LP2982AIM5X-3.3 [NSC]
Micropower 50 mA Ultra Low-Dropout Regulator; 微50毫安超低压差稳压器型号: | LP2982AIM5X-3.3 |
厂家: | National Semiconductor |
描述: | Micropower 50 mA Ultra Low-Dropout Regulator |
文件: | 总17页 (文件大小:414K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
March 2000
LP2982
Micropower 50 mA Ultra Low-Dropout Regulator
General Description
The LP2982 is a 50 mA, fixed-output voltage regulator de-
signed to provide ultra low dropout and lower noise in battery
powered applications.
Features
n Ultra low dropout voltage
n Guaranteed 50 mA output current
@
n Typical dropout voltage 180 mV 80 mA
™
Using an optimized VIP (Vertically Integrated PNP) pro-
n Smallest possible size (SOT-23, micro SMD package)
n Requires minimum external components
cess, the LP2982 delivers unequaled performance in all
specifications critical to battery-powered designs:
<
n
1 µA quiescent current when shutdown
@
Dropout Voltage: Typically 120 mV 50 mA load, and 7 mV
n Low ground pin current at all loads
@
1 mA load.
n Output voltage accuracy 1.0% (A Grade)
n High peak current capability (150 mA typical)
n Wide supply voltage range (16V max)
n Low ZOUT 0.3Ω typical (10 Hz to 1 MHz)
n Overtemperature/overcurrent protection
n −40˚C to +125˚C junction temperature range
n Custom voltages available
@
Ground Pin Current: Typically 375 µA 50 mA load, and
@
80 µA 1 mA load.
Sleep Mode: Less than 1 µA quiescent current when on/off
pin is pulled low.
Smallest Possible Size: SOT-23 and micro SMD packages
use absolute minimum board space.
Precision Output: 1.0% tolerance output voltages available
(A grade).
Applications
Low Noise: By adding an external bypass capacitor, output
noise can be reduced to 30 µV (typical).
n Cellular Phone
n Palmtop/Laptop Computer
n Personal Digital Assistant (PDA)
n Camcorder, Personal Stereo, Camera
Ten output voltage versions, from 2.5V to 5.0V, are available
as standard products.
Block Diagram
DS012679-1
™
VIP is a trademark of National Semiconductor Corporation.
© 2000 National Semiconductor Corporation
DS012679
www.national.com
Connection Diagrams
5-Lead Small Outline Package (M5)
micro SMD, 5 Bump Package (BPA05)
DS012679-55
DS012679-3
Bottom View
Top View
See NS Package Number BPA05
See NS Package Number MF05A
For ordering information see Table 1
Basic Application Circuit
DS012679-2
*
ON/OFF input must be actively terminated. Tie to V if this function is not to be used.
IN
**
Hints).
Minimum capacitance is shown to insure stability over full load current range. More capacitance provides superior dynamic performance (see Application
***
See Application Hints.
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2
Ordering Information
TABLE 1. Package Marking and Ordering Information
Output Voltage
Package
(V)
Grade
Order Information
Marking
Supplied as:
5-Lead Small Outline Package (M5)
2.5
2.5
2.5
2.5
2.6
2.6
2.6
2.6
2.8
2.8
2.8
2.8
3.0
3.0
3.0
3.0
3.3
3.3
3.3
3.3
3.6
3.6
3.6
3.6
3.8
3.8
3.8
3.8
4.0
4.0
4.0
4.0
4.5
4.5
4.5
4.5
4.7
4.7
4.7
4.7
5.0
5.0
5.0
5.0
5.3
A
A
LP2982AIM5X-2.5
LP2982AIM5-2.5
LP2982IM5X-2.5
LP2982IM5-2.5
LP2982AIM5X-2.6
LP2982AIM5-2.6
LP2982IM5X-2.6
LP2982IM5-2.6
LP2982AIM5X-2.8
LP2982AIM5-2.8
LP2982IM5X-2.8
LP2982IM5-2.8
LP2982AIM5X-3.0
LP2982AIM5-3.0
LP2982IM5X-3.0
LP2982IM5-3.0
LP2982AIM5X-3.3
LP2982AIM5-3.3
LP2982IM5X-3.3
LP2982IM5-3.3
LP2982AIM5X-3.6
