LM4701T [NSC]

LM4701 Overture⑩ Audio Power Amplifier Series 30W Audio Power Amplifier with Mute and Standby Modes; LM4701 Overture⑩音频功率放大器系列30W音频功率放大器静音和待机模式
LM4701T
型号: LM4701T
厂家: National Semiconductor    National Semiconductor
描述:

LM4701 Overture⑩ Audio Power Amplifier Series 30W Audio Power Amplifier with Mute and Standby Modes
LM4701 Overture⑩音频功率放大器系列30W音频功率放大器静音和待机模式

放大器 功率放大器
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中文:  中文翻译
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March 1998  
Ovture  
LM4701 Overture Audio Power Amplifier Series  
30W Audio Power Amplifier with  
Mute and Standby Modes  
General Description  
The LM4701 is an audio power amplifier capable of deliver-  
ing typically 30W of continuous average output power into an  
8load with less than 0.1% (THD + N).  
Key Specifications  
n THD+N at 1 kHz at continuous average output power of  
25W into 8: 0.1% (max)  
n THD+N from 20 Hz to 20 kHz at 30W of continuous  
average output power into 8:  
n Standby current:  
0.08% (typ)  
2.1 mA (typ)  
The LM4701 has an independent smooth transition fade-in/  
out mute and a power conserving standby mode which can  
be controlled by external logic.  
Features  
n SPiKe Protection  
The performance of the LM4701, utilizing its Self Peak In-  
stantaneous Temperature (˚Ke) (SPiKe ) Protection Cir-  
cuitry, places it in a class above discrete and hybrid amplifi-  
ers by providing an inherently, dynamically protected Safe  
Operating Area (SOA). SPiKe Protection means that these  
parts are completely safeguarded at the output against over-  
voltage, undervoltage, overloads, including thermal runaway  
and instantaneous temperature peaks.  
n Minimal amount of external components necessary  
n Quiet fade-in/out mute function  
n Power conserving standby-mode  
n Non-Isolated 9-lead TO-220 package  
Applications  
n TVs  
n Component stereo  
n Compact stereo  
Typical Application  
Connection Diagram  
Plastic Package  
DS100835-2  
Top View  
Order Number LM4701T  
See NS Package Number TA9A  
For Staggered Lead Non-Isolated Package  
Only a 9-Pin Package  
DS100835-1  
*
Optional components dependent upon specific design requirements. Refer  
to the External Components Description section for a component functional  
description.  
FIGURE 1. Typical Audio Amplifier Application Circuit  
SPiKe Protection and Overture are trademarks of National Semiconductor Corporation.  
© 1999 National Semiconductor Corporation  
DS100835  
www.national.com  
Absolute Maximum Ratings (Notes 5, 4)  
If Military/Aerospace specified devices are required,  
please contact the National Semiconductor Sales Office/  
Distributors for availability and specifications.  
Junction Temperature (Note 8)  
Thermal Resistance  
θJC  
150˚C  
1.8˚C/W  
43˚C/W  
θJA  
Soldering Information  
TF Package (10 sec.)  
Storage Temperature  
Supply Voltage |VCC| + |VEE  
(No Signal)  
|
260˚C  
66V  
−40˚C TA  
Supply Voltage |VCC| + |VEE  
(with Input and Load)  
|
+150˚C  
64V  
(VCC or VEE) and  
|VCC| + |VEE| 60V  
60V  
Common Mode Input Voltage  
Operating Ratings (Notes 4, 5)  
Temperature Range  
Differential Input Voltage  
Output Current  
TMIN TA TMAX  
−20˚C TA +85˚C  
Internally Limited  
62.5W  
Supply Voltage |VCC| + |VEE| (Note 1)  
20V to 64V  
Power Dissipation (Note 6)  
ESD Susceptibility (Note 7)  
2000V  
Electrical Characteristics  
=
=
=
(Notes 4, 5) The following specifications are for VCC +28V, VEE −28V with RL 8, unless otherwise specified. Limits ap-  
=
ply for TA 25˚C.  
