LM4871 [NSC]

1.1W Audio Power Amplifier with Shutdown Mode; 1.1W音频功率放大器关断模式
LM4871
型号: LM4871
厂家: National Semiconductor    National Semiconductor
描述:

1.1W Audio Power Amplifier with Shutdown Mode
1.1W音频功率放大器关断模式

放大器 功率放大器
文件: 总8页 (文件大小:247K)
中文:  中文翻译
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February 2000  
LM4871  
1.1W Audio Power Amplifier with Shutdown Mode  
General Description  
Key Specifications  
The LM4871 is a bridge-connected audio power amplifier ca-  
pable of delivering typically 1.1W of continuous average  
n THD at 1 kHz at 1W continuous  
average output power into 8  
%
0.5 (max)  
%
power to an 8load with 0.5 (THD) from a 5V power sup-  
%
n Output power at 10 THD+N  
ply.  
1.5W (typ)  
at 1 kHz into 8Ω  
Boomer audio power amplifiers were designed specifically to  
provide high quality output power with a minimal amount of  
external components. Since the LM4871 does not require  
output coupling capacitors, bootstrap capacitors, or snubber  
networks, it is optionally suited for low-power portable sys-  
tems.  
n Shutdown Current  
0.6 µA (typ)  
Features  
n No output coupling capacitors, bootstrap capacitors, or  
snubber circuits are necessary  
The LM4871 features an externally controlled, low-power  
consumption shutdown mode, as well as an internal thermal  
shutdown protection mechanism.  
n Small Outline or DIP packaging  
n Unity-gain stable  
n External gain configuration capability  
n Pin compatible with LM4861  
The unity-gain stable LM4871 can be configured by external  
gain-setting resistors.  
Applications  
n Portable Computers  
n Desktop Computers  
n Low Voltage Audio Systems  
Typical Application  
Connection Diagram  
Small Outline and DIP Package  
DS100008-2  
Top View  
Order Number LM4871M or LM4871N  
See NS Package Number M08A or N08E  
DS100008-1  
FIGURE 1. Typical Audio Amplifier Application Circuit  
Boomer® is a registered trademark of National Semiconductor Corporation.  
© 2000 National Semiconductor Corporation  
DS100008  
www.national.com  
Absolute Maximum Ratings (Note 2)  
If Military/Aerospace specified devices are required,  
please contact the National Semiconductor Sales Office/  
Distributors for availability and specifications.  
Infrared (15 sec.)  
220˚C  
See AN-450 Surface Mounting and their Effects on  
Product Reliabilityfor other methods of  
soldering surface mount devices.  
θJC (typ) — M08A  
θJA (typ) — M08A  
θJC (typ) — N08E  
θJA (typ) — N08E  
35˚C/W  
140˚C/W  
37˚C/W  
Supply Voltage  
6.0V  
−65˚C to +150˚C  
−0.3V to VDD to +0.3V  
Internally Limited  
5000V  
Supply Temperature  
Input Voltage  
107˚C/W  
Power Dissipation (Note 3)  
ESD Susceptibility (Note 4)  
ESD Susceptibility (Note 5)  
Junction Temperature  
Soldering Information  
Small Outline Package  
Vapor Phase (60 sec.)  
Operating Ratings  
250V  
Temperature Range  
TMIN TA TMAX  
Supply Voltage  
150˚C  
−40˚C TA 85˚C  
2.0V VDD 5.5V  
215˚C  
Electrical Characteristics (Notes 1, 2)  
The following specifications apply for VDD = 5V unless otherwise specified. Limits apply for TA = 25˚C.  
LM4871  
Units  
Symbol  
Parameter  
Conditions  
Typical  
Limit  
(Limits)  
(Note 6)  
(Note 7)  
2.0  
VDD  
Supply Voltage  
V (min)  
V (max)  
mA (max)  
µA (max)  
mV (max)  
W (min)  
W
5.5  
IDD  
ISD  
VOS  
Po  
Quiescent Power Supply Current  
Shutdown Current  
VIN = 0V, Io = 0A  
6.5  
0.6  
5
10.0  
2
VPIN1 = VDD  
VIN = 0V  
Output Offset Voltage  
Output Power  
50  
%
THD = 0.5 (max); f = 1 kHz  
1.10  
1.5  
0.25  
1.0  
%
THD+N = 10 ; f = 1 kHz  
%
THD+N  
PSRR  
Total Harmonic Distortion+Noise  
Power Supply Rejection Ratio  
Po = 1 Wrms; AVD = 2; 20 Hz f  
20 kHz  
VDD = 4.9V to 5.1V  
65  
dB  
Note 1: All voltages are measured with respect to the ground pin, unless otherwise specified.  
