LMX2531LQ1500E_08 [NSC]

High Performance Frequency Synthesizer System with Integrated VCO; 集成VCO的高性能频率合成器系统
LMX2531LQ1500E_08
型号: LMX2531LQ1500E_08
厂家: National Semiconductor    National Semiconductor
描述:

High Performance Frequency Synthesizer System with Integrated VCO
集成VCO的高性能频率合成器系统

文件: 总24页 (文件大小:442K)
中文:  中文翻译
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September 4, 2008  
LMX2531LQ1500E  
High Performance Frequency Synthesizer System with  
Integrated VCO  
General Description  
Features  
The LMX2531LQ1500E is a low power, high performance  
frequency synthesizer system which includes a fully integrat-  
ed delta-sigma PLL and VCO with fully integrated tank circuit.  
The third and fourth poles are also integrated and also ad-  
justable. Also included are integrated ultra-low noise and high  
precision LDOs for the PLL and VCO which give higher supply  
noise immunity and also more consistent performance. When  
combined with a high quality reference oscillator, the  
LMX2531LQ1500E generates very stable, low noise local os-  
cillator signals for up and down conversion in wireless com-  
munication devices. The LMX2531LQ1500E is a monolithic  
integrated circuit, fabricated in an advanced BiCMOS pro-  
cess. There are several different versions of this product in  
order to accomdate different frequency bands.  
PLL Features  
Fractional-N Delta Sigma Modulator Order  
programmable up to 4th order  
FastLock/Cycle Slip Reduction with Timeout Counter  
Partially integrated, adjustable Loop Filter  
Very low phase noise and spurs  
VCO Features  
Integrated tank inductor  
Low phase noise  
1499 - 1510 MHz Output Frequency  
749.5 - 755 MHz Output Frequency (Divide by 2 Mode)  
Other Features  
2.8 V to 3.2 V Operation  
Low Power-Down Current  
1.8V MICROWIRE Support  
Package: 36 Lead LLP  
Device programming is facilitated using  
MICROWIRE Interface that can operate down to 1.8 volts.  
a three-wire  
Supply voltage range is 2.8 to 3.2 Volts. The  
LMX2531LQ1500E is available in a 36 pin 6x6x0.8 mm Lead-  
Free Leadless Leadframe Package (LLP).  
Target Applications  
Data Converting Clocking  
Functional Block Diagram  
20195001  
© 2008 National Semiconductor Corporation  
201950  
www.national.com  
Connection Diagram  
20195002  
Pin Descriptions  
Pin #  
Pin Name  
VccDIG  
GND  
I/O  
Description  
Power Supply for digital LDO circuitry. Input may range from 2.8 - 3.2 V. Bypass capacitors should be  
placed as close as possible to this pin and ground.  
1
-
-
3
Ground  
2,4,5,7,  
12, 13,  
29, 35  
NC  
-
No Connect.  
6
VregBUF  
DATA  
-
I
Internally regulated voltage for the VCO buffer circuitry. Connect to ground with a capacitor.  
MICROWIRE serial data input. High impedance CMOS input. This pin must not exceed 2.75V. Data is  
clocked in MSB first. The last bits clocked in form the control or register select bits.  
8
MICROWIRE clock input. High impedance CMOS input. This pin must not exceed 2.75V. Data is clocked  
into the shift register on the rising edge.  
9
CLK  
LE  
I
I
MICROWIRE Latch Enable input. High impedance CMOS input. This pin must not exceed 2.75V. Data  
stored in the shift register is loaded into the selected latch register when LE goes HIGH.  
10  
Chip Enable Input. High impedance CMOS input. This pin must not exceed 2.75V. When CE is brought  
high the LMX2531LQ1500E is powered up corresponding to the internal power control bits. It is  
necessary to reprogram the R0 register to get the part to re-lock.  
11  
CE  
I
14, 15  
16  
NC  
-
-
No Connect. Do NOT ground.  
Power Supply for VCO regulator circuitry. Input may range from 2.8 - 3.2 V. Bypass capacitors should  
be placed as close as possible to this pin and ground.  
VccVCO  
Internally regulated voltage for VCO circuitry. Not intended to drive an external load. Connect to ground  
with a capacitor and some series resistance.  
17  
VregVCO  
-
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2
Pin #  
Pin Name  
I/O  
Description  
Internal reference voltage for VCO LDO. Not intended to drive an external load. Connect to ground with  
a capacitor.  
18  
VrefVCO  
-
19  
20  
21  
GND  
GND  
Fout  
-
-
Ground for the VCO circuitry.  
Ground for the VCO Output Buffer circuitry.  
Buffered RF Output for the VCO.  
O
Power Supply for the VCO Buffer circuitry. Input may range from 2.8 - 3.2 V. Bypass capacitors should  
be placed as close as possible to this pin and ground.  
22  
23  
VccBUF  
Vtune  
-
I
Tuning voltage input for the VCO. For connection to the CPout Pin through an external passive loop  
filter.  
24  
25  
CPout  
FLout  
O
O
Charge pump output for PLL. For connection to Vtune through an external passive loop filter.  
An open drain NMOS output which is used for FastLock or a general purpose output.  
Internally regulated voltage for PLL charge pump. Not intended to drive an external load. Connect to  
ground with a capacitor.  
26  
27  
28  
VregPLL1  
VccPLL  
-
-
-
Power Supply for the PLL. Input may range from 2.8 - 3.2 V. Bypass capacitors should be placed as  
close as possible to this pin and ground.  