Symbol  
Parameter  
Conditions  
LM4701  
Typical Limit  
(Note 9) (Note 10)  
Units  
(Limits)  
|VCC| + |VEE  
|
Power Supply Voltage  
(Note 11)  
GND − VEE 9V  
18  
20  
64  
V (min)  
V (max)  
= =  
THD + N 0.1% (max), f 1 kHz  
PO  
Output Power  
=
=
=
(Note 3)  
(Continuous Average)  
RL 8, |VCC  
|
|VEE  
|
28V  
30  
22  
25  
15  
W/ch  
(min)  
=
=
=
RL 4, |VCC  
|
|VEE  
|
20V (Note 13)  
W/ch  
(min)  
=
THD + N  
Total Harmonic Distortion  
Plus Noise  
30W/ch, RL 8,  
0.08  
%
=
20 Hz f 20 kHz, AV 26 dB  
=
=
SR (Note 3)  
ITOTAL  
Slew Rate  
VIN 1.414 Vrms, trise 2 ns  
18  
12  
40  
V/µs (min)  
=
=
=
Total Quiescent Power  
Supply Current  
VCM 0V, VO 0V, IO 0 mA  
(Note 2)  
Standby: Off  
25  
mA (max)  
mA  
Standby: On  
2.1  
Standby Pin  
VIL  
VIH  
Standby Low Input Voltage  
Standby High Input Voltage  
Not in Standby Mode  
In Standby Mode  
0.8  
2.5  
V (max)  
V (min)  
2.0  
Mute Pin  
VIL  
Mute Low Input Voltage  
Mute High Input Voltage  
Mute Attenuation  
Output Not Muted  
Output Muted  
0.8  
2.5  
80  
V (max)  
V (min)  
VIH  
2.0  
115  
2.0  
=
AM  
VPIN8 2.5V  
dB (min)  
mV (max)  
µA (max)  
µA (max)  
APK (min)  
=
=
VOS (Note 2)  
Input Offset Voltage  
Input Bias Current  
VCM 0V, IO 0 mA  
15  
=
=
IB  
VCM 0V, IO 0 mA  
0.2  
0.5  
0.2  
2.9  
=
=
IOS  
IO  
Input Offset Current  
Output Current Limit  
VCM 0V, IO 0 mA  
0.002  
3.5  
=
= =  
10V, tON 10 ms,  
|VCC  
|
|VEE  
VO 0V  
|VCC − VO|, VCC 20V, IO +100 mA  
|
=
=
=
VOD  
Output Dropout Voltage  
(Note 12)  
1.8  
2.5  
115  
2.3  
3.2  
85  
V (max)  
V (max)  
dB (min)  
= =  
|VO − VEE|, VEE −20V, IO −100 mA  
(Note 2)  
PSRR  
(Note 2)  
= =  
VCC 30V to 10V, VEE −30V,  
Power Supply Rejection Ratio  
=
=
VCM 0V, IO 0 mA  
=
=
VCC 30V, VEE −30V to −10V  
110  
85  
dB (min)  
=
=
VCM 0V, IO 0 mA  
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2
Electrical Characteristics (Continued)  
=
=
=
(Notes 4, 5) The following specifications are for VCC +28V, VEE −28V with RL 8, unless otherwise specified. Limits ap-  
=
ply for TA 25˚C.  
Symbol  
Parameter  
Conditions  
LM4701  
Typical Limit  
(Note 9) (Note 10)  
Units  
(Limits)  
=
=
CMRR (Note  
2)  
Common Mode Rejection Ratio  
VCC 35V to 10V, VEE −10V to −35V,  
110  
80  
dB (min)  
=
=
VCM 10V to −10V, IO 0 mA  
=
=
AVOL (Note 2) Open Loop Voltage Gain  
RL 2 k, VO 30V  
110  
7.5  
2.0  
90  
5
dB (min)  
MHz (min)  
µV (max)  
=
=
GBWP  
eIN  
Gain-Bandwidth Product  
Input Noise  
fO 100 kHz, VIN 50 mVrms  
IHF — A Weighting Filter  
8
=
RIN 600(Input Referred)  
(Note 3)  
SNR  
=
Signal-to-Noise Ratio  
PO 1W, A-Weighted,  
98  
dB  
dB  
=
Measured at 1 kHz, RS 25Ω  
=
PO 25W, A-Weighted  
108  
=
Measured at 1 kHz, RS 25Ω  
Note 1: Operation is guaranteed up to 64V, however, distortion may be introduced from SPiKe Protection Circuitry if proper thermal considerations are not taken into  
account. Refer to the Application Information section for a complete explanation.  