LP2982AIM5-3.6
LP2982IM5X-3.6
LP2982IM5-3.6
LP2982AIM5X-3.8
LP2982AIM5-3.8
LP2982IM5X-3.8
LP2982IM5-3.8
LP2982AIM5X-4.0
LP2982AIM5-4.0
LP2982IM5X-4.0
LP2982IM5-4.0
LP2982AIM5X-4.5
LP2982AIM5-4.5
LP2982IM5X-4.5
LP2982IM5-4.5
LP2982AIM5X-4.7
LP2982AIM5-4.7
LP2982IM5X-4.7
LP2982IM5-4.7
LP2982AIM5X-5.0
LP2982AIM5-5.0
LP2982IM5X-5.0
LP2982IM5-5.0
LP2982AIM5X-5.3
L58A
L58A
L58B
L58B
LBYA
LBYA
LBYB
LBYB
L60A
L60A
L60B
L60B
L20A
L20A
L20B
L20B
L19A
L19A
L19B
L19B
L0BA
L0BA
L0BB
L0BB
L76A
L76A
L76B
L76B
L29A
L29A
L29B
L29B
LA8A
LA8A
LA8B
LA8B
L0HA
L0HA
L0HB
L0HB
L18A
L18A
L18B
L18B
LBZA
3000 Units on Tape and Reel
1000 Units on Tape and Reel
3000 Units on Tape and Reel
1000Units on Tape and Reel
3000 Units on Tape and Reel
1000 Units on Tape and Reel
3000 Units on Tape and Reel
1000Units on Tape and Reel
3000 Units on Tape and Reel
1000 Units on Tape and Reel
3000 Units on Tape and Reel
1000 Units on Tape and Reel
3000 Units on Tape and Reel
1000 Units on Tape and Reel
3000 Units on Tape and Reel
1000 Units on Tape and Reel
3000 Units on Tape and Reel
1000 Units on Tape and Reel
3000 Units on Tape and Reel
1000 Units on Tape and Reel
3000 Units on Tape and Reel
1000 Units on Tape and Reel
3000 Units on Tape and Reel
1000 Units on Tape and Reel
3000 Units on Tape and Reel
1000 Units on Tape and Reel
3000 Units on Tape and Reel
1000 Units on Tape and Reel
3000 Units on Tape and Reel
1000 Units on Tape and Reel
3000 Units on Tape and Reel
1000 Units on Tape and Reel
3000 Units on Tape and Reel
1000 Units on Tape and Reel
3000 Units on Tape and Reel
1000 Units on Tape and Reel
3000 Units on Tape and Reel
1000 Units on Tape and Reel
3000 Units on Tape and Reel
1000 Units on Tape and Reel
3000 Units on Tape and Reel
1000 Units on Tape and Reel
3000 Units on Tape and Reel
1000 Units on Tape and Reel
3000 Units on Tape and Reel
STD
STD
A
A
STD
STD
A
A
STD
STD
A
A
STD
STD
A
A
STD
STD
A
A
STD
STD
A
A
STD
STD
A
A
STD
STD
A
A
STD
STD
A
A
STD
STD
A
A
STD
STD
A
3
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Ordering Information (Continued)
TABLE 1. Package Marking and Ordering Information (Continued)
Output Voltage
(V)
Package
Marking
Grade
Order Information
Supplied as:
5-Lead Small Outline Package (M5)
5.3
5.3
5.3
A
LP2982AIM5-5.3
LP2982IM5X-5.3
LP2982IM5-5.3
LBZA
LBZB
LBZB
1000 Units on Tape and Reel
3000 Units on Tape and Reel
1000 Units on Tape and Reel
STD
STD
micro SMD, 5 Bump Package (BPA05)
2.8
2.8
2.8
2.8
3.0
3.0
3.0
3.0
A
A
LP2982AIBP-2.8
LP2982AIBPX-2.8
LP2982IBP-2.8
LP2982IBPX-2.8
LP2982AIBP-3.0
LP2982AIBPX-3.0
LP2982IBP-3.0
LP2982IBPX-3.0
250 Units on Tape and Reel
3000 Units on Tape and Reel
250 Units on Tape and Reel
3000 Units on Tape and Reel
250 Units on Tape and Reel
3000 Units on Tape and Reel
250 Units on Tape and Reel
3000 Units on Tape and Reel
STD
STD
A
A
STD
STD
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4
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Power Dissipation (Note 3)
Input Supply Voltage (Survival)
Input Supply Voltage (Operating)
Shutdown Input Voltage (Survival)
Output Voltage (Survival, (Note 4))
IOUT (Survival)
Internally Limited
−0.3V to +16V
2.1V to +16V
−0.3V to +16V
−0.3V to +9V
Storage Temperature Range
−65˚C to +150˚C
−40˚C to +125˚C
260˚C
Short Circuit Protected
Operating Junction Temperature Range
Lead Temperature (Soldering, 5 sec.)