Internally regulated voltage for RF digital circuitry. Not intended to drive an external load. Connect to  
ground with a capacitor.  
VregPLL2  
30  
31  
Ftest/LD  
OSCin  
O
I
Multiplexed CMOS output. Typically used to monitor PLL lock condition.  
Oscillator input.  
Oscillator complimentary input. When a single ended source is used, then a bypass capacitor should be  
placed as close as possible to this pin and be connected to ground.  
32  
OSCin*  
I
33  
34  
36  
Test  
GND  
O
-
This pin if for test purposes and should be grounded for normal operation.  
Ground  
VregDIG  
-
Internally regulated voltage for LDO digital circuitry.  
3
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Absolute Maximum Ratings (Note 1)  
If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors  
for availability and specifications.  
Parameter  
Symbol  
Ratings  
Units  
VCC  
-0.3 to 3.5  
(VccDIG, VccVCO,  
VccBUF, VccPLL)  
Power Supply Voltage  
V
All other pins (Except  
Ground)  
-0.3 to 3.0  
Storage Temperature  
Range  
TSTG  
TL  
-65 to 150  
+ 260  
°C  
°C  
Lead Temperature (solder 4 sec.)  
Recommended Operating Conditions  
Parameter  
Symbol  
Min  
Typ  
3.0  
Max  
Units  
Power Supply Voltage  
(VccDig, VccVCO, VccBUF)  
Vcc  
2.8  
3.2  
V
V
Serial Interface and Power Control  
Voltage  
Vi  
0
2.75  
+85  
Ambient Temperature  
(Note 3)  
TA  
-40  
°C  
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Recommended Operating Conditions indicate conditions for  
which the device is intended to be functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical  
Characteristics. The guaranteed specifications apply only to the test conditions listed.  
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4
Electrical Characteristics (VCC = 3.0 V, -40°C TA 85 °C; fFout = 1500 MHz, except as specified.)  
Symbol  
Parameter  
Conditions  
Current Consumption  
Divider Disabled  
Divider Enabled  
CE = 0 V, Part Initialized  
Oscillator  
Min  
Typ  
Max  
Units  
34  
37  
7
41  
46  
ICC  
Power Supply Current  
Power Down Current  
mA  
µA  
ICCPD  
IIHOSC  
IILOSC  
fOSCin  
VIH = 2.75 V  
Oscillator Input High Current  
Oscillator Input Low Current  
Frequency Range  
100  
µA  
µA  
VIL = 0  
-100  
5
80  
MHz  
Vpp  
vOSCin  
Oscillator Sensitivity  
0.5  
2.0  
PLL  
fCOMP  
Phase Detector Frequency  
32  
MHz  
µA  
ICP = 0  
ICP = 1  
90  
180  
360  
1440  
2
µA  
Charge Pump  
Output Current Magnitude  
ICPout  
ICP = 3  
µA  
ICP = 15  
µA  
ICPoutTRI  
ICPoutMM  
0.4 V < VCPout < 2.0 V  
CP TRI-STATE Current  
10  
8
nA  
VCPout = 1.2 V  
TA = 25°C  
Charge Pump  
Sink vs. Source Mismatch  
2
%
%
%
0.4 V < VCPout < 2.0 V  
TA = 25°C  
Charge Pump  
Current vs. CP Voltage Variation  
ICPout  
V
T
4
CP Current vs. Temperature  
Variation  
ICPout  
VCPout = 1.2 V  
8
ICP = 1X Charge Pump Gain  
4 kHz Offset  
-202  
-212  
Normalized Phase Noise  
Contribution  
LN(f)  
dBc/Hz  
ICP = 16X Charge Pump Gain  
4 kHz Offset  
(Note 2)  
5
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Symbol  
Parameter  
Conditions  
VCO Frequencies  
Min  
Typ  
Max  
Units  
fFout  
Operating Frequency Range  
1499  
1510  
MHz  
Other VCO Specifications  
Divider Disabled  
1.0  
1.0  
3.5  
3.0  
7.0  
6.0  
dBm  
dBm  
Output Power to a 50/5pF Load  
(Applies across entire tuning range.)  
pFout  
Divider Enabled  
Fine Tuning Sensitivity  
(When a range is displayed in the  
typical column, indicates the lower  
sensitivity is typical at the lower end  
of the tuning range, and the higher  
tuning sensitivity is typical at the  
higher end of the tuning range.)  