Note 2: DC Electrical Test; Refer to Test Circuit #1.  
Note 3: AC Electrical Test; Refer to Test Circuit #2.  
Note 4: All voltages are measured with respect to the GND (pin 7), unless otherwise specified.  
Note 5: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is func-  
tional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which guar-  
antee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters where no limit is  
given, however, the typical value is a good indication of device performance.  
Note 6: For operating at case temperatures above 25˚C, the device must be derated based on a 150˚C maximum junction temperature and a thermal resistance of  
=
θ
1.8 ˚C/W (junction to case). Refer to the section, Determining the Correct Heat Sink, in the Application Information section.  
JC  
Note 7: Human body model, 100 pF discharged through a 1.5 kresistor.  
Note 8: The operating junction temperature maximum is 150˚C, however, the instantaneous Safe Operating Area temperature is 250˚C.  
Note 9: Typicals are measured at 25˚C and represent the parametric norm.  
Note 10: Limits are guarantees that all parts are tested in production to meet the stated values.  
Note 11:  
V
must have at least −9V at its pin with reference to ground in order for the under-voltage protection circuitry to be disabled. In addition, the voltage dif-  
EE  
ferential between V  
and V must be greater than 14V.  
EE  
CC  
Note 12: The output dropout voltage, V , is the supply voltage minus the clipping voltage. Refer to the Clipping Voltage vs. Supply Voltage graph in the Typical Per-  
OD  
formance Characteristics section.  
±
Note 13: For a 4load, and with 20V supplies, the LM4701 can deliver typically 22 Watts of continuous average power per channel with less than 0.1% (THD+N).  
±
With supplies above 20V, the LM4701 cannot deliver more than 22 watts into 4due to current limiting of the output transistors. Thus, increasing the power supply  
±
above 20V will only increase the internal power dissipation, not the possible output power. Increased power dissipation will require a larger heat sink as explained  
in the Application Information section.  
3
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#
Test Circuit 1 (Note 2) (DC Electrical Test Circuit)  
DS100835-3  
#
Test Circuit 2 (Note 3) (AC Electrical Test Circuit)  
DS100835-4  
Bridged Amplifier Application Circuit  
DS100835-5  
FIGURE 2. Bridged Amplifier Application Circuit  
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4
Single Supply Application Circuit  
DS100835-6  
FIGURE 3. Single Supply Amplifier Application Circuit  
Auxillary Amplifier Application Circuit  
DS100835-7  
FIGURE 4. Auxillary Amplifier Application Circuit  
5
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Equivalent Schematic (Excluding Active Protection Circuitry)  
DS100835-8  
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6
External Components Description  
Components  
Functonal Description  
1
2
RB  
Prevents currents from entering the amplifier’s non-inverting input which may be passed through to the  
load upon power down of the system due to the low input impedance of the circuitry when the  
undervoltage circuitry is off. This phenomenon occurs when the supply voltages are below 1.5V.  
RI  
Inverting input resistance to provide AC gain in conjunction with RF. Also creates a highpass filter with CI  
=
at fC 1/(2πRICI).  
3
4
5
RF  
Feedback resistance to provide AC gain in conjunction with RI.  
Feedback capacitor which ensures unity gain at DC.  
CI (Note 14)  
CS  
Provides power supply filtering and bypassing. Refer to the Supply Bypassing application section for  
proper placement and selection of bypass capacitors.  
6
7
RV  
(Note 14)  
Acts as a volume control by setting the input voltage level.  