Note 2: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is func-  
tional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which guar-  
antee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters where no limit is  
given, however, the typical value is a good indication of device performance.  
Note 3: The maximum power dissipation must be derated at elevated temperatures and is dictated by T  
, θ , and the ambient temperature T . The maximum  
JMAX JA  
A
allowable power dissipation is P  
= (T  
–T )/θ or the number given in Absolute Maximum Ratings, whichever is lower. For the LM4871, T  
= 150˚C. The  
JMAX  
DMAX  
JMAX  
A
JA  
typical junction-to-ambient thermal resistance is 140˚C/W for package number M08A and is 107˚C/W for package number N08E.  
Note 4: Human body model, 100 pF discharged through a 1.5 kresistor.  
Note 5: Machine Model, 220 pF–240 pF discharged through all pins.  
Note 6: Typicals are measured at 25˚C and represent the parametric norm.  
Note 7: Limits are guaranteed to National’s AOQL (Average Outgoing Quality Level).  
www.national.com  
2
External Components Description (Figure 1)  
Components  
Functional Description  
1.  
Ri  
Inverting input resistance which sets the closed-loop gain in conjunction with Rf. This resistor also forms a  
high pass filter with Ci at fC= 1/(2π RiCi).  
2.  
Ci  
Input coupling capacitor which blocks the DC voltage at the amplifiers input terminals. Also creates a  
highpass filter with Ri at fc = 1/(2π RiCi). Refer to the section, Proper Selection of External Components,  
for an explanation of how to determine the value of Ci.  
3.  
4.  
Rf  
Feedback resistance which sets the closed-loop gain in conjunction with Ri.  
CS  
Supply bypass capacitor which provides power supply filtering. Refer to the Power Supply Bypassing  
section for information concerning proper placement and selection of the supply bypass capacitor.  
5.  
CB  
Bypass pin capacitor which provides half-supply filtering. Refer to the section, Proper Selection of External  
Components, for information concerning proper placement and selection of CB.  
Typical Performance Characteristics  
THD+N vs Frequency  
THD+N vs Frequency  
THD+N vs Frequency  
DS100008-3  
DS100008-4  
DS100008-5  
THD+N vs Output Power  
THD+N vs Output Power  
THD+N vs Output Power  
DS100008-6  
DS100008-7  
DS100008-8  
Output Power vs  
Supply Voltage  
Output Power vs  
Supply Voltage  
Output Power vs  
Supply Voltage  
DS100008-9  
DS100008-10  
DS100008-11  
3
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Typical Performance Characteristics (Continued)  
Output Power vs  
Load Resistance  
Power Dissipation vs  
Output Power  
Power Derating Curve  
DS100008-12  
DS100008-13  
DS100008-14  
Clipping Voltage vs  
Supply Voltage  
Frequency Response vs  
Input Capacitor Size  
Noise Floor  
DS100008-15  
DS100008-16  
DS100008-17  
Power Supply  
Rejection Ratio  
Open Loop  
Frequency Response  
Supply Current vs  
Supply Voltage  
DS100008-20  
DS100008-18  
DS100008-19  
www.national.com  
4
package, θCS is the case to heat sink thermal resistance and  
θSA is the heat sink to ambient thermal resistance. By adding  
additional copper area around the LM4871, the θJA can be  
reduced from its free air value of 140˚C/W for package  
M08A. Depending on the ambient temperature, TA, and the  
θJA, Equation 2 can be used to find the maximum internal  
power dissipation supported by the IC packaging. If the re-  
sult of Equation 1 is greater than that of Equation 2, then ei-  
ther the supply voltage must be decreased, the load imped-  
ance increased, the θJA decreased, or the ambient  
temperature reduced. For the typical application of a 5V  
power supply, with an 8load, and no additional heatsink-  
ing, the maximum ambient temperature possible without vio-  
lating the maximum junction temperature is approximately  
61˚C provided that device operation is around the maximum  
power dissipation point and assuming surface mount pack-  
aging. Internal power dissipation is a function of output  
power. If typical operation is not around the maximum power  
dissipation point, the ambient temperature can be increased.  
