Parameter  
LM3355-4.1  
Output Voltage (V  
Conditions  
Min (Note 5)  
Typ (Note 4)  
Max (Note 5)  
Units  
)
VIN = 3.5V; I  
= 50 mA  
LOAD  
4.038  
4.1  
4.1  
4.162  
OUT  
<
<
<
2.6V VIN 5.5V;  
3.977/3.936  
4.223/4.264  
<
1 mA ILOAD 50 mA  
V
<
<
2.5V VIN 5.5V;  
3.977/3.936  
4.1  
4.223/4.264  
<
<
1 mA ILOAD 40 mA  
Efficiency  
ILOAD = 10 mA  
80  
75  
%
ILOAD= 50 mA  
Output Voltage Ripple  
(Peak-to-Peak)  
ILOAD = 50 mA  
75  
mVP-P  
C
= 10 µF ceramic  
OUT  
LM3355-ALL OUTPUT VOLTAGE VERSIONS  
Operating Quiescent Current  
Measured at Pin VIN  
;
375  
475  
µA  
I
= 0A (Note 6)  
LOAD  
Shutdown Quiescent Current  
Switching Frequency  
SD Pin at 0V (Note 7)  
2.3  
1
5
µA  
MHz  
V
0.60  
1.40  
<
<
SD Input Threshold Low  
SD Input Threshold High  
SD Input Current  
2.5V VIN 5.5V  
0.2 VIN  
<
<
2.5V VIN 5.5V  
0.8 VIN  
V
Measured at SD Pin;  
SD Pin = VIN = 5.5V  
0.3  
µA  
Note 1: “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur. Operating Ratings are conditions for which the device is  
intended to be functional, but device parameter specifications may not be guaranteed. For guaranteed specifications and test conditions, see “Electrical  
Characteristics”.  
Note 2: As long as T +85˚C, all electrical characteristics hold true and the junction temperature should remain below +125˚C.  
A
Note 3: The Human Body Model is a 100 pF capacitor discharged through a 1.5 kresistor into each pin. The Machine Model is a 200 pF capacitor discharged  
directly into each pin.  
Note 4: Typical numbers are at 25˚C and represent the most likely norm.  
Note 5: All limits guaranteed at room temperature (standard typeface) and at temperature extremes (bold typeface). All room temperature limits are 100% tested  
or guaranteed through statistical analysis. All limits at temperature extremes are guaranteed by correlation using standard Statistical Quality Control methods (SQC).  
All limits are used to calculate Average Outgoing Quality Level (AOQL).  
Note 6: The V  
pin is forced to 200 mV above the typical V  
. This is to insure that the internal switches are off.  
OUT  
OUT  
Note 7: The output capacitor C  
is fully discharged before measurement.  
OUT  
3
www.national.com  
Typical Performance Characteristics Unless otherwise specified TA = 25˚C.  
VOUT vs. VIN  
VOUT vs. VIN  
DS200219-4  
DS200219-5  
Efficiency vs. VIN  
Load Transient Response  
DS200219-14  
DS200219-20  
Operating Quiescent  
Current vs. VIN  
Switching Frequency vs. VIN  
DS200219-23  
DS200219-24  
www.national.com  
4
Typical Performance Characteristics Unless otherwise specified TA = 25˚C. (Continued)  
Maximum VOUT Ripple vs. COUT  
Maximum VOUT Ripple vs. COUT  
DS200219-32  
DS200219-30  
Applications Information  
DS200219-3  
FIGURE 1. Block Diagram  
gain signal is sent to the phase generator which then sends  
the appropriate timing and configuration signals to the switch  
array. This dual loop provides regulation over a wide range of  
loads efficiently.  
Operating Principle  
The LM3355 is designed to provide a step-up/step-down  
voltage regulation in battery powered systems. It combines  
switched capacitor circuitry, reference, comparator, and  
shutdown logic in a single 10-pin MSOP package. The  
LM3355 can provide a regulated voltage between 1.8V and  
4.1V from an input voltage between 2.5V and 5.5V. It can  
supply a load current up to 50 mA.  
Since efficiency is automatically optimized, the curves for  
VOUT vs. VIN and Efficiency vs. VIN in the Typical Perfor-  
mance Characteristics section exhibit small variations. The  
reason is that as input voltage or output load changes, the  
digital control loops are making decisions on how to optimize  
efficiency. As the switch array is reconfigured, small varia-  
tions in output voltage and efficiency result. In all cases  
where these small variations are observed, the part is oper-  
ating correctly; minimizing output voltage changes and opti-  
mizing efficiency.  