RIN  
Sets the amplifier’s input terminals DC bias point when CIN is present in the circuit. Also works with CIN  
=
(Note 14)  
to create a highpass filter at fC 1/(2πRINCIN). Refer to Figure 4.  
8
CIN  
Input capacitor which blocks the input signal’s DC offsets from being passed onto the amplifier’s inputs.  
(Note 14)  
9
RSN  
Works with CSN to stabilize the output stage by creating a pole that reduces high frequency instabilities.  
=
(Note 14)  
The pole is set at fC 1/(2πRSNCSN). Refer to Figure 4.  
10  
CSN  
Works with RSN to stabilize the output stage by creating a pole that reduces high frequency instabilities.  
(Note 14)  
11  
12  
L (Note 14)  
Provides high impedance at high frequencies so that R may decouple a highly capacitive load and  
reduce the Q of the series resonant circuit. Also provides a low impedance at low frequencies to short  
out R and pass audio signals to the load. Refer to Figure 4.  
R (Note 14)  
13  
14  
15  
RA  
CA  
Provides DC voltage biasing for the transistor Q1 in single supply operation.  
Provides bias filtering for single supply operation.  
RINP  
Limits the voltage difference between the amplifier’s inputs for single supply operation. Refer to the  
(Note 14)  
Clicks and Pops application section for a more detailed explanation of the function of RINP  
Provides input bias current for single supply operation. Refer to the Clicks and Pops application section  
for a more detailed explanation of the function of RBI  
.
16  
17  
RBI  
.
RE  
Establishes a fixed DC current for the transistor Q1 in single supply operation. This resistor stabilizes the  
half-supply point along with CA.  
Note 14: Optional components dependent upon specific design requirements.  
7
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Typical Performance Characteristics  
THD + N vs Frequency  
THD + N vs Output Power  
THD + N vs Output Power  
THD + N vs Frequency  
THD + N vs Frequency  
THD + N vs Output Power  
THD + N vs Output Power  
DS100835-10  
DS100835-13  
DS100835-16  
DS100835-11  
DS100835-12  
THD + N vs Output Power  
DS100835-14  
DS100835-15  
THD + N vs Output Power  
DS100835-17  
DS100835-18  
Clipping Voltage vs  
Supply Voltage  
Clipping Voltage vs  
Supply Voltage  
Clipping Voltage vs  
Supply Voltage  
DS100835-19  
DS100835-20  
DS100835-21  
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8
Typical Performance Characteristics (Continued)  
Power Dissipation vs  
Output Power  
Power Dissipation vs  
Ouput Power  
Power Dissipation vs  
Output Power  
DS100835-22  
DS100835-23  
DS100835-24  
Output Power vs  
Load Resistance  
Output Power vs  
Supply Voltage  
Output Mute vs  
Mute Pin Voltage  
DS100835-25  
DS100835-26  
DS100835-27  
Pulse Response  
Large Signal Response  
Output Mute vs  
Mute Pin Voltage  
DS100835-28  
DS100835-29  
DS100835-30  
9
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Typical Performance Characteristics (Continued)  
Power Supply  
Rejection Ratio  
Common-Mode  
Rejection Ratio  
Open Loop  
Frequency Response  
DS100835-31  
DS100835-32  
DS100835-33  
Safe Area  
Spike Protection Response  
Supply Current vs  
Supply Voltage  
DS100835-35  
DS100835-34  
DS100835-36  
Pulse Thermal  
Resistance  
Pulse Thermal  
Resistance  
Supply Current vs  
Output Voltage  
DS100835-37  
DS100835-39  
DS100835-38  
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10  
Typical Performance Characteristics (Continued)  
Pulse Power Limit  
Pulse Power Limit  
Supply Current vs  
Case Temperature  
DS100835-40  
DS100835-41  
DS100835-42  
Standby Current (ICC) vs  
Standby Pin Voltage  
Supply Current (IEE) vs  
Standby Pin Voltage  
Input Bias Current vs  
Case Temperature  
DS100835-44  
DS100835-43  
DS100835-45  
turn-off, the output of the LM4701 is brought to ground be-  
fore the power supplies such that no transients occur at  
power-down.  
