LM61BIZ [NSC]
2.7V, SOT-23 or TO-92 Temperature Sensor; 2.7V ， SOT- 23或TO- 92温度传感器
| 型号： | LM61BIZ |
| 厂家： | 
National Semiconductor |
| 描述： | 2.7V, SOT-23 or TO-92 Temperature Sensor |
| 文件： | 总9页 (文件大小：245K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
June 1999
LM61
2.7V, SOT-23 or TO-92 Temperature Sensor
General Description
Applications
n Cellular Phones
n Computers
n Power Supply Modules
n Battery Management
n FAX Machines
n Printers
n HVAC
n Disk Drives
n Appliances
The LM61 is a precision integrated-circuit temperature sen-
sor that can sense a −30˚C to +100˚C temperature range
while operating from a single +2.7V supply. The LM61’s out-
put voltage is linearly proportional to Celsius (Centigrade)
temperature (+10 mV/˚C) and has a DC offset of +600 mV.
The offset allows reading negative temperatures without the
need for a negative supply. The nominal output voltage of the
LM61 ranges from +300 mV to +1600 mV for a −30˚C to
+100˚C temperature range. The LM61 is calibrated to pro-
±
±
vide accuracies of 2.0˚C at room temperature and 3˚C
over the full −25˚C to +85˚C temperature range.
Key Specifications
The LM61’s linear output, +600 mV offset, and factory cali-
bration simplify external circuitry required in a single supply
environment where reading negative temperatures is re-
quired. Because the LM61’s quiescent current is less than
125 µA, self-heating is limited to a very low 0.2˚C in still air.
Shutdown capability for the LM61 is intrinsic because its in-
herent low power consumption allows it to be powered di-
rectly from the output of many logic gates.
±
±
n Accuracy at 25˚C
2.0 or 3.0˚C
(max)
±
±
n Accuracy for −30˚C to +100˚C
n Accuracy for −25˚C to +85˚C
n Temperature Slope
4.0˚C (max)
3.0˚C (max)
+10 mV/˚C
n Power Supply Voltage Range
+2.7V to +10V
125 µA (max)
@
n Current Drain 25˚C
Features
n Calibrated linear scale factor of +10 mV/˚C
n Rated for full −30˚ to +100˚C range
n Suitable for remote applications
±
n Nonlinearity
0.8˚C (max)
n Output Impedance
800 Ω (max)
Typical Application
DS012897-2
=
VO (+10 mV/˚C x T ˚C) + 600 mV
Temperature (T)
+100˚C
+85˚C
Typical VO
+1600 mV
+1450 mV
+850 mV
+600 mV
+350 mV
+300 mV
+25˚C
0˚C
−25˚C
−30˚C
FIGURE 1. Full-Range Centigrade Temperature Sensor (−30˚C to +100˚C)
Operating from a Single Li-Ion Battery Cell
© 1999 National Semiconductor Corporation
DS012897
www.national.com
Connection Diagrams
SOT-23
TO-92
DS012897-1
DS012897-25
Top View
See NS Package Number MA03B
Top View
See NS Package Number Z03A
Ordering Information
Accuracy
Over
Specified
Order
Device
Package
Supplied In
Specified
Temperature
Range (˚C)
Temperature
Range
Number
Marking
Type
LM61BIM3
LM61BIM3X
LM61CIM3
LM61CIM3X
LM61BIZ
T1B
T1B
T1C
T1C
1000 Units on Tape and Reel
3000 Units on Tape and Reel
1000 Units on Tape and Reel
3000 Units on Tape and Reel
±
±
3
4
−25˚C to +85˚C
−30˚C to +100˚C
SOT-23
TO-92
±
±
LM61BIZ Bulk
LM61CIZ Bulk
3
4
−25˚C to +85˚C
−30˚C to +100˚C
LM61CIZ
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2
Absolute Maximum Ratings (Note 1)
Lead Temperature:
TO-92 Package:
Supply Voltage
Output Voltage
+12V to −0.2V
Soldering (10 seconds)
SOT-23 Package (Note 4):
Vapor Phase (60 seconds)
Infrared (15 seconds)
+260˚C
(+VS + 0.6V) to
−0.6V
+215˚C
+220˚C
Output Current
10 mA
5 mA
Input Current at any pin (Note 2)
Storage Temperature
−65˚C to +150˚C
Operating Ratings(Note 1)
Maximum Junction Temperature
(TJMAX
)
+125˚C
Specified Temperature Range:
LM61C
TMIN ≤ TA ≤ TMAX
−30˚C ≤ TA ≤ +100˚C
−25˚C ≤ TA ≤ +85˚C
+2.7V to +10V
ESD Susceptibility (Note 3) :
Human Body Model
Machine Model
2500V
250V
LM61B
Supply Voltage Range (+VS)
Thermal Resistance, θJA(Note 5)
SOT-23
TO-92
450˚C/W
180˚C/W
Electrical Characteristics
=
=
=
Unless otherwise noted, these specifications apply for +VS +3.0 VDC. Boldface limits apply for TA TJ TMIN to TMAX ; all
=
=
other limits TA TJ 25˚C.