As shown in Figure 1, the LM3355 employs two feedback  
loops to provide regulation in the most efficient manner  
possible. The first loop is from VOUT through the comparator  
COMP, the AND gate G1, the phase generator, and the  
switch array. The comparator’s output is high when VOUT is  
less than the reference VREF. Regulation is provided by  
gating the clock to the switch array. In this manner, charge is  
transferred to the output only when needed. The second  
loop controls the gain configuration of the switch array. This  
loop consists of the comparator, the digital control block, the  
phase generator, and the switch array. The digital control  
block computes the most efficient gain from a set of five  
gains based on inputs from the A/D and the comparator. The  
Charge Pump Capacitor Selection  
A 0.33 µF ceramic capacitor is suggested for C1 and C2. To  
ensure proper operation over temperature variations, an  
X7R dielectric material is recommended.  
5
www.national.com  
choice for low ripple, high frequency applications. However,  
the temperature stability of the ceramics is bad, except for  
the X7R and X5R dielectric types. High capacitance values  
Filter Capacitor Selection  
a) CAPACITOR TECHNOLOGIES  
>
(
1
µF) are achievable from companies such as  
The three major technologies of capacitors that can be used  
as filter capacitors for LM3355 are: i) tantalum, ii) ceramic  
and iii) polymer electrolytic technologies.  
Taiyo-yuden which are suitable for use with regulators. Ce-  
ramics are taller and larger than the tantalums of the same  
capacitance value.  
i) Tantalum  
iii) Polymer Electrolytic  
Tantalum capacitors are widely used in switching regulators.  
Tantalum capacitors have the highest CV rating of any tech-  
nology; as a result, high values of capacitance can be ob-  
tained in relatively small package sizes. It is also possible to  
obtain high value tantalum capacitors in very low profile  
Polymer electrolytic is a third suitable technology. Polymer  
capacitors provide some of the best features of both the  
ceramic and the tantalum technologies. They provide very  
low ESR values while still achieving high capacitance val-  
ues. However, their ESR is still higher than the ceramics,  
and their capacitance value is lower than the tantalums of  
the same size. Polymers offer good frequency stability (com-  
parable to ceramics) and good temperature stability (compa-  
rable to tantalums). The Aluminum Polymer Electrolytics  
offered by Cornell-Dubilier and Panasonic, and the POS-  
CAPs offered by Sanyo fall under this category.  
<
(
1.2 mm) packages. This makes the tantalums attractive  
for low-profile, small size applications. Tantalums also pos-  
sess very good temperature stability; i.e., the change in the  
capacitance value, and impedance over temperature is rela-  
tively small. However, the tantalum capacitors have relatively  
high ESR values which can lead to higher voltage ripple and  
their frequency stability (variation over frequency) is not very  
Table 1 compares the features of the three capacitor tech-  
nologies.  
>
good, especially at high frequencies ( 1 MHz).  
ii) Ceramic  
Ceramic capacitors have the lowest ESR of the three tech-  
nologies and their frequency stability is exceptionally good.  
These characteristics make the ceramics an attractive  
TABLE 1. Comparison of Capacitor Technologies  
Polymer  
Ceramic  
Tantalum  
High  
Electrolytic  
ESR  
Lowest  
Low  
<
Relative Height  
Low for Small Values ( 10 µF); Taller for  
Lowest  
Low  
Higher Values  
Relative Footprint  
Large  
Small  
Largest  
Good  
Good  
Low  
Temperature Stability  
Frequency Stability  
VOUT Ripple Magnitude  
VOUT Ripple Magnitude  
X7R/X5R-Acceptable  
Good  
Good  
Low  
Acceptable  
High  
<
>
@
@
50 mA  
100 mA  
Low  
Slightly Higher  
High  
Low  
@
dv/dt of VOUT Ripple All Loads  
Lowest  
Low  
b) CAPACITOR SELECTION  
ii) Input Capacitor (CIN  
)
The input capacitor CIN directly affects the magnitude of the  
input ripple voltage, and to a lesser degree the VOUT ripple.  