Refer to the Typical Performance Characteristics curves  
for power dissipation information for different output powers  
and output loading.  
Application Information  
BRIDGE CONFIGURATION EXPLANATION  
As shown in Figure 1, the LM4871 has two operational am-  
plifiers internally, allowing for a few different amplifier con-  
figurations. The first amplifier’s gain is externally config-  
urable, while the second amplifier is internally fixed in a  
unity-gain, inverting configuration. The closed-loop gain of  
the first amplifier is set by selecting the ratio of Rf to Ri while  
the second amplifier’s gain is fixed by the two internal 40 kΩ  
resistors. Figure 1 shows that the output of amplifier one  
serves as the input to amplifier two which results in both am-  
plifiers producing signals identical in magnitude, but out of  
phase 180˚. Consequently, the differential gain for the IC is  
A
VD= 2 *(Rf/Ri)  
By driving the load differentially through outputs Vo1 and  
Vo2, an amplifier configuration commonly referred to as  
“bridged mode” is established. Bridged mode operation is  
different from the classical single-ended amplifier configura-  
tion where one side of its load is connected to ground.  
A bridge amplifier design has a few distinct advantages over  
the single-ended configuration, as it provides differential  
drive to the load, thus doubling output swing for a specified  
supply voltage. Four times the output power is possible as  
compared to a single-ended amplifier under the same condi-  
tions. This increase in attainable output power assumes that  
the amplifier is not current limited or clipped. In order to  
choose an amplifier’s closed-loop gain without causing ex-  
cessive clipping, please refer to the Audio Power Amplifier  
Design section.  
POWER SUPPLY BYPASSING  
As with any amplifier, proper supply bypassing is critical for  
low noise performance and high power supply rejection. The  
capacitor location on both the bypass and power supply pins  
should be as close to the device as possible. Typical applica-  
tions employ a 5V regulator with 10 µF and a 0.1 µF bypass  
capacitors which aid in supply stability. This does not elimi-  
nate the need for bypassing the supply nodes of the  
LM4871. The selection of bypass capacitors, especially CB,  
is dependent upon PSRR requirements, click and pop per-  
formance as explained in the section, Proper Selection of  
External Components, system cost, and size constraints.  
A bridge configuration, such as the one used in LM4871,  
also creates a second advantage over single-ended amplifi-  
ers. Since the differential outputs, Vo1 and Vo2, are biased  
at half-supply, no net DC voltage exists across the load. This  
eliminates the need for an output coupling capacitor which is  
required in a single supply, single-ended amplifier configura-  
tion. Without an output coupling capacitor, the half-supply  
bias across the load would result in both increased internal  
IC power dissipation and also possible loudspeaker damage.  
SHUTDOWN FUNCTION  
In order to reduce power consumption while not in use, the  
LM4871 contains a shutdown pin to externally turn off the  
amplifier’s bias circuitry. This shutdown feature turns the am-  
plifier off when a logic high is placed on the shutdown pin.  
The trigger point between a logic low and logic high level is  
typically half- supply. It is best to switch between ground and  
supply to provide maximum device performance. By switch-  
ing the shutdown pin to VDD, the LM4871 supply current  
draw will be minimized in idle mode. While the device will be  
disabled with shutdown pin voltages less then VDD, the idle  
current may be greater than the typical value of 0.6 µA. In ei-  
ther case, the shutdown pin should be tied to a definite volt-  
age to avoid unwanted state changes.  
POWER DISSIPATION  
Power dissipation is a major concern when designing a suc-  
cessful amplifier, whether the amplifier is bridged or single-  
ended. A direct consequence of the increased power deliv-  
ered to the load by a bridge amplifier is an increase in  
internal power dissipation. Equation 1 states the maximum  
power dissipation point for a bridge amplifier operating at a  
given supply voltage and driving a specified output load.  