KVtune  
4-7  
MHz/V  
Divider Disabled  
-30  
-20  
-40  
-25  
300  
-25  
-15  
-35  
-20  
2nd Harmonic, 50Ω /  
Harmonic Suppression  
(Applies Across Entire Tuning  
Range)  
5pF Load  
Divider Enabled  
Divider Disabled  
Divider Enabled  
HSFout  
dBc  
3rd Harmonic, 50Ω /  
5pF Load  
PUSHFout  
PULLFout  
ZFout  
Creg = 0.1uF, VDD ± 100mV, Open Loop  
VSWR=2:1, Open Loop  
Frequency Pushing  
Frequency Pulling  
Output Impedance  
kHz/V  
kHz  
Ω
±600  
50  
VCO Phase Noise (Note 4)  
10 kHz Offset  
-97  
100 kHz Offset  
fFout = 1500 MHz  
-120  
-142  
-155  
L(f)Fout  
Phase Noise  
dBc/Hz  
1 MHz Offset  
5 MHz Offset  
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6
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
Digital Interface (DATA, CLK, LE, CE, Ftest/LD, FLout)  
VIH  
VIL  
IIH  
High-Level Input Voltage  
Low-Level Input Voltage  
High-Level Input Current  
Low-Level Input Current  
High-Level Output Voltage  
Low-Level Output Voltage  
1.6  
2.75  
0.4  
V
V
VIH = 1.75  
VIL = 0 V  
-3.0  
-3.0  
2.0  
3.0  
µA  
µA  
V
IIL  
3.0  
VOH  
VOL  
IOH = 500 µA  
IOL = -500 µA  
2.65  
0.0  
0.4  
V
MICROWIRE Timing  
tCS  
tCH  
Data to Clock Set Up Time  
Data to Clock Hold Time  
Clock Pulse Width High  
See Data Input Timing  
See Data Input Timing  
See Data Input Timing  
See Data Input Timing  
See Data Input Timing  
See Data Input Timing  
See Data Input Timing  
25  
20  
25  
25  
25  
25  
25  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tCWH  
tCWL  
tES  
Clock Pulse Width Low  
Clock to Enable Set Up Time  
Enable to Clock Set Up Time  
Enable Pulse Width High  
tCES  
tEWH  
Note 2: Normalized Phase Noise Contribution is defined as: LN(f) = L(f) – 20log(N) – 10log(Fcomp) where L(f) is defined as the single side band phase noise  
measured at an offset frequency, f, in a 1 Hz Bandwidth and Fcomp is the comparison frequency of the synthesizer. The offset frequency, f, must be chosen  
sufficiently smaller then the loop bandwidth of the PLL, and large enough to avoid a substantial noise contribution from the reference.  
Note 3: Maximum Allowable Temperature Drift for Continuous Lock is how far the temperature can drift in either direction from the value it was at the time that  
the R0 register was last programmed, and still have the part stay in lock. The action of programming the R0 register, even to the same value, activates a frequency  
calibration routine. This implies that the part will work over the entire frequency range, but if the temperature drifts more than the maximum allowable drift for  
continuous lock, then it will be necessary to reload the R0 register to ensure that it stays in lock. Regardless of what temperature the part was initially programmed  
at, the temperature can never drift outside the frequency range of -40°C TA85°C without violating specifications.  
Note 4: The VCO phase noise is measured assuming that the loop bandwidth is sufficiently narrow that the VCO noise dominates. The maximum limits apply  
only at center frequency and over temperature, assuming that the part is reloaded at each test frequency. Over frequency, the phase noise can vary 1-2 dB, with  
the worst case performance typically occurring at the highest frequency. Over temperature, the phase noise typically varies 1-2 dB, assuming the part is reloaded.  
Serial Data Timing Diagram  
20195003  
The DATA is clocked into a shift register on each rising edge of the CLK signal. On the rising edge of the LE signal, the data is  
sent from the shift registers to an actual counter. A slew rate of at least 30 V/µs is recommended for these signals. After the  
programming is complete, the CLK, DATA, and LE signals should be returned to a low state. If the CLK and DATA lines are toggled  
while the in VCO is in lock , as is sometimes the case when these lines are shared with other parts, the phase noise may be  
degraded during the time of this programming.  
7
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sen to be 2, then the comparison frequency is 9.84 MHz. The  
greatest common multiple of 9.84 MHz and 2110.8 MHz is  
240 kHz. 9.84 MHz / 240 kHz = 41. So the fractional denom-  
inator could be 41, or any multiple of 41. For this last example  
value, the entire N counter value would be 214 + 21/41.  
1.0 Functional Description  
The LMX2531LQ1500E is a low power, high performance  
frequency synthesizer system which includes the PLL, VCO,  
and partially integrated loop filter. Section 2.0 on program-  
ming describes the bits mentioned in this section in more  
detail.  
The fractional value is achieved with a delta sigma architec-  
ture. In this architecture, an integer N counter is modulated  
between different values in order to achieve a fractional value.  
On this part, the modulator order can be zero (integer mode),  
two, three, or four. The higher the fractional modulator order  
is, the lower the spurs theoretically are. However, this is not  
always the case, and the higher order fractional modulator  
can sometimes give rise to additional spurious tones, but this  
is dependent on the application. This is why it is an advantage  
to have the modulator order selectable. Dithering also has an  
impact on the fractional spurs, but a lesser one.  
1.1 REFERENCE OSCILLATOR INPUT  
Because the VCO frequency calibration algorithm is based on  
clocks from the OSCin pin, there are certain bits that need to  
be  
set  
depending  
on  
the  
OSCin  
frequency.  
XTLSEL ( R6[22:20] ) and XTLDIV ( R7[9:8] ) are both need  
to be set based on the OSCin frequency.  
1.2 R DIVIDER  
The R divider divides the OSCin frequency down to the phase  
detector frequency. The only valid R counter values are 1, 2,  
4, 8, 16, and 32. The R divider also has an impact on the  
fractional modulus that can be used, if it is greater than 8.  
1.4 PHASE DETECTOR  
The phase detector compares the outputs of the R and N  
counters and puts out a correction current corresponding to  
the phase error. The choice of the phase detector frequency  
does have an impact on performance. When determining  
which phase detector frequency to use, the restrictions on the  
R counter values must be taken into consideration.  