A higher value CIN will give a lower VIN ripple. To optimize  
low input and output ripple as well as size a 10 µF polymer  
electrolytic or ceramic, or 15 µF tantalum capacitor is rec-  
ommended. This will ensure low input ripple at 50 mA load  
current. If lower currents will be used or higher input ripple  
can be tolerated then a smaller capacitor may be used to  
reduce the overall size of the circuit. The lower ESR ceram-  
ics and polymer electrolytics achieve a lower VIN ripple than  
the higher ESR tantalums of the same value. Tantalums  
make a good choice for small size, very low profile applica-  
tions. The ceramics and polymer electrolytics are a good  
choice for low ripple, low noise applications where size is  
less of a concern. The 10 µF polymer electrolytics are physi-  
cally much larger than the 15 µF tantalums and 10 µF  
ceramics.  
i) Output Capacitor (COUT  
)
The output capacitor COUT directly affects the magnitude of  
the output ripple voltage so COUT should be carefully se-  
lected. The graphs titled VOUT Ripple vs. COUT in the Typical  
Performance Characteristics section show how the ripple  
voltage magnitude is affected by the COUT value and the  
capacitor technology. These graphs are taken at the gain at  
which worst case ripple is observed. In general, the higher  
the value of COUT, the lower the output ripple magnitude. At  
lighter loads, the low ESR ceramics offer a much lower VOUT  
ripple than the higher ESR tantalums of the same value. At  
higher loads, the ceramics offer a slightly lower VOUT ripple  
magnitude than the tantalums of the same value. However,  
the dv/dt of the VOUT ripple with the ceramics and polymer  
electrolytics is much lower than the tantalums under all load  
conditions. The tantalums are suggested for very low profile,  
small size applications. The ceramics and polymer electro-  
lytics are a good choice for low ripple, low noise applications  
where size is less of a concern.  
www.national.com  
6
Of the different capacitor technologies, a sample of vendors  
that have been verified as suitable for use with the LM3355  
are shown in Table 2.  
Filter Capacitor Selection (Continued)  
iii) CFIL  
A 1 µF, X7R ceramic capacitor should be connected to pin  
CFIL. This capacitor provides the filtering needed for the  
internal supply rail of the LM3355.  
TABLE 2. Capacitor Vendor Information  
Manufacturer  
Tel  
Fax  
Website  
www.t-yuden.com  
www.avxcorp.com  
www.vishay.com  
Ceramic  
Taiyo-yuden  
AVX  
(408) 573-4150  
(803) 448-9411  
(207) 324-4140  
(408) 573-4159  
(803) 448-1943  
(207) 324-7223  
Sprague/Vishay  
Tantalum  
Nichicon  
(847) 843-7500  
(508) 996-8561  
(619) 661-6322  
(847) 843-2798  
(508) 996-3830  
(619) 661-1055  
www.nichicon.com  
Polymer Electrolytic  
Cornell-Dubilier (ESRD)  
Sanyo (POSCAP)  
www.cornell-dubilier.com  
www.sanyovideo.com  
pump action once the junction temperature exceeds the  
thermal trip point, and re-enables the charge pump when the  
junction temperature falls back to a safe operating point.  
Thermal Protection  
During output short circuit conditions, the LM3355 will draw  
high currents causing a rise in the junction temperature.  
On-chip thermal protection circuitry disables the charge  
Typical Application Circuits  
DS200219-33  
FIGURE 2. Basic Buck/Boost Regulator  
DS200219-15  
FIGURE 3. Low Output Noise and Ripple Buck/Boost Regulator  
7
www.national.com  
capacitors as close to the IC as possible and to keep the  
traces between the capacitors and the IC short and direct.  
Use of a ground plane is recommended.  
Layout Considerations  
Due to the 1 MHz typical switching frequency of the LM3355,  
careful board layout is a must. It is important to place the  
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8
Physical Dimensions inches (millimeters) unless otherwise noted  
MSOP-10 Pin Package (MM)  
For Ordering, Refer to Ordering Information Table  
NS Package Number MUB10A  
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DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL  
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:  
1. Life support devices or systems are devices or  
systems which, (a) are intended for surgical implant  
into the body, or (b) support or sustain life, and  
whose failure to perform when properly used in  
accordance with instructions for use provided in the  
labeling, can be reasonably expected to result in a  
significant injury to the user.  
2. A critical component is any component of a life  
support device or system whose failure to perform  
can be reasonably expected to cause the failure of  
the life support device or system, or to affect its  
safety or effectiveness.  
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