Application Information  
MUTE MODE  
By placing a logic-high voltage on the mute pin, the signal  
going into the amplifiers will be muted. If the mute pin is left  
floating or connected to a logic-low level, the amplifier will be  
in a non-muted state. Refer to the Typical Performance  
Characteristics section for curves concerning Mute Attenu-  
ation vs Mute Pin Voltage.  
OVER-VOLTAGE PROTECTION  
The LM4701 contains over-voltage protection circuitry that  
limits the output current to approximately 3.5 Apk while also  
providing voltage clamping, though not through internal  
clamping diodes. The clamping effect is quite the same,  
however, the output transistors are designed to work alter-  
nately by sinking large current spikes.  
STANDBY MODE  
The standby mode of the LM4701 allows the user to drasti-  
cally reduce power consumption when the amplifier is idle.  
By placing a logic-high voltage on the standby pin, the ampli-  
fier will go into Standby Mode. In this mode, the current  
drawn from the VCC supply is typically less than 10 µA total  
for both amplifiers. The current drawn from the VEE supply is  
typically 2.1 mA. Clearly, there is a significant reduction in  
idle power consumption when using the standby mode. Re-  
fer to the Typical Performance Characteristics section for  
curves showing Supply Current vs Standby Pin Voltage for  
both supplies.  
SPiKe PROTECTION  
The  
LM4701  
is  
protected  
from  
instantaneous  
peak-temperature stressing of the power transistor array.  
The Safe Operating Area graph in the Typical Performance  
Characteristics section shows the area of device operation  
where SPiKe Protection Circuitry is not enabled. The wave-  
form to the right of the SOA graph exemplifies how the dy-  
namic protection will cause waveform distortion when en-  
abled.  
THERMAL PROTECTION  
The LM4701 has a sophisticated thermal protection scheme  
to prevent long-term thermal stress of the device. When the  
temperature on the die reaches 165˚C, the LM4701 shuts  
down. It starts operating again when the die temperature  
drops to about 155˚C, but if the temperature again begins to  
rise, shutdown will occur again at 165˚C. Therefore, the de-  
vice is allowed to heat up to a relatively high temperature if  
UNDER-VOLTAGE PROTECTION  
Upon system power-up, the under-voltage protection cir-  
cuitry allows the power supplies and their corresponding ca-  
pacitors to come up close to their full values before turning  
on the LM4701 such that no DC output spikes occur. Upon  
11  
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SUPPLY BYPASSING  
Application Information (Continued)  
The LM4701 has excellent power supply rejection and does  
not require a regulated supply. However, to improve system  
performance as well as eliminate possible oscillations, the  
LM4701 should have its supply leads bypassed with  
low-inductance capacitors having short leads that are lo-  
cated close to the package terminals. Inadequate power  
supply bypassing will manifest itself by a low frequency oscil-  
lation known as “motorboating” or by high frequency insta-  
bilities. These instabilities can be eliminated through multiple  
bypassing utilizing a large tantalum or electrolytic capacitor  
(10 µF or larger) which is used to absorb low frequency  
variations and a small ceramic capacitor (0.1 µF) to prevent  
any high frequency feedback through the power supply lines.  
the fault condition is temporary, but a sustained fault will  
cause the device to cycle in a Schmitt Trigger fashion be-  
tween the thermal shutdown temperature limits of 165˚C and  
155˚C. This greatly reduces the stress imposed on the IC by  
thermal cycling, which in turn improves its reliability under  
sustained fault conditions.  
Since the die temperature is directly dependent upon the  
heat sink used, the heat sink should be chosen such that  
thermal shutdown will not be reached during normal opera-  
tion. Using the best heat sink possible within the cost and  
space constraints of the system will improve the long-term  
reliability of any power semiconductor device, as discussed  
in the Determining the Correct Heat Sink Section.  
If adequate bypassing is not provided, the current in the sup-  
ply leads which is a rectified component of the load current  
may be fed back into internal circuitry. This signal causes  
distortion at high frequencies requiring that the supplies be  
bypassed at the package terminals with an electrolytic ca-  
pacitor of 470 µF or more.  