ESD Rating (Note 2)
Input-Output Voltage (Survival, (Note 5))
−0.3V to +16V
2 kV
Electrical Characteristics
Limits in standard typeface are for TJ = 25˚C, and limits in boldface type apply over the full operating temperature range. Un-
less otherwise specified: VIN = VO(NOM) + 1V, IL = 1 mA, CIN = 1 µF, COUT = 4.7 µF, VON/OFF = 2V.
Symbol
Parameter
Conditions
Typ
LP2982AI-X.X
LP2982I-X.X
Units
(Note 6)
(Note 6)
Min
Max
Min
Max
∆VO
Output Voltage
Tolerance
IL = 1 mA
−1.0
+1.0
−1.5
+1.5
%VNOM
<
<
1 mA IL 50 mA
−1.5
+1.5
+2.0
−2.0
+2.0
+3.5
−2.0
−3.5
Output Voltage Line
Regulation
VO(NOM) + 1V ≤ VIN ≤ 16V
0.007
0.014
0.014
%/V
0.032
3
0.032
3
VIN–VO
Dropout Voltage
(Note 7)
IL = 0
1
5
5
IL = 1 mA
IL = 10 mA
IL = 50 mA
IL = 0
7
10
10
15
15
mV
40
60
60
90
90
120
65
150
225
95
150
225
95
IGND
Ground Pin Current
125
110
170
220
460
600
1200
0.8
2.0
125
110
170
220
460
600
1200
0.8
2.0
IL = 1 mA
IL = 10 mA
IL = 50 mA
80
140
375
µA
<
VON/OFF 0.3V
0.01
0.10
1.4
<
VON/OFF 0.15V
VON/OFF
ION/OFF
IO(PK)
ON/OFF Input Voltage
(Note 8)
High = O/P ON
Low = O/P OFF
VON/OFF = 0
1.6
1.6
V
0.55
0.01
5
0.15
−2
0.15
−2
ON/OFF Input Current
µA
VON/OFF = 5V
VOUT ≥ VO(NOM) − 5%
IL = 80 mA
15
15
Peak Output Current
Dropout Voltage
150
180
100
100
mA
mV
VIN–VO
225
325
225
325
IGND
Ground Pin Current
IL = 80 mA
525
30
750
750
µA
µV
1400
1400
en
Output Noise Voltage
(RMS)
BW = 300 Hz–50 kHz,
COUT = 10 µF
CBYPASS = 0.01 µF
5
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Electrical Characteristics (Continued)
Limits in standard typeface are for TJ = 25˚C, and limits in boldface type apply over the full operating temperature range. Un-
less otherwise specified: VIN = VO(NOM) + 1V, IL = 1 mA, CIN = 1 µF, COUT = 4.7 µF, VON/OFF = 2V.
Symbol
Parameter
Conditions
Typ
LP2982AI-X.X
LP2982I-X.X
Units
(Note 6)
(Note 6)
Min
Max
Min
Max
Ripple Rejection
f = 1 kHz
COUT = 10 µF
45
dB
IO(MAX)
Short Circuit Current
RL = 0 (Steady State)
(Note 9)
150
mA
Note 1: Absolute maximum ratings indicate limits beyond which damage to the component may occur. Electrical specifications do not apply when operating the de-
vice outside of its rated operating conditions.
Note 2: The ESD rating of pins 3 and 4 is 1 kV.
Note 3: The maximum allowable power dissipation is a function of the maximum junction temperature, T
, the junction-to-ambient thermal resistance, θ , and
JA
J(MAX)
the ambient temperature, T . The maximum allowable power dissipation at any ambient temperature is calculated using:
A
The value of θ for the SOT-23 package is 220˚C/W and the micro SMD package is 320˚C/W. Exceeding the maximum allowable power dissipation will cause ex-
JA
cessive die temperature, and the regulator will go into thermal shutdown.
