LMX9820_技术文档

June 2004

LMX9820

Bluetooth™ Serial Port Module

The firmware supplied within this device offers a complete

Bluetooth (v1.1) stack including profiles and command

interface. This firmware features point-to-point and point-

to-multipoint link management supporting data rates up to

the theoretical maximum over RFComm of 704 kbps. The

internal memory supports up to three active Bluetooth

links.

1.0 General Description

®

The National Semiconductor LMX9820 Bluetooth™ Serial

Port module is a highly integrated radio, baseband control-

ler and memory device implemented on an LTCC (Low

Temperature Co-fired Ceramic) substrate. All hardware

and firmware is included to provide a complete solution

from antenna through the complete lower and upper layers

of the Bluetooth stack, up to the application including the

Generic Access Profile (GAP), the Service Discovery Appli-

cation Profile (SDAP), and the Serial Port Profile (SPP).

The module includes a configurable service database to

fulfil service requests for additional profiles on the host.

The LMX9820 features a small form factor (10.1 x 14.0 x

1.9 mm) design; thus, solving many of the challenges

associated with system integration. Moreover, the

LMX9820 is pre-qualified as a Bluetooth Integrated Com-

ponent. Conformance testing through the Bluetooth qualifi-

cation program enables a short time to market after system

integration by insuring a high probability of compliance and

interoperability.

1.1 APPLICATIONS

■ Personal Digital Assistants

■ POS Terminals

■ Data Logging Systems

™

Based on National’s CompactRISC 16-bit processor

architecture and Digital Smart Radio technology, the

LMX9820 is optimized to handle the data and link manage-

ment processing requirements of a Bluetooth node.

2.0 Functional Block Diagram

UART_RX

UART_TX

FIRMWARE

(INCLUDES

LINK

MGMNT

UART

UART_RTS#

UART_CTS#

PROFILES AND

COMMAND

PROCESSOR

(LMP)

INTERFACE)

IOVCC

TX_SWITCH_P

ENV0

ENV1

AUX

LSTAT_0

LSTAT_1

HOST_WU

RESET_B#

RESET_5100#

LNA

PORTS

DIGITAL

SMART

RADIO

BASEBAND

COMPACTRISC™

CORE

TR

SW

CONTROLLER

PA

ISEL1

ISEL2

INTERFACE

SELECT

FLASH

RAM

JTAG

SYNTHESIZER

VDD_ANA_OUT

ANALOG

DIGITAL

VOLTAGE

VDD_DIG_OUT

REGULATORS

VDD_DIG_PWR_D#

CRYSTAL/OSCILLATOR

VCC

DIG_GND[1:2]

CompactRISC is a trademark of National Semiconductor Corporation.

Bluetooth is a trademark of Bluetooth SIG, Inc. and is used under license by National Semiconductor.

www.national.com

■ On-chip application including:

3.0 Features

– Command Interface:

■ Bluetooth version 1.1 qualified

– Link setup and configuration (also Multipoint)

– Configuration of the module

– In system programming

■ Implemented in CMOS technology on LTCC substrate.

■ Temperature Range: -40°C to +85°C

– Service database modifications

– Default connections

– UART Transparent mode

3.1 DIGITAL HARDWARE

■ Baseband and Link Management processors

■ CompactRISC Core

– Different Operation modes:

– Automatic mode

– Command mode

■ Integrated Memory:

– Flash

– RAM

3.3 DIGITAL SMART RADIO

■ Accepts external clock or crystal input:

– 12 MHz

■ UART Command/Data Port:

– Support for up to 921.6k baud rate

■ Auxiliary Host Interface Ports:

– Link Status

– 20 ppm cumulative clock error required for Bluetooth

■ Synthesizer:

– Transceiver Status (Tx or Rx)

– Operating Environment Control:

– Integrated VCO and loop filter

– Provides all clocking for radio and baseband func-

tions

– Default Bluetooth mode

– In System Programming (ISP) mode

■ Advanced Power Management (APM) features

■ Antenna Port (50 Ohms nominal impedance):

– Embedded front-end filter for enhanced out of band

performance

3.2 FIRMWARE

■ Integrated transmit/receive switch (full duplex operation

■ Complete Bluetooth Stack including:

– Baseband and Link Manager

– L2CAP, RFCOMM, SDP

– Profiles:

via antenna port)

■ Embedded Balun

■ Better than -77 dBm input sensitivity

■ 0 dBm typical output power

– GAP

– SDAP

– SPP

3.4 PHYSICAL

■ Compact size - 10.1mm x 14.0mm x 1.9mm

■ Additional Profile support on Host for:

■ Complete system interface provided in Land Grid Array

– Dial Up Networking (DUN)

– Facsimile Profile (FAX)

– File Transfer Protocol (FTP)

– Object Push Profile (OPP)

– Synchronization Profile (SYNC)

on underside for surface mount assembly

■ Metal shield included

Figure 1. Physical Illustration

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2

Table of Contents

1.0

General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . .1

1.1 APPLICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . 1

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2

9.0

System Power-Up Sequence . . . . . . . . . . . . . . . . . . . 20

10.0 Integrated Firmware . . . . . . . . . . . . . . . . . . . . . . . . . . 21

10.1 FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

10.1.1 Operation Modes . . . . . . . . . . . . . . . . . . . . . . 21

10.1.2 Default Connections . . . . . . . . . . . . . . . . . . . . 21

10.1.3 Event Filter . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

10.1.4 Default Link Policy . . . . . . . . . . . . . . . . . . . . . 21

11.0 Low Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

11.1 POWER MODES . . . . . . . . . . . . . . . . . . . . . . . . 23

11.2 ENABLING AND DISABLING UART

2.0

3.0

3.1

3.2

3.3

3.4

DIGITAL HARDWARE . . . . . . . . . . . . . . . . . . . . . . 2

FIRMWARE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

DIGITAL SMART RADIO . . . . . . . . . . . . . . . . . . . . 2

PHYSICAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

4.0

5.0

6.0

Connection Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Pad Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5

Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . .8

TRANSPORT

23

6.1

6.2

6.3

6.4

GENERAL SPECIFICATIONS . . . . . . . . . . . . . . . . 8

DC CHARACTERISTICS . . . . . . . . . . . . . . . . . . . 9

RF PERFORMANCE CHARACTERISTICS . . . .10

PERFORMANCE DATA (TYPICAL) . . . . . . . . . . 12

11.2.1 Hardware Wake up functionality . . . . . . . . . . . 23

11.2.2 Disabling the UART transport layer . . . . . . . . 23

11.2.3 LMX9820 enabling the UART interface . . . . . 23

11.2.4 Enabling the UART transport layer

7.0

Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . 14

from the host

23

7.1

BASEBAND AND LINK MANAGEMENT

PROCESSORS

12.0 Command Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

12.1 FRAMING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

12.1.1 Start and End Delimiter . . . . . . . . . . . . . . . . . . 24

12.1.2 Packet Type ID . . . . . . . . . . . . . . . . . . . . . . . . 24

12.1.3 Opcode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

12.1.4 Data Length . . . . . . . . . . . . . . . . . . . . . . . . . . 24

12.1.5 Checksum: . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

12.2 COMMAND SET OVERVIEW . . . . . . . . . . . . . . 25

13.0 Usage Scenarios . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

13.1 SCENARIO 1: POINT-TO-POINT

14

7.1.1 Bluetooth Lower Link Controller . . . . . . . . . . . . 14

7.1.2 Bluetooth Upper Layer Stack . . . . . . . . . . . . . .14

7.1.3 Profile support . . . . . . . . . . . . . . . . . . . . . . . . .14

7.1.4 Application with command interface . . . . . . . . . 14

7.2

7.3

7.4

MEMORY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

CONTROL AND TRANSPORT PORT . . . . . . . . . 15

AUXILIARY PORTS . . . . . . . . . . . . . . . . . . . . . . . 15

7.4.1 Reset_5100 and Reset_b . . . . . . . . . . . . . . . . 15

7.4.2 Operating Environment Pads

CONNECTION

29

(Env0 and Env1)

15

13.2 SCENARIO 2: AUTOMATIC POINT-TO-POINT

CONNECTION

13.3 SCENARIO 3: POINT-TO-MULTIPOINT CONNEC-

7.4.3 Interface Select Inputs (ISEL1, ISEL2) . . . . . .15

7.4.4 Module and LInk Status Outputs . . . . . . . . . . . 15

Digital Smart Radio . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

30

8.0

TION

31

8.1

8.2

8.3

8.4

8.5

8.6

8.7

RADIO RECEIVER . . . . . . . . . . . . . . . . . . . . . . .16

LOW NOISE AMPLIFIER (LNA) . . . . . . . . . . . . . 16

RX MIXER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

CHANNEL SELECT FILTER . . . . . . . . . . . . . . . .16

LIMITER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

FM DISCRIMINATOR . . . . . . . . . . . . . . . . . . . . . 16

RECEIVE SIGNAL STRENGTH INDICATOR

(RSSI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

RADIO TRANSMITTER . . . . . . . . . . . . . . . . . . . .16

MODULATOR . . . . . . . . . . . . . . . . . . . . . . . . . . .16

14.0 Application Information . . . . . . . . . . . . . . . . . . . . . . . 32

14.1 MATCHING NETWORK . . . . . . . . . . . . . . . . . . . 32

14.2 FILTERED POWER SUPPLY . . . . . . . . . . . . . . . 32

14.3 HOST INTERFACE . . . . . . . . . . . . . . . . . . . . . . 32

14.4 CLOCK INPUT . . . . . . . . . . . . . . . . . . . . . . . . . . 32

14.5 SCHEMATIC AND LAYOUT EXAMPLES . . . . . 32

15.0 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

16.0 Datasheet Revision History . . . . . . . . . . . . . . . . . . . . 38

17.0 Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . 40

8.8

8.9

8.10 TRANSMIT FREQUENCY OUTPUT . . . . . . . . . . 16

8.11 FREQUENCY SYNTHESIZERS . . . . . . . . . . . . . 16

8.12 CRYSTAL CIRCUIT . . . . . . . . . . . . . . . . . . . . . . . 16

8.13 EXTERNAL CRYSTAL OSCILLATORS . . . . . . . 16

8.13.1 Crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

8.13.2 TCXO (Temperature Compensated Crystal

Oscillator) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Revision 1.0

3

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4.0 Connection Diagram

1

2

3

4

5

6

7

8

9

10

11

12

13

A

B

C

D

E

F

NC

PI1_

Tx_rx_

synch

CCB_

Clock

BBCLK PI2_TP12

RF_CE_TP11 clock

RF GND RF GND RF GND RF GND RF GND RF GND

Clk-

Clk+

AAI_srd

Env1

AAI_std

32kHz_CLKI

Tx_rx_

data

Uart_rx

Uart_rts#

AAI_sfs

AAI_sclk 32kHz_CLKO

RF GND RF GND RF GND RF GND RF GND RF GND CCB_data Uart_tx Uart_cts#

Reset_ Dig_gnd_1

5100#

NC

RF GND RF GND RF GND RF GND RF GND RF GND

Lstat_0

Lstat_1

Env0

Host_wu

J_tms

J_rdy

J_tdi

J_tck

USB_D+ USB_D-

J_tdo

USB_VCC PH3_TP9

G

H

J

RF GND RF GND RF GND RF GND RF GND

NC

Reset_b#

Dig_gnd_2 USB_Gnd PH2_TP8

VCC

TX_

NC

RF GND RF GND RF GND RF_inout RF GND RF GND RF GND

IOVCC

ISEL2

ISEL1

Switch_P

NC

VDD_ANA_OUT

VDD_DIG_OUT NC

VDD_DIG_PWR_D#

NC

CCB_

latch

NC

X-Ray (Top View)