DETERMINING MAXIMUM POWER DISSIPATION  
Power dissipation within the integrated circuit package is a  
very important parameter requiring a thorough understand-  
ing if optimum power output is to be obtained. An incorrect  
maximum power dissipation calculation may result in inad-  
equate heat sinking causing thermal shutdown and thus lim-  
iting the output power.  
BRIDGED AMPLIFIER APPLICATION  
One common power amplifier configuration is shown in Fig-  
ure 2 and is referred to as “bridged mode” operation. Bridged  
mode operation is different from the classical single-ended  
amplifier configuration where one side of the output load is  
connected to ground.  
Equation (1) exemplifies the theoretical maximum power dis-  
sipation point of each amplifier where VCC is the total supply  
voltage.  
PDMAX VCC2/2π2RL  
(1)  
=
A bridge amplifier design has a distinct advantage over the  
single-ended configuration, as it provides differential drive to  
the load, thus doubling output swing for a specified supply  
voltage. Consequently, theoretically four times the output  
power is possible as compared to a single-ended amplifier  
under the same conditions. This increase in attainable output  
power assumes that the amplifier is not current limited or  
clipped.  
Thus by knowing the total supply voltage and rated output  
load, the maximum power dissipation point can be calcu-  
lated. Refer to the graphs of Power Dissipation vs Output  
Power in the Typical Performance Characteristics section  
which show the actual full range of power dissipation not just  
the maximum theoretical point that results from equation (1).  
DETERMINING THE CORRECT HEAT SINK  
A direct consequence of the increased power delivered to  
the load by a bridge amplifier is an increase in internal power  
dissipation. For each operational amplifier in a bridge con-  
figuration, the internal power dissipation will increase by a  
factor of two over the single ended dissipation. Since there  
are two amplifiers used in a bridge configuration, the maxi-  
mum system power dissipation point will increase by a factor  
of four over the figure obtained by equation (1).  
The choice of a heat sink for a high-power audio amplifier is  
made entirely to keep the die temperature at a level such  
that the thermal protection circuitry does not operate under  
normal circumstances.  
The thermal resistance from the die (junction) to the outside  
air (ambient) is a combination of three thermal resistances,  
θJC, θCS and θSA. The thermal resistance, θJC (junction to  
case), of the LM4701 is 2˚C/W. Using Thermalloy Therma-  
cote thermal compound, the thermal resistance, θCS (case to  
sink), is about 0.2˚C/W. Since convection heat flow (power  
dissipation) is analogous to current flow, thermal resistance  
is analogous to electrical resistance, and temperature drops  
are analogous to voltage drops, the power dissipation out of  
the LM4701 is equal to the following:  
This value of PDMAX can be used to calculate the correct size  
heat sink for a bridged amplifier application, assuming that  
both IC’s are mounted on the same heatsink. Since the inter-  
nal dissipation for a given power supply and load is in-  
creased by using bridged-mode, the heatsink’s θSA will have  
to decrease accordingly as shown by equation (3). Refer to  
the section, Determining the Correct Heat Sink, for a more  
detailed discussion of proper heat sinking for a given appli-  
cation.  
=
PDMAX (TJMAX − TAMB)/θJA  
(2)  
=
where TJMAX 150˚C, TAMB is the system ambient tempera-  
=
ture and θJA θJC + θCS + θSA  
.
Once the maximum package power dissipation has been  
calculated using equation (1), the maximum thermal resis-  
tance, θSA, (in ˚C/W) for a heat sink can be calculated. This  
calculation is made using equation (3) which is derived by  
solving for θSA in equation (2).  
SINGLE-SUPPLY AMPLIFIER APPLICATION  
The typical application of the LM4701 is a split supply ampli-  
fier. But as shown in Figure 3, the LM4701 can also be used  
in a single power supply configuration. This involves using  
some external components to create  
a half-supply bias  
=
θSA [(TJMAX−TAMB)−PDMAX(θJC+θCS)]/PDMAX (3)  
which is used as the reference for the inputs and outputs.  