Note 4: If used in a dual-supply system where the regulator load is returned to a negative supply, the LP2982 output must be diode-clamped to ground.
Note 5: The output PNP structure contains a diode between the V and V
terminals that is normally reverse-biased. Reversing the polarity from V to V
IN OUT
IN
OUT
will turn on this diode.
Note 6: temperature range are guaranteed through correlation using Statistical Quality Control (SQC) methods. The limits are used to calculate National’s Average
Outgoing Quality Level (AOQL).
Note 7: Dropout voltage is defined as the input to output differential at which the output voltage drops 100 mV below the value measured with a 1V differential.
Note 8: The ON/OFF inputs must be properly driven to prevent possible misoperation. For details, refer to Application Hints.
Note 9: See Typical Performance Characteristics curves.
Typical Performance Characteristics Unless otherwise specified: TA = 25˚C, VIN = VO(NOM) + 1V,
COUT = 4.7 µF, CIN = 1 µF, all voltage options, ON/OFF pin tied to VIN
.
Output Voltage vs
Temperature
Output Voltage vs
Temperature
DS012679-5
DS012679-4
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Typical Performance Characteristics Unless otherwise specified: TA = 25˚C, VIN = VO(NOM) + 1V,
COUT = 4.7 µF, CIN = 1 µF, all voltage options, ON/OFF pin tied to VIN. (Continued)
Output Voltage vs
Temparature
Dropout Characteristics
DS012679-7
DS012679-6
Dropout Characteristics
Dropout Characteristics
DS012679-9
DS012679-8
Dropout Voltage vs
Temperature
Dropout Voltage vs
Load Current
DS012679-10
DS012679-11
7
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Typical Performance Characteristics Unless otherwise specified: TA = 25˚C, VIN = VO(NOM) + 1V,
COUT = 4.7 µF, CIN = 1 µF, all voltage options, ON/OFF pin tied to VIN. (Continued)
Ground Pin Current vs
Temperature
Ground Pin Current vs
Load Current
DS012679-13
DS012679-12
Input Current vs VIN
Input Current vs VIN
DS012679-15
DS012679-14
Line Transient Response
Line Transient Response
DS012679-16
DS012679-17
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Typical Performance Characteristics Unless otherwise specified: TA = 25˚C, VIN = VO(NOM) + 1V,
COUT = 4.7 µF, CIN = 1 µF, all voltage options, ON/OFF pin tied to VIN. (Continued)
Load Transient Response
Load Transient Response
Short Circuit Current
Load Transient Response
DS012679-18
DS012679-19
Load Transient Response
DS012679-20
DS012679-21
Instantaneous Short Circuit
Current vs Temperature
DS012679-22
DS012679-23
9
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Typical Performance Characteristics Unless otherwise specified: TA = 25˚C, VIN = VO(NOM) + 1V,
COUT = 4.7 µF, CIN = 1 µF, all voltage options, ON/OFF pin tied to VIN. (Continued)
Short Circuit Current
Instantaneous Short Circuit
Current vs Output Voltage
DS012679-24
DS012679-25
Output Impedance vs
Frequency
Output Impedance vs
Frequency
DS012679-26
DS012679-29
ON/OFF Pin Current vs
VON/OFF
ON/OFF Threshold
vs Temperature
DS012679-35
DS012679-34
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10
Typical Performance Characteristics Unless otherwise specified: TA = 25˚C, VIN = VO(NOM) + 1V,
COUT = 4.7 µF, CIN = 1 µF, all voltage options, ON/OFF pin tied to VIN. (Continued)
Input to Output Leakage
vs Temperature
Output Reverse Leakage vs
Temperature
DS012679-30
DS012679-31
Output Noise Density
Output Noise Density
DS012679-48
DS012679-42
Output Noise Density
Ripple Rejection
DS012679-49
DS012679-41
11
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Typical Performance Characteristics Unless otherwise specified: TA = 25˚C, VIN = VO(NOM) + 1V,
COUT = 4.7 µF, CIN = 1 µF, all voltage options, ON/OFF pin tied to VIN. (Continued)
Turn-ON Waveform
Turn-ON Waveform
DS012679-50
DS012679-51
Turn-ON Waveform
DS012679-52
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12
meet the same ESR requirements over the operating tem-
perature range, which is more difficult because of their large
increase in ESR at cold temperature.