Parameter
Conditions
Typical
(Note 6)
LM61B
Limits
LM61C
Limits
Units
(Limit)
(Note 7)
(Note 7)
±
±
Accuracy (Note 8)
2.0
3.0
˚C (max)
˚C (max)
mV
±
±
3.0
4.0
Output Voltage at 0˚C
Nonlinearity (Note 9)
Sensor Gain
+600
+10
±
±
0.6
0.8
˚C (max)
mV/˚C (min)
mV/˚C (max)
+9.7
+9.6
(Average Slope)
+10.3
+10.4
Output Impedance
+3.0V ≤ +VS ≤ +10V
−30˚C ≤ TA ≤ +85˚C, +VS +2.7V
0.8
2.3
5
0.8
2.3
5
kΩ (max)
kΩ (max)
kΩ (max)
=
=
+85˚C ≤ TA ≤ +100˚C, +VS +2.7V
±
±
±
±
Line Regulation (Note 10)
Quiescent Current
+3.0V ≤ +VS ≤ +10V
+2.7V ≤ +VS ≤ +3.3V
+2.7V ≤ +VS ≤ +10V
0.7
5.7
0.7
5.7
mV/V (max)
mV (max)
µA (max)
µA (max)
µA
82
125
125
155
155
±
5
Change of Quiescent Current
Temperature Coefficient of
Quiescent Current
+2.7V ≤ +VS ≤ +10V
0.2
µA/˚C
=
=
Long Term Stability (Note 11)
TJ TMAX +100˚C,
±
0.2
˚C
for 1000 hours
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is func-
tional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed speci-
fications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions.
<
>
+V ), the current at that pin should be limited to 5 mA.
Note 2: When the input voltage (V ) at any pin exceeds power supplies (V
GND or V
I
I
I
S
Note 3: The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. The machine model is a 200 pF capacitor discharged di-
rectly into each pin.
Note 4: See AN-450 “Surface Mounting Methods and Their Effect on Product Reliability” or the section titled “Surface Mount” found in any post 1986 National Semi-
conductor Linear Data Book for other methods of soldering surface mount devices.
Note 5: The junction to ambient thermal resistance (θ ) is specified without a heat sink in still air.
JA
=
=
25˚C and represent most likely parametric norm.
Note 6: Typicals are at T
T
A
J
Note 7: Limits are guaranteed to National’s AOQL (Average Outgoing Quality Level).
Note 8: Accuracy is defined as the error between the output voltage and +10 mV/˚C times the device’s case temperature plus 600 mV, at specified conditions of volt-
age, current, and temperature (expressed in ˚C).
Note 9: Nonlinearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line, over the device’s rated temperature
range.
Note 10: Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating effects can be com-
puted by multiplying the internal dissipation by the thermal resistance.
Note 11: For best long-term stability, any precision circuit will give best results if the unit is aged at a warm temperature, and/or temperature cycled for at least 46
hours before long-term life test begins. This is especially true when a small (Surface-Mount) part is wave-soldered; allow time for stress relaxation to occur. The ma-
jority of the drift will occur in the first 1000 hours at elevated temperatures. The drift after 1000 hours will not continue at the first 1000 hour rate.
3
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Typical Performance Characteristics The LM61 in the SOT-23 package mounted to a printed circuit
board as shown in Figure 2 was used to generate the following thermal curves.
Thermal Resistance
Junction to Air
Thermal Time Constant
Thermal Response in
Still Air with Heat Sink
DS012897-3
DS012897-4
DS012897-5
Thermal Response
in Stirred Oil Bath
with Heat Sink
Thermal Response in Still
Air without a Heat Sink
Quiescent Current
vs. Temperature
DS012897-6
DS012897-8
DS012897-9
Accuracy vs Temperature
Noise Voltage
DS012897-10
DS012897-11
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4
Typical Performance Characteristics The LM61 in the SOT-23 package mounted to a printed
circuit board as shown in Figure 2 was used to generate the following thermal curves. (Continued)
Supply Voltage
Start-Up Response
vs Supply Current
DS012897-22
DS012897-12
DS012897-14
FIGURE 2. Printed Circuit Board Used
for Heat Sink to Generate All Curves.
1
⁄2" Square Printed Circuit Board
with 2 oz. Copper Foil or Similar.
accompanying wiring and circuits must be kept insulated and
1.0 Mounting
dry, to avoid leakage and corrosion. This is especially true if
the circuit may operate at cold temperatures where conden-
sation can occur. Printed-circuit coatings and varnishes such
as Humiseal and epoxy paints or dips are often used to en-
sure that moisture cannot corrode the LM61 or its connec-
tions.