Figure 2. Connection Diagram LMX9820

Table 1. Order Information

Order Number

LMX9820SB

Shipment Method

Tray

LMX9820SBX

Tape & Reel

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4

5.0 Pad Descriptions

Table 2. System Interface Signals

Pad Name

Pad

Direction

Description

Location

Clk-

B8

Input

Xtal g or Negative Clock Input. Typically connected along with

XTAL_D to an external surface mount AT cut crystal. Can also be con-

figured as a frequency input when using an external crystal oscillator.

When configured as a frequency input, typically connected to Ground

with a 10 pF capacitor.

Clk+

B9

Xtal d or Positive Clock Input. Typically connected along with

XTAL_G to an external surface mount AT cut crystal. Can also be con-

figured as a frequency input when using an external crystal oscillator.

When configured as a frequency input, is typically connected to an ex-

ternal Temperature Compensated Crystal Oscillator (TCXO) through

an Alternating Current (AC) coupling capacitor.

32kHz_CLKI

32kHz_CLKO

RF_inout

B13

C13

H8

Input

Output

32 kHz Clock input. Not supported. Place pad and do not connect to

VCC or Ground.

32 kHz Clock Output. Not supported. Place pad and do not connect to

VCC or Ground.

Input/Output

RF Antenna Port. 50Ω nominal impedance. Typically connected to an

antenna through a 6.8pF capacitor.

ISEL2

ISEL1

H13

J13

Input

Module Interface Select Input Bit 1.

Module Interface Select Input Bit 0.

Table 3. USB Interface Signals (Not supported by lmx9820 firmware)

Pad Name

Pad

Location

Direction

Description

1

USB_VCC

USB_D+

USB_D-

F12

E11

E12

G12

Input

USB Transceiver Power Supply +

1

Input/Output

Input

USB Data Positive

1

USB Data Negative

1

USB_Gnd

USB Transceiver Ground

1. Treat as No Connect, Pad required for mechanical stability.

Table 4. UART Interface Signals

Pad Name

Pad

Location

Direction

Description

Uart_tx

D9

C9

Output

Input

UART Host Control Interface Transport, Transmit Data.

UART Host Control Interface Transport, Receive Data.

UART Host Control Interface Transport, Request to Send.

UART Host Control Interface Transport, Clear to Send.

Uart_rx

Uart_rts#

Uart_cts#

C10

D10

Output

Input

Revision 1.0

5

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5.0 Pad Descriptions (Continued)

Table 5. Auxiliary Ports Interface Signals

Pad Name

Pad

Location

Direction

Description

IOVCC

H12

G8

Input

2.85V to 3.6V Logic Threshold Program Input.

Reset_b#

Reset_5100#

Reset Input for Smart Radio. Normally connected to Reset_5100.

D11

Reset for Baseband and Link Management Processors. Active

low.

Lstat_0

Lstat_1

Host_wu

Env0

E8

F8

Output

Input

Link Status Bit 0.

Link Status Bit 1.

F9

Host Wakeup

E9

Module Operating Environment Bit 0.

Module Operating Environment Bit 1.

Transceiver Status, 0 = Receive; 1 = Transmit.

Env1

B11

H3

Input

TX_Switch_P

Output

Table 6. Audio Port Interface Signals (not supported by LMX9820 Firmware)

Pad Name

Pad

Location

Direction

Description

1

AAI_srd

AAI_std

AAI_sfs

AAI_sclk

B10

B12

C11

C12

Input

Advanced Audio Interface Receive Data Input.

1

Output

Advanced Audio Interface Transmit Data Output.

1

Input/Output

Advanced Audio Interface Frame Synchronization.

1

Advanced Audio Interface Clock.

1. Treat as No Connect, Pad required for mechanical stability.

Table 7. Test Interface Signals

Pad Name

Pad

Direction

Description

Location

1

J_rdy

J_tdi

E10

F10

F11

G9

Output

Input

JTAG Ready.

1

JTAG Test Data.

J_tdo

J_tms

J_tck

Input/Output

Input

JTAG Test Data.

1

JTAG Test Mode Select.

1

G10

A8

JTAG Test Clock.

1

PI1_RFCE_TP1

1

Testpin

Module Test Point.

1

PI2_TP12

Tx_rx_clock

Tx_rx_data

Tx_rx_synch

CCB_Clock

CCB_data

CCB_latch

BBCLK

A13

A9

Testpin

Module Test Point.

1

Module Test Point.

1

C8

Module Test Point.

1

A10

A11

D8

Module Test Point.

1

Module Test Point.

1

Module Test Point.

1

J12

A12

Module Test Point.

1

Module Test Point.

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6

5.0 Pad Descriptions (Continued)

Table 7. Test Interface Signals (Continued)

Pad Name

Pad

Location

Direction

Description

1

PH3_TP9

PH2_TP8

F13

G13

Testpin

Module Test Point.

1. Treat as No Connect, Pad required for mechanical stability.

Table 8. Power, Ground, and No Connect Signals

Pad Name

Pad

Direction

Description

Location

NC

A1, A2, A3, A4, A5,

A6, A7, B1, C1, D1,

D13, E1, E13, F1,

G1, G7, H1, H4, J1,

J3, J6, J7, J9, J10,

J11

not

No Connect. Must have pad for mechanical stability.

connected

Input

1

B2, B3, B4, B5, B6,

B7, C2, C3, C4, C5,

C6, C7, D2, D3, D4,

D5, D6, D7, E2, E3,

E4, E5, E6, E7, F2,

F3, F4, F5, F6, F7,

G2, G3, G4, G5,

G6, H5, H6, H7, H9,

H10, H11

Radio System Ground. Must be connected to RF Ground

plane. Thermal relief required for proper soldering.

RF GND

1

D12

G11

H2

Input

Digital Ground.

Dig_gnd_1

1

Dig_gnd_2

VCC

2.85V to 3.6V Input for the Internal Power Supply Reg-

ulators.

VDD_ANA_OUT

VDD_DIG_OUT

J2

J5

J4

Output

Input

Voltage Regulator Output/Power Supply for Analog

Circuitry. If not used, place pad and do not connect to VCC

or Ground.

Voltage Regulator Output/Power Supply for Digital Cir-

cuitry. If not used, place pad and do not connect to VCC or

Ground.

VDD_DIG_PWR

_D#

Power Down for the Internal Power Supply Regulator

for the Digital Circuitry. Place pad and do not connect to

VCC or Ground.

1. Connect RF GND, Dig_gnd_1, and Dig_gnd_2 to single Ground plane.

Revision 1.0

7

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The following conditions are true unless otherwise stated in

the tables below:

6.0 Electrical Specifications

6.1 GENERAL SPECIFICATIONS

•

T = -40°C to +85°C

A

Absolute Maximum Ratings (see Table 9) indicate limits

beyond which damage to the device may occur. Operating

Ratings (see Table 10) indicate conditions for which the

device is intended to be functional.

VCC = 3.3V

RF system performance specifications are guaranteed

on National Semiconductor Austin Board rev1.0b refer-

ence design platform.

This device is a high performance RF integrated circuit and

is ESD sensitive. Handling and assembly of this device

should be performed at ESD free workstations.

Table 9. Absolute Maximum Ratings

Min

Symbol

VCC

Parameter

Max

Unit

Core Logic Power Supply Voltage

I/O Power Supply Voltage

2.25

2.97

3.6

V

IOVCC

3.6

1

USB Power Supply Voltage

3.63

USB_VCC

V

Voltage on any pad with GND = 0V

-0.5

VCC + 0.5

V

I

PinRF

RF Input Power

+15

dBm

o

T

Storage Temperature Range

-65

+150

S

L

C

o

Lead Temperature (solder 4 sec)

+260

C

ESD-HBM

ESD-MM

ESD - Human Body Model

ESD - Machine Model

2000

200

V

1. USB Interface not supported by LMX9820 firmware. Treat as no connect, place pad for mechanical stability.

1

Table 10. Recommended Operating Conditions

2

Symbol

Parameter

Min

Max

Unit

Typ

3.3

VCC

Module Power Supply Voltage

I/O Power Supply Voltage

USB Power Supply Voltage

2.85

2.97

3.6

V

IOVCC

3

3.63

USB_VCC

t

Module Power Supply Rise Time

Operating Temperature Range

50

+85

90

ms

°C

%

R

T

-40

10

O

HUM

Humidity (operating, across operating

temperature range)

OP

o

HUM

5

95

%

NONOP Humidity (non-operating, 38.7 C web bulb

temperature)

1. Maximum voltage difference allowed between VCC and IOVCC is 500 mV.

2. Typical operating conditions are at 3.3V operating voltage and 25°C ambient temperature.

3. USB Interface not supported by LMX9820 firmware. Treat as no connect, place pad for mechanical stability.

Table 11. Power Supply Electrical Specifications: Analog and Digital LDOs

1

Symbol

Parameter

Min

2.20

2.40

Max

2.75

Unit

Typ

2

VDD_ANA_OUT

VDD_DIG_OUT

2.54

V

Analog Voltage Output Range

3

2.60

Digital Voltage Output Range

o

1. Typical operating conditions are at 3.3V operating voltage and 25 C ambient temperature.

2. Set in factory at 2.5V nominal output.

3. Set in factory at 2.6V nominal output.

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8

6.0 Electrical Specifications (Continued)

NOTE: The voltage regulators are optimized for the internal

operation of the LMX9820. As any noise or coupling into

those can have influence on the radio performance, it is

highly recommended to have no additional load on those

outputs.