Thus, the signal will swing around half-supply much like it  
swings around ground in a split-supply application. Along  
with proper circuit biasing, a few other considerations must  
be accounted for to take advantage of all of the LM4701  
functions.  
Again it must be noted that the value of θSA is dependent  
upon the system designer’s amplifier requirements. If the  
ambient temperature that the audio amplifier is to be working  
under is higher than 25˚C, then the thermal resistance for the  
heat sink, given all other things are equal, will need to be  
smaller.  
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12  
based upon a specific application loading and thus, the sys-  
tem designer may need to adjust these values for optimum  
performance.  
Application Information (Continued)  
The LM4701 possesses a mute and standby function with in-  
ternal logic gates that are half-supply referenced. Thus, to  
enable either the mute or standby function, the voltage at  
these pins must be a minimum of 2.5V above half-supply. In  
single-supply systems, devices such as microprocessors  
and simple logic circuits used to control the mute and  
standby functions, are usually referenced to ground, not  
half-supply. Thus, to use these devices to control the logic  
circuitry of the LM4701, a “level shifter”, like the one shown  
in Figure 5, must be employed. A level shifter is not needed  
As shown in Figure 3, the resistors labeled RBI help bias up  
the LM4701 off the half-supply node at the emitter of the  
2N3904. But due to the input and output coupling capacitors  
in the circuit, along with the negative feedback, there are two  
different values of RBI, namely 10 kand 200 k. These re-  
sistors bring up the inputs at the same rate resulting in a pop-  
less turn-on. Adjusting these resistors values slightly may re-  
duce pops resulting from power supplies that ramp  
extremely quick or exhibit overshoot during system turn-on.  
in  
a split-supply configuration since ground is also  
half-supply.  
AUDIO POWER AMPLlFIER DESIGN  
Design a 25W/8Audio Amplifier  
Given:  
Power Output  
Load Impedance  
Input Level  
25 Wrms  
8Ω  
1 Vrms(max)  
47 kΩ  
Input Impedance  
Bandwidth  
±
20 Hz to 20 kHz 0.25 dB  
A designer must first determine the power supply require-  
ments in terms of both voltage and current needed to obtain  
the specified output power. VOPEAK can be determined from  
equation (4) and IOPEAK from equation (5).  
DS100835-9  
FIGURE 5. Level Shift Circuit  
When the voltage at the Logic Input node is 0V, the 2N3904  
is “off” and thus resistor RC pulls up mute or standby input to  
the supply. This enables the mute or standby function. When  
the Logic Input is 5V, the 2N3904 is “on” and consequently,  
the voltage at the collector is essentially 0V. This will disable  
the mute or standby function, and thus the amplifier will be in  
its normal mode of operation. RSHIFT, along with CSHIFT, cre-  
ates an RC time constant that reduces transients when the  
mute or standby functions are enabled or disabled. Addition-  
ally, RSHIFT limits the current supplied by the internal logic  
gates of the LM4701 which insures device reliability. Refer to  
the Mute Mode and Standby Mode sections in the Applica-  
tion Information section for a more detailed description of  
these functions.  
(4)  
(5)  
To determine the maximum supply voltage, the following  
conditions must be considered. Add the dropout voltage to  
the peak output swing VOPEAK, to get the supply rail at a cur-  
rent of IOPEAK. The regulation of the supply determines the  
unloaded voltage which is usually about 15% higher. The  
supply voltage will also rise 10% during high line conditions.  
Therefore the maximum supply voltage is obtained from the  
following equation:  
±
Max Supplies (VOPEAK + VOD) (1 + Regulation) (1.1)  
CLICKS AND POPS  
For 25W of output power into an 8load, the required VO  
-
In the typical application of the LM4701 as a split-supply au-  
dio power amplifier, the IC exhibits excellent “click” and “pop”  
performance when utilizing the mute and standby functions.  