1.3 N DIVIDER AND FRACTIONAL CIRCUITRY  
The N divider on the LMX2531LQ1500E is fractional and can  
achieve any fractional denominator between  
1 and  
4,194,303. The integer portion of the N counter value, NInte-  
ger, is determined by the value of the N word. Because there  
is a 16/17/20/21 prescaler, there are restrictions on how small  
the NInteger value can be. This is because this value is actually  
formed by several different prescalers in the quadruple mod-  
ulus prescaler in order to achieve the desired value. The  
fractional word, NFractional , is a fraction formed with the NUM  
and DEN words. The fractional denominator value, DEN, can  
be set from 2 to 4,194,303. The case of DEN=0 makes no  
sense, since this would cause an infinite N value, and the case  
of 1 makes no sense (but could be done), because integer  
mode should be used in these applications. All other values  
in this range, like 10, 32,734, or 4,000,000 are all valid. Once  
the fractional denominator, DEN, is determined, the fractional  
numerator, NUM, is intended to be varied from 0 to DEN-1.  
Sometimes, expressing the same fraction, like 1/10, in terms  
of larger fractions, like 100/10000, sometimes yields better  
fractional spurs, but other times it does not. This can be im-  
pacted by the fractional modulator order and the dithering  
mode selected, as well as the loop bandwidth, and other ap-  
plication specific criteria. So in general, the total N counter  
value is determined by:  
1.5 PARTIALLY INTEGRATED LOOP FILTER  
The LMX2531LQ1500E integrates the third pole (formed by  
R3 and C3) and fourth pole (formed by R4 and C4) of the loop  
filter. This loop filter can be enabled or bypassed using the  
EN_LPFLTR ( R6[15] ). The values for C3, C4, R3, and R4  
can also be programmed independently through the MI-  
CROWIRE interface . Also, the values for R3 and R4 can be  
changed during FastLock, for minimum lock time. It is recom-  
mended that the integrated loop filter be set to the maximum  
possible attenuation (R3=R4=40kΩ, C3=C4=100pF), the in-  
ternal loop filter is more effective at reducing certain spurs  
than the external loop filter. However, if the attenuation of the  
internal loop filter is too high, it limits the maximum attainable  
loop bandwidth that can be achieved, which corresponds to  
the case where the shunt loop filter capacitor, C1, is zero.  
Increasing the charge pump current and/or the comparison  
frequency increases the maximum attainable loop bandwidth  
when designing with the integrated filter. Furthermore, this  
often allows the loop filter to be better optimized and have  
stronger attenuation. If the charge pump current and com-  
parison frequency are already as high as they go, and the  
maximum attainable loop bandwidth is still too low, the resis-  
tor and capacitor values can be decreased or the internal loop  
filter can even be bypassed. Note that when the internal loop  
filter is bypassed, there is still a small amount of input capac-  
itance on front of the VCO on the order of 200 pF. For design  
tools and more information on partially integrated loop filters,  
go to wireless.national.com.  
N = NInteger + NFractional  
In order to calculate the minimum necessary fractional de-  
nominator, the R counter value needs to be chosen, so that  
the comparison frequency is known. The minimum necessary  
fractional denominator can be calculated by dividing the com-  
parison frequency by the greatest common multiple of the  
comparison frequency and the OSCin frequency. For exam-  
ple, consider the case of a 10 MHz crystal and a 200 kHz  
channel spacing. If the R counter value is chosen to be 2, then  
the comparison frequency will be 5 MHz. The greatest com-  
mon multiple of 200 kHz and 5 MHz is 200 kHz. If one takes  
5 MHz divided by 200 kHz, this is 25. So a fractional denom-  
inator of 25, or any multiple of 25 would work in this situation.  
Now consider a second example where the channel spacing  
is changed to 30 kHz. If it is again assumed that the compar-  
ison frequency is 5 MHz, then the greatest common multiple  
of 30 kHz and 5 MHz is 10 kHz. 5 MHz divided by 10 kHz is  
500. In this situation, a fractional denominator of 500, or any  
multiple of 500 would suffice. For a final example, consider  
an application with a fixed output frequency of 2110.8 MHz  
and a crystal frequency of 19.68 MHz. If the R counter is cho-  
1.6 LOW NOISE, FULLY INTEGRATED VCO  
The LMX2531LQ1500E includes a fully integrated VCO, in-  
cluding the inductors. In order for optimum phase noise per-  
formance, this VCO has frequency and phase noise calibra-  
tion algorithms. The frequency calibration algorithm is  
necessary because the VCO internally divides up the fre-  
quency range into several bands, in order to achieve a lower  
tuning gain, and therefore better phase noise performance.  
The frequency calibration routine is activated any time that  
the R0 register is programmed. If the temperature shifts con-  
siderably and the R0 register is not programmed, then it can  
not drift more than the maximum allowable drift for continuous  
lock, ΔTCL, or else the VCO is not guaranteed to stay in lock.  
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8
The phase noise calibration algorithm is necessary in order  
to achieve the lowest possible phase noise. The  
VCO_ACI_SEL bit ( R6[19:16] ) needs to be set to the correct  
value to ensure the best possible phase noise.  
user many degrees of freedom. This section discusses some  
of the design considerations. From the perspective of the PLL  
noise, choosing the charge pump current and comparison  
frequency as high as possible are best for optimal phase  
noise performance. The far out PLL noise improves 3 dB for  
every doubling of the comparison frequency, but at lower off-  
sets, this effect is much less due to the PLL 1/f noise. In-  
creasing the charge pump current improves the phase noise  
about 3 dB per doubling of the charge pump current, although  
there are small diminishing returns as the charge pump cur-  
rent goes higher.  