PDMAX = 4*(VDD)2/(2π2RL)  
(1)  
In many applications, a microcontroller or microprocessor  
output is used to control the shutdown circuitry which pro-  
vides a quick, smooth transition into shutdown. Another solu-  
tion is to use a single-pole, single-throw switch in conjunction  
with an external pull-up resistor. When the switch is closed,  
the shutdown pin is connected to ground and enables the  
amplifier. If the switch is open, then the external pull-up re-  
sistor will disable the LM4871. This scheme guarantees that  
the shutdown pin will not float thus preventing unwanted  
state changes.  
Since the LM4871 has two operational amplifiers in one  
package, the maximum internal power dissipation is 4 times  
that of a single-ended ampifier. Even with this substantial in-  
crease in power dissipation, the LM4871 does not require  
heatsinking under most operating conditions and output  
loading. From Equation 1, assuming a 5V power supply and  
an 8load, the maximum power dissipation point is  
625 mW. The maximum power dissipation point obtained  
from Equation 1 must not be greater than the power dissipa-  
tion that results from Equation 2:  
PDMAX = (TJMAX–TA)/θJA  
(2)  
PROPER SELECTION OF EXTERNAL COMPONENTS  
For package M08A, θJA = 140˚C/W, and for package N08E,  
θJA = 107˚C/W assuming free air operation. TJMAX = 150˚C  
for the LM4871. The θJA can be decreased by using some  
form of heat sinking. The resultant θJA will be the summation  
of the θJC, θCS, and θSA. θJC is the junction to case of the  
Proper selection of external components in applications us-  
ing integrated power amplifiers is critical to optimize device  
and system performance. While the LM4871 is tolerant of  
5
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AUDIO POWER AMPLIFIER DESIGN  
Application Information (Continued)  
Design a 1W/8Audio Amplifier  
external component combinations, consideration to compo-  
nent values must be used to maximize overall system qual-  
ity.  
Given:  
Power Output  
Load Impedance  
Input Level  
1 Wrms  
8Ω  
The LM4871 is unity-gain stable which gives a designer  
maximum system flexibility. The LM4871 should be used in  
low gain configurations to minimize THD+N values, and  
maximize the signal to noise ratio. Low gain configurations  
require large input signals to obtain a given output power. In-  
put signals equal to or greater than 1 Vrms are available  
from sources such as audio codecs. Please refer to the sec-  
tion, Audio Power Amplifier Design, for a more complete  
explanation of proper gain selection.  
1 Vrms  
20 kΩ  
Input Impedance  
±
100 Hz–20 kHz 0.25 dB  
Bandwidth  
A designer must first determine the minimum supply rail to  
obtain the specified output power. By extrapolating from the  
Output Power vs Supply Voltage graphs in the Typical Per-  
formance Characteristics section, the supply rail can be  
easily found. A second way to determine the minimum sup-  
ply rail is to calculate the required Vopeak using Equation 3  
and add the output voltage. Using this method, the minimum  
Besides gain, one of the major considerations is the closed-  
loop bandwidth of the amplifier. To a large extent, the band-  
width is dictated by the choice of external components  
shown in Figure 1. The input coupling capacitor, Ci, forms a  
first order high pass filter which limits low frequency re-  
sponse. This value should be chosen based on needed fre-  
quency response for a few distinct reasons.  
supply voltage would be (Vopeak + (VOD  
+ VODBOT)), where  
VOD  
and VOD  
are extrapolated frToOmP the Dropout Volt-  
TOP  
age BvOsT Supply Voltage curve in the Typical Performance  
Characteristics section.  
Selection Of Input Capacitor Size  
Large input capacitors are both expensive and space hungry  
for portable designs. Clearly, a certain sized capacitor is  
needed to couple in low frequencies without severe attenua-  
tion. But in many cases the speakers used in portable sys-  
tems, whether internal or external, have little ability to repro-  
duce signals below 100 Hz to 150 Hz. Thus, using a large  
input capacitor may not increase actual system perfor-  
mance.  