Application Hints
EXTERNAL CAPACITORS
An aluminum electrolytic can exhibit an ESR increase of as
much as 50X when going from 20˚C to −40˚C. Also, some
aluminum electrolytic are not operational below −25˚C be-
cause the electrolyte can freeze.
Like any low-dropout regulator, the external capacitors used
with the LP2982 must be carefully selected to assure regula-
tor loop stability.
INPUT CAPACITOR: An input capacitor whose value is ≥
1 µF is required with the LP2982 (amount of capacitance can
be increased without limit).
This capacitor must be located a distance of not more than
0.5" from the input pin of the LP2982 and returned to a clean
analog ground. Any good quality ceramic or tantalum can be
used for this capacitor.
OUTPUT CAPACITOR: The output capacitor must meet
both the requirement for minimum amount of capacitance
and E.S.R. (equivalent series resistance) value. Curves are
provided which show the allowable ESR range as a function
of load current for various output voltages and capacitor val-
ues (refer to Figure 1, Figure 2).
IMPORTANT: The output capacitor must maintain its ESR in
the stable region over the full operating temperature to as-
sure stability. Also, capacitor tolerance and variation with
temperature must be considered to assure the minimum
amount of capacitance is provided at all times.
DS012679-43
FIGURE 1. 5V/2.2 µF ESR Curves
This capacitor should be located not more than 0.5" from the
output pin of the LP2982 and returned to a clean analog
ground.
LOW-CURRENT OPERATION: In applications where the
<
load current is 1 mA, special consideration must be given
to the output capacitor.
Circuitry inside the LP2982 is specially designed to reduce
operating (quiescent) current at light loads down to about
65 µA.
The mode of operation which yields this very low quiescent
current also means that the output capacitor ESR is critical.
For optimum stability and minimum output noise, it is recom-
mended that a 10Ω resistor be placed in series with the out-
<
put capacitor in any applications where IL 1 mA.
CAPACITOR CHARACTERISTICS
DS012679-44
TANTALUM: Tantalum capacitors are the best choice for
use with the LP2982. Most good quality tantalum can be
used with the LP2982, but check the manufacturer’s data
sheet to be sure the ESR is in range.
FIGURE 2. 3V/4.7 µF ESR Curves
BYPASS CAPACITOR
The 0.01 µF capacitor connected to the bypass pin to reduce
noise must have very low leakage.
It is important to remember that ESR increases sharply at
<
lower temperatures ( 10˚C) and a capacitor that is near the
The current flowing out of the bypass pin comes from the
bandgap reference, which is used to set the output voltage.
upper limit for stability at room temperature can cause insta-
bility when it gets cold.
This capacitor leakage current causes the output voltage to
decline by an amount proportional to the current. Typical val-
In applications which must operate at very low temperatures,
it may be necessary to parallel the output tantalum capacitor
with a ceramic capacitor to prevent the ESR from going up
too high (see next section for important information on ce-
ramic capacitors).
@
@
25˚C, and
ues are −0.015%/nA
−40˚C, −0.021%/nA
@
−0.035%/nA +125˚C.
This data is valid up to a maximum leakage current of about
500 nA, beyond which the bandgap is so severely loaded
that it can not function.
CERAMIC: Ceramic capacitors are not recommended for
use at the output of the LP2982. This is because the ESR of
a ceramic can be low enough to go below the minimum
stable value for the LP2982. A good 2.2 µF ceramic was
measured and found to have an ESR of about 15 mΩ, which
is low enough to cause oscillations.
Care must be taken to ensure that the capacitor selected will
not have excessive leakage current over the operating tem-
perature range of the application.
A high quality ceramic capacitor which uses either NPO or
COG type dielectric material will typically have very low leak-
age. Small surface mount polypropylene or polycarbonate
film capacitors also have extremely low leakage, but are
slightly larger than ceramics.
If a ceramic capacitor is used on the output, a 1Ω resistor
should be placed in series with the capacitor.