The gain of the VCO can change considerably over frequen-  
cy. It is lowest at the minimum frequency and highest at the  
maximum frequency. This range is specified in the datasheet.  
When designing the loop filter, the following method is rec-  
ommended. First, take the geometric mean of the minimum  
and maximum frequencies that are to be used. Then use a  
linear approximation to extrapolate the VCO gain.  
From a loop filter design and PLL phase noise perspective,  
one might think to always design with the highest possible  
comparison frequency and charge pump current. However, if  
one considers the worst case fractional spurs that occur at an  
output frequency equal to 1 channel spacing away from a  
multiple of the OSCin frequency, then this gives reason to re-  
consider. If the comparison frequency or charge pump cur-  
rents are too high, then these spurs could be degraded, and  
the loop filter may not be able to filter these spurs as well as  
theoretically predicted. For optimal spur performance, a com-  
parison frequency in the ballpark of 2.5 MHz and a charge  
pump current of 1X are recommended.  
1.7 PROGRAMMABLE DIVIDE BY 2  
All options of the LMX2531LQ1500E offer a divide by 2 option.  
This allows the user to get exactly half of the VCO frequency,  
by dividing the output of the VCO output by two. Because this  
divide by two is outside feedback path between the VCO and  
the PLL, the loop filter and counter values are set up for the  
VCO frequency before it is divide by two. Note that R0 register  
should be reprogrammed the first time after the DIV2 bit is  
enabled or disabled for optimal phase noise performance.  
1.8 CHOOSING THE CHARGE PUMP CURRENT AND  
COMPARISON FREQUENCY  
The LMX2531LQ1500E has 16 levels of charge pump cur-  
rents and a highly flexible fractional modulus. This gives the  
9
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2.0 General Programming Information  
The LMX2531LQ1500E is programmed using 11 24-bit registers used to control the LMX2531LQ1500E operation. A 24-bit shift  
register is used as a temporary register to indirectly program the on-chip registers. The shift register consists of a data field and  
an address field. The last 4 register bits, CTRL[3:0] form the address field, which is used to decode the internal register address.  
The remaining 20 bits form the data field DATA[19:0]. While LE is low, serial data is clocked into the shift register upon the rising  
edge of clock (data is programmed MSB first). When LE goes high, data is transferred from the data field into the selected register  
bank.  
Although there are actually 14 registers in this part, only a portion of them should be programmed, since the state of the other  
hidden registers (R13, R11, and R10) are set during the initialization sequence. Although it is possible to program these hidden  
registers, as well as a lot of bits that are defined to either '1' or '0', the user should not experiment with these hidden registers and  
bits, since doing will most likely degrade performance. Furthermore, this would be inconsistent to how these parts are tested.  
DATA[19:0]  
CONTROL[3:0]  
LS  
MS  
B
B
D1 D1 D1 D1 D1 D1 D1 D1 D1 D1 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 C3 C2 C1 C0  
9
8
7
6
5
4
3
2
1
0
2.01 Register Location Truth Table  
C3  
1
C2  
C1  
0
C0  
0
Data Address  
1
0
0
1
1
1
1
0
0
0
0
R12  
R9  
R8  
R7  
R6  
R5  
R4  
R3  
R2  
R1  
R0  
1
0
1
1
0
0
0
1
1
0
1
0
0
0
1
0
0
0
0
1
1
0
1
0
0
0
1
0
0
0
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10  
2.02 Initialization Sequence  
The initial loading sequence from a cold start is described below. The registers must be program in order shown.  
23 22 21 20 19 18 17 16 15 14 13 12 11 10  
DATA[19:0]  
9
8
7
6
5
4
3
2
1
0
REGISTE  
R
C3 C2 C1 C0  
R5  
INIT1  
1
1
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
0
0
1
1
R5  
INIT2  
R5  
R12  
R9  
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
0
0
1
1
1
0
1
0
1
1
1
0
1
0
1
0
0
1
1
1
1
0
0
0
0
1
0
1
See individual section for R9 programming information.  
See individual section for Register R8 programming information.  
R8  
Register R8 only needs to be programmed for a few options of the LMX2531LQ1500E and  
and only in the case that the OSCin frequency is greater than 40 MHz.  
1
0
0
0
R7  
R6  
See individual section for Register R7 programming information.  
See individual section for Register R6 programming information.  
0
0
1
1
1
1
1
0
See individual section for Register R4 programming information.  
Register R4 only needs to be programmed if FastLock is used.  
R4  
0
1
0
0
R3  
R2  
R1  
R0  
See individual section for Register R3 programming information.  
See individual section for Register R2 programming information.  
See individual section for Register R1 programming information.  
See individual section for Register R0 programming information.  
0
0
0
0
0
0
0
0
1
1
0
0
1
0
1
0
Note: There must be a minimum of 10 mS between the time when R5 is last loaded and when R1 is loaded to ensure time for the  
LDOs to power up properly.  