In addition, the device employs Under-Voltage Protection,  
which eliminates unwanted power-up and power-down tran-  
sients. The basis for these functions are a stable and con-  
±
PEAK is 20V. A minimum supply rail of 25V results from add-  
ing VOPEAK and VOD. With regulation, the maximum supplies  
are 31.7V and the required IOPEAK is 2.5A from equation  
±
(5). At this point it is a good idea to check the Power Output  
vs Supply Voltage to ensure that the required output power is  
obtainable from the device while maintaining low THD+N. In  
addition, the designer should verify that with the required  
power supply voltage and load impedance, that the required  
heatsink value θSA is feasible given system cost and size  
constraints. Once the heatsink issues have been addressed,  
the required gain can be determined from equation (6).  
stant half-supply potential. In  
ground is the stable half-supply potential. But in  
single-supply application, the half-supply needs to charge up  
just like the supply rail, VCC  
a split-supply application,  
a
.
This makes the task of attaining a clickless and popless  
turn-on more challenging. Any uneven charging of the ampli-  
fier inputs will result in output clicks and pops due to the dif-  
ferential input topology of the LM4701.  
(6)  
From equation (6), the minimum AV is AV 14.14.  
To achieve a transient free power-up and power-down, the  
voltage seen at the input terminals should be ideally the  
same. Such a signal will be common-mode in nature, and  
will be rejected by the LM4701. In Figure 3, the resistor RINP  
serves to keep the inputs at the same potential by limiting the  
voltage difference possible between the two nodes. This  
should significantly reduce any type of turn-on pop, due to an  
uneven charging of the amplifier inputs. This charging is  
=
By selecting a gain of 21, and with a feedback resistor, RF  
20 k, the value of RI follows from equation (7).  
=
RI RF (AV − 1)  
(7)  
=
Thus with RJ 1 ka non-inverting gain of 21 will result.  
Since the desired input impedance was 47 k, a value of 47  
kwas selected for RIN. The final design step is to address  
the bandwidth requirements which must be stated as a pair  
of −3 dB frequency points. Five times away from a −3 dB  
13  
www.national.com  
The high frequency pole is determined by the product of the  
desired high frequency pole, fH, and the gain, AV. With a AV  
Application Information (Continued)  
=
=
point is 0.17 dB down from passband response which is bet-  
21 and fH 100 kHz, the resulting GBWP of 2.1 MHz is  
±
ter than the required 0.25 dB specified. This fact results in  
less than the minimum GBWP of 5 MHz for the LM4701. This  
will ensure that the high frequency response of the amplifier  
will be no worse than 0.17 dB down at 20 kHz which is well  
within the bandwidth requirements of the design.  
a low and high frequency pole of 4 Hz and 100 kHz respec-  
tively. As stated in the External Components section, RI in  
conjunction with CI create a high-pass filter.  
=
*
*
CI 1/(2π 1 k4 Hz) 39.8 µF; use 39 µF.  
www.national.com  
14  
Physical Dimensions inches (millimeters) unless otherwise noted  
Ovture  
For Staggered Lead Non-Isolated Package  
Only a 9-Pin Package  
Order Number LM4701T  
NS Package Number TA9A  
LIFE SUPPORT POLICY  
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT  
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL  
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:  
1. Life support devices or systems are devices or  
systems which, (a) are intended for surgical implant  
into the body, or (b) support or sustain life, and  
whose failure to perform when properly used in  
accordance with instructions for use provided in the  
labeling, can be reasonably expected to result in a  
significant injury to the user.  
2. A critical component is any component of a life  
support device or system whose failure to perform  
can be reasonably expected to cause the failure of  
the life support device or system, or to affect its  
safety or effectiveness.  
National Semiconductor  
Corporation  
Americas  
Tel: 1-800-272-9959  
Fax: 1-800-737-7018  
Email: support@nsc.com  
National Semiconductor  
Europe  
National Semiconductor  
Asia Pacific Customer  
Response Group  
Tel: 65-2544466  
Fax: 65-2504466  
National Semiconductor  
Japan Ltd.  
Tel: 81-3-5639-7560  
Fax: 81-3-5639-7507  
Fax: +49 (0) 1 80-530 85 86  
Email: europe.support@nsc.com  
Deutsch Tel: +49 (0) 1 80-530 85 85  
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Email: sea.support@nsc.com  
www.national.com  
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.  

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