The LM61 can be applied easily in the same way as other
integrated-circuit temperature sensors. It can be glued or ce-
mented to a surface. The temperature that the LM61 is sens-
ing will be within about +0.2˚C of the surface temperature
that LM61’s leads are attached to.
This presumes that the ambient air temperature is almost the
same as the surface temperature; if the air temperature were
much higher or lower than the surface temperature, the ac-
tual temperature measured would be at an intermediate tem-
perature between the surface temperature and the air tem-
perature.
The thermal resistance junction to ambient (θJA) is the pa-
rameter used to calculate the rise of a device junction tem-
perature due to its power dissipation. For the LM61 the
equation used to calculate the rise in the die temperature is
as follows:
=
TJ TA + θJA [(+VS IQ) + (+VS − VO) IL]
To ensure good thermal conductivity the backside of the
LM61 die is directly attached to the GND pin. The lands and
traces to the LM61 will, of course, be part of the printed cir-
cuit board, which is the object whose temperature is being
measured.
where IQ is the quiescent current and ILis the load current on
the output. Since the LM61’s junction temperature is the ac-
tual temperature being measured care should be taken to
minimize the load current that the LM61 is required to drive.
The table shown in Figure 3 summarizes the rise in die tem-
perature of the LM61 without any loading with a 3.3V supply,
and the thermal resistance for different conditions.
Alternatively, the LM61 can be mounted inside a sealed-end
metal tube, and can then be dipped into a bath or screwed
into a threaded hole in a tank. As with any IC, the LM61 and
5
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1.0 Mounting (Continued)
SOT-23*
SOT-23**
TO-92*
TO-92***
no heat sink
small heat fin
no heat sink
small heat fin
θJA
(˚C/W)
450
TJ − TA
θJA
(˚C/W)
260
TJ − TA
θJA
TJ − TA
(˚C)
θJA
(˚C/W)
140
TJ − TA
(˚C)
(˚C)
0.13
0.09
(˚C/W)
180
(˚C)
0.07
0.03
Still air
0.26
0.09
Moving air
180
90
0.05
70
*Part soldered to 30 gauge wire.
1
**Heat sink used is
⁄2" square printed circuit board with 2 oz. foil with part attached as shown in Figure 2.
***Part glued and leads soldered to 1″ square of 1/16″ printed circuit board with 2oz. foil or similar.
FIGURE 3. Temperature Rise of LM61 Due to
Self-Heating and Thermal Resistance (θJA
)
2.0 Capacitive Loads
The LM61 handles capacitive loading well. Without any spe-
cial precautions, the LM61 can drive any capacitive load as
shown in Figure 4. Over the specified temperature range the
LM61 has a maximum output impedance of 5 kΩ. In an ex-
tremely noisy environment it may be necessary to add some
filtering to minimize noise pickup. It is recommended that
0.1 µF be added from +VS to GND to bypass the power sup-
ply voltage, as shown in Figure 5. In a noisy environment it
may be necessary to add a capacitor from the output to
ground. A 1 µF output capacitor with the 5 kΩ maximum out-
put impedance will form a 32 Hz lowpass filter. Since the
thermal time constant of the LM61 is much slower than the 5
ms time constant formed by the RC, the overall response
time of the LM61 will not be significantly affected. For much
larger capacitors this additional time lag will increase the
overall response time of the LM61.
DS012897-15
FIGURE 4. LM61 No Decoupling Required for
Capacitive Load
DS012897-16
FIGURE 5. LM61 with Filter for Noisy Environment
DS012897-17
FIGURE 6. Simplified Schematic
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6
3.0 Applications Circuits
DS012897-18
FIGURE 7. Centigrade Thermostat
DS012897-19
FIGURE 8. Conserving Power Dissipation with Shutdown
4.0 Recommended Solder Pads for SOT-23 Package
DS012897-20
7
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Physical Dimensions inches (millimeters) unless otherwise noted
SOT-23 Molded Small Outline Transistor Package (M3)
Order Number LM61BIM3 or LM61CIM3
NS Package Number MA03B
TO-92 Plastic Package (Z)
Order Number LM61BIZ or LM61CIZ
NS Package Number Z03A
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8
Notes
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant
into the body, or (b) support or sustain life, and
whose failure to perform when properly used in
accordance with instructions for use provided in the
labeling, can be reasonably expected to result in a
significant injury to the user.
2. A critical component is any component of a life
support device or system whose failure to perform
can be reasonably expected to cause the failure of
the life support device or system, or to affect its
safety or effectiveness.
National Semiconductor
Corporation
Americas
Tel: 1-800-272-9959
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Email: support@nsc.com
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National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
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