11  
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E N _ P L L  
E N _ V C O  
E N _ O S C  
E N _ V C O L D  
E N _ P L L L D O 1  
E N _ P L L L D O 2  
E N _ D I G L D O  
E N _ L P F L T R  
0
R E G _ R S T  
1
0
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12  
2.1 REGISTER R0  
The action of programming the R0 register activates a frequency calibration routine for the VCO. This calibration is necessary to  
get the VCO to center the tuning voltage for optimal performance. If the temperature drifts considerably, then the PLL should stay  
in lock, provided that the temperature drift specification is not violated.  
2.1.1 NUM[10:0] and NUM[21:12] -- Fractional Numerator  
The NUM word is split between the R0 register and R1 register. The Numerator bits determine the fractional numerator for the  
delta sigma PLL. This value can go from 0 to 4095 when the FDM bit ( R3[22] ) is 0 (the other bits in this register are ignored), or  
0 to 4194303 when the FDM bit is 1.  
NUM[21:12]  
NUM[11:0]  
Fra  
ctio  
nal  
Nu  
mer  
ator  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
...  
409  
503  
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
409  
6
...  
419  
430  
3
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Note that there are restrictions on the fractional numerator value depending on the R counter value if it is 16 or 32.  
2.1.2 N[7:0] and N[10:8]  
The N counter is 11 bits. 8 of these bits are located in the R0 register, and the remaining 3 (MSB bits) are located in the R1 register.  
The LMX2531LQ1500E consists of an A, B, and C counter, which work in conjunction with the 16/17/20/21 prescaler in order to  
form the final N counter value.  
N[10:8]  
N[7:0]  
Values less than 55 are prohibited.  
N Value  
<55  
C
0
1
B
A
55  
0
1
0
1
0
1
0
1
1
0
0
1
1
1
1
1
1
...  
2039  
1
1
1
13  
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2.2 REGISTER R1  
2.2.1 NUM[21:12]  
These are the MSB bits in for the fractional numerator that already have been described.  
2.2.2 N[10:8] -- 3 MSB Bits for the N Counter  
These are the 2 MSB bits for the N counter, which were discussed in the R0 register section.  
2.2.3 ICP[3:0] -- Charge Pump Current  
This bit programs the charge pump current when the charge pump gain. The current is programmable between 100uA and 1.6mA  
in 100uA steps. In general, higher charge pump currents yield better phase noise for the PLL, but also can cause higher spurs.  
Typical Charge Pump Current at 3 Volts  
ICP  
Charge Pump State  
(µA)  
0
1
1X  
2X  
90  
180  
270  
360  
450  
540  
630  
720  
810  
900  
990  
1080  
1170  
1260  
1350  
1440  
2
3X  
3
4X  
4
5X  
5
6X  
6
7X  
7
8X  
8
9X  
9
10X  
11X  
12X  
13X  
14X  
15X  
16X  
10  
11  
12  
13  
14  
15  
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14  
2.3 REGISTER R2  
2.3.1 R[5:0] -- R Counter Value  
These bits determine the phase detector frequency. The OSCin frequency is divided by this R counter value. Note that only the  
values of 1, 2, 4, 8, 16, and 32 are allowed.  
Fractional  
R Value  
Denominator  
Restrictions  
R[5:0]  
0,3,5-7,  
9-15,17-31,  
33-63  
n/a  
These values are illegal.  
1
2
4
8
none  
none  
none  
none  
0
0
0
0
0
0
0
0
0
0
0
1
0
0
1
0
0
1
0
0
1
0
0
0
Must be  
divisible by 2  
16  
32  
0
1
1
0
0
0
0
0
0
0
0
0
Must be  
divisible by 4  
Note that the R counter value can put some restrictions on the fractional denominator. In the case that it is 16, the fractional  
denominator must be divisible by 2, which is equivalent to saying that the LSB of the fractional denominator word is zero. In the  
case that the R counter is 32, the two LSB bits of the fractional denominator word must also be zero, which is equivalent to saying  
that the fractional denominator must be divisible by 4. Because the fractional denominator can be very large, this should cause no  
issues. For instance, if one wanted to achieve a fractional word of 1/65, and the R counter value was 16, the fractional word could  
be changed t0 4/260 ,and the same resolution could be achieved.  
2.3.2 DEN[21:12] and DEN[11:0]-- Fractional Denominator  
These bits determine the fractional denominator. Note that the MSB bits for this word are in register R3. If the FDM bit is set to 0,  
DEN[21:12] are ignored. The fractional denominator should only be set to zero if the fractional circuitry is being disabled by setting  
ORDER=1. A value of one never makes sense to use. All other values could reasonably be used in fractional mode.  
DEN[21:12]  
DEN[11:0]  
Fra  
ctio  
nal  
Den  
omi  
nat  
or  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
...  
409  
5
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
409  
6
...  
419  
430  
3
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
15  
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2.4 REGISTER R3  
2.4.1 DEN[21:12] -- Extension for the Fractional Denominator  
These are the MSB bits of the DEN word, which have already been discussed.  
2.4.2 FoLD[3:0] -- Multiplexed Output for Ftest/LD Pin  
The FoLD[3:0] word is used to program the output of the Ftest/LD Pin. This pin can be used for a general purpose I/O pin, a lock  
detect pin, and for diagnostic purposes. When programmed to the digital lock detect state, the output of the Ftest/LD pin will be  
high when the part is in lock, and low otherwise. Lock is determined by comparing the input phases to the phase detector. The  
analog lock detect modes put out a high signal with very fast negative pulses, that correspond to when the charge pump comes  
on. This output can be low pass filtered with an RC filter in order to determine the lock detect state. If the open drain state is used,  
a pull-up resistor that is much larger than the resistance in the RC filter, to increase the sensitivity of the circuit. For diagnostic  
purposes, the options that allow one to view the output of the R counter or the N counter can be very useful. Be aware that the  
output voltage level of the Ftest/LD is not equal to the supply voltage of the part, but rather is given by VOH and VOL in the electrical  
characteristics specification.  