ALUMINUM: Because of large physical size, aluminum elec-
trolytic are not typically used with the LP2982. They must
13
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ON/OFF INPUT OPERATION
Application Hints (Continued)
The LP2982 is shut off by pulling the ON/OFF input low, and
turned on by driving the input high. If this feature is not to be
used, the ON/OFF input should be tied to VIN to keep the
regulator on at all times (the ON/OFF input must not be left
floating).
REVERSE CURRENT PATH
The power transistor used in the LP2982 has an inherent di-
ode connected between the regulator input and output (see
below).
To ensure proper operation, the signal source used to drive
the ON/OFF input must be able to swing above and below
the specified turn-on/turn-off voltage thresholds which guar-
antee an ON or OFF state (see Electrical Characteristics).
The ON/OFF signal may come from either a totem-pole out-
put, or an open-collector output with pull-up resistor to the
LP2982 input voltage or another logic supply. The high-level
voltage may exceed the LP2982 input voltage, but must re-
main within the Absolute Maximum Ratings for the ON/OFF
pin.
DS012679-39
If the output is forced above the input by more than a VBE
this diode will become forward biased and current will flow
from the VOUT terminal to VIN. This current must be limited to
,
It is also important that the turn-on/turn-off voltage signals
applied to the ON/OFF input have a slew rate which is
greater than 40 mV/µs.
<
100 mA to prevent damage to the part.
The internal diode can also be turned on by abruptly step-
ping the input voltage to a value below the output voltage.
Important: the regulator shutdown function will operate incor-
rectly if a slow-moving signal is applied to the ON/OFF input.
To prevent regulator misoperation, a Schottky diode should
be used in any application where input/output voltage condi-
tions can cause the internal diode to be turned on (see be-
low).
Micro SMD Mounting
The micro SMD package requires specific mounting tech-
niques which are detailed in National Semiconductor Appli-
cation Note # 1112. Referring to the section Surface Mount
Technology (SMT) Assembly Considerations, it should be
noted that the pad style which must be used with the 5-pin
package is the NSMD (non-solder mask defined) type.
For best results during assembly, alignment ordinals on the
PC board may be used to facilitate placement of the micro
SMD device.
DS012679-40
Micro SMD Light Sensitivity
As shown, the Schottky diode is connected in parallel with
the internal parasitic diode and prevents it from being turned
on by limiting the voltage drop across it to about 0.3V.
Exposing the micro SMD device to direct sunlight will cause
misoperation of the device. Light sources such as Halogen
lamps can also affect electrical performance if brought near
to the device.
The wavelenghts which have the most detrimental effect are
reds and infra-reds, which means that the fluorescent light-
ing used inside most buildings has very little effect on perfor-
mance. A micro SMD test board was brought to within 1 cm
of a fluorescent desk lamp and the effect on the regulated
output voltage was negligible, showing a deviation of less
than 0.1% from nominal.
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14
Physical Dimensions inches (millimeters) unless otherwise noted
5-Lead Small Outline Package (M5)
NS Package Number MF05A
For Order Numbers, refer to Table 1in the “Ordering Information” section of this document.
15
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Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
NOTES: UNLESS OTHERWISE SPECIFIED
1. EPOXY COATING
2. 63Sn/37Pb EUTECTIC BUMP
3. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD.
4. PIN 1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION. REMAINING PINS ARE
NUMBERED COUNTER CLOCKWISE.
5. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1 IS PACKAGE WIDTH, X2 IS PACK-
AGE LENGTH AND X3 IS PACKAGE HEIGHT.
6.NO JEDEC REGISTRATION AS OF AUG.1999.
micro SMD, 5 Bump, Package (BPA05)
NS Package Number BPA05A
For Order Numbers, refer to Table 1“Ordering Information” section of this document.
The dimensions for X1, X2 and X3 are as given:
X1 = 0.930 +/− 0.030mm
X2 = 1.107 +/− 0.030mm
X3 = 0.850 +/− 0.050mm
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16
Notes
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant
into the body, or (b) support or sustain life, and
whose failure to perform when properly used in
accordance with instructions for use provided in the
labeling, can be reasonably expected to result in a
significant injury to the user.
2. A critical component is any component of a life
support device or system whose failure to perform
can be reasonably expected to cause the failure of
the life support device or system, or to affect its
safety or effectiveness.
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