1,2,3

Table 12. Power Supply Requirements

Min

Symbol

Parameter

Typ

Max

Unit

I

Power supply current for continous transmit

Power supply current for continous receive

56

80

mA

CC-TX

CC-RX

RXSL

RXM

62

33

78

mA

4

Receive Data in SPP Link, Slave

4

27

Receive Data in SPP Link, Master

4

12.3

7

SnM

Sniff Mode, Sniffintervall 1 second

4

SC-TLDIS

Idle

Scanning, No Active Link, TL Disabled

4

5.7

Idle, Scanning Disabled, TL Disabled

1. Power supply requirements based on Class II output power.

2. VCC = 3.0V, IOVCC = 3.3V, Ambient Temperature = +25 °C.

3. Based on UART Baudrate 115.2kbit/s.

4. Average values

6.2 DC CHARACTERISTICS

Table 13. Digital DC Characteristics

Condition

Symbol

VCC

Parameter

Min

Max

3.6

Units

Core Logic Supply Voltage

IO Supply Voltage

Logical 1 Input Voltage

2.85

V

IOVCC

3.6

V

0.7*IOVCC

IOVCC + 0.5

0.2*IOVCC

0.3*IOVCC

IH

IL

Logical 0 Input Voltage

-0.5

V

1

32.768kHz Logical 0 Input Voltage

32.768kHz Logical 1 Input Voltage

External 32.768kHz clock

V

XL2

1

0.7*IOVCC

IOVCC + 0.5

V

XH2

2

0.1*IOVCC

-1.6

V

HYS

Hysteresis Loop Width

I

Logical 1 Output Current

Logical 0 Output Current

Weak Pull-up Current

V

= 1.8V,

OH

mA

OH

IOVCC = 2.25V

V

= 0.45V,

1.6

-10

mA

µA

OL

IOVCC = 2.25V

V

= 1.8V,

OHW

IH

OH

IOVCC = 2.25V

High-level Input Current

Low-level Input Current

V

= IOVCC = 2.85V

= 0

- 1.0

1.0

µA

IH

IL

3

I

IL

High Impedance Input Leakage

Current

0V ≤ V ≤ IOVCC

-2.0

2.0

µA

L

IN

I

Output Leakage Current (I/O pins in

input mode)

0V ≤ V

≤ VCC

OUT

O(Off)

1. Not supported, please place pad and leave unconnected.

2. Guaranteed by design.

3. Limit for I for the pins Reset_b#, Pl1_RFCE_TP & VDD_DIG_PWR_D# is +/-3uA.

IL

Revision 1.0

9

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6.0 Electrical Specifications (Continued)

6.3 RF PERFORMANCE CHARACTERISTICS

•

All tests are measured at antenna port unless otherwise

specified

In the performance characteristics tables the following

applies:

•

T = -40°C to +85°C

A

VCC = 3.3V unless otherwise specified

•

All tests performed are based on Bluetooth Test Specifi-

cation rev 0.91.

RF system performance specifications are guaranteed

on National Semiconductor Austin Board rev1.0b refer-

ence design platform.

Table 14. Receiver Performance Characteristics

1

Symbol

Parameter

Condition

Min

Max

Unit

Typ

2

Receive Sensitivity

BER < 0.001

2.402 GHz

2.441 GHz

2.480 GHz

-77

0

-74

dBm

dB

RX

sense

PinRF

Maximum Input Level

-20

C/I

Carrier to Interferer Ratio

in the Presence of Co-

channel Interferer

P RF = -60 dBm,

9

11

0

CCI

in

BER < 0.001

C/I

Carrier to Interferer Ratio

in the Presence of Adja-

cent Channel Interferer

∆F

= + 1 MHz,

-3

dB

ACI

P RF = -60 dBm,

in

BER < 0.001

∆F

= + 2 MHz.

-42

-46

-20

-30

-40

ACI

P RF = -60 dBm,

in

BER < 0.001

∆F

= + 3 MHz,

ACI

P RF = -67 dBm,

in

BER < 0.001

C/I

Image Frequency

Interference

∆F= - 2 MHz,

-9

IMAGE

P RF = -67 dBm,

in

BER < 0.001

-

Image Frequency

Interference

∆f = -3 MHz,

PinRF = -67 dBm,

BER < 0.001

-32

-31

-20

dB

IMAGE

1MHz

3

Intermodulation

Interference Performance

F = + 3 MHz,

-39

dBm

IMP

1

F = + 6 MHz,

2

P RF = -64 dBm

in

4

Input Impedance of RF

Port (RF_inout)

Single input impedance

= 2.5 GHz

50

Ω

Z

RFIN

F

in

5

Return Loss

-8

dB

Return Loss

OOB

Out Of Band Blocking

Performance

P RF = -10 dBm,

-10

-27

-10

dBm

in

30 MHz < F

BER < 0.00

< 2 GHz,

CWI

P RF = -27 dBm,

dBm

in

2000 MHz < F

BER < 0.001

< 2399 MHz,

< 3000 MHz,

< 12.75 GHz,

CWI

OOB

Out Of Band Blocking

Performance

(Continued)

P RF = -27 dBm,

in

2498 MHz < F

BER < 0.001

CWI

P RF = -10 dBm,

in

3000 MHz < F

BER < 0.001

CWI

1. Typical operating conditions are at 3.3V operating voltage and 25°C ambient temperature.

2. The receiver sensitivity is measured at the device interface.

3. The f =-64dBm Bluetooth modulated signal, f =-39dBm sine wave, f =-39dBm Bluetooth modulated signal, f =2f -f ,

0

1

2

0

1 2

and |f -f |=n*1MHz, where n is 3,4 or 5. For the typical case, n = 3.

2

1

4. Reference Smith Chart Figure 8 on page 13.

5. Reference chart Figure 9 on page 14.

www.national.com

10

6.0 Electrical Specifications (Continued)

Table 15. Transmitter Performance Characteristics

1

Symbol

Parameter

Condition

2.402 GHz

Min

Max

Unit

Typ

+1

1

2

Transmit Output Power

-3

+4

2

dBm

kHz

P

RF

OUT

2.441 GHz

2.480 GHz

-3

Power Density

-4

MOD ∆F1

Modulation Characteris-

tics

Data = 00001111

Data = 10101010

140

165

175

AVG

3

Modulation Characteris-

tics

115

0.8

125

kHz

MOD ∆F2

MAX

4

Modulation Characteris-

tics

∆F2

∆F1

AVG

5

AVG

/

Adjacent Channel Power

(In-band Spurious)

+ 500 kHz

-20

-40

dBc

dBm

dB

ACP

| M - N | = 2

-50

-53

-48

-51

-77

| M - N | > 3

6

nd

Maximum gain setting:

P

2*f

PA 2 Harmonic

OUT

o

f = 2402 MHz,

0

Suppression

P

= 4804 MHz

out

3

rd

Maximum gain setting:

f = 2402 MHz,

-98

50

dB

3*f

PA 3 Harmonic

o

Suppression

0

P

= 7206 MHz

out

7

RF Output Impedance/In-

put Impedance of RF Port

(RF_inout)

P

@ 2.5 GHz

Ω

Z

out

RFOUT

8

Return Loss

-8

dB

Return Loss

o

1. Typical operating conditions are at 3.3V operating voltage and 25 C ambient temperature.

2. The output power is measured at the antenna port, including all front end losses for balun, TX/RX switch and filter.

3. ∆F2max > 115 kHz for at least 99.9% of all ∆f2max.

4. Modulation index set between 0.28 and 0.35.

5. Not tested in production.

6. Out-of-Band spurs only exist at 2nd and 3rd harmonics of the CW frequency for each channel. Performance of the

radio is significantly better than BT 1.1 specification.

7. Reference Smith chart Figure 8 on page 13.

8. Reference chart Figure 9 on page 14.

1

Table 16. Synthesizer Performance Characteristics

Symbol

Parameter

Condition

Min

Typ

Max

Unit

f

t

VCO Frequency Range

2402

2480

MHz

VCO

Lock Time

f + 20 kHz

120

0

µs

LOCK

0

∆f offset

Initial Carrier Frequency Tolerance During preamble

-75

75

kHz

0

∆f drift

Initial Carrier Frequency Drift

DH1 data packet

DH3 data packet

DH5 data packet

Drift Rate

-25

-40

-20

0

4

25

40

20

kHz

0

kHz

kHz/50µs

µs

t -Tx

Transmitter Delay Time

From Tx data to anten-

na

D

1. Frequency accuracy dependent on crystal or oscillator chosen. Crystal/oscillator must have cumulative accuracy

specifications of not more than +20 ppm to meet the Bluetooth specification.

Revision 1.0

11

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6.0 Electrical Specifications (Continued)

Table 17. Crystal/Oscillator Performance Characteristics

Symbol

Parameter

Condition

Min

Typ

Max

Unit

f

Crystal Oscillator Frequency

12

MHz

OSC

1

Frequency Accuracy

Cumulative over operating

temperature range

-20

+20

ppm

ACC

t

Oscillator Turn-On Time

VCC applied, f

= 12 MHz,

OSC

4

ms

OSC-ON

C

= 0.1 µF, settled to within

ext

f

ACC

V

Oscillator Input Voltage

External XO input

0.6

49

2.0

Vpp

OSC

ESR

Equivalent Series Resis-

tance

50

100

Ω

D

Duty Cycle

51

%

CYCLE

P

Phase Noise

100Hz

-105

dBc/H

z

NOISE

1000Hz

-125

dBc/H

z

BBCLK

Baseband Clock Output

Frequency

12

MHz

1. Frequency accuracy dependent on crystal or oscillator chosen. Crystal/oscillator must have cumulative accuracy

specifications of +15 ppm to provide margin for frequency drift with ageing and temperature.

