LM360MX [NSC]
Homogeneous Material Composition Declaration for Electronic Products; 均质材料成分声明的电子产品
| 型号： | LM360MX |
| 厂家： | 
National Semiconductor |
| 描述： | Homogeneous Material Composition Declaration for Electronic Products |
| 文件： | 总2页 (文件大小：23K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Company
DUNS#
URL for Additional Information
National Semiconductor
04-147-2986
http://www.national.com/quality/green/
Contact
Title
Phone
Email
Product Ecology Engineer
Green.Project@nsc.com
Steve Osborne
1-408-721-7838
Part Number
MSL Rating
Peak Body Temp C
MaxTime (Sec)
Cycles
Unit Type
LM360MX
NOPB
1
260
40
4
Each
Document Date
Weight (mg)
European RoHS Compliant.
China RoHS Compliant
26-Apr-2008
69.76
Homogeneous Material Composition Declaration for Electronic Products
Item
Weight (mg) Component
CAS#
Weight (mg)
Item-ppm
Part-ppm
Plastic
44.71 SiO2
Epoxy Resin
Sb2O3
60676-86-0
25928-94-3
1309-64-4
36.215
810,000
162,000
20,000
519,138
103,828
12,818
7.243
0.894
0.358
20.036
0.493
0.025
0.006
2.346
0.014
1.600
0.203
0.068
0.180
0.080
Brominated Epoxy
40039-93-8
7440-50-8
7439-89-6
7440-66-6
7723-14-0
7440-21-3
7429-90-5
7440-31-5
7440-22-4
25928-94-3
7440-22-4
7440-57-5
8,000
974,500
24,000
5,127
287,209
7,073
354
Leadframe
20.56 Cu
Fe
Zn
1,200
P
300
88
Chip
2.36 Si
Al
994,000
6,000
33,627
203
Ext. LeadFinish
Die Attach
1.60 Sn
0.27 Ag
1,000,000
750,000
250,000
1,000,000
1,000,000
22,936
2,903
968
Epoxy Resin
Int. LeadFinish
Wires
0.18 Ag
0.08 Au
2,580
1,147
Note: The device content disclosed herewith is approximate and is based on engineering estimates only. It has not been verified through analytical testing.
Additionally, the following should be noted:
1. One or more dopant materials may be present in the silicon die at sub-ppm levels to provide semiconductor properties.
2. Epoxy resin components listed are generic and may or may not be the specific compound used, which is considered proprietary.
RoHS Material Composition Declaration
RoHS Definition: Quantity limit of 0.1% by mass (1000 PPM) in homogeneous material for: Lead (Pb), Mercury, Hexavalent
Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass
(100 PPM) of homogeneous material for Cadmium
RoHS Directive
2002/95/EC
Subject to the limitations below, National Semiconductor Corporation (“National”) certifies the following information as of the document date.
1. National products designated “ROHS Compliant” comply with the European Union’s Directive on the Restriction of the Use of Hazardous Substances
2002/95/EC (“RoHS”). These products do not contain Joint Industry Guide (JIG) -101 Level A substances above threshold limits, except lead in RoHS
exempt applications 5, 7a and 7c. These products do not contain perfluorooctane sulfonates (PFOS).
2. National products are manufactured in conformance with National specifications (SC) CSP-9-111C1 Supplier Environmental Requirements for
Materials and Products and (SC) CSP-9-111S2 List of Banned and Reportable Substances, which are available at www.national.com/quality/green/.
National has taken commercially reasonable steps to provide representative and accurate information but may not have independently verified information
provided or conducted chemical analysis of incoming materials. Equivalent compliant materials may have been substituted for those stated herein.
Material concentrations are the maximum expected concentration of the substances in the device and may not represent the actual concentration. National
and its suppliers consider certain limited information to be confidential and thus CAS numbers and other limited information may not be available for
release. National’s Standard Terms and Conditions of Sale apply to any issues arising out of or in connection with the information provided herein unless
otherwise provided by a written contract signed by both parties.
NATIONAL ACCEPTS NO DUTY TO NOTIFY USERS OF THIS DECLARATION OF UPDATES OR CHANGES TO THIS DECLARATION.
Gerry Fields
Vice President Quality
National Semiconductor
Page 1 of 2
Banned Substance Monitoring
Part Number
LM360MX NOPB
Document Date
26-Apr-2008
European RoHS Compliant.
China RoHS Compliant
Item# Material
Cd
<1
<2
<2
<2
<2
<2
CrVl
Pb
<1
<5
<5
30
15
<2
Hg
<30
<1
PBB
<10
<10
<10
NA
PBDE
<10
<10
<10
NA
Cl
Br
NA
<20
<20
NA
N/A
NA
Ref #
1000
637
32
1
2
3
4
5
6
CHIP
<1
<5
<5
<2
<2
<2
NA
<20
160
NA
N/A
NA
COMPOUND
EPOXY
EXTLF
<1
<2
595
53
FRAME
WIRE
<2
NA
NA
<2
NA
NA
132
* Cd: Cadmium, CrVI: Hexavalent Chromium, Pb: Lead, Hg: Mercury, ND: Not Detected
* Unless otherwise noted, units are in PPM (parts-per-million)
3rd Party Analysis (available upon request, subject to a non-disclosure agreement)
Ref #
1000
Analysis on 02/13/2008 by Balazs Analytical Services-Freemont CA per Report# 08-00823-00
Analysis on 03/14/2008 by ALS per Report# ATJB/0791BS/2008
Analysis on 03/14/2008 by ALS per Report# ATJB/0807BS/2008
Analysis on 03/14/2008 by SGS per Report# LPCI/03628/08
637
32
595
53
Analysis on 03/13/2007 by SGS per Report# LPCI/05143/07
Analysis on 04/09/2008 by SGS per Report# LPCI/06217/08
132
National Semiconductor
Page 2 of 2
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