(3)  
Using the Output Power vs Supply Voltage graph for an 8Ω  
load, the minimum supply rail is 4.6V. But since 5V is a stan-  
dard voltage in most applications, it is chosen for the supply  
rail. Extra supply voltage creates headroom that allows the  
LM4871 to reproduce peaks in excess of 1W without produc-  
ing audible distortion. At this time, the designer must make  
sure that the power supply choice along with the output im-  
pedance does not violate the conditions explained in the  
Power Dissipation section.  
In addition to system cost and size, click and pop perfor-  
mance is effected by the size of the input coupling capacitor,  
Ci. A larger input coupling capacitor requires more charge to  
reach its quiescent DC voltage (nominally 1/2 VDD). This  
charge comes from the output via the feedback and is apt to  
create pops upon device enable. Thus, by minimizing the ca-  
pacitor size based on necessary low frequency response,  
turn-on pops can be minimized.  
Once the power dissipation equations have been addressed,  
the required differential gain can be determined from Equa-  
tion 4.  
(4)  
Besides minimizing the input capacitor size, careful consid-  
eration should be paid to the bypass capacitor value. Bypass  
capacitor, CB, is the most critical component to minimize  
turn-on pops since it determines how fast the LM4871 turns  
on. The slower the LM4871’s outputs ramp to their quiescent  
DC voltage (nominally 1/2 VDD), the smaller the turn-on pop.  
Choosing CB equal to 1.0 µF along with a small value of Ci  
(in the range of 0.1 µF to 0.39 µF), should produce a virtually  
clickless and popless shutdown function. While the device  
will function properly, (no oscillations or motorboating), with  
=
Rf/Ri AVD/2  
(5)  
From Equation 4, the minimum AVD is 2.83; use AVD = 3.  
Since the desired input impedance was 20 k, and with a  
AVD impedance of 2, a ratio of 1.5:1 of Rf to Ri results in an  
allocation of Ri = 20 kand Rf = 30 k. The final design step  
is to address the bandwidth requirements which must be  
stated as a pair of −3 dB frequency points. Five times away  
from a −3 dB point is 0.17 dB down from passband response  
±
which is better than the required 0.25 dB specified.  
fL = 100 Hz/5 = 20 Hz  
CB equal to 0.1 µF, the device will be much more susceptible  
to turn-on clicks and pops. Thus, a value of CB equal to  
1.0 µF is recommended in all but the most cost sensitive de-  
signs.  
fH = 20 kHz * 5 = 100 kHz  
As stated in the External Components section, Ri in con-  
junction with Ci create a highpass filter.  
Ci 1/(2π*20 k*20 Hz) = 0.397 µF; use 0.39 µF  
The high frequency pole is determined by the product of the  
desired frequency pole, fH, and the differential gain, AVD  
.
With a AVD = 3 and fH = 100 kHz, the resulting GBWP =  
150 kHz which is much smaller than the LM4871 GBWP of  
4 MHz. This figure displays that if a designer has a need to  
design an amplifier with a higher differential gain, the  
LM4871 can still be used without running into bandwidth limi-  
tations.  
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6
Physical Dimensions inches (millimeters) unless otherwise noted  
Order Number LM4871M  
NS Package Number M08A  
Order Number LM4871N  
NS Package Number N08E  
7
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Notes  
LIFE SUPPORT POLICY  
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT  
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL  
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:  
1. Life support devices or systems are devices or  
systems which, (a) are intended for surgical implant  
into the body, or (b) support or sustain life, and  
whose failure to perform when properly used in  
accordance with instructions for use provided in the  
labeling, can be reasonably expected to result in a  
significant injury to the user.  
2. A critical component is any component of a life  
support device or system whose failure to perform  
can be reasonably expected to cause the failure of  
the life support device or system, or to affect its  
safety or effectiveness.  
National Semiconductor  
Corporation  
Americas  
Tel: 1-800-272-9959  
Fax: 1-800-737-7018  
Email: support@nsc.com  
National Semiconductor  
Europe  
National Semiconductor  
Asia Pacific Customer  
Response Group  
Tel: 65-2544466  
Fax: 65-2504466  
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Japan Ltd.  
Tel: 81-3-5639-7560  
Fax: 81-3-5639-7507  
Fax: +49 (0) 180-530 85 86  
Email: europe.support@nsc.com  
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National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.  

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