6.4 PERFORMANCE DATA (TYPICAL)

Figure 5. Corresponding Eye Diagram

Figure 3. Modulation

Figure 6. Synthesizer Phase Noise

Figure 4. Transmit Spectrum

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12

6.0 Electrical Specifications (Continued)

Filter Insertion Loss

0

-2

-4

IL(dB)

-6

-8

-1-100

2.1E+09

2.2E+09

2.3E+09

2.4E+09

2.5E+09

2.6E+09

2.7E+09

2.8E+09

2.1E+09 2.2E+09 2.3E+09 2.4E+09 2.5E+09 2.6E+09 2.7E+09 2.8E+09

Fre que nc y (H z)

Frequency (Hz)

Figure 7. Front-End Bandpass Filter Response

1.00

2.00

0.50

m1

0.00

0.50

2.00

m2

1.00

m2

freq=2.402ghz

-0.50

S(1.1)=0.093/-29.733

-2.00

impedance = Z0* (1.170 - j0.109)

-1.00

freq(2.400ghz to 2.500ghz)

m1

freq=2.500ghz

S(1.1)=0.035/175.614

impedance = Z0* (0.933 + j0.005)

Figure 8. TX and RX Pin 50Ω Impedance Characteristics

Revision 1.0

13

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0.0

-0.6

-1.6

-2.6

-3.6

-4.6

-5.6

-6.6

-7.6

-8.6

-9.6

m4

freq=2.402GHz

dB(S(1.1))=-8.282

m4

m5

m3

freq=2.483GHz

dB(S(1.1))=-9.227

freq=2.441GHz

dB(S(1.1))=-9.313

m5

m3

freq. ghz

Figure 9. Transceiver Return Loss

7.1.3 Profile support

7.0 Functional Description

The on-chip application of the LMX9820 allows full stand-

alone operation, without any Bluetooth protocol layer nec-

essary outside the module. It supports the Generic Access

Profile (GAP), the Service Discovery Application Profile

(SDAP), and the Serial Port Profile (SPP).

7.1 BASEBAND AND LINK MANAGEMENT

PROCESSORS

Baseband and Lower Link control functions are imple-

mented using a combination of National Semiconductor’s

CompactRISC 16-bit processor and the Bluetooth Lower

Link Controller. These processors operate from integrated

Flash memory and RAM and execute on-board firmware

implementing all Bluetooth functions.

The on-chip profiles can be used as interfaces to additional

profiles executed on the host. The LMX9820 includes a

configurable service database to answer requests with the

profiles supported.

7.1.4 Application with command interface

7.1.1 Bluetooth Lower Link Controller

The module supports automatic slave operation eliminating

the need for an external control unit. The implemented

transparent option enables the chip to handle incoming

data raw, without the need for packaging in a special for-

mat. The device uses a fixed pin to block unallowed con-

nections.

The integrated Bluetooth Lower Link Controller (LLC) com-

plies with the Bluetooth Specification version 1.1 and

implements the following functions:

•

Support for 1, 3, and 5 slot packet types

79 Channel hop frequency generation circuitry

Fast frequency hopping at 1600 hops per second

Power management control

Acting as master, the application offers a simple but versa-

tile command interface for standard Bluetooth operation

like inquiry, service discovery, or serial port connection.

The firmware supports up to three slaves. Default Link Pol-

icy settings and a specific master mode allow optimized

configuration for the application specific requirements. See

also Section "Integrated Firmware" on page 21.

Access code correlation and slot timing recovery

7.1.2 Bluetooth Upper Layer Stack

The integrated upper layer stack is prequalified and

includes the following protocol layers:

7.2 MEMORY

•

L2CAP

RFComm

SDP

The LMX9820 includes 256kB of programmable Flash

memory that can be used for code and constant data. It

allows single cycle read access from the CPU. In addition

www.national.com

14

to storing all algorithms and firmware, the on-board Flash

also contains the IEEE 802 compliant Media Access Con-

troller (MAC) address (BDADDR). The firmware and the

BDADDR are programmed by National Semiconductor or

can be programmed by the customer either before assem-

bly into the host system or in system. Module firmware can

be updated as well during manufacturing or by the con-

sumer using the ISP capabilities of the LMX9820. The

LMX9820 firmware uses the internal RAM for buffers and

program variables.

9.6kbit/s. Default configuration in NVS is 1 Stopbit, 1 Start-

bit and No parity.

Table 19 provides the ISEL1 and ISEL2 selection settings.

Table 19. UART Speed Selection

ISEL1

ISEL2

Interface

UART

Settings

(Pad J13) (Pad H13) Speed (baud)

1

0

1

0

921.6k

115.2k

9.6k

Check NVS

7.3 CONTROL AND TRANSPORT PORT

1Stop, 1Start,

No Parity

The LMX9820 provides one Universal Asynchronous

Receiver Transmitter (UART). It supports 8-bit data formats

with or without parity and one or two stop bits. The baud

rate is generated by hardware that is programmed at boot

time. Alternatively, the speed and configuration settings

can be read out of internal memory settings. The UART

can operate at baud rates of 2.4k, 4.8k, 7.2k, 9.6k, 19.2k,

38.4k, 57.6k, 115.2k, 230.4k, 460.8k and 921.6k. It imple-

ments flow control logic (RTS, CTS) to provide hardware

handshaking capability. The UART offers wakeup from the

power save modes via the multi-input wakeup module.

UART logic thresholds are set via the IOVCC pin.

0

Check NVS

7.4.4 Module and LInk Status Outputs

The LMX9820 provides signals that the host can use to

determine the real-time status of the radio link. The

TX_Switch_P signal (pad H3) is a real-time indication of

the current configuration (direction) of the transceiver. The

link status lines (Lstat_0 and Lstat_1, pads E8 and F8,

respectively) are GPIO lines controlled by the LMX9820

firmware. The Host Wakeup line (Host_wu, pad F9) is

implemented using GPIO and firmware. It is used to bring

the host processor out of Sleep mode when link activity

calls for host processing. Host_wu can also be used by the

host to check if link activity is present. If Host_wu is active,

then link activity is present and the host loses network

awareness if the operating system continues to allow the

host processor to enter the Sleep mode. Table 20 presents

the definitions of the various module and link status out-

puts.

7.4 AUXILIARY PORTS

7.4.1 Reset_5100 and Reset_b

Reset_5100 and Reset_b are active low reset inputs for the

baseband controller and digital smart radio portions of the

LMX9820, respectively. These pins are normally tied

together and are connected to the host system so that the

host can initialize the LMX9820 by asserting the reset

inputs. Upon removal, the status of the module operating

environment (Env) pads are sampled and the LMX9820

enters the corresponding operational mode.

Table 20. Module / Link Status Definitions

Mode

7.4.2 Operating Environment Pads (Env0 and Env1)

The module provides two operating environments (see

Table 18) depending on the state of the Env pads after the

removal of the reset inputs. At power up of the module,

Env0 and Env1 are checked to determine which operating

environment straps are selected and operating.

x

1

x

At least 1 SPP link es-

tablished

The ISP mode allows end-of-line or field programming of

the LMX9820 Flash memory by starting the baseband con-

troller from the boot block of memory.

x

0

x

1

0

x

0

1

No SPP link

Transceiver = Transmit

Transceiver = Receive

Host can Sleep

Table 18. Operating Environments

Operating Environment

Env1

(Pad B11)

Env0

(Pad E9)

Wakeup host/host

shouldn’t Sleep

ISP Mode

1

0

1

Run (Normal) Mode (De-

fault)

7.4.3 Interface Select Inputs (ISEL1, ISEL2)

The interface selection pads are used for setting the UART

speed and settings. As ISEL1 and ISEL2 are set by internal

weak-pull-ups, the default baudrate is 921.6kbit/s. The set-

tings for Stopbits, Startbit and Parity are stored as internal

NVS parameter. If a baudrate different to the listed needs

to be used, ISEL 1 and ISEL2 have to be set to 0. This

forces the device to get also the UART speed from the

parameter table. The default baudrate value set in NVS is

Revision 1.0

15

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8.8 RADIO TRANSMITTER

8.0 Digital Smart Radio

The signal path of the TX architecture contains an internal

modulator for 1 Mb/s GFSK (Gaussian Frequency Shift

Keying) modulation of the 2.5 GHz VCO. Closed loop ∆Σ

modulation is chosen since it is the most low power solu-

tion. The integrated pre-amplifier provides output levels

sufficient for Class 2 Bluetooth operation.

The LMX9820 Digital Smart Radio includes a high perfor-

mance, monolithic, radio transceiver optimized for Blue-

tooth communications systems.

The radio transceiver is a highly integrated design and

includes the Low Noise Amplifier (LNA), mixer, on-chip fil-

ters, 2.5 GHz ∆Σ PLL, voltage controlled oscillator, Power

Amplifier (PA) driver, and modem functions. Digital modula-

tion and demodulation techniques are utilized for a robust

manufacturable design. Power management includes con-

trol over individual chip functions and internal voltage regu-

lation for optimum performance.

8.9 MODULATOR

An internal digital Gaussian filter provides the FSK modula-

tion waveform. A modulation input to the completely inte-

grated 2.5 GHz ∆Σ PLL provides a consistent modulation

deviation. This eliminates the risks of open loop modulation

such as frequency drift and frequency offset.

8.1 RADIO RECEIVER

The signal path of the RX architecture contains an internal

LNA and quadrature RF downconverting mixer at 2.5 GHz.

A low Intermediate Frequency (IF) receiver provides high

performance at low cost and low current consumption. The

IF demodulator is implemented digitally in combination with

a limiting amplifier.

8.10 TRANSMIT FREQUENCY OUTPUT

The transmit RF output is differential, and is connected to

the antenna through an integrated passive balun.

8.11 FREQUENCY SYNTHESIZERS

The 2.4 to 2.5GHz RF range is provided by an on-chip volt-

age controlled oscillator (VCO). A programmable 2.5 GHz

∆Σ PLL selects the channel frequency. An internal crystal

oscillator can be configured with 12MHz crystal, or for

TCXO frequency input. Internal dividers provide internal

clocks and clock outputs to the baseband controller.

8.2 LOW NOISE AMPLIFIER (LNA)

The on-board LNA is a single-ended structure designed

with a 50Ω input impedance for simple capacitive match-

ing. The LNA is closely integrated with the mixer providing

low noise and good immunity from blocking signals.

8.12 CRYSTAL CIRCUIT

8.3 RX MIXER

Due to the need for clock accuracy, the LMX9820 has a

dedicated crystal oscillator. The LMX9820 uses the crystal

to supply a 12 MHz clock source to the baseband control-

ler. The 12 MHz is buffered, providing a receive data clock

to the baseband controller. It is also possible to configure

the crystal oscillator for input only when another high qual-

ity crystal oscillator is available in the system. The

LMX9820 can accommodate 12 MHz crystal.