FoLD  
0
Output Type  
High Impedance  
Push-Pull  
Push-Pull  
Push-Pull  
N/A  
Function  
Disabled  
1
Logical High State  
Logical Low State  
Digital Lock Detect  
Reserved  
2
3
4
5
Push-Pull  
Open-Drain  
Push-Pull  
N/A  
N Counter Output Divided by 2  
Analog Lock Detect  
Analog Lock Detect  
Reserved  
6
7
8
9
N/A  
Reserved  
10  
11  
12  
13  
14  
15  
N/A  
Reserved  
N/A  
Reserved  
N/A  
Reserved  
N/A  
Reserved  
Push-Pull  
N/A  
R Counter Output  
Reserved  
2.4.3 ORDER -- Order of Delta Sigma Modulator  
This bit determines the order of the delta sigma modulator in the PLL. In general, higher order fractional modulators tend to reduce  
the primary fractional spurs that occur at increments of the channel spacing, but can also create spurs that are at a fraction of the  
channel spacing, if there is not sufficient filtering. The optimal choice of modulator order is very application specific, however, a  
third order modulator is a good starting point if not sure what to try first.  
ORDER  
Delta Sigma Modulator Order  
0
Fourth  
Reset Modulator  
(Integer Mode - all fractions are ignored)  
1
2
3
Second  
Third  
www.national.com  
16  
2.4.4 DITHER -- Dithering  
Dithering is useful in reducing fractional spurs, especially those that occur a a fraction of the channel spacing. The only exception  
is when the fractional numerator is zero. In this case, dithering usually is not a benefit. Dithering also can sometimes increase the  
PLL phase noise by a fraction of a dB. In general, if dithering is disabled, phase noise may be slightly better inside the loop bandwidth  
of the system, but spurs are likely to be worse too.  
DITHER  
Dithering Mode  
Weak Dithering  
Reserved  
0
1
2
3
Strong Dithering  
Dithering Disabled  
2.4.5 FDM -- Fractional Denominator Mode  
When this bit is set to 1, the 10 MSB bits for the fractional numerator and denominator are considered. This allows the fractional  
denominator to range from 1 to 4,194,303. If this bit is set to zero, only the 12 LSB bits of the fractional numerator and denominator  
are considered, and this allows a fractional denominator from 1 to 4095. When this bit is disabled, the current consumption is about  
0.5 mA lower.  
2.4.6 -- DIV2  
When this bit is enabled on the appropriate option, the output of the VCO is divided by 2 on options that offer this feature. This has  
a small impact on harmonic content and output power.  
DIV2  
VCO Output Frequency  
Not Divided by 2  
Divided by 2  
0
1
17  
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2.5 REGISTER R4  
2.5.1 TOC[13:0] -- Time Out Counter for FastLock  
When the value of this word is 3 or less, then FastLock is disabled, and this pin can only be used for general purpose I/O. When  
this value is 4 or greater, the time out counter is engaged for the amount of phase detector cycles shown in the table below.  
TOC Value  
FLout Pin State  
Timeout Count  
0
High Impedance  
0
1
Low  
Low  
High  
Low  
.
Always Enabled  
2
0
3
0
4
.
4 X 2 Phase Detector  
.
16383  
Low  
16383 X 2 Phase Detector  
When this count is active, the FLout Pin is grounded, the FastLock current is engaged, and the resistors R3 and R4 are also  
potentially changed. The table below summarizes the bits that control various values in and out of FastLock differences.  
FastLock State  
Steady State  
Fastlock  
FLout  
Charge Pump Current  
R3  
R4  
High Impedance  
Grounded  
ICP  
R3_ADJ  
R4_ADJ  
ICPFL  
R3_ADJ_FL  
R4_ADJ_FL  
2.5.2 ICPFL[3:0] -- Charge Pump Current for Fastlock  
When FastLock is enabled, this is the charge pump current that is used for faster lock time.  
Typical Fastlock Charge Pump Current  
at 3 Volts (µA)  
ICPFL  
Fastlock Charge Pump State  
0
1
1X  
2X  
90  
180  
2
3X  
270  
3
4X  
360  
4
5X  
450  
5
6X  
540  
6
7X  
630  
7
8X  
720  
8
9X  
810  
9
10X  
11X  
12X  
13X  
14X  
15X  
16X  
900  
10  
11  
12  
13  
14  
15  
990  
1080  
1170  
1260  
1350  
1440  
www.national.com  
18  
2.6 REGISTER R5  
2.6.1 EN_PLL -- Enable Bit for PLL  
When this bit is set to 1, the PLL is powered up, otherwise, it is powered down.  
2.6.2 EN_VCO -- Enable Bit for the VCO  
When this bit is set to 1, the VCO is powered up, otherwise, it is powered down.  
2.6.3 EN_OSC -- Enable Bit for the Oscillator Inverter  
When this bit is set to 1 (default), the reference oscillator is powered up, otherwise it is powered down.  