The receive mixer is an image reject ring diode type mixer.

An internal low noise gain block is incorporated prior to the

mixer to achieve extremely low noise performance. A dif-

ferential IF output improves noise immunity while maintain-

ing a high intercept point.

8.4 CHANNEL SELECT FILTER

The IF circuitry is followed by an integrated complex active

bandpass filter that provides the required channel selectiv-

ity and image rejection. The I and Q outputs of the filter are

then converted to the digital domain using a limiter, discrim-

inator, and A/D converter.

8.13 EXTERNAL CRYSTAL OSCILLATORS

The LMX9820 contains a crystal driver circuit. This circuit

operates with an external crystal and capacitors to form an

oscillator. See Figure 10 on page 17 and Figure 11 on page

17. The LMX9820 also can operate with an external TCXO

(Temperature Compensated Crystal Oscillator).

8.5 LIMITER

The limiter circuit consists of I and Q limiting amplifiers that

provide the remaining gain in the receiver such that an

acceptable signal level exists at the frequency modulation

(FM) discriminator. Limiting amplification of the downcon-

verted wanted signal minimizes the input range require-

ments of the A/D converter.

8.13.1 Crystal

The crystal appears inductive near its resonant frequency.

It forms a resonant circuit with its load capacitors. The res-

onant frequency may be trimmed with the crystal load

capacitance.

1. Load Capacitance

8.6 FM DISCRIMINATOR

For resonance at the correct frequency, the crystal should

be loaded with its specified load capacitance, which is the

value of capacitance used in conjunction with the crystal

unit. Load capacitance is a parameter specified by the

crystal, typically expressed in pF. The crystal circuit shown

in Figure 11 is composed of:

The limited signal is translated to digital format by using an

analog Frequency Shift Keying (FSK) demodulator and A/D

converter. The A/D converter extracts the RX signal at a

sample rate of 72.0 MHz.

8.7 RECEIVE SIGNAL STRENGTH INDICATOR

(RSSI)

•

C1 (motional capacitance)

R1 (motional resistance)

L1 (motional inductance)

C0 (static or shunt capacitance)

The receive signal strength indicator (RSSI) signal is

derived from the input level to the limiter and covers a

range low detector level = -59dBm and high detector level

= -38dBm. The information is typically fed back to the

baseband controller via the serial interface.

The LMX9820 provides some of the load with internal

capacitors C . The remainder must come from the exter-

int

nal capacitors labeled Ct1 and Ct2 as shown in Figure 10.

Ct1 and Ct2 should have the same value for best noise

www.national.com

16

performance. Crystal load capacitance (C is calculated as

the following:

Figure 12 shows the results are 100 kHz off the center fre-

quency, which is –4 ppm. The pullability of the crystal is 24

ppm/pF, so the load capacitance must be decreased by

about 0.2 pF. By changing Ct1 or Ct2 to 9 pF, the total load

capacitance is increased by 0.26 pF. Figure 13 shows the

frequency offset test resuts. The frequency offset is now

zero with Ct1 = 9 pF, Ct2 = 10 pF.

L)

C = C + Ct1//Ct2

L

int

The C above does not include the crystal internal self-

L

capacitance C0 as shown in Figure 11 on page 17, so the

total capacitance is:

C

= C + C0

5. Kinseki KSS CX-4025S

total

L

The LMX9820 has also been tested with the Kineski KSS

CX-4025S. See Table 22 on page 17.

XTL_G

XTL_D

Table 21. VXE4-1055-12M000

Specification

Package

Frequency

Mode

Value

6.0x3.5x1.1 mm - 4 pads

12.000 MHz

Crystal

Ct2

Ct1

Fundamental

Stability

±18 ppm at -20 to +70°C (in-

clusive of all conditions)

Load Capacitance

ESR

9 pF

40 Ω max, 20 Ω typ

7 pF max

Figure 10. LMX9820 Crystal Recommended

Circuit

Shunt Capacitance

Drive Level

10 to 100 µW

24 ppm/pF min

-40 to +85°C

Pullability

R1

C1

C0

L1

Storage Temperature

Table 22. KSS CX-4025S

Specification

Package

Frequency

Mode

Value

4.0x2.5x0.75 mm - 4 pads

12.000 MHz

Figure 11. Crystal Equivalent Circuit

Fundamental

2. Crystal Pullability

Pullability is another important parameter for a crystal,

which is the change in frequency of a crystal with units of

ppm/pF, either from the natural resonant frequency to a

load resonant frequency, or from one load resonant fre-

quency to another. The frequency can be pulled in a paral-

lel resonant circuit by changing the value of load

capacitance. A decrease in load capacitance causes an

increase in frequency, and an increase in load capacitance

causes a decrease in frequency.

Stability

±20 ppm at -30 to +80°C (in-

clusive of all conditions)

Load Capacitance

ESR

12pF

80 Ω max, 20 Ω typ

3 pF max

Shunt Capacitance

Drive Level

100 µW max

-40 to +85°C

Storage Temperature

3. Frequency Tuning

Frequency Tuning is achieved by adjusting the crystal load

capacitance with external capacitors. It is a Bluetooth

requirement that the frequency is always within ±20 ppm.

Crystal/oscillator must have cumulative accuracy specifica-

tions of +15 ppm to provide margin for frequency drift with

ageing and temperature.

4. Vite Crystal

The VXE4-1055 is a 12 MHz SMT crystal from Vite.

National is using this crystal with the LMX9820. Table 21

on page 17 shows the specification of VXE4-1055.

Since the internal capacitance of the crystal circuit is 4-5 pF

and the load capacitance is 9 pF, 10 pF is a good starting

point for both Ct1 and Ct2. The 2480 MHz RF frequency

offset is then tested. Figure 12 on page 18 shows the RF

frequency offset test results.

Revision 1.0

17

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8.0 Digital Smart Radio (Continued)

Figure 12. Frequency Offset with 10 pF // 10 pF Capacitors

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18

8.0 Digital Smart Radio (Continued)

Figure 13. Frequency Offset with 9 pF//10 pF Capacitors

8.13.2 TCXO (Temperature Compensated Crystal

Oscillator)

The LMX9820 has also been tested with the NKG3184A

TCXO. See Table 23 on page 19.

Table 23. TCXO - NKG3184A

The LMX9820 also can operate with an external TCXO

(Temperature Compensated Crystal Oscillator). The TCXO

signal is directly connected to the XTL_G.

Specification

Package

Value

5.0x3.2x1.4 mm - 4 pads

12.000 MHz

Input Impedance

Frequency

Stability

The LMX9820 XTL_G pin has in input impedance of 2pF

capacitance in parallel with >400kΩ resistance.

±18 ppm at -30 to +85°C (in-

clusive of all conditions)

NKG3184A TCXO

Output Load

10kΩ // 13pF

Current Consumption

Output Level

2.0mA

0.3Vp-p to 2.0Vp-p

-40 to +85°C

Storage Temperature

DC Cut Capacitor

Included in VC-TCXO

Revision 1.0

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The Reset_b# and Reset_5100# of the LMX9820 should

be driven high minimum of 2ms after the LMX9820 voltage

rails are high. The LMX9820 is properly reset.

9.0 System Power-Up Sequence

In order to correctly power-up the LMX9820 the following

sequence must be performed:

Reference Table 24 on page 20.

Apply IOVCC and VCC to the LMX9820.

VCC

tPTOR

IOVCC

Reset_b#

Low

Reset_5100#

Low

BBP_CLOCK

TX_RX_DATA

High

Low

TX_RX_SYNC

CCB_DATA

Low

CCB_CLOCK

CCB_LATCH

High

LMX9820

Oscillator

Start-Up

LMX9820

Standby

Active

Initialization

LMX9820

Initialization

LMX9820 in Normal Mode

LMX9820 in

Power-Up Mode

Figure 14. LMX9820 System Power-Up Sequence Timing

Table 24. LMX9820 System Power-up Sequence Timing

Symbol

Parameter

Power to Reset

Condition

and IO at operating

VCC

Min

Typ

Max

Unit

t

V

2

ms

PTOR

CC

voltage level to valid reset

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20

Transparent Mode

10.0 Integrated Firmware

The LMX9820 supports transparent data communication

from the UART interface to a bluetooth link.

The LMX9820 includes the full Bluetooth stack up to

RFComm to support the following profiles:

If activated, the module does not interpret the commands

on the UART which normally are used to configure and

control the module. The packages don’t need to be format-

ted as described in Table 27 on page 24. Instead all data

are directly passed through the firmware to the active blue-

tooth link and the remote device.

•

GAP (Generic Access Profile)

SDAP (Service Discovery Application Profile)

SPP (Serial Port Profile)

Figure 15 shows the Bluetooth protocol stack with com-

mand interpreter interface. The command interpreter offers

a number of different commands to support the functional-

ity given by the different profiles. Execution and interface

timing is handled by the control application.

Transparent mode can only be supported on a point-to-

point connection. To leave Transparent mode, the host

must send a UART_BREAK signal to the module

Force Master Mode

The chip has an internal data area in Flash that includes

the parameters shown in Table 25 on page 22.

In Force Master mode tries to act like an Accesspoint for

multiple connections. For this it will only accept the link if a

Master/slave role switch is accepted by the connecting

device. After successful link establishment the LMX9820

will be Master and available for additional incoming links.

On the first incoming link the LMX9820 will switch to trans-

parent depending on the setting for automatic or command

mode. Additional links will only be possible if the device is

not in transparent mode.

Command Interpreter

Control Application

10.1.2 Default Connections

SPP

SDAP

The LMX9820 supports the storage of up to 3 devices

within its NVS. Those connections can either be connected

after reset or on demand using a specific command.

GAP

RFComm

SDP

10.1.3 Event Filter

The LMX9820 uses events or indicators to notify the host

about successful commands or changes at the bluetooth

interface. Depending on the application the LMX9820 can

be configured. The following levels are defined:

L2CAP

Link Manager

Baseband

•

No Events:

– The LMX9820 is not reporting any events. Optimized

for passive cable replacement solutions.

Figure 15. LMX9820 Software Implementation

10.1 FEATURES

•

Standard LMX9820 events:

– only necessary events will be reported

All events:

10.1.1 Operation Modes

– Additional to the standard all changes at the physical

layer will be reported.

On boot-up, the application configures the module follow-

ing the parameters in the data area.

Automatic Mode

10.1.4 Default Link Policy

No Default Connections Stored:

Each Bluetooth Link can be configured to support M/S role

switch, Hold Mode, Sniff Mode and Park Mode. The default

link policy defines the standard setting for incoming and

outgoing connections.

In Automatic mode the module is connectable and discov-

erable and automatically answers to service requests. The

command interpreter listens to commands and links can be

set up. The full command list is supported.

If connected by another device, the module sends an event

back to the host, where the RFComm port has been con-

nected, and switches to transparent mode.

Default Connections Stored:

If default connections were stored on a previous session,

once the LMX9820 is reset, it will attempt to connect each

device stored within the data Flash three times. The host

will be notified about the success of the link setup via a link

status event.

Command Mode

In Command mode, the LMX9820 does not check the

default connections section within the Data Flash. If con-

nected by another device, it will NOT switch to transparent

mode and continue to interpret data sent on the UART.

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Table 25. Operation Parameters Stored in LMX9820

Parameter

Default Value

Description

BDADDR

(Hard coded into Device)

Bluetooth device address

Local Name

Serial port device

PinCode

0000

Bluetooth PinCode

Operation Mode

Default Connections

SDP Database

Automatic

0

Command or Automatic mode

Up to three default devices to connect on default

1 SPP entry:

Name: COM1

Service discovery database, control for supported

profiles

Authentication and encryption enabled

UART Speed

9600

Sets the speed of the physical UART interface to the

host

UART Settings

Ports to Open

Link Keys

1 Stop bit, parity disabled

0000 0001

Parity and stop bits on the hardware UART interface

Defines the RFComm ports to open

Link keys for paired devices

No link keys

2

Security Mode

Page Scan Mode

Inquiry Scan Mode

Security mode

Connectable

Discoverable

Connectable/Not connectable for other devices

Discoverable/NotDiscoverable/LimitedDiscoverable

for other devices

Default Link Policy

All modes allowed

Configures modes allowed for incoming or outgoing

connections (Role switch, Hold mode, Sniff mode,

Park mode)

Default Link Timeout 20 seconds

Default link supervision timeout

Event Filter

Standard LMX9820 events reported

Defines the level of reporting on the UART

- no events

- standard events

- standard including ACL link events

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22

11.0 Low Power Modes

The LMX9820 supports different Low Power Modes to

reduce power in different operating situations. The modular

structure of the LMX9820 allows the firmware to power

down unused modules.

Host

LMX9820

RTS#

CTS#

TX

RTS#

CTS#

TX

The Low power modes have influence on:

•

UART transport layer

RX

– enabling or disabling the interface

•

Bluetooth Baseband activity

– firmware disables LLC and Radio if possible

GPIO

Host_WU

(optional)

11.1 POWER MODES

Figure 16. UART NULL modem connection

11.2.2 Disabling the UART transport layer

The following LMX9820 power modes, which depend on

the activity level of the UART transport layer and the radio

activity are defined:

The Host can disable the UART transport layer by sending

the “Disable Transport Layer” Command. The LMX9820

will empty its buffers, send the confirmation event and dis-

able its UART interface. Afterwards the UART interface will

be reconfigured to wake up on a falling edge of the CTS

pin.

The radio activity level mainly depends on application

requirements and is defined by standard bluetooth opera-

tions like inquiry/page scanning or an active link.

A remote device establishing or disconnecting a link may

also indirectly change the radio activity level.

11.2.3 LMX9820 enabling the UART interface

The UART transport layer by default is enabled on device

power up. In order to disable the transport layer the com-

mand “Disable Transport Layer” is used. Thus only the

Host side command interface can disable the transport

layer. Enabling the transport layer is controlled by the HW

Wakeup signalling. This can be done from either the Host

and the LMX9820. See also “LMX9820 Software Users

Guide” for detailed information on timing and implementa-

tion requirements.

As the Transport Layer can be disabled in any situation the

LMX9820 must first make sure the transport layer is

enabled before sending data to the host. Possible scenar-

ios can be incoming data or incoming link indicators. If the

UART is not enabled the LMX9820 assumes that the Host

is sleeping and waking it up by activating RTS and setting

HOST_WU to 1. To be able to react on that Wake up, the

host has to monitor the CTS pin.

As soon as the host activates its RTS pin, the LMX9820 will

first send a confirmation event and then start to transmit

the events.

Table 26. Power Mode activity

Power

Mode

UART activity

Radio activity

11.2.4 Enabling the UART transport layer from the host

PM0

PM1

PM2

PM3

PM4

PM5

OFF

ON

OFF

If the host needs to send data or commands to the

LMX9820 while the UART Transport Layer is disabled it

must first assume that the LMX9820 is sleeping and wake

it up using its RTS signal.

OFF

ON

Scanning

SPP Link

When the LMX9820 detects the Wake-Up signal it acti-

vates the UART HW and acknowledges the Wake-Up sig-

nal by settings its RTS and HOST_WU signal. Additionally

the Wake up will be confirmed by a confirmation event.

When the Host has received this “Transport Layer

Enabled” event, the LMX9820 is ready to receive com-

mands.

OFF

ON

11.2 ENABLING AND DISABLING UART

TRANSPORT

.

11.2.1 Hardware Wake up functionality

In certain usage scenarios the host is able to switch off the

transport layer of the LMX9820 in order to reduce power

consumption. Afterwards both devices, host and LMX9820

are able to shut down their UART interfaces.

In order to save system connections the UART interface is

reconfigured to hardware wakeup functionality. For a

detailed timing and command functionality please see also

the “LMX9820 Software Users Guide”.

The interface between host and LMX9820 is defined as

described in Figure 16.

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12.1.2 Packet Type ID

12.0 Command Interface

This byte identifies the type of packet. See Table 28 for

details.

The LMX9820 offers Bluetooth functionality in either a self

contained slave functionality or over a simple command

interface. The interface is listening on the UART interface.

12.1.3 Opcode

The following sections describe the protocol transported on

the UART interface between the LMX9820 and the host in

command mode (see Figure 17). In Transparent mode, no

data framing is necessary and the device does not listen

for commands.

The opcode identifies the command to execute. The

opcode values can be found within the “LMX9820 Software

User’s Guide” included within the LXMX9820 Evaluation

Board.

12.1.4 Data Length

12.1 FRAMING

Number of bytes in the Packet Data field. The maximum

size is defined with 333 data bytes per packet.

The connection is considered “Error free”. But for packet

recognition and synchronization, some framing is used.

All packets sent in both directions are constructed per the

model shown in Table 27.

12.1.5 Checksum:

This is a simple Block Check Character (BCC) checksum

of the bytes “Packet type”, “Opcode” and “Data Length”.

The BCC checksum is calculated as low byte of the sum of

all bytes (e.g., if the sum of all bytes is 0x3724, the check-

sum is 0x24).

12.1.1 Start and End Delimiter

The “STX” char is used as start delimiter: STX = 0x02. ETX

= 0x03 is used as end delimiter.

Existing device

without Bluetooth™

capabilities

LMX9820

UART

Figure 17. Bluetooth Functionality

.

Table 27. Package Framing

Start De-

limiter

Packet

Type ID

Opcode

Data Length

Checksum

Packet Data

End De-

limiter

1 Byte

2 Bytes

1 Byte

<Data Length> Bytes

1 Byte

- - - - - - - - - - - - - Checksum - - - - - - - - - - - - -

Table 28. Packet Type Identification

Description

ID

Direction

0x52

‘R’

REQUEST

(REQ)

A request sent to the Bluetooth module.

All requests are answered by exactly one confirm.

0x43

‘C’

Confirm

(CFM)

The Bluetooth modules confirm to a request.

All requests are answered by exactly one confirm.

0x69

‘i’

Indication

(IND)

Information sent from the Bluetooth module that is not a direct confirm to a request.

Indicating status changes, incoming links, or unrequested events.

0x72

‘r’

Response

(RES)

An optional response to an indication.

This is used to respond to some type of indication message.

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24

Tables 29 through 38 show the actual command set and

the events coming back from the device. A full documented

description of the commands can be found in the

“LMX9820 Software Users Guide”.

12.2 COMMAND SET OVERVIEW

The LMX9820 has a well defined command set to:

•

Configure the device:

– Hardware settings

NOTE: For standard Bluetooth operation only commands

from Table 29 through Table 31 will be used. Most of the

remaining commands are for configuration purposes only.

– Local Bluetooth parameters

– Service database

.

•

Set up and handle links

Table 29. Device Discovery

Command

Event

Description

Inquiry

Inquiry Complete

Device Found

Search for devices

Lists BDADDR and class of device

Get name of remote device

Remote Device Name

Remote Device Name Confirm

Table 30. SDAP Client Commands

Command

Event

Description

SDAP Connect

SDAP Disconnect

SDAP Connect Confirm

SDAP Disconnect Confirm

Connection Lost

Create an SDP connection to remote device

Disconnect an active SDAP link

Notification for lost SDAP link

SDAP Service Browse

SDAP Service Search

SDAP Attribute Request

Service Browse Confirm

SDAP Service Search Confirm

SDAP Attribute Request Confirm

Get the services of the remote device

Search a specific service on a remote device

Searches for services with specific attributes

Table 31. SPP Link Establishment

Event Description

Command

Establish SPP Link

Establishing SPP Link Confirm

Link Established

Initiates link establishment to a remote device

Link successfully established

Incoming Link

A remote device established a link to the local

device

Release SPP Link

SPP Send Data

Release SPP Link Confirm

SPP Send Data Confirm

Incoming Data

Initiate release of SPP link

Send data to specific SPP port

Incoming data from remote device

Get current Link Supervision timeout

Set Link Supervision timeout

Get Link Timeout

Set Link Timeout

Transparent Mode

Get Link Timeout Confirm

Set Link Timeout Confirm

Transparent Mode Confirm

Switch to Transparent mode on the UART

Table 32. Storing Default Connections

Event Description

Command

Connect Default Connection

Connect Default Connection Confirm

Connects to either one or all stored default

connections

Store Default Connection

Store Default Connection Confirm

Store device as default connection

Get list of Default Connections List of Default Devices

Delete Default Connections Delete Default Connections Confirm

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12.0 Command Interface (Continued)

Table 33. Bluetooth Low Power Modes

Event Description

Command

Set Default Link Policy

Set Default Link Policy Confirm

Defines the link policy used for any incoming

or outgoing link.