2.6.4 EN_VCOLDO -- ENABLE BIT FOR THE VCO LDO  
When this bit is set to 1 (default), the VCO LDO is powered up, otherwise it is powered down.  
2.6.5 EN_PLLLDO1 -- ENABLE BIT FOR THE PLL LDO 1  
When this bit is set to 1 (default), the PLL LDO 1 is powered up, otherwise it is powered down.  
2.6.6 EN_PLLLDO2 -- ENABLE BIT FOR THE PLL LDO 2  
When this bit is set to 1 (default), the PLL LDO 2 is powered up, otherwise it is powered down.  
2.6.7 EN_DIGLDO -- ENABLE BIT FOR THE DIGITAL LDO  
When this bit is set to 1 (default), the Digital LDO is powered up, otherwise it is powered down.  
2.6.8 REG_RST -- RESETS ALL REGISTERS TO DEFAULT SETTINGS  
This bit needs to be programmed three times to initialize the part. When this bit is set to one, all registers are set to default mode,  
and the part is powered down. The second time the R5 register is programmed with REG_RST=0, the register reset is released  
and the default states are still in the registers. However, since the default states for the blocks and LDOs is powered off, it is  
therefore necessary to program R5 a third time so that all the LDOs and blocks can be programmed to a power up state. When  
this bit is set to 1, all registers are set to the default modes, but part is powered down. For normal operation, this bit is set to 0.  
Note that once this initialization is done, it is not necessary to initialize the part any more.  
19  
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2.7 REGISTER R6  
2.7.1 C3_C4_ADJ[2:0] -- VALUE FOR C3 AND C4 IN THE INTERNAL LOOP FILTER  
C3_C4_ADJ  
C3 (pF)  
50  
C4 (pF)  
50  
0
1
2
3
4
5
6
7
50  
100  
150  
50  
50  
100  
150  
100  
50  
50  
100  
150  
150  
50  
2.7.2 R3_ADJ_FL[1:0] -- Value for Internal Loop Filter Resistor R3 During Fastlock  
R3_ADJ_FL Value  
R3 Resistor During Fastlock (kΩ)  
0
1
2
3
10  
20  
30  
40  
2.7.3 R3_ADJ[1:0] -- Value for Internal Loop Filter Resistor R3  
R3_ADJ  
R3 Value (kΩ)  
0
1
2
3
10  
20  
30  
40  
2.7.4 R4_ADJ_FL[1:0] -- Value for Internal Loop Filter Resistor R4 During Fastlock  
R4_ADJ_FL  
R4 Value during Fast Lock (kΩ)  
0
1
2
3
10  
20  
30  
40  
2.7.5 R4_ADJ[1:0] -- Value for Internal Loop Filter Resistor R4  
R4_ADJ  
R4 Value (kΩ)  
0
1
2
3
10  
20  
30  
40  
2.7.6 EN_LPFLTR-- Enable for Partially Integrated Internal Loop Filter  
The Enable Loop Filter bit is used to enable/disable the 3rd and 4th pole on-chip loop filters.  
EN_LPFLTR  
3rd and 4th Poles of Loop Filter  
disabled  
0
1
(R3 = R4 = 0 ohms and C3 + C4 = 200pF)  
enabled  
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20  
2.7.7 VCO_ACI_SEL  
This bit is used to optimize the VCO phase noise. The recommended values are what are used for all testing purposes, and this  
bit should be set as the table below instructs.  
Part  
VCO_ACI_SEL  
LMX2531LQ1500E  
8
2.7.8 XTLSEL[2:0] -- Crystal Select  
XTLSEL  
Crystal Frequency  
<25 MHz  
0
1
2
3
4
5
6
7
25 - 50 MHz  
50 - 70 MHz  
>70 MHz  
Manual Mode  
Reserved  
Reserved  
Reserved  
The value of this word needs to be changed based on the frequency presented to the OSCin pin in accordance to the table above.  
2.8 REGISTER R7  
2.8.1 XTLDIV[1:0] -- Division Ratio for the Crystal Frequency  
The frequency provided to the VCO frequency calibration circuitry is based on the OSCin frequency divided down by a factor,  
determined by the XTLDIV word. Note that this division ratio is independent of the R counter value or the comparison frequency.  
The necessary division ratio depends on the OSCin frequency and is shown in the table below:  
XTLDIV  
Crystal Division Ratio  
Reserved  
Crystal Range  
Reserved  
0
1
2
3
Divide by 2  
< 20 MHz  
Divide by 4  
20-40 MHz  
> 40 MHz  
Divide by 8  
2.8.2 XTLMAN[11:0] -- Manual Crystal Mode  
Program all these bits to zero.  
21  
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2.9 REGISTER R8  
2.9.1 XTLMAN2 -- MANUAL CRYSTAL MODE SECOND ADJUSTMENT  
Set all these bits to zero.  
2.10 REGISTER R9  
All the bits in this register should be programmed as shown in the programming table.  
2.11 REGISTER R12  
Even though this register does not have user selectable bits, it still needs to be programmed. This register should be loaded as  
shown in section 2.02 Complete Register Content Map.  
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22  
Physical Dimensions inches (millimeters) unless otherwise noted  
Leadless Leadframe Package (Bottom View)  
Order Number LMX2531LQ1500EX for 2500 Unit Reel  
Order Number LMX2531LQ1500E for 250 Unit Reel  
NS Package Number LQA036AA  
Package Marking 311500EB  
23  
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相关型号:

LMX2531LQ1515E

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