Get Default Link Policy

Set Link Policy

Get Default Link Policy Confirm

Set Link Policy Confirm

Returns the stored default link policy

Defines the modes allowed for a specific link

Returns the actual link policy for the link

Get Link Policy

Get Link Policy Confirm

Enter Sniff Mode Confirm

Exit Sniff Mode Confirm

Enter Park Mode Confirm

Enter Hold Mode Confirm

Power Save Mode Changed

Enter Sniff Mode

Exit Sniff Mode

Enter Park Mode

Enter Hold Mode

Remote device changed power save mode

on the link

Table 34. Wake Up Functionality

Command

Event

Transport Layer Enabled

Description

Disable Transport Layer

Disabling the UART Transport Layer and

activates the Hardware Wakeup function

Table 35. SPP Port Configuration and Status

Command

Event

Description

Set Port Config

Set Port Config Confirm

Set port setting for the “virtual” serial port link

over the air

Get Port Config

Get Port Config Confirm

Port Config Changed

Read the actual port settings for a “virtual”

serial port

Notification if port settings were changed

from remote device

SPP Get Port Status

SPP Get Port Status Confirm

Returns status of DTR, RTS (for the active

RFComm link)

SPP Port Set DTR

SPP Port Set RTS

SPP Port BREAK

SPP Port Set DTR Confirm

SPP Port Set RTS Confirm

SPP Port BREAK

Sets the DTR bit on the specified link

Sets the RTS bit on the specified link

Indicates that the host has detected a break

SPP Port Overrun Error

SPP Port Overrun Error Confirm

Used to indicate that the host has detected an

overrun error

SPP Port Parity Error

SPP Port Parity Error Confirm

SPP Port Framing Error Confirm

SPP Port Status Changed

Host has detected a parity error

Host has detected a framing error

SPP Port Framing Error

Indicates that remote device has changed

one of the port status bits

Table 36. Local Bluetooth Settings

Description

Read actual friendly name of the device

Command

Event

Read Local Name Confirm

Read Local Name

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12.0 Command Interface (Continued)

Table 36. Local Bluetooth Settings (Continued)

Command

Event

Description

Write Local Name

Read Local BDADDR

Change Local BDADDR

Write Local Name Confirm

Read Local BDADDR Confirm

Change Local BDADDR Confirm

Set the friendly name of the device

Note: Only use if you have your own

BDADDR pool

Store Class of Device

Set Scan Mode

Store Class of Device Confirm

Set Scan Mode Confirm

Change mode for discoverability and

connectability

Set Scan Mode Indication

Get Fixed Pin Confirm

Reports end of Automatic limited

discoverable mode

Get Fixed Pin

Reads current PinCode stored within the

device

Set Fixed Pin

Set Fixed Pin Confirm

Set the local PinCode

Set Default Link Timeout

Set Default Link Timeout Confirm

Set Default Link Supervision Timeout for all

incoming an outgoing links

Get Default Link Timeout

Get Default Link Timeout Confirm

Read Default Link Supervision Timeout for all

incoming an outgoing links

Get Security Mode

Set Security Mode

Get Security Mode Confirm

Set Security Mode Confirm

Get actual Security mode

Configure Security mode for local device

(default 2)

Remove Pairing

Remove Pairing Confirm

List of Paired Devices

Remove pairing with a remote device

List Paired Devices

Get list of paired devices stored in the

LMX9820 data memory

Force Master Role

Force Master Role Confirm

Enables/Disables the request for Master role

at incoming connections

Table 37. Local Service Database Configuration

Command

Event

Description

Store SPP Record

Store SPP Record Confirm

Create a new SPP record within the service

database

Store DUN Record

Store FAX Record

Store OPP Record

Store FTP Record

Store IrMCSync Record

Store DUN Record Confirm

Store FAX Record Confirm

Store OPP Record Confirm

Store FTP Record Confirm

Store IrMCSync Record Confirm

Create a new DUN record within the service

database

Create a new FAX record within the service

database

Create a new OPP record within the service

database

Create a new FTP record within the service

database

Create a new IrMCSync record within the ser-

vice database

Enable SDP Record

Delete All SDP Records

Ports to Open

Enable SDP Record Confirm

Delete All SDP Records Confirm

Ports to Open Confirmed

Enable or disable SDP records

Specify the RFComm Ports to open on

startup

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12.0 Command Interface (Continued)

Table 38. Local Hardware Commands

Command

Event

Description

Set Event Filter

Set Event Filter Confirm

Configures the reporting level of the

command interface

Get Event Filter

Read RSSI

Get Event Filter Confirm

Read RSSI Confirm

Get the status of the reporting level

Returns an indicator for the incoming signal

strength

Change UART Speed

Change UART Speed Confirm

Set specific UART speed; needs proper ISEL

pin setting

Change UART Settings

Test Mode

Change UART Settings Confirm

Test Mode Confirm

Change configuration for parity and stop bits

Enable Bluetooth, EMI test, or local loopback

Restore Factory Settings

Reset

Restore Factory Settings Confirm

Dongle Ready

Soft reset

Firmware Upgrade

Stops the bluetooth firmware and executes

the In-system-programming code

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The SPP conformance of the LMX9820 allows any device

using the SPP to connect to the LMX9820.

13.0 Usage Scenarios

Because of switching to Transparent automatically, the

controller has no need for an additional protocol layer; data

is sent raw to the other Bluetooth device.

13.1 SCENARIO 1: POINT-TO-POINT

CONNECTION

LMX9820 acts only as slave, no further configuration is

required.

On default, a PinCode is requested to block unallowed tar-

geting.

Example: Sensor with LMX9820; hand-held device with

standard Bluetooth option.

Air Interface

Sensor Device

Standard Device

with Bluetooth

UART

Inquiry Request

Search for Devices

Inquiry Response

SDP Link Request

SDP Link Accept

Get Remote Services

Service Browse

Service Response

Release SDP Link

Release Confirm

SPP Link Request

Establish SPP Link

Link Established

Connected

on Port L

SPP Link Accept

Transparent Mode

Raw Data

LMX9820

Microcontroller

No Bluetooth™ commands necessary

only “connected” event indicated to controller

The client software only

shows high level functions

Figure 18. Point-to-Point Connection

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13.0 Usage Scenarios (Continued)

If step 5 is executed, the stored default device is connected

(step 4) after reset (in Automatic mode only) or by sending

the command “Connect to Default Device”. The command

can be sent to the device at any time.

13.2 SCENARIO 2: AUTOMATIC POINT-TO-POINT

CONNECTION

LMX9820 at both sides.

Example: Serial Cable Replacement.

If step 6 is left out, the microcontroller has to use the com-

mand “Send Data” instead of sending data directly to the

module.

Device #1 controls the link setup with a few commands as

described.

Serial Device #1

Serial Device #2

Air

1. Devices in Range?

Interface

Inquiry

Inquiry Request

Inquiry Result

Inquiry Response

2. Choose the Device

3. Which COM Port is

available?

Establish SDP Link

SDP Link Request

SDP Link Accept

SDP Link Established

Service Browse

Browse Result

Service Browse

RFComm Port = R

Service Response

Release SDP Link

SDP Link Released

Release SDP Link

SDP Link Released

Release SDP Link

Release Confirm

4. Create SPP Link

Establish SPP Link

to Port R on Port L

SPP Link Request

SPP Link Accept

to Port R1 on Port L2

Connected on Port L

Link Established

Connected

on Port R

5. Connect on Default

(Optional)

Transparent Mode

Store Default Device

Device Stored

Storing Default Device

Device Stored

6. Switch to

Transparent

Transparent Mode

Raw Data

Microcontroller

LMX9820

Microcontroller

LMX9820

Bluetooth™ device controls link with

a few commands

No Bluetooth™ commands necessary;

only “connected” event indicated to controller

1. Port R indicates the remote RFComm channel to connect to. Usually the result of the SDP request.

2. Port L indicates the Local RFComm channel used for that connection.

Figure 19. Automatic Point-to-Point Connection

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Serial Device #1 is acting as master for both devices. As

the host has to decide to or from which device data is com-

ing from, data must be sent using the “Send data com-

mand”. If the device receives data from the other devices, it

is packaged into an event called “Incoming data event”.

The event includes the device related port number.

13.3 SCENARIO 3: POINT-TO-MULTIPOINT CON-

NECTION

LMX9820 acts as master for several slaves.

Example: Two sensors with LMX9820; one hand-held

device with implemented LMX9820.

Serial Devices #2 and #3 establish the link automatically as

soon as they are contacted by another device. No control-

ler interaction is necessary for setting up the Bluetooth link.

Both switch automatically into Transparent mode. The host

sends raw data over the UART.

If necessary, a link configuration can be stored as default in

the master Serial Device #1 to enable the automatic recon-

nect after reset, power-up, or by sending the “connect

default connection” command.

Serial Device #1

Serial Device #2

Air

Interface

Connect to Device #2

see Scenario 2

Connect to Device #2

see Scenario 2

Connection Request

Link Established

on Port L1

Connected

on Port L

Automatic Link Setup

Transparent Mode

Link Established

Send Data Command

Receive Data Event

Send Data to Port L1

Raw Data

Data Received

from Port L1

LMX9820

Microcontroller

Serial Device #3

Connect to Device #3

see Scenario 2

Connect to Device #3

see Scenario 2

Connection Request

Link Established

on Port L2

Connected

on Port L

Automatic Link Setup

Transparent Mode

Send Data Command

Receive Data Event

LMX9820

Send Data to Port L2

Raw Data

Data Received

from Port L2

Microcontroller

LMX9820

Microcontroller

Figure 20. Point-to-Multipoint Connection

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ISEL2 (pad H13) and ISEL1 (pad J13) can be strapped to

the host logic 0 and 1 levels to set the host interface boot-

up configuration. Alternatively both ISEL2 and ISEL1 can

be hardwired over 10KΩ pull-up/pull-down resistors.

Env0 (pad E9) and Env1 (pad B11) can be left uncon-

nected (both are read as high) if no ISP capability is

required. If the environment mode ISP needs to be acti-

vated by hardware (alternatively a firmware upgrade com-

mand can be used) then Env0 must be set to Logical Low

and Reset needs to be set. Upon removal of Reset, the

LMX9820 boots into the mode corresponding to the values

present on Env0 and Env1.

14.0 Application Information

Figure 21 on page 32 represents a typical system sche-

matic for the LMX9820.

14.1 MATCHING NETWORK

The antenna matching network may or may not be

required, depending upon the impedance of the antenna

chosen. A 6.8pF blocking capacitor is recommended.

14.2 FILTERED POWER SUPPLY

It is imperative that the LMX9820 be provided with ade-

quate Ground planes and a filtered power supply. It is

highly recommended that a 0.1 µF and a 10 pF bypass

capacitor be placed as close as possible to VCC (pad H2)

on the LMX9820.

14.4 CLOCK INPUT

The clock source must be placed as close as possible to

the LMX9820. The quality of the radio performance is

directly related to the quality of the clock source connected

to the oscillator port on the LMX9820. Careful attention

must be paid to the crystal/oscillator parameters or radio

performance could be drastically reduced.

14.3 HOST INTERFACE

To set the logic thresholds of the LMX9820 to match the

host system, IOVCC (pad H12) must be connected to the

logic power supply of the host system. It is highly recom-

mended that a 10 pF bypass capacitor be placed as close

as possible to the IOVCC pad on the LMX9820.

14.5 SCHEMATIC AND LAYOUT EXAMPLES

VCC

IOVCC

10 pF

0.01 µF

10 pF

0.01 µF

H2

H12

B1 Antenna

6.8 pF

H8

C8

Connect

system

to

RF_inout

Uart_rx

Uart_tx

Uart_cts

Uart_rts

D9

UART bus.

D10

C10

B9

B8

Clk+

Clk-

12 MHz

Y1

Reference

D11

G8

Table 24 on

page 20 for

correct POR

timing.

Reset_5100

Reset_b

10 pF

C1

10 pF

C2

LMX9820

Reference

Table 18 on

page 15.

E9

Env0

Env1

B11

J13

Reference

Table 19 on

page 15.

ISEL1

ISEL2

USBGND

G12

Dig_gnd[1:2]

D12, G11

H13

RF GND

Notes:

Capacitor values, C1, C2, C31 & C32, may vary depending on board design crystal manufacturer specification.

Single ground plane is used for both RF and Digital grounds.

Figure 21. Example System Schematic with pre-selected 115.2kbit/s UART speed

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32

14.0 Application Information (Continued)

Figure 22. Component Placement - Layer 1

Revision 1.0

33

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14.0 Application Information (Continued)

Figure 23. Solid Ground Plane - Layer 2

Figure 24. Signal Plane - Layer 3

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34

14.0 Application Information (Continued)

Figure 25. Component Layout Bottom - Layer 4

Revision 1.0

35

www.national.com

the temperature at which the solder has molten com-

ponents. The temperature that melting starts at.

15.0 Soldering

The LMX9820 bumps are designed to melt as part of the

Surface Mount Assembly (SMA) process. The LMX9820 is

assembled with a high temperature solder alloy to ensure

there are no re-reflow conditions imposed upon the module

when reflowed to a PCB with these typical low temperature

60/40 (S = 183°C, L = 188°C), 62/36/2 (E = 179°C), or

63/37 (E = 183°C) solder alloys.

•

E: Eutectic

– Denotes solid to liquid without a plastic phase.

The low temperature solder alloy will reflow with the solder

bump and provide the maximum allowable solder joint reli-

ability.

Reflow at a peak of 215 --> 220°C (approximately 30 sec-

onds at peak) [not to exceed 225°C; measured in close

proximity of the modules] to avoid any potential re-reflow

conditions.

Where:

•

S: Solidus

– Denotes the points in a phase diagram representing

the temperature at which the solder composition be-

gins to melt during heating, or complete freezing dur-

ing cooling.

Table 39 and Figure 26 on page 37 provide the soldering

details required to properly solder the LMX9820 to stan-

dard PCBs. The illustration serves only as a guide and

National is not liable if a selected profile does not work.

•

L: Liquidus

– Denotes the points in a phase diagram representing

Table 39. Soldering Details

Parameter

Value

PCB Land Pad Diameter

PCB Solder Mask Opening

PCB Finish (HASL details)

Stencil Aperture

24 mil

30 mil

63/37 (difference in thickness < 28 micron)

28 mil

Stencil Thickness

5 mil

Solder Paste Used

Low temperature 60/40 (S = 183°C, L = 188°C), 62/36/2 (E

1

= 179°C), or 63/37 (E = 183°C) solder alloys

1

Flux Cleaning Process

Reflow Profiles

No Clean Flux System

See Figure 26 on page 37

1. Typically defined by customer.

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36

15.0 Soldering (Continued)

Profile

#

Peak

Min

Max

Rising

Time

Rising

Time

Total

Time

Above

183

Rising Falling Time 130 Between Time 160 Between

Slope

130/160

160/183

1

2

213.9

206.7

32.8

31.1

2.50

2.41

-1.60

-1.73

208.01

213.01

109.00

121.01

99.01

92.00

57.00

53.00

75.00

64.00

Figure 26. Typical Reflow Profiles

Revision 1.0

37

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stages/definitions of the datasheet. Table 41 lists the revi-

sion history and Table 42 lists the specific edits to create

the current revision.

16.0 Datasheet Revision History

This section is a report of the revision/creation process of

the datasheet for the LMX9820. Table 40 provides the

Table 40. Documentation Status Definitions

Product Status Definition

Datasheet Status

Advance Information

Formative or in Design This datasheet contains the design specifications for product de-

velopment. Specifications may change in any manner without no-

tice.

Preliminary

First Production

This datasheet contains preliminary data. Supplementary data will

be published at a later date. National Semiconductor Corporation

reserves the right to make changes at any time without notice in

order to improve design and supply the best possible product.S

No Identification Noted Full production

This datasheet contains final specifications. National Semicon-

ductor Corporation reserves the right to make changes at any time

without notice in order to improve design and supply the best pos-

sible product.

Obsolete

Not in Production

This datasheet contains specifications on a product that has been

discontinued by National Semiconductor Corporation. The

datasheet is printed for reference information only.

Table 41. Revision History

Revision #

Revisions / Comments

(PDF Date)

0.3

Third draft of preliminary datasheet. First pass through tech pubs.

(January 2003)

0.4

(April 2003)

Datasheet revised to include new radio and additional functionality. Several edits have been made

to functional, performance, and electrical details.

1.0

Final datasheet. Several edits have been made to performance, electrical details and command

interface. See Table 42 for details.

(February 2004)

Revision 1.0

38

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16.0 Datasheet Revision History (Continued)

Table 42. Edits to Current Revision

Revisions / Comments

Section

General

•

Section "General Description" on page 1 updated

– Text Description updated

Description

– Features Updated

– Physical dimension changed to (10.1mm x 14.0mm x 1.9mm)

Pad Description

•

Table 2 "System Interface Signals" on page 5 updated

– changed information on 32_CLK pins

Electrical

Specifications

•

Table “USB Transceiver” removed

Table 10 "Recommended Operating Conditions" on page 8 updated

– USB_VCC Footnote added

•

Table 11 "Power Supply Electrical Specifications: Analog and Digital LDOs" on page 8 added

,,

Table 12 "Power Supply Requirements " on page 9 updated

Table 13 "Digital DC Characteristics" on page 9 updated

Table 14 "Receiver Performance Characteristics" on page 10 updated

Table 15 "Transmitter Performance Characteristics" on page 11 updated

Figure 9 "Transceiver Return Loss" on page 14 added

Functional

Description

Section 7.1.4 "Application with command interface" on page 14 updated

Section 7.2 "Memory" on page 14 updated

Section 7.4.3 "Interface Select Inputs (ISEL1, ISEL2)" on page 15 updated

Section 7.4.4 "Module and LInk Status Outputs" on page 15 updated

Table 20 "Module / Link Status Definitions" on page 15 updated

Section 8.7 "Receive Signal Strength Indicator (RSSI)" on page 16 updated

Section 8.11 "FRequency Synthesizers" on page 16 updated

Section 8.13 "External Crystal Oscillators" on page 16 updated

New in this revision

Digital Smart

Radio

System Power

Up Sequence

Integrated

Firmware

•

Section 10.1 "Features" on page 21 updated

Table 25 "Operation Parameters Stored in LMX9820" on page 22 updated

New in this revision

Low Power

Modes

Command

Interface

•

Table 34 "Wake Up Functionality" on page 26 added

Table 36 "Local Bluetooth Settings" on page 26 updated

Table 38 "Local Hardware Commands" on page 28 updated

Section 14.1 "MATCHING NETWORK" on page 32 updated

Section 14.2 "FILTERED POWER SUPPLY" on page 32 updated

Section 14.3 "HOST INTERFACE" on page 32 updated

Application|

Information

Figure 21 "Example System Schematic with pre-selected 115.2kbit/s UART speed" on page 32

updated

Soldering

•

Figure 26 "Typical Reflow Profiles" on page 37 updated

Revision 1.0

39

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17.0 Physical Dimensions inches (millimeters) unless otherwise noted

NOTES:

PAD PITCH IS 1.00 MILLIMETER (.0394”) NON-ACCUMULATIVE.

UNLESS OTHERWISE SPECIFIED, ALL DIMENSIONS ARE IN INCHES.

TOLERANCE, UNLESS OTHERWISE SPECIFIED:

TWO PLACE (.00): ±.01

THREE PLACE (.000): ±.002

ANGULAR: ±1°

Figure 27. LTCC (Low Temperature Co-Fired Ceramic) Package SB116A (RevA)

LIFE SUPPORT POLICY

NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT

DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL

COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:

1. Life support devices or systems are devices or systems which, 2. A critical component is any component of a life support device

(a) are intended for surgical implant into the body, or (b) support

or sustain life, and whose failure to perform, when properly used

in accordance with instructions for use provided in the labeling,

can be reasonably expected to result in a significant injury to the

user.

or system whose failure to perform can be reasonably expected

to cause the failure of the life support device or system, or to af-

fect its safety or effectiveness.

BANNED SUBSTANCE COMPLIANCE

National Semiconductor certifies that the products and packing materials meet the provisions of the Customer Products Stewardship

Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification (CSP-9-111S2) and contain no “Banned

Substances” as defined in CSP-9-111S2.

National Semiconductor

Corporation

National Semiconductor

Europe

National Semiconductor

Asia Pacific

National Semiconductor

Japan Ltd.

Tel: 1-800-272-9959

Fax: 1-800-737-7018

Email: support@nsc.com

Customer Response Group

Tel: 65-254-4466

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National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.


型号：	LMX9820
厂家：	National Semiconductor
描述：	Bluetooth Serial Port Module 蓝牙串口模块蓝牙
文件：	总40页 (文件